JPH07307533A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH07307533A JPH07307533A JP9725894A JP9725894A JPH07307533A JP H07307533 A JPH07307533 A JP H07307533A JP 9725894 A JP9725894 A JP 9725894A JP 9725894 A JP9725894 A JP 9725894A JP H07307533 A JPH07307533 A JP H07307533A
- Authority
- JP
- Japan
- Prior art keywords
- resin plate
- printed wiring
- wiring board
- plate
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はプリント配線基板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board.
【０００２】[0002]
【従来の技術】図９は電子部品を実装した従来のプリン
ト配線基板の一部を示す断面図である。図に示すよう
に、金属板１に樹脂板２が設けられ、樹脂板２の表面に
配線３が形成され、樹脂板２に収納穴４が設けられ、収
納穴４内に金属板１と接するように電子部品５が挿入さ
れ、電子部品５のリード線６がハンダ７によって配線３
に接続されている。2. Description of the Related Art FIG. 9 is a sectional view showing a part of a conventional printed wiring board on which electronic components are mounted. As shown in the figure, a metal plate 1 is provided with a resin plate 2, a wiring 3 is formed on the surface of the resin plate 2, a storage hole 4 is provided in the resin plate 2, and the metal plate 1 is in contact with the storage hole 4. The electronic component 5 is inserted as shown in FIG.
It is connected to the.
【０００３】このプリント配線基板においては、電子部
品５から発せられる熱を金属板１を介して放熱すること
ができるから、放熱性が良好であるので、フィンを有す
る電子部品を用いる必要がない。In this printed wiring board, the heat generated from the electronic component 5 can be radiated through the metal plate 1, so that the heat radiation property is good and it is not necessary to use the electronic component having the fins.
【０００４】なお、この種の従来技術について記載され
ている文献としては、特開昭６２−２３９５９７号公報
を挙げることができる。As a document describing this type of conventional technique, there is JP-A-62-239597.
【０００５】[0005]
【発明が解決しようとする課題】しかし、このようなプ
リント配線基板においては、電子部品５を実装するとき
に、電子部品５を収納穴４内に挿入する必要があるか
ら、電子部品５の実装作業が面倒であり、また特殊なリ
ード線６を有する電子部品５を実装しなければならない
から、実装すべき電子部品５が高価となる。However, in such a printed wiring board, when the electronic component 5 is mounted, it is necessary to insert the electronic component 5 into the accommodation hole 4, so that the mounting of the electronic component 5 is performed. Since the work is troublesome and the electronic component 5 having the special lead wire 6 has to be mounted, the electronic component 5 to be mounted becomes expensive.
【０００６】この発明は上述の課題を解決するためにな
されたもので、放熱性が良好であり、しかも電子部品の
実装作業が容易であり、かつ実装すべき電子部品が高価
ではないプリント配線基板を提供することを目的とす
る。The present invention has been made to solve the above-mentioned problems, and has a good heat dissipation property, the mounting work of electronic parts is easy, and the electronic parts to be mounted are not expensive printed wiring boards. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、この発明においては、金属板に樹脂板が設けられ、
上記樹脂板に配線が形成されたプリント配線基板におい
て、上記金属板の上記樹脂板側に表面が上記樹脂板の表
面と同一平面である凸部を設ける。To achieve this object, in the present invention, a metal plate is provided with a resin plate,
In a printed wiring board in which wiring is formed on the resin plate, a convex portion whose surface is flush with the surface of the resin plate is provided on the resin plate side of the metal plate.
【０００８】また、金属板に樹脂板が設けられ、上記樹
脂板に配線が形成されたプリント配線基板において、上
記金属板の上記樹脂板側に表面が上記樹脂板の表面から
突出した凸部を設ける。Further, in a printed wiring board in which a resin plate is provided on a metal plate and wiring is formed on the resin plate, a convex portion whose surface protrudes from the surface of the resin plate is provided on the resin plate side of the metal plate. Set up.
【０００９】[0009]
【作用】このプリント配線基板においては、電子部品か
ら発せられる熱を金属板を介して放熱することができ、
しかも電子部品を実装するときに、電子部品を収納穴内
に挿入する必要がなく、また特殊なリード線を有しない
通常の電子部品を実装することができる。In this printed wiring board, the heat generated from the electronic component can be radiated through the metal plate,
Moreover, when mounting the electronic component, it is not necessary to insert the electronic component into the storage hole, and a normal electronic component having no special lead wire can be mounted.
【００１０】[0010]
【実施例】図１は電子部品を実装したこの発明に係るプ
リント配線基板の一部を示す断面図、図２は図１に示し
たプリント配線基板の全体を示す概略図である。図に示
すように、金属板１１に樹脂板１３が設けられ、樹脂板
１３の表面に配線１４が形成され、金属板１１の樹脂板
１３側に凸部１２が設けられ、凸部１２の表面が樹脂板
１３の表面と同一平面であり、金属板１１と接するよう
に電子部品１５が設けられ、電子部品１５のリード線１
６がハンダ１７によって配線１４に接続されている。1 is a sectional view showing a part of a printed wiring board according to the present invention on which electronic parts are mounted, and FIG. 2 is a schematic view showing the entire printed wiring board shown in FIG. As shown in the figure, the metal plate 11 is provided with the resin plate 13, the wiring 14 is formed on the surface of the resin plate 13, the convex portion 12 is provided on the resin plate 13 side of the metal plate 11, and the surface of the convex portion 12 is provided. Is flush with the surface of the resin plate 13, the electronic component 15 is provided so as to contact the metal plate 11, and the lead wire 1 of the electronic component 15 is provided.
6 is connected to the wiring 14 by the solder 17.
【００１１】つぎに、図３により図１、図２に示したプ
リント配線基板を製造する方法について説明する。ま
ず、図３(ａ)に示すように、金属板１１の片面を選択的
にエッチングすることにより、金属板１１の所定位置に
凸部１２を設ける。つぎに、図３(ｂ)に示すように、表
面に銅箔３３が設けられた樹脂板１３の凸部１２に対応
する部分に穴を設け、金属板１１の凸部１２が設けられ
た面に樹脂板１３を設ける。つぎに、図３(ｃ)に示すよ
うに、銅箔３３を選択的にエッチングすることにより、
配線１４を形成する。Next, a method for manufacturing the printed wiring board shown in FIGS. 1 and 2 will be described with reference to FIG. First, as shown in FIG. 3A, a convex portion 12 is provided at a predetermined position on the metal plate 11 by selectively etching one surface of the metal plate 11. Next, as shown in FIG. 3 (b), a hole is provided in a portion corresponding to the convex portion 12 of the resin plate 13 on the surface of which the copper foil 33 is provided, and the surface of the metal plate 11 on which the convex portion 12 is provided. A resin plate 13 is provided on the. Next, as shown in FIG. 3C, by selectively etching the copper foil 33,
The wiring 14 is formed.
【００１２】このプリント配線基板においては、電子部
品１５から発せられる熱を金属板１１を介して放熱する
ことができるから、放熱性が良好である。このため、フ
ィンを有する電子部品を用いる必要がないから、高密度
に電子部品を実装したプリント配線基板を高密度に配置
することができる。しかも、電子部品１５を実装すると
きに、電子部品１５を収納穴内に挿入する必要がないか
ら、電子部品１５の実装作業が容易であり、また特殊な
リード線を有しない通常の電子部品１５を実装すること
ができるから、実装すべき電子部品１５が高価となるこ
とがない。In this printed wiring board, the heat generated from the electronic component 15 can be radiated through the metal plate 11, so that the heat radiation property is good. For this reason, it is not necessary to use an electronic component having fins, and thus a printed wiring board on which electronic components are mounted at a high density can be arranged at a high density. Moreover, since it is not necessary to insert the electronic component 15 into the accommodation hole when mounting the electronic component 15, the mounting work of the electronic component 15 is easy, and the normal electronic component 15 having no special lead wire is used. Since it can be mounted, the electronic component 15 to be mounted does not become expensive.
【００１３】図４はこの発明に係る他のプリント配線基
板の一部を示す断面図、図５は図４に示したプリント配
線基板の全体を示す概略図である。図に示すように、金
属板１１の凸部１２が設けられた面とは反対側の面に樹
脂板１８が設けられ、樹脂板１８の表面に配線１９が形
成され、金属板１１に穴２０が設けられ、配線１４と配
線１９とを接続するスルホール２１が設けられ、スルホ
ール２１は穴２０を貫通し、金属板１１には樹脂板１３
から突出した突出部１１ａが設けられている。FIG. 4 is a sectional view showing a part of another printed wiring board according to the present invention, and FIG. 5 is a schematic view showing the entire printed wiring board shown in FIG. As shown in the figure, a resin plate 18 is provided on the surface of the metal plate 11 opposite to the surface on which the convex portions 12 are provided, wiring 19 is formed on the surface of the resin plate 18, and holes 20 are formed in the metal plate 11. Is provided, a through hole 21 that connects the wiring 14 and the wiring 19 is provided, the through hole 21 penetrates the hole 20, and the metal plate 11 has the resin plate 13
A projecting portion 11a projecting from is provided.
【００１４】このプリント配線基板においては、２層の
配線１４、１９が形成されているから、配線を高密度に
することができる。また、金属板１１には突出部１１ａ
が設けられているから、突出部１１ａを筐体等に取り付
ければ、電子部品１５から発せられた熱を筐体等に伝達
することができる。In this printed wiring board, since the two layers of wirings 14 and 19 are formed, the wirings can have a high density. In addition, the metal plate 11 has a protrusion 11a.
Therefore, if the protrusion 11a is attached to the housing or the like, the heat generated from the electronic component 15 can be transferred to the housing or the like.
【００１５】図６はこの発明に係る他のプリント配線基
板の一部を示す断面図である。図に示すように、金属板
１１の凸部１２が設けられた面とは反対側の面に凸部３
４が設けられ、凸部３４の表面が樹脂板１８の表面と同
一平面である。FIG. 6 is a sectional view showing a part of another printed wiring board according to the present invention. As shown in the figure, the protrusion 3 is formed on the surface of the metal plate 11 opposite to the surface on which the protrusion 12 is provided.
4 is provided, and the surface of the convex portion 34 is flush with the surface of the resin plate 18.
【００１６】このプリント配線基板においては、基板の
両面に凸部１２、３４の表面が露出しているから、基板
の両面に電子部品を実装することができる。In this printed wiring board, since the surfaces of the projections 12 and 34 are exposed on both surfaces of the board, electronic parts can be mounted on both surfaces of the board.
【００１７】図７はこの発明に係る他のプリント配線基
板の一部を示す断面図、図８は図７に示したプリント配
線基板の全体を示す概略図である。図に示すように、金
属板１１の凸部１２が設けられた面とは反対側の面に樹
脂板２４が設けられ、樹脂板２４の金属板１１側とは反
対側に金属板２２が設けられ、金属板２２の樹脂板２４
側とは反対側に凸部２３が設けられ、金属板２２の樹脂
板２４側とは反対側に樹脂板２５が設けられ、凸部２３
の表面が樹脂板２５の表面と同一平面であり、樹脂板２
５の表面に配線２６が形成され、樹脂板１３の内部に配
線２７が形成され、樹脂板２４の内部に配線２８が形成
され、樹脂板２５の内部に配線２９が形成され、金属板
１１、２２に穴３０、３１が設けられ、配線１４、２６
〜２９を接続するスルホール３２が設けられ、スルホー
ル３２は穴３０、３１を貫通し、金属板１１、２２には
樹脂板１３、２４、２５から突出した曲げ部１１ｂ、２
２ａが設けられている。FIG. 7 is a sectional view showing a part of another printed wiring board according to the present invention, and FIG. 8 is a schematic view showing the entire printed wiring board shown in FIG. As shown in the drawing, a resin plate 24 is provided on the surface of the metal plate 11 opposite to the surface on which the convex portion 12 is provided, and a metal plate 22 is provided on the opposite side of the resin plate 24 from the metal plate 11 side. The resin plate 24 of the metal plate 22
The convex portion 23 is provided on the side opposite to the side, and the resin plate 25 is provided on the side opposite to the resin plate 24 side of the metal plate 22.
Of the resin plate 2 is flush with the surface of the resin plate 25.
5, the wiring 26 is formed on the surface of the resin plate 5, the wiring 27 is formed inside the resin plate 13, the wiring 28 is formed inside the resin plate 24, and the wiring 29 is formed inside the resin plate 25. 22 are provided with holes 30 and 31, and wirings 14 and 26 are provided.
Through-holes 32 are provided to connect the through holes 32, 31 to the through-holes 32, 31 and the metal plates 11, 22 have bent portions 11 b, 2 protruding from the resin plates 13, 24, 25.
2a is provided.
【００１８】このプリント配線基板においては、２枚の
金属板１１、２２が設けられ、基板の両面に凸部１２、
２３の表面が露出しているから、基板の両面に電子部品
を実装することができる。また、多層の配線１４、２６
〜２９が形成されているから、配線を高密度にすること
ができる。In this printed wiring board, two metal plates 11 and 22 are provided, and projections 12 are provided on both sides of the board.
Since the surface of 23 is exposed, electronic components can be mounted on both surfaces of the substrate. In addition, the multilayer wiring 14, 26
Since .about.29 are formed, the wiring can have a high density.
【００１９】なお、上述実施例においては、凸部１２、
２３の表面を樹脂板１３、２５の表面と同一平面とした
が、凸部１２、２３の表面を樹脂板１３、２５の表面か
ら突出させてもよい。また、金属板１１、２２としては
銅板、アルミニウム板、インバー板、アルミニウム合金
板、鉄板等を用いることができる。Incidentally, in the above-mentioned embodiment, the convex portion 12,
Although the surface of 23 is flush with the surfaces of the resin plates 13 and 25, the surfaces of the protrusions 12 and 23 may be projected from the surfaces of the resin plates 13 and 25. Moreover, as the metal plates 11 and 22, a copper plate, an aluminum plate, an Invar plate, an aluminum alloy plate, an iron plate, or the like can be used.
【００２０】[0020]
【発明の効果】以上説明したように、この発明に係るプ
リント配線基板においては、電子部品から発せられる熱
を金属板を介して放熱することができるから、放熱性が
良好であり、しかも電子部品を実装するときに、電子部
品を収納穴内に挿入する必要がないから、電子部品の実
装作業が容易であり、また特殊なリード線を有しない通
常の電子部品を実装することができるから、実装すべき
電子部品が高価となることがない。As described above, in the printed wiring board according to the present invention, the heat generated from the electronic component can be radiated through the metal plate, so that the heat radiation property is good and the electronic component is good. Since it is not necessary to insert the electronic component into the storage hole when mounting the, the mounting work of the electronic component is easy, and the normal electronic component without a special lead wire can be mounted. The electronic component to be used is not expensive.
【図１】この発明に係るプリント配線基板の一部を示す
断面図である。FIG. 1 is a sectional view showing a part of a printed wiring board according to the present invention.
【図２】図１に示したプリント配線基板の全体を示す概
略図である。FIG. 2 is a schematic diagram showing the entire printed wiring board shown in FIG.
【図３】図１、図２に示したプリント配線基板の製造方
法の説明図である。FIG. 3 is an explanatory view of a method for manufacturing the printed wiring board shown in FIGS. 1 and 2.
【図４】この発明に係る他のプリント配線基板の一部を
示す断面図である。FIG. 4 is a cross-sectional view showing a part of another printed wiring board according to the present invention.
【図５】図４に示したプリント配線基板の全体を示す概
略図である。5 is a schematic view showing the entire printed wiring board shown in FIG.
【図６】この発明に係る他のプリント配線基板の一部を
示す断面図である。FIG. 6 is a sectional view showing a part of another printed wiring board according to the present invention.
【図７】この発明に係る他のプリント配線基板の一部を
示す断面図である。FIG. 7 is a sectional view showing a part of another printed wiring board according to the present invention.
【図８】図７に示したプリント配線基板の全体を示す概
略図である。FIG. 8 is a schematic view showing the entire printed wiring board shown in FIG.
【図９】従来のプリント配線基板の一部を示す断面図で
ある。FIG. 9 is a cross-sectional view showing a part of a conventional printed wiring board.
１１…金属板 １２…凸部 １３…樹脂板 １４…配線 １８…樹脂板 １９…配線 ２２…金属板 ２３…凸部 ２４…樹脂板 ２５…樹脂板 ２６〜２９…配線 ３４…凸部 11 ... Metal plate 12 ... Convex part 13 ... Resin plate 14 ... Wiring 18 ... Resin plate 19 ... Wiring 22 ... Metal plate 23 ... Convex part 24 ... Resin plate 25 ... Resin plates 26-29 ... Wiring 34 ... Convex part
Claims (2)
配線が形成されたプリント配線基板において、上記金属
板の上記樹脂板側に表面が上記樹脂板の表面と同一平面
である凸部を設けたことを特徴とするプリント配線基
板。1. A printed wiring board in which a resin plate is provided on a metal plate, and wiring is formed on the resin plate. A convex surface of the metal plate on the resin plate side is flush with the surface of the resin plate. A printed wiring board having a section.
配線が形成されたプリント配線基板において、上記金属
板の上記樹脂板側に表面が上記樹脂板の表面から突出し
た凸部を設けたことを特徴とするプリント配線基板。2. A printed wiring board in which a resin plate is provided on a metal plate and wiring is formed on the resin plate, and a convex portion whose surface protrudes from the surface of the resin plate is provided on the resin plate side of the metal plate. A printed wiring board characterized by being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6097258A JP2521034B2 (en) | 1994-05-11 | 1994-05-11 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6097258A JP2521034B2 (en) | 1994-05-11 | 1994-05-11 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07307533A true JPH07307533A (en) | 1995-11-21 |
| JP2521034B2 JP2521034B2 (en) | 1996-07-31 |
Family
ID=14187531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6097258A Expired - Lifetime JP2521034B2 (en) | 1994-05-11 | 1994-05-11 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2521034B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005094144A1 (en) * | 2004-03-29 | 2005-10-06 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing same |
| JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
| JP2009033199A (en) * | 2008-10-17 | 2009-02-12 | Denka Agsp Kk | Light emitting element mounting substrate |
| KR101148127B1 (en) * | 2006-12-09 | 2012-05-23 | 엘지이노텍 주식회사 | radiant heat circuit substrate and method for manufacturing thereof |
| JP6263301B1 (en) * | 2017-06-15 | 2018-01-17 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142880A (en) * | 1984-08-03 | 1986-03-01 | 川口金属工業株式会社 | Plug-in connector |
| JPH02180034A (en) * | 1988-12-29 | 1990-07-12 | Nec Corp | Semiconductor device |
| JPH03102625A (en) * | 1989-09-14 | 1991-04-30 | Konica Corp | Magnetic recording medium |
-
1994
- 1994-05-11 JP JP6097258A patent/JP2521034B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142880A (en) * | 1984-08-03 | 1986-03-01 | 川口金属工業株式会社 | Plug-in connector |
| JPH02180034A (en) * | 1988-12-29 | 1990-07-12 | Nec Corp | Semiconductor device |
| JPH03102625A (en) * | 1989-09-14 | 1991-04-30 | Konica Corp | Magnetic recording medium |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005094144A1 (en) * | 2004-03-29 | 2005-10-06 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing same |
| JPWO2005094144A1 (en) * | 2004-03-29 | 2008-02-14 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
| JP4722836B2 (en) * | 2004-03-29 | 2011-07-13 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
| JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
| JP4563980B2 (en) * | 2006-10-13 | 2010-10-20 | 三菱電機株式会社 | Surface mount type package and semiconductor device |
| KR101148127B1 (en) * | 2006-12-09 | 2012-05-23 | 엘지이노텍 주식회사 | radiant heat circuit substrate and method for manufacturing thereof |
| JP2009033199A (en) * | 2008-10-17 | 2009-02-12 | Denka Agsp Kk | Light emitting element mounting substrate |
| JP6263301B1 (en) * | 2017-06-15 | 2018-01-17 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
| JP2018093163A (en) * | 2017-06-15 | 2018-06-14 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2521034B2 (en) | 1996-07-31 |
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