JPH07326779A - Sensor module - Google Patents
Sensor moduleInfo
- Publication number
- JPH07326779A JPH07326779A JP6117012A JP11701294A JPH07326779A JP H07326779 A JPH07326779 A JP H07326779A JP 6117012 A JP6117012 A JP 6117012A JP 11701294 A JP11701294 A JP 11701294A JP H07326779 A JPH07326779 A JP H07326779A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sensor
- bare chip
- chip mounting
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、赤外線、紫外線等を検
出するセンサーモジュールに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor module for detecting infrared rays, ultraviolet rays and the like.
【０００２】[0002]
【従来の技術】従来、赤外線、紫外線等を検出するセン
サーの構成単位として、 CANパッケージに封止された受
光センサーチップ及びその受光センサーチップの出力信
号を処理する信号処理用IC及びその信号処理用ICの周辺
部品を１枚の基板上に実装したセンサーモジュールとい
う構成が用いられていた。2. Description of the Related Art Conventionally, a light-receiving sensor chip encapsulated in a CAN package, a signal processing IC for processing an output signal of the light-receiving sensor chip, and a signal processing IC as a constituent unit of a sensor for detecting infrared rays, ultraviolet rays, etc. A sensor module was used in which IC peripheral components were mounted on a single board.
【０００３】図４に赤外線を検出する赤外線センサーモ
ジュールの一例を示す。図４で、（ａ）は赤外線センサ
ーモジュールの表側（赤外線を受光する側）の構造を示
した斜視図、（ｂ）は赤外線センサーモジュールの裏側
の構造を示した斜視図である。図４で、１は本体基板、
２は赤外線センサーチップを内蔵した CANパッケージ、
３はクワッドフラットパッケージ形の信号処理用IC、４
は本体部分が本体基板１の表側に実装された、ＬＥＤ、
電解コンデンサ等のリード端子付き部品、５は本体基板
１の裏面側に実装された表面実装用のチップ部品であ
る。２ａは CANパッケージ２の上部に形成された開口に
固着された赤外線フィルターで、赤外線のみを CANパッ
ケージ２の内部に透過させるものである。FIG. 4 shows an example of an infrared sensor module for detecting infrared rays. In FIG. 4, (a) is a perspective view showing the structure of the front side (the side receiving infrared rays) of the infrared sensor module, and (b) is a perspective view showing the structure of the back side of the infrared sensor module. In FIG. 4, 1 is a main substrate,
2 is a CAN package with built-in infrared sensor chip,
3 is a quad flat package type signal processing IC, 4
Is an LED whose main body is mounted on the front side of the main board 1,
Components 5 with lead terminals, such as electrolytic capacitors, are chip components for surface mounting mounted on the back surface side of the main body substrate 1. Reference numeral 2a is an infrared filter fixed to an opening formed in the upper part of the CAN package 2 and transmits only infrared rays to the inside of the CAN package 2.
【０００４】[0004]
【発明が解決しようとする課題】図４に示したように、
例えば、赤外線センサーチップの場合、 CANパッケージ
に封止されていた。これは赤外線センサーチップの信頼
性及び感度を保持するためと、赤外線をパッケージ内部
に透過させるセンサー受光窓を設けることができるパッ
ケージにする必要があるからである。しかし、 CANパッ
ケージは小型化が困難で、また、高感度が要求される場
合は内部に特定の封入ガスを充填しなければならないの
でコスト高になるという問題点があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As shown in FIG.
For example, infrared sensor chips were encapsulated in CAN packages. This is because in order to maintain the reliability and sensitivity of the infrared sensor chip, it is necessary to make the package capable of providing a sensor light receiving window for transmitting infrared rays inside the package. However, the CAN package is difficult to miniaturize, and if high sensitivity is required, it is necessary to fill the inside with a specific enclosed gas, resulting in high cost.
【０００５】赤外線センサーチップを CAN封止せずに赤
外線センサーモジュールを構成する方法としては、本体
基板の他に、一方の面に赤外線センサーチップをベアチ
ップ実装し他方の面に信号処理用ICのベアチップを実装
したベアチップ実装基板を設けて、そのベアチップ実装
基板を本体基板に実装する方法があった。図５にそのベ
アチップ実装基板の一例を示す。図５は、ベアチップ実
装基板６の側面図で、７はベアチップ実装基板６の本体
となる小基板、８は小基板７の一方の面にダイボンドさ
れた赤外線センサーチップ、９は小基板７の他方の面に
ダイボンドされたベアチップ状の信号処理用IC、１０
は、赤外線センサーチップ８と小基板７、または、信号
処理用IC９と小基板７とを接続するボンディングワイ
ヤ、１１は信号処理用IC９及びそれに接続されたボンデ
ィングワイヤ１０を保護する封止樹脂である。As a method of constructing an infrared sensor module without sealing the infrared sensor chip in CAN, an infrared sensor chip is bare chip mounted on one surface and a bare chip of a signal processing IC is mounted on the other surface in addition to the main body substrate. There is a method of providing a mounted bare chip mounting substrate and mounting the bare chip mounting substrate on the main body substrate. FIG. 5 shows an example of the bare chip mounting substrate. FIG. 5 is a side view of the bare chip mounting substrate 6, where 7 is a small substrate that is the main body of the bare chip mounting substrate 6, 8 is an infrared sensor chip die-bonded to one surface of the small substrate 7, and 9 is the other of the small substrate 7. Bare chip signal processing IC die-bonded to the surface of the
Is a bonding wire that connects the infrared sensor chip 8 and the small substrate 7, or the signal processing IC 9 and the small substrate 7, and 11 is a sealing resin that protects the signal processing IC 9 and the bonding wire 10 connected thereto. .
【０００６】次に、図６に赤外線センサーモジュールの
一例を示す。図６で、（ａ）はベアチップ実装基板６を
本体基板１２に実装する前の状態を示す本体基板表側の
斜視図、（ｂ）はベアチップ実装基板６を本体基板１２
に実装する前の状態を示す本体基板裏側の斜視図、
（ｃ）はベアチップ実装基板６を本体基板１２に実装し
た状態を示す本体基板表側の斜視図、（ｄ）はベアチッ
プ実装基板６を本体基板１２に実装した状態を示す本体
基板裏側の斜視図である。Next, FIG. 6 shows an example of an infrared sensor module. 6, (a) is a perspective view of the front side of the main body substrate showing a state before the bare chip mounting substrate 6 is mounted on the main body substrate 12, and (b) shows the bare chip mounting substrate 6 on the main substrate 12.
A perspective view of the back side of the main body board showing the state before mounting on
(C) is a perspective view of the front side of the main body board showing a state where the bare chip mounting board 6 is mounted on the main body substrate 12, and (d) is a perspective view of the back side of the main body board showing a state where the bare chip mounting board 6 is mounted on the main body substrate 12. is there.
【０００７】図６で、本体基板１２には両面に回路パタ
ーンが形成されていると共に、平面視略矩形状のセンサ
ー受光窓１２ａが中央部分に形成されている。１３は電
解コンデンサ等のリード付電子部品、１４は表面実装用
のチップ部品である。In FIG. 6, a circuit pattern is formed on both sides of the main body substrate 12, and a sensor light receiving window 12a having a substantially rectangular shape in plan view is formed in the central portion. Reference numeral 13 is an electronic component with leads such as an electrolytic capacitor, and 14 is a chip component for surface mounting.
【０００８】図に示すように、赤外線センサーチップ８
の上部の受光面が本体基板１２に形成されたセンサー受
光窓１２ａに臨みベアチップ実装基板６がセンサー受光
窓１２ａの一方の開口を塞ぐようにベアチップ実装基板
６は本体基板１２に接着剤によって固着されている。ま
た、センサー受光窓１２ａの他方の開口を塞ぐようにプ
ラスチックフィルター１５が本体基板１２に取り付けら
れている。このように構成することによって、封止工程
の簡略化によるコスト低減、小型化を図ることができ
た。As shown in the figure, the infrared sensor chip 8
The bare chip mounting substrate 6 is fixed to the main body substrate 12 with an adhesive so that the upper light receiving surface of the bare chip mounting substrate 6 faces the sensor light receiving window 12a formed in the main substrate 12 and the bare chip mounting substrate 6 closes one opening of the sensor light receiving window 12a. ing. Further, a plastic filter 15 is attached to the main body substrate 12 so as to close the other opening of the sensor light receiving window 12a. With such a configuration, cost reduction and size reduction can be achieved by simplifying the sealing process.
【０００９】次に、図５に示したベアチップ実装基板６
を本体基板１２に実装する工程を図７の断面図に基づい
て説明する。まず、（ａ）に示すように、本体基板１２
上に形成されたセンサー受光窓１２ａの開口のうち、チ
ップ部品１４を実装する面側の開口１２ｂに赤外線セン
サーチップ８が臨むように、ベアチップ実装基板６を本
体基板１２上に配置する。（ｂ）は配置した状態を示し
た断面図である。次に、リフローによる半田付けによ
り、チップ部品１４と共にベアチップ実装基板６を本体
基板１２に固着する。しかし、このリフロー時のベアチ
ップ実装基板６の位置決めが困難で、（ｃ）に示すよう
に、本体基板１２に対して位置がずれた状態でベアチッ
プ実装基板６が本体基板１２に固着されることがあっ
た。これにより、本体基板１２とベアチップ実装基板６
とが正しく接続されずセンサーモジュールが正常に動作
しないという問題点があった。Next, the bare chip mounting substrate 6 shown in FIG.
A process of mounting the substrate on the main body substrate 12 will be described based on the sectional view of FIG. First, as shown in FIG.
The bare chip mounting substrate 6 is arranged on the main substrate 12 so that the infrared sensor chip 8 faces the opening 12b on the surface side where the chip component 14 is mounted among the openings of the sensor light receiving window 12a formed above. (B) is sectional drawing which showed the state arrange | positioned. Next, the bare chip mounting substrate 6 is fixed to the main body substrate 12 together with the chip component 14 by soldering by reflow. However, it is difficult to position the bare chip mounting substrate 6 during this reflow, and the bare chip mounting substrate 6 may be fixed to the main substrate 12 in a state of being displaced from the main substrate 12 as shown in (c). there were. As a result, the main body substrate 12 and the bare chip mounting substrate 6
There was a problem that and were not connected correctly and the sensor module did not work properly.
【００１０】本発明は上記課題に鑑みなされたもので、
その目的とするところは、本体基板に対するベアチップ
実装基板の位置ずれによる動作不良を防止することがで
きるセンサーモジュールの構造を提供することにある。The present invention has been made in view of the above problems,
It is an object of the present invention to provide a structure of a sensor module capable of preventing malfunction due to the displacement of the bare chip mounting substrate with respect to the main body substrate.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するた
め、本発明のセンサーモジュールは、受光センサーチッ
プ及び信号処理用ICを実装したセンサーモジュールにお
いて、本体基板にセンサー受光窓を形成し、一方の面に
前記受光センサーチップを実装し他方の面に前記信号処
理用ICをベアチップ実装したベアチップ実装基板上に、
前記受光センサーチップを覆い前記センサー受光窓に嵌
合する中空有底のフィルター兼用位置決めカバーを固着
すると共に、そのフィルター兼用位置決めカバーが前記
センサー受光窓に嵌合するように前記本体基板にベアチ
ップ実装基板を実装したことを特徴とするものである。In order to achieve the above object, the sensor module of the present invention is a sensor module in which a light receiving sensor chip and a signal processing IC are mounted. On the bare chip mounting substrate on which the light-receiving sensor chip is mounted on the surface and the signal processing IC is mounted on the other surface on the bare chip,
A hollow bottomed filter / positioning cover that covers the light-receiving sensor chip and fits into the sensor light-receiving window is fixed, and a bare-chip mounting substrate is mounted on the main body substrate so that the filter / positioning cover fits into the sensor light-receiving window. It is characterized by implementing.
【００１２】[0012]
【作用】本発明のセンサーモジュールは、中空有底のフ
ィルター兼用位置決めカバーを受光センサーチップに被
せることによって受光センサーチップを保護すると共
に、フィルター兼用位置決めカバーによって本体基板に
対する受光センサーチップの位置決めを確実にすること
を特徴とするものである。これは、フィルター兼用位置
決めカバーの外形形状が本体基板に形成されたセンサー
受光窓に嵌合する形状に形成されているからである。The sensor module of the present invention protects the light-receiving sensor chip by covering the light-receiving sensor chip with the hollow bottomed filter / positioning cover, and ensures the positioning of the light-receiving sensor chip with respect to the main body substrate by the filter / positioning cover. It is characterized by doing. This is because the outer shape of the filter / positioning cover is formed to fit into the sensor light receiving window formed on the main body substrate.
【００１３】[0013]
【実施例】図１に本発明のセンサーモジュールに用いる
ベアチップ実装基板１６の一実施例を示す。図で、１７
は小基板、１８は赤外線センサーチップ、１９はベアチ
ップ状の信号処理用IC、２０は赤外線センサーチップ１
８と小基板１７、または、信号処理用IC１９と小基板１
７とを接続するボンディングワイヤ、２１は信号処理用
IC１９及びそれに接続されたボンディングワイヤ２０を
保護する封止樹脂、２２はフィルター兼用位置決めカバ
ーである。FIG. 1 shows an embodiment of a bare chip mounting substrate 16 used in the sensor module of the present invention. In the figure, 17
Is a small substrate, 18 is an infrared sensor chip, 19 is a bare chip-shaped signal processing IC, and 20 is an infrared sensor chip 1.
8 and small board 17, or signal processing IC 19 and small board 1
Bonding wire connecting 7 and 21 for signal processing
A sealing resin 22 for protecting the IC 19 and the bonding wire 20 connected to the IC 19 and a positioning cover 22 also serving as a filter.
【００１４】フィルター兼用位置決めカバー２２は、従
来のプラスチックフィルタの機能を備えた中空有底状の
カバーで、赤外線センサーチップ１８を覆うように小基
板１７に固着されている。また、フィルター兼用位置決
めカバー２２の外形形状は本体基板１２上にに形成され
たセンサー受光窓１２ａに嵌合するように形成されてい
る。このように構成することによって、図２の断面図に
示すように、センサー受光窓１２ａにフィルター兼用位
置決めカバー２２が嵌合するようにベアチップ実装基板
１６を本体基板１２上に配置してリフローによる半田付
けを行うことができるので本体基板１２に対するベアチ
ップ実装基板１６の位置ずれを防止することができる。The filter / positioning cover 22 is a hollow bottomed cover having the function of a conventional plastic filter, and is fixed to the small substrate 17 so as to cover the infrared sensor chip 18. Further, the outer shape of the filter / positioning cover 22 is formed so as to fit into the sensor light receiving window 12 a formed on the main body substrate 12. With this configuration, as shown in the cross-sectional view of FIG. 2, the bare chip mounting substrate 16 is arranged on the main body substrate 12 so that the filter / positioning cover 22 fits into the sensor light receiving window 12a, and soldering by reflow is performed. Since the mounting can be performed, it is possible to prevent the displacement of the bare chip mounting substrate 16 with respect to the main body substrate 12.
【００１５】次に、図３の側面図に基づいてベアチップ
実装基板１６の製造工程を説明する。まず、（ａ）に示
すように、小基板１７の一方の面上に信号処理用IC１９
をダイボンドする。次に、（ｂ）に示すように、小基板
１７上に形成されたボンディングパッド（図示省略）と
信号処理用IC１９に形成された電極パッド（図示省略）
とをボンディングワイヤ２０によって接続する。次に、
（ｃ）に示すように、信号処理用IC１９及びその信号処
理用IC１９に接続されたボンディングワイヤ２０を封止
樹脂２１により封止する。次に、（ｄ）に示すように、
小基板１７の他方の面上に赤外線センサーチップ１８を
ダイボンドする。次に、（ｅ）に示すように、小基板１
７上に形成されたボンディングパッド（図示省略）と赤
外線センサーチップ１８に形成された電極パッド（図示
省略）とをボンディングワイヤ２０によって接続する。
最後に、（ｆ）に示すように、赤外線センサーチップ１
８がフィルター兼用位置決めカバー２２によって覆われ
るように、小基板１７上にフィルター兼用位置決めカバ
ー２２を固着すればよい。Next, the manufacturing process of the bare chip mounting substrate 16 will be described with reference to the side view of FIG. First, as shown in (a), the signal processing IC 19 is provided on one surface of the small board 17.
Die bond. Next, as shown in (b), bonding pads (not shown) formed on the small substrate 17 and electrode pads (not shown) formed on the signal processing IC 19 are shown.
Are connected by a bonding wire 20. next,
As shown in (c), the signal processing IC 19 and the bonding wire 20 connected to the signal processing IC 19 are sealed with a sealing resin 21. Next, as shown in (d),
The infrared sensor chip 18 is die-bonded on the other surface of the small substrate 17. Next, as shown in (e), the small substrate 1
Bonding pads (not shown) formed on the substrate 7 and electrode pads (not shown) formed on the infrared sensor chip 18 are connected by bonding wires 20.
Finally, as shown in (f), the infrared sensor chip 1
The filter / positioning cover 22 may be fixed on the small substrate 17 so that the filter / positioning cover 22 covers the parts 8.
【００１６】なお、受光センサーチップは赤外線センサ
ーチップであるとして説明したが、実施例に限定される
ものではない。Although the light-receiving sensor chip has been described as an infrared sensor chip, it is not limited to the embodiment.
【００１７】[0017]
【発明の効果】以上のように、本発明のセンサーモジュ
ールでは、受光センサチップを覆うフィルター兼用位置
決めカバーが本体基板に形成されたセンサー受光窓に嵌
合するように構成したので、リフロー時の本体基板に対
するベアチップ実装基板の位置ずれを防止することがで
きるので、封止工程の簡略化による低コスト化、及び、
小型化を図ることができる。As described above, in the sensor module of the present invention, the filter / positioning cover for covering the light receiving sensor chip is configured to fit into the sensor light receiving window formed on the main body substrate, so that the main body at the time of reflow is formed. Since it is possible to prevent the displacement of the bare chip mounting substrate with respect to the substrate, the cost can be reduced by simplifying the sealing process, and
The size can be reduced.
【図１】本発明のセンサーモジュールに用いられるベア
チップ実装基板の一実施例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a bare chip mounting substrate used in a sensor module of the present invention.
【図２】本発明のセンサーモジュールの一実施例の断面
図である。FIG. 2 is a sectional view of an embodiment of the sensor module of the present invention.
【図３】本発明のセンサーモジュールに用いられるベア
チップ実装基板の一実施例の製造工程を示す工程図であ
る。FIG. 3 is a process drawing showing a manufacturing process of an example of a bare chip mounting substrate used in the sensor module of the present invention.
【図４】従来のセンサーモジュールの一例を示す図で、
（ａ）は表面側の構造を示す斜視図、（ｂ）は裏面側の
構造を示す斜視図である。FIG. 4 is a diagram showing an example of a conventional sensor module,
(A) is a perspective view showing the structure on the front surface side, and (b) is a perspective view showing the structure on the back surface side.
【図５】従来のセンサーモジュールに用いられるベアチ
ップ実装基板の一例を示す断面図である。FIG. 5 is a cross-sectional view showing an example of a bare chip mounting substrate used for a conventional sensor module.
【図６】従来のセンサーモジュールの一例を示す斜視図
である。FIG. 6 is a perspective view showing an example of a conventional sensor module.
【図７】従来のセンサーモジュールの問題点を説明する
ための断面図である。FIG. 7 is a cross-sectional view illustrating a problem of a conventional sensor module.
１２ 本体基板 １２ａ センサー受光窓 １６ ベアチップ実装基板 １８ 赤外線センサーチップ（受光センサ
ーチップ） １９ 信号処理用IC ２２ フィルター兼用位置決めカバー12 Main body board 12a Sensor light receiving window 16 Bare chip mounting board 18 Infrared sensor chip (light receiving sensor chip) 19 Signal processing IC 22 Filter and positioning cover
Claims (1)
実装したセンサーモジュールにおいて、本体基板にセン
サー受光窓を形成し、一方の面に前記受光センサーチッ
プを実装し他方の面に前記信号処理用ICをベアチップ実
装したベアチップ実装基板上に、前記受光センサーチッ
プを覆い前記センサー受光窓に嵌合する中空有底のフィ
ルター兼用位置決めカバーを固着すると共に、そのフィ
ルター兼用位置決めカバーが前記センサー受光窓に嵌合
するように前記本体基板にベアチップ実装基板を実装し
たことを特徴とするセンサーモジュール。1. A sensor module having a light receiving sensor chip and a signal processing IC mounted thereon, wherein a sensor light receiving window is formed on a main body substrate, the light receiving sensor chip is mounted on one surface, and the signal processing IC is mounted on the other surface. A bare bottom filter / positioning cover that covers the light-receiving sensor chip and fits into the sensor light-receiving window is fixed on the bare-chip mounting substrate on which the filter / positioning cover also fits into the sensor light-receiving window. A bare chip mounting substrate is mounted on the main body substrate as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117012A JPH07326779A (en) | 1994-05-30 | 1994-05-30 | Sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117012A JPH07326779A (en) | 1994-05-30 | 1994-05-30 | Sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07326779A true JPH07326779A (en) | 1995-12-12 |
Family
ID=14701272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6117012A Withdrawn JPH07326779A (en) | 1994-05-30 | 1994-05-30 | Sensor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07326779A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6814883B2 (en) | 2001-08-27 | 2004-11-09 | Murata Manufacturing Co., Ltd. | High frequency magnetic material and high frequency circuit element including the same |
| KR100497533B1 (en) * | 2002-08-28 | 2005-07-01 | 송기영 | structure and manufacturing methode of photo sensor for infrared remote controller |
| EP1226611B1 (en) * | 1999-11-04 | 2006-12-20 | STMicroelectronics S.A. | Optical semiconductor housing and method for making same |
| KR100685117B1 (en) * | 2005-07-01 | 2007-02-27 | 루미컴 주식회사 | Infrared Receiver Module |
| WO2015037390A1 (en) * | 2013-09-10 | 2015-03-19 | 株式会社村田製作所 | Sensor module |
-
1994
- 1994-05-30 JP JP6117012A patent/JPH07326779A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1226611B1 (en) * | 1999-11-04 | 2006-12-20 | STMicroelectronics S.A. | Optical semiconductor housing and method for making same |
| US6814883B2 (en) | 2001-08-27 | 2004-11-09 | Murata Manufacturing Co., Ltd. | High frequency magnetic material and high frequency circuit element including the same |
| KR100497533B1 (en) * | 2002-08-28 | 2005-07-01 | 송기영 | structure and manufacturing methode of photo sensor for infrared remote controller |
| KR100685117B1 (en) * | 2005-07-01 | 2007-02-27 | 루미컴 주식회사 | Infrared Receiver Module |
| WO2015037390A1 (en) * | 2013-09-10 | 2015-03-19 | 株式会社村田製作所 | Sensor module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010731 |