JPH0741478U - Measuring device for electronic components - Google Patents
Measuring device for electronic componentsInfo
- Publication number
- JPH0741478U JPH0741478U JP7372493U JP7372493U JPH0741478U JP H0741478 U JPH0741478 U JP H0741478U JP 7372493 U JP7372493 U JP 7372493U JP 7372493 U JP7372493 U JP 7372493U JP H0741478 U JPH0741478 U JP H0741478U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- contact
- electronic component
- holder
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】
【目的】 測子を電子部品のリードに対し安定かつ確実
に接触させることができ、測定精度を向上させる。
【構成】 上下動自在なホルダ５０に可動側測子５８，
５９を配設する。ホルダ５０を下降させると、電子部品
１の各リード２Ａ，２Ｂが第１の固定測子３７，３９に
上方から圧接される。また、可動側測子５８，５９の一
端接触部６４ａ，６５ａが各リード２Ａ，２Ｂにそれぞ
れ上方から圧接され、他端接触部６４ｂ，６５ｂが第２
の固定測子３８，４０に上方から圧接される。
(57) [Abstract] [Purpose] The probe can be brought into stable and reliable contact with the leads of electronic components, and the measurement accuracy is improved. [Structure] A movable side probe 58 is attached to a vertically movable holder 50,
59 is provided. When the holder 50 is lowered, the leads 2A and 2B of the electronic component 1 are pressed against the first fixed probe 37 and 39 from above. Further, one end contact portions 64a, 65a of the movable side probes 58, 59 are pressed against the leads 2A, 2B from above, respectively, and the other end contact portions 64b, 65b are the second contact portions.
Is pressed against the fixed probe 38, 40 from above.
Description
【０００１】[0001]
本考案は、トランジスタ、ＩＣ等の電子部品の検査、選別装置などに使用して 好適な電子部品の測定装置に関するものである。 The present invention relates to an electronic component measuring device suitable for use in inspection and sorting devices for electronic components such as transistors and ICs.
【０００２】[0002]
ＩＣ、コンデンサ、ディスクリートデバイス等の高周波特性をもつモールド型 電子部品（以下総称して電子部品と云う）の電気特性を検査する自動検査装置に おいては、測定位置に電子部品をセットし、そのリードに測子（接触子）を接触 させ、テスターから電流または電圧を印加し、電子部品の抵抗等の電気特性を測 定し、その測定結果にしたがって各カテゴリ毎に分類、収納している。特性の測 定方法としては、印加と測定を１つの測子で行うシングルコンタクト方式と、印 加と測定を別々の測子で行うケルビンコンタクト方式の２方式があり、通常前者 は高い測定精度が要求されない場合に用いられ、後者は高い測定精度が要求され る場合に用いられる。 In an automatic inspection device for inspecting the electrical characteristics of mold type electronic parts (hereinafter collectively referred to as electronic parts) having high frequency characteristics such as ICs, capacitors, and discrete devices, the electronic parts are set at the measurement position and A probe (contactor) is brought into contact with the lead, a current or voltage is applied from the tester, the electrical characteristics such as resistance of electronic components are measured, and according to the measurement results, each category is stored and stored. There are two methods for measuring the characteristics: the single contact method, in which application and measurement are performed with a single probe, and the Kelvin contact method, in which application and measurement are performed with different probes. It is used when it is not required, and the latter is used when high measurement accuracy is required.
【０００３】 図４および図５はこのようなケルビンコンタクト方式を採用した測定装置の従 来例（実公平３−５０４６１号公報）を示すものである。これを概略説明すると 、１は電子部品、２は電子部品１のリード、１０は測定装置である。測定装置１ ０は、板厚方向に離間して配列された第１，第２測子１１，１２と、第１，第２ 測子１１，１２の基部ａ，ｂを共通に保持するプラスチック等からなる第１保持 体１３と、第１保持体１３の上方に配設され第１測子１１の中間部Ｃの上部を保 持する第２保持体１５と、第２保持体１５を測定時に図５に示すように左方に押 圧して平行移動させるプッシャー１６等を備え、これらによってケルビンコンタ クトを構成したものである。第１，第２測子１１，１２は、電子部品１のリード 間隔で紙面と直交する方向に並列配置された、例えば７本の測子群によってそれ ぞれ構成され、その先端部ｅ，ｆが電子部品１側に略直角に折曲されて上下に対 向し、先端が電子部品１のリード２との接触部１８，１９を構成している。一方 、第１，第２測子１１，１２の下端部は第１保持体１３の下方に突出して端子部 ２０，２１を構成し、テスターの電気回路に接続されている。第２保持体１５に は貫通孔２２が形成されており、この貫通孔２２に第２測子１２の中間部ｇが挿 通されている。FIG. 4 and FIG. 5 show a conventional example (Japanese Utility Model Publication No. 3-50461) of a measuring apparatus adopting such a Kelvin contact method. Briefly explaining this, 1 is an electronic component, 2 is a lead of the electronic component 1, and 10 is a measuring device. The measuring device 10 is a plastic or the like that holds the first and second probes 11 and 12 that are spaced apart in the plate thickness direction and the bases a and b of the first and second probes 11 and 12 in common. The first holding body 13 consisting of, the second holding body 15 which is arranged above the first holding body 13 and holds the upper part of the intermediate portion C of the first probe 11, and the second holding body 15 at the time of measurement. As shown in FIG. 5, a pusher 16 for pushing in parallel to the left side and the like are provided, and these constitute a Kelvin contact. The first and second probes 11, 12 are respectively constituted by, for example, seven probe groups arranged in parallel in the direction perpendicular to the plane of the drawing at the lead interval of the electronic component 1, and their tip parts e, f are formed. Is bent at a substantially right angle to the electronic component 1 side and faces up and down, and the tips form contact portions 18 and 19 with the leads 2 of the electronic component 1. On the other hand, the lower ends of the first and second probes 11 and 12 project below the first holder 13 to form terminals 20 and 21, which are connected to the electric circuit of the tester. A through hole 22 is formed in the second holding body 15, and the intermediate portion g of the second probe 12 is inserted into the through hole 22.
【０００４】 測定に際しては、プッシャー１６により第２保持体１５を図５に示すように左 方に押圧移動させて第１，第２測子１１，１２を左方に弾性変形させ、その接触 部１８，１９をリード２の先端部にそれぞれ接触させる。そして、この接触状態 で第１，第２測子１１，１２のいずれか一方に通電し、他方側ではこの時の電圧 または電流変化を測定することで、電子部品１の特性測定が行われる。At the time of measurement, the pusher 16 pushes the second holding body 15 to the left as shown in FIG. 5 to elastically deform the first and second probes 11 and 12 to the left, and their contact portions. 18 and 19 are brought into contact with the tips of the leads 2, respectively. Then, in this contact state, one of the first and second probes 11 and 12 is energized, and the voltage or current change at this time is measured on the other side to measure the characteristics of the electronic component 1.
【０００５】[0005]
しかしながら、上記した従来の測定装置においては、測子１１，１２の長さが 長く、そのため内部抵抗による電流または電圧の減衰が大きく、高周波特性を有 する電子部品１の特性測定には未だ不十分で、改善の余地があった。また、ばね 性を利用して２つの測子をリードの片面に接触させる方式を採っているので、接 触の安定性という点でも問題があった。 However, in the above-described conventional measuring device, the lengths of the probes 11 and 12 are long, so that the current or voltage is largely attenuated by the internal resistance, and it is still insufficient for the characteristic measurement of the electronic component 1 having a high frequency characteristic. So there was room for improvement. In addition, there is also a problem in terms of contact stability because the method uses two springs to make contact with one side of the lead by utilizing the spring property.
【０００６】 したがって、本考案は上記したような従来の問題点に鑑みてなされたもので、 その目的とするところは、測子を電子部品のリードに対し安定かつ確実に接触さ せることができ、測定精度を向上させるようにした電子部品の測定装置を提供す ることにある。Therefore, the present invention has been made in view of the above-mentioned conventional problems, and an object thereof is to make a probe contact a lead of an electronic component in a stable and reliable manner. The purpose of the present invention is to provide a measuring device for electronic parts that improves the measurement accuracy.
【０００７】[0007]
上記目的を達成するため本考案は、測定すべき電子部品のリードが接触する第 １の固定測子と、この第１の固定測子と離間して配置された第２の固定測子と、 これら固定測子に対して前記電子部品とは反対側に接近、離間自在に配設された ホルダとを備え、このホルダには、測定時に一端接触部が前記電子部品のリード を介して前記第１の固定測子に圧接され、他端接触部が前記第２の固定測子に圧 接される可動側測子が配設されているものである。 In order to achieve the above-mentioned object, the present invention provides a first fixed probe that comes in contact with a lead of an electronic component to be measured, and a second fixed probe that is arranged apart from the first fixed probe. A holder is provided on the opposite side of the fixed probe so as to be close to and away from the electronic component, and at the time of measurement, this holder has a contact portion at one end through the lead of the electronic component and There is provided a movable probe which is pressed against one fixed probe and whose other end contact portion is pressed against the second fixed probe.
【０００８】[0008]
本考案において、ホルダ側に配設された可動側測子はホルダと一体に移動し、 その一端接触部が電子部品のリードに圧接され、同リードを第１の固定測子に押 し付ける。この場合、可動側測子はホルダによる押圧力によってリードに圧接さ れ、第１の固定測定子と共にリードを挟持するので、接触が安定かつ確実で、大 きな測圧が得られ、接触抵抗を小さくする。 In the present invention, the movable-side probe arranged on the holder side moves integrally with the holder, and one end contact portion thereof is pressed against the lead of the electronic component, and the lead is pressed against the first fixed probe. In this case, the movable probe is pressed into contact with the lead by the pressing force of the holder, and the lead is sandwiched together with the first fixed probe, so contact is stable and reliable, and large pressure can be obtained. To reduce.
【０００９】[0009]
以下、本考案を図面に示す実施例に基づいて詳細に説明する。 図１は本考案に係る電子部品の測定装置を示す断面図、図２は要部の拡大断面 図である。これらの図において、３０は測定装置本体で、ベース３１、上板３２ および左右に対向する一対の側板３３Ａ，３３Ｂとで構成されている。ベース３ １の上面中央部には、４つのソケット３４（３４Ａ〜３４Ｄ）と、一対のストッ パ３５Ａ，３５Ｂが配設されている。４つのソケット３４のうち左側２つのソケ ット３４Ａ，３４Ｂは対をなし、その上面にはそれぞれ複数個からなる第１，第 ２の固定測子３７，３８が突設されている。これらの第１，第２の固定測子３７ ，３８は、電子部品１の片側のリード数と同数個またはそれより多い数、例えば ７つからなり、紙面と直交する方向に電子部品１のリード間隔でそれぞれ並設さ れている。また、右側２つのソケット３４Ｃ，３４Ｄは対をなし、その上面には 同じくそれぞれ７つからなる第１，第２の固定測子３９，４０が紙面と直交する 方向にリード間隔で並設されている。 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. FIG. 1 is a sectional view showing an electronic device measuring apparatus according to the present invention, and FIG. In these figures, 30 is a measuring device main body, which is composed of a base 31, an upper plate 32, and a pair of side plates 33A and 33B facing each other in the left and right direction. Four sockets 34 (34A to 34D) and a pair of stoppers 35A and 35B are arranged in the center of the upper surface of the base 31. The left two sockets 34A, 34B of the four sockets 34 form a pair, and a plurality of first and second fixed probes 37, 38 are provided on the upper surface of the sockets 34A, 34B, respectively. The first and second fixed probes 37, 38 are the same number or more than the number of leads on one side of the electronic component 1, for example, 7, and the leads of the electronic component 1 are arranged in the direction orthogonal to the paper surface. They are arranged side by side at intervals. Further, the two sockets 34C and 34D on the right side form a pair, and on the upper surface thereof, the first and second fixed measuring elements 39 and 40, which are also each seven in number, are arranged side by side in a lead interval in a direction orthogonal to the paper surface. There is.
【００１０】 図３は第１の固定測子３７（３８，３９，４０も同様）の側面図である。第１ の固定測子３７は、銅等の導電性のよい薄い金属板によって図に示すように横向 き略Ｕ字状に形成されることにより、水平基部４１ａと、一端が水平基部４１ａ に連接されたＪ字状の弾性変形部４１ｂと、弾性変形部４１ｂの先端に上向きに 連接された接触部４１ｃとからなり、水平基部４１ａと弾性変形部４１ｂがソケ ット３４Ａ上面に形成されたスリット４２に挿入されて水平基部４１ａのみが固 定され、接触部４１ｃがソケット３４Ａの上方に突出している。また、水平基部 ４１ａの下面には端子部４１ｄが連接されている。FIG. 3 is a side view of the first fixed probe 37 (same for 38, 39, 40). The first fixed probe 37 is formed by a thin metal plate having good conductivity such as copper into a horizontal U-shape as shown in the figure, so that the horizontal base 41a and one end thereof are connected to the horizontal base 41a. The J-shaped elastically deformable portion 41b and the contact portion 41c that is connected upward to the tip of the elastically deformable portion 41b. The horizontal base 41a and the elastically deformable portion 41b are formed on the upper surface of the socket 34A. Only the horizontal base portion 41a is fixed by being inserted into 42, and the contact portion 41c projects above the socket 34A. Further, a terminal portion 41d is connected to the lower surface of the horizontal base portion 41a.
【００１１】 図２において、前記ストッパ３５Ａ，３５Ｂは、ソケット３４Ａ，３４Ｃの両 側に隣接して配設されている。第１の固定測子３７と３９の間隔は、電子部品１ のリード２Ａ，２Ｂの先端部間の間隔より短く設定されている。そして、各ソケ ット３４は、ベース３１の下方に配設されたプリント基板４３の測定回路に基板 側ソケット４４を介してそれぞれ接続されている。In FIG. 2, the stoppers 35A and 35B are arranged adjacent to both sides of the sockets 34A and 34C. The distance between the first fixed probes 37 and 39 is set shorter than the distance between the tips of the leads 2A and 2B of the electronic component 1. Each socket 34 is connected to a measurement circuit of a printed circuit board 43 arranged below the base 31 via a board side socket 44.
【００１２】 図１において、４５は前記ベース３１の上方に配設された測定シュートホルダ で、このシュートホルダ４５は両端部が前記各側板３３Ａ，３３Ｂの内側にそれ ぞれ配設された複数個のガイドシャフト４６によって上下動自在に案内保持され 、かつ圧縮コイルばね４７によって上方への復帰習性を付与されている。また、 シュートホルダ４５の上面両端部は、前記上板３２の上面両端部にそれぞれ下向 きに縦設されたシリンダ４８のシリンダヘッド４８ａにそれぞれ連結されており 、電子部品１の特性測定時にこれらシリンダ４８によって前記ばね４７に抗して 下方に平行移動されるよう構成されている。一方、シュートホルダ４５の下面中 央部にはホルダ５０がモールドガイド５１を介して配設されている。ホルダ５０ の下面中央には測定すべき電子部品１を収納する測定シュート５３がガイド５４ を介して配設されている。ガイド５４は、ホルダ５０に対して上下動自在で、ば ね５５によって下方に付勢されており、ホルダ５０の下面に配設されたストッパ ５６により下方への脱落を防止されている。In FIG. 1, reference numeral 45 denotes a measurement chute holder disposed above the base 31, and the chute holder 45 has a plurality of both ends arranged inside each of the side plates 33A and 33B. The guide shaft 46 is vertically movably guided and held, and the compression coil spring 47 imparts an upward returning habit. Further, both ends of the upper surface of the chute holder 45 are respectively connected to the cylinder heads 48a of the cylinders 48 vertically provided at the both ends of the upper surface of the upper plate 32, respectively. A cylinder 48 is configured to translate downwardly against the spring 47. On the other hand, a holder 50 is arranged in the center of the lower surface of the chute holder 45 via a mold guide 51. At the center of the lower surface of the holder 50, a measuring chute 53 for housing the electronic component 1 to be measured is arranged via a guide 54. The guide 54 is vertically movable with respect to the holder 50, is urged downward by a rod 55, and is prevented from dropping downward by a stopper 56 provided on the lower surface of the holder 50.
【００１３】 また、前記ホルダ５０の下面には図２に示すように可動側測子５８，５９が、 前記電子部品１の各リード２Ａ，２Ｂにそれぞれ対応して配設されている。左側 の可動側測子５８は、前記電子部品１の左側のリード２Ａに圧接することにより 、前記第１，第２の固定測子３７，３８と共にケルビンコンタクトを構成するも ので、これら測子３７，３８と同数でかつ同一配列ピッチにて紙面と直交する方 向に７つ並設されている。同じく右側の可動側測子５９も、前記電子部品１の右 側のリード２Ｂに圧接することにより、前記第１，第２の固定測子３９，４０と 共にケルビンコンタクトを構成するもので、これら測子３９，４０と同数でかつ 同一配列ピッチにて紙面と直交する方向に７つ並設されている。可動側測子５８ ，５９は、銅等の導電性のよい薄い金属板によって横長下向きコ字状に形成され 、前記ホルダ５０の下面に形成されたスリット６１に両端部をホルダ５０の下方 に突出させてそれぞれ差し込まれ、抜け止め片６２によって脱落を防止されてい る。一方の可動側測子５８の両端部は、電子部品１のリード２Ａと第１，第２の 固定測子３７，３８との接触部６４ａ，６４ｂをそれぞれ形成し、他方の可動側 測子５９の両端部は、電子部品１のリード２Ｂと第１，第２の固定測子３９，４ ０との接触部６５ａ，６５ｂをそれぞれ形成している。As shown in FIG. 2, movable side probes 58 and 59 are provided on the lower surface of the holder 50 so as to correspond to the leads 2A and 2B of the electronic component 1, respectively. The left movable side measuring element 58 forms a Kelvin contact together with the first and second fixed measuring elements 37 and 38 by being pressed against the left lead 2A of the electronic component 1, so these measuring elements 37 , 38 in parallel with each other at the same arrangement pitch in the direction orthogonal to the paper surface. Similarly, the movable side probe 59 on the right side also forms a Kelvin contact together with the first and second fixed probes 39, 40 by being pressed into contact with the lead 2B on the right side of the electronic component 1. Seven probes 39 and 40 are arranged in parallel at the same arrangement pitch in the direction orthogonal to the paper surface. The movable side probes 58, 59 are formed in a horizontally long downward U-shape by a thin metal plate having good conductivity such as copper, and both ends thereof are projected below the holder 50 in a slit 61 formed on the lower surface of the holder 50. Then, they are inserted respectively, and are prevented from coming off by the retaining pieces 62. Both ends of one movable side probe 58 form contact portions 64a and 64b between the lead 2A of the electronic component 1 and the first and second fixed probes 37 and 38, respectively, and the other movable side probe 59 is formed. The both ends of the contact parts 65a and 65b respectively contact the lead 2B of the electronic component 1 and the first and second fixed probes 39 and 40.
【００１４】 次に、このような構成からなる測定装置による電子部品１の特性測定について 説明する。 測定すべき電子部品１が測定シュート５３の測定位置に到着すると、不図示の デバイスストッパが電子部品１をその位置に停止させる。この停止位置は、電子 部品１の各リード２Ａ，２Ｂが第１の固定測子３７，３９および可動側測子５８ ，５９の接触部６４ａ，６５ａとそれぞれ対応一致する位置とされる。電子部品 １が測定位置に停止したことを不図示のセンサが検知すると、左右のシリンダ４ ８が同時に駆動して測定シュートホルダ４５をばね４７に抗してホルダ５０がス トッパ３５Ａ，３５Ｂに当接するまで下降させ、測定シュート５３をベース３１ の上面に押し付け、電子部品１の各リード２Ａ，２Ｂの先端部下面を各第１の固 定測子３７，３９の接触部４１ｃ（図３）上面に押し付ける。この時、ガイド５ ４はばね５５に抗して上昇するため、測定シュート５３を所定圧力にてベース３ １に押し付けることができ、その破損を防止する。また、ガイド５４が上昇する と、ホルダ５０と測定シュート５３との間隔が短縮するため、各リード２Ａ，２ Ｂの先端部上面が各可動側測子５８，５９の接触部６４ａ，６５ａにそれぞれ圧 接され、前記第１の固定測子３７，３９とで弾性的に挟持される。また、ホルダ ５０の下降により各可動側測子５８，５９の接触部６４ｂ，６５ｂは第２の固定 測子３８，４０にそれぞれ圧接される。図２はこの状態を示す。この状態におい て各第１の固定測子３７，３９に所定の電圧を印加すると、電子部品１の特性に 応じた電流が可動側測子５８，５９に生じ、これを検出することで、電子部品１ の特性を測定することができる。Next, the characteristic measurement of the electronic component 1 by the measuring device having such a configuration will be described. When the electronic component 1 to be measured reaches the measurement position of the measurement chute 53, a device stopper (not shown) stops the electronic component 1 at that position. The stop position is a position where the leads 2A and 2B of the electronic component 1 respectively correspond to the contact portions 64a and 65a of the first fixed probe 37 and 39 and the movable probe 58 and 59, respectively. When a sensor (not shown) detects that the electronic component 1 has stopped at the measurement position, the left and right cylinders 48 are simultaneously driven to resist the measurement chute holder 45 against the spring 47 and the holder 50 contacts the stoppers 35A and 35B. The measuring chute 53 is pressed against the upper surface of the base 31, and the lower surface of the tip of each lead 2A, 2B of the electronic component 1 is contacted with the contact portion 41c (FIG. 3) of the first fixed probe 37, 39. Press on. At this time, since the guide 54 rises against the spring 55, the measurement chute 53 can be pressed against the base 31 with a predetermined pressure, and its damage is prevented. Further, when the guide 54 rises, the distance between the holder 50 and the measurement chute 53 is shortened, so that the top surfaces of the tips of the leads 2A and 2B come into contact with the contact portions 64a and 65a of the movable side probes 58 and 59, respectively. It is pressed and is elastically sandwiched between the first fixed probe 37 and 39. Further, when the holder 50 is lowered, the contact portions 64b and 65b of the movable side probes 58 and 59 are brought into pressure contact with the second fixed probes 38 and 40, respectively. FIG. 2 shows this state. In this state, when a predetermined voltage is applied to the first fixed probe 37, 39, a current according to the characteristics of the electronic component 1 is generated in the movable probe 58, 59. The characteristics of component 1 can be measured.
【００１５】[0015]
以上説明したように本考案に係る電子部品の測定装置によれば、移動自在なホ ルダに可動側測子を配設し、測定時にホルダの移動により可動側測子の一端接触 部を電子部品のリードを介して第１の固定測子に圧接し、他端接触部を第２の固 定測子に圧接させるように構成したので、リード、第１の固定測子および可動側 測子の接触部の安定性が良好で、高い測圧をかけることができるケルビンコンタ クトを得ることができる。したがって、接触抵抗が小さく、安定かつ高精度な測 定を行なうことができる。 また、第１の固定測子を短く形成することがきると共に、フリーの部分が短い ので、狭いリードピッチにも確実に対応できるなど、その実用的効果は非常に大 である。 As described above, according to the electronic component measuring apparatus of the present invention, the movable side probe is disposed in the movable holder, and the one end contact portion of the movable side probe is moved by the movement of the holder during measurement. Since it is configured to press-contact the first fixed probe through the lead and the other end contact portion to the second fixed probe, the lead, the first fixed probe, and the movable probe are connected. It is possible to obtain a Kelvin contact that has good stability of the contact portion and can apply high pressure. Therefore, the contact resistance is small, and stable and highly accurate measurement can be performed. In addition, the first fixed probe can be formed short and the free portion is short, so that it is possible to reliably cope with a narrow lead pitch, and the practical effect thereof is very large.
【提出日】平成６年３月１日[Submission date] March 1, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Name of item to be corrected] 0005
【補正方法】変更[Correction method] Change
【０００５】[0005]
しかしながら、上記した従来の測定装置においては、測子１１，１２の長さが 長く、そのため内部抵抗が大きくなり計測誤差が大きく、高周波特性を有する電 子部品１の特性測定には未だ不十分で、改善の余地があった。また、ばね性を利 用して２つの測子をリードの片面に接触させる方式を採っているので、接触の安 定性という点でも問題があった。However, in the above-mentioned conventional measuring device, the lengths of the probes 11 and 12 are long, and therefore the internal resistance is large and the measurement error is large, which is still insufficient for the characteristic measurement of the electronic component 1 having a high frequency characteristic. , There was room for improvement. In addition, there is also a problem in terms of contact stability because the method uses two springs to make contact with one side of the lead by utilizing the spring property.
【図１】本考案に係る電子部品の測定装置を示す断面図
である。FIG. 1 is a cross-sectional view showing an electronic device measuring apparatus according to the present invention.
【図２】要部の拡大断面図である。FIG. 2 is an enlarged cross-sectional view of a main part.
【図３】第１の固定測子の正面図である。FIG. 3 is a front view of a first fixed probe.
【図４】ケルビンコンタクトの従来例を示す断面図であ
る。FIG. 4 is a sectional view showing a conventional example of a Kelvin contact.
【図５】同コンタクトの測定状態を示す断面図である。FIG. 5 is a cross-sectional view showing a measurement state of the contact.
１ 電子部品２，２Ａ，２Ｂ リード ３１ ベース ３７，３９ 第１の固定測子 ３８，４０ 第２の固定測子 ５０ ホルダ ５３ 測定シュート ５８，５９ 可動側測子 ６４ａ，６４ｂ 接触部 ６５ａ，６５ｂ 接触部 1 Electronic parts 2, 2A, 2B Lead 31 Base 37, 39 First fixed probe 38, 40 Second fixed probe 50 Holder 53 Measuring chute 58, 59 Movable probe 64a, 64b Contact part 65a, 65b Contact Department
Claims (1)
第１の固定測子と、この第１の固定測子と離間して配置
された第２の固定測子と、これら固定測子に対して前記
電子部品とは反対側に接近、離間自在に配設されたホル
ダとを備え、このホルダには、測定時に一端接触部が前
記電子部品のリードを介して前記第１の固定測子に圧接
され、他端接触部が前記第２の固定測子に圧接される可
動側測子が配設されていることを特徴とする電子部品の
測定装置。1. A first fixed probe which is in contact with a lead of an electronic component to be measured, a second fixed probe which is arranged apart from the first fixed probe, and these fixed probes. On the other hand, a holder arranged so as to be close to and away from the side opposite to the electronic component is provided, and the holder has a contact portion at one end at the time of measurement via the lead of the electronic component. A measuring device for an electronic component, wherein a movable-side probe is arranged to be pressed into contact with the second fixed probe and the other end contact portion is pressed into contact with the second fixed probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7372493U JP2540157Y2 (en) | 1993-12-27 | 1993-12-27 | Electronic component measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7372493U JP2540157Y2 (en) | 1993-12-27 | 1993-12-27 | Electronic component measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0741478U true JPH0741478U (en) | 1995-07-21 |
| JP2540157Y2 JP2540157Y2 (en) | 1997-07-02 |
Family
ID=13526469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7372493U Expired - Lifetime JP2540157Y2 (en) | 1993-12-27 | 1993-12-27 | Electronic component measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2540157Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157522A (en) * | 2012-01-31 | 2013-08-15 | Fuji Electric Co Ltd | Semiconductor device, method of manufacturing semiconductor device, testing instrument for semiconductor device, method of testing semiconductor device, and method of connecting semiconductor device |
-
1993
- 1993-12-27 JP JP7372493U patent/JP2540157Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157522A (en) * | 2012-01-31 | 2013-08-15 | Fuji Electric Co Ltd | Semiconductor device, method of manufacturing semiconductor device, testing instrument for semiconductor device, method of testing semiconductor device, and method of connecting semiconductor device |
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| Publication number | Publication date |
|---|---|
| JP2540157Y2 (en) | 1997-07-02 |
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