JPH07501910A - 強磁性バイアを内部に有する多層の三次元構造 - Google Patents
強磁性バイアを内部に有する多層の三次元構造Info
- Publication number
- JPH07501910A JPH07501910A JP6508440A JP50844094A JPH07501910A JP H07501910 A JPH07501910 A JP H07501910A JP 6508440 A JP6508440 A JP 6508440A JP 50844094 A JP50844094 A JP 50844094A JP H07501910 A JPH07501910 A JP H07501910A
- Authority
- JP
- Japan
- Prior art keywords
- ferromagnetic
- vias
- multilayer
- structures
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Thin Magnetic Films (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Magnetic Heads (AREA)
Abstract
Description
Claims (7)
- 1.複数の絶縁層と、 前記絶縁層に形成され、強磁性材料を含む領域を規定する複数の強磁性バイアと 、 を具備し、前記絶縁層と前記強磁性バイアとによって一体化多層回路構造の一部 が形成される強磁性構造。
- 2.前記複数の強磁性バイアが、複数のコラムの強磁性バイアを含む請求項1記 載の強磁性構造。
- 3.前記複数の強磁性バイアが、連結された強磁性バイアのグリッドを含む請求 項1記載の強磁性構造。
- 4.前記複数の強磁性バイアが、榎数の積層された強磁性の線状バイアを含む請 求項1記載の強磁性構造。
- 5.前記複数の強磁性バイアが、前記絶縁層の間に配置された結合されたストリ ップラインの間の重なり領域に形成される請求項1記載の強磁性構造。
- 6.前記複数の強磁性バイアが、第1の連結された強磁性バイアと第2の連結さ れた強磁性バイアとを含み、マイクロストリップ・インダクタンスの一部を部分 的に取り囲む請求項1記載の強磁性構造。
- 7.前記複数の強磁性バイアが、導体の一部を取り囲む連結された強磁性バイア を含む請求項1記載の強磁性構造。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US95107292A | 1992-09-24 | 1992-09-24 | |
US951,072 | 1992-09-24 | ||
PCT/US1993/009052 WO1994007349A1 (en) | 1992-09-24 | 1993-09-24 | Magnetic vias within multi-layer, 3-dimensional structures/substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07501910A true JPH07501910A (ja) | 1995-02-23 |
JP2509807B2 JP2509807B2 (ja) | 1996-06-26 |
Family
ID=25491223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6508440A Expired - Lifetime JP2509807B2 (ja) | 1992-09-24 | 1993-09-24 | 強磁性バイアを内部に有する多層の三次元構造 |
Country Status (11)
Country | Link |
---|---|
US (1) | US5438167A (ja) |
EP (1) | EP0613610B1 (ja) |
JP (1) | JP2509807B2 (ja) |
KR (1) | KR0158475B1 (ja) |
CA (1) | CA2124196C (ja) |
DE (1) | DE69312466T2 (ja) |
DK (1) | DK0613610T3 (ja) |
ES (1) | ES2105326T3 (ja) |
GR (1) | GR3024693T3 (ja) |
MX (1) | MX9305885A (ja) |
WO (1) | WO1994007349A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016174A (ja) * | 2000-06-30 | 2002-01-18 | Kyocera Corp | 多層配線基板 |
JP2008103743A (ja) * | 1996-11-08 | 2008-05-01 | W L Gore & Assoc Inc | 電子アセンブリおよび電子物品内でのヴァイアのインダクタンスを低減する方法 |
JPWO2009050843A1 (ja) * | 2007-10-19 | 2011-02-24 | 株式会社アドバンテスト | 電子デバイス |
WO2020009146A1 (ja) * | 2018-07-06 | 2020-01-09 | 株式会社フジクラ | 高周波受動部品、および、高周波受動部品の製造方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184736B1 (en) * | 1992-04-03 | 2001-02-06 | Compaq Computer Corporation | Sinusoidal radio-frequency clock distribution system for synchronization of a computer system |
US6486394B1 (en) * | 1996-07-31 | 2002-11-26 | Dyconex Patente Ag | Process for producing connecting conductors |
US5828271A (en) * | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
JP3366552B2 (ja) * | 1997-04-22 | 2003-01-14 | 京セラ株式会社 | 誘電体導波管線路およびそれを具備する多層配線基板 |
US6169801B1 (en) | 1998-03-16 | 2001-01-02 | Midcom, Inc. | Digital isolation apparatus and method |
US6975189B1 (en) * | 2000-11-02 | 2005-12-13 | Telasic Communications, Inc. | On-chip multilayer metal shielded transmission line |
IL141118A0 (en) * | 2001-01-25 | 2002-02-10 | Cerel Ceramics Technologies Lt | A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
EP1265466A3 (en) * | 2001-06-05 | 2004-07-21 | Dai Nippon Printing Co., Ltd. | Method for fabrication wiring board provided with passive element and wiring board provided with passive element |
US6778043B2 (en) * | 2001-12-19 | 2004-08-17 | Maxxan Systems, Inc. | Method and apparatus for adding inductance to printed circuits |
US6867664B2 (en) * | 2003-05-05 | 2005-03-15 | Joey Bray | Ferrite-filled, antisymmetrically-biased rectangular waveguide phase shifter |
US7829135B2 (en) * | 2005-06-22 | 2010-11-09 | Canon Kabushiki Kaisha | Method and apparatus for forming multi-layered circuit pattern |
US8440917B2 (en) * | 2007-11-19 | 2013-05-14 | International Business Machines Corporation | Method and apparatus to reduce impedance discontinuity in packages |
US20090153281A1 (en) * | 2007-12-13 | 2009-06-18 | Ahmadreza Rofougaran | Method and system for an integrated circuit package with ferri/ferromagnetic layers |
US20100307798A1 (en) * | 2009-06-03 | 2010-12-09 | Izadian Jamal S | Unified scalable high speed interconnects technologies |
KR101692434B1 (ko) * | 2010-06-28 | 2017-01-18 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
US9362606B2 (en) * | 2013-08-23 | 2016-06-07 | International Business Machines Corporation | On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures |
US11177318B2 (en) | 2018-01-29 | 2021-11-16 | Agency For Science, Technology And Research | Semiconductor package and method of forming the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5524446A (en) * | 1978-08-09 | 1980-02-21 | Ngk Insulators Ltd | Ceramic circuit board |
JPS5854661A (ja) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | 多層セラミツク半導体パツケ−ジ |
JPS6048291B2 (ja) * | 1979-10-11 | 1985-10-26 | ファナック株式会社 | ワイヤカット放電加工装置 |
JPS61265890A (ja) * | 1985-05-20 | 1986-11-25 | 日本シイエムケイ株式会社 | プリント配線板とシ−ルド用トナ− |
JPS62219691A (ja) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | 厚膜混成集積回路 |
JPS62259500A (ja) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | 回路基板 |
JPS63177586A (ja) * | 1987-01-19 | 1988-07-21 | 株式会社日立製作所 | 回路板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3456215A (en) * | 1964-09-02 | 1969-07-15 | Peter A Denes | High frequency low pass filter |
US4647878A (en) * | 1984-11-14 | 1987-03-03 | Itt Corporation | Coaxial shielded directional microwave coupler |
US4894114A (en) * | 1987-02-11 | 1990-01-16 | Westinghouse Electric Corp. | Process for producing vias in semiconductor |
JPH0196991A (ja) * | 1987-10-09 | 1989-04-14 | Tdk Corp | 厚膜複合部品の製造方法 |
US5312674A (en) * | 1992-07-31 | 1994-05-17 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
-
1993
- 1993-09-24 DK DK93922353.3T patent/DK0613610T3/da active
- 1993-09-24 ES ES93922353T patent/ES2105326T3/es not_active Expired - Lifetime
- 1993-09-24 WO PCT/US1993/009052 patent/WO1994007349A1/en active IP Right Grant
- 1993-09-24 EP EP93922353A patent/EP0613610B1/en not_active Expired - Lifetime
- 1993-09-24 MX MX9305885A patent/MX9305885A/es unknown
- 1993-09-24 CA CA002124196A patent/CA2124196C/en not_active Expired - Lifetime
- 1993-09-24 JP JP6508440A patent/JP2509807B2/ja not_active Expired - Lifetime
- 1993-09-24 DE DE69312466T patent/DE69312466T2/de not_active Expired - Lifetime
- 1993-10-19 US US08/141,291 patent/US5438167A/en not_active Expired - Lifetime
-
1994
- 1994-05-24 KR KR1019940701759A patent/KR0158475B1/ko not_active IP Right Cessation
-
1997
- 1997-09-10 GR GR970402342T patent/GR3024693T3/el unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5524446A (en) * | 1978-08-09 | 1980-02-21 | Ngk Insulators Ltd | Ceramic circuit board |
JPS6048291B2 (ja) * | 1979-10-11 | 1985-10-26 | ファナック株式会社 | ワイヤカット放電加工装置 |
JPS5854661A (ja) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | 多層セラミツク半導体パツケ−ジ |
JPS61265890A (ja) * | 1985-05-20 | 1986-11-25 | 日本シイエムケイ株式会社 | プリント配線板とシ−ルド用トナ− |
JPS62219691A (ja) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | 厚膜混成集積回路 |
JPS62259500A (ja) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | 回路基板 |
JPS63177586A (ja) * | 1987-01-19 | 1988-07-21 | 株式会社日立製作所 | 回路板 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008103743A (ja) * | 1996-11-08 | 2008-05-01 | W L Gore & Assoc Inc | 電子アセンブリおよび電子物品内でのヴァイアのインダクタンスを低減する方法 |
JP2008124473A (ja) * | 1996-11-08 | 2008-05-29 | W L Gore & Assoc Inc | 電子アセンブリおよび電子物品内でのヴァイアのインダクタンスを低減する方法 |
JP2002016174A (ja) * | 2000-06-30 | 2002-01-18 | Kyocera Corp | 多層配線基板 |
JPWO2009050843A1 (ja) * | 2007-10-19 | 2011-02-24 | 株式会社アドバンテスト | 電子デバイス |
WO2020009146A1 (ja) * | 2018-07-06 | 2020-01-09 | 株式会社フジクラ | 高周波受動部品、および、高周波受動部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR0158475B1 (en) | 1998-12-15 |
US5438167A (en) | 1995-08-01 |
DK0613610T3 (da) | 1997-08-25 |
WO1994007349A1 (en) | 1994-03-31 |
ES2105326T3 (es) | 1997-10-16 |
DE69312466D1 (de) | 1997-09-04 |
JP2509807B2 (ja) | 1996-06-26 |
EP0613610B1 (en) | 1997-07-23 |
DE69312466T2 (de) | 1998-02-26 |
CA2124196C (en) | 1997-04-29 |
GR3024693T3 (en) | 1997-12-31 |
MX9305885A (es) | 1994-07-29 |
EP0613610A1 (en) | 1994-09-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH07501910A (ja) | 強磁性バイアを内部に有する多層の三次元構造 | |
JP2637332B2 (ja) | 固体複合磁性素子の製造方法 | |
US3765082A (en) | Method of making an inductor chip | |
US7973631B2 (en) | Inductive component and method for manufacturing an inductive component | |
US7253711B2 (en) | Embedded toroidal inductors | |
TW301004B (ja) | ||
US6903938B2 (en) | Printed circuit board | |
US5239744A (en) | Method for making multilayer magnetic components | |
JP2004128506A (ja) | 積層型コイル部品及びその製造方法 | |
JPH06216538A (ja) | 共焼成強磁性素子、ドロップイン部品および多層変成器を含む低温共焼成セラミックテ−プ構造 | |
GB2083952A (en) | Microcoil Assembly | |
JPH10172831A (ja) | 積層型インダクタ | |
US6669796B2 (en) | Method of manufacturing laminated ceramic electronic component, and laminated ceramic electronic component | |
US9647626B2 (en) | LC composite component | |
US6992556B2 (en) | Inductor part, and method of producing the same | |
JP3545701B2 (ja) | コモンモードチョーク | |
JPH06333742A (ja) | 積層コイル | |
KR20010114120A (ko) | 피씨비 인덕터 및 그를 이용한 변압기 | |
CN107305806B (zh) | 电子部件 | |
CN109643606A (zh) | 电感元件和制造电感元件的方法 | |
JPH0837108A (ja) | 積層トランス | |
JP2589636Y2 (ja) | 積層トランス | |
JPH0365645B2 (ja) | ||
JPH0132331Y2 (ja) | ||
JPH02272753A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080416 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090416 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100416 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120416 Year of fee payment: 16 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 17 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140416 Year of fee payment: 18 |