JPH07285219A - Ink jet head - Google Patents
Ink jet headInfo
- Publication number
- JPH07285219A JPH07285219A JP7998994A JP7998994A JPH07285219A JP H07285219 A JPH07285219 A JP H07285219A JP 7998994 A JP7998994 A JP 7998994A JP 7998994 A JP7998994 A JP 7998994A JP H07285219 A JPH07285219 A JP H07285219A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- external
- drive
- laminated piezoelectric
- electrode member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インクジェットヘッ
ド、より詳細には、多数のインクジェットノズルを有す
るいわゆるマルチノズル式のインクジェットヘッドに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head, and more particularly to a so-called multi-nozzle ink jet head having a large number of ink jet nozzles.
【０００２】[0002]
【従来の技術】図８は、従来のマルチノズル式のインク
ジェットヘッドの圧電素子電極と信号線電極の接合例
（特開昭５５−８６７６５号公報）を示す図で、図中、
２０は圧電素子２１の一方の側に配設された上部電極、
２６は圧電素子２１の他方の側に配設された下部電極
で、図示のように圧電素子２１の上下に電極２０，２６
を設け、上部電極２０をハンダ付け部２２にて選択電極
２３と接続し、下部電極２６を圧力室上に配設した振動
板の共通電極２４に接合するようにしたものである。2. Description of the Related Art FIG. 8 is a diagram showing an example of joining a piezoelectric element electrode and a signal line electrode of a conventional multi-nozzle type ink jet head (JP-A-55-86765).
20 is an upper electrode disposed on one side of the piezoelectric element 21,
Reference numeral 26 is a lower electrode disposed on the other side of the piezoelectric element 21, and as shown in the figure, the electrodes 20 and 26 are provided above and below the piezoelectric element 21, respectively.
Is provided, the upper electrode 20 is connected to the selection electrode 23 by the soldering portion 22, and the lower electrode 26 is joined to the common electrode 24 of the diaphragm disposed on the pressure chamber.
【０００３】また、本出願人は、先に基板上に配置され
た電極パターンを各圧電素子のスリット加工と同時にパ
ターン分離することによって、圧電素子から外部へ独立
した電気的接続とするインクジェット記録装置について
提案した（特開平３−７３３４７号公報）。Further, the applicant of the present invention has made an ink jet recording apparatus in which an electrode pattern previously arranged on a substrate is separated into patterns at the same time as slitting each piezoelectric element, thereby independently making an electrical connection from the piezoelectric element to the outside. (Japanese Patent Laid-Open No. 3-73347).
【０００４】図９及び図１０は、本出願人が先に提案し
たインクジェットヘッドの一例を説明するための斜視
図、基板３０は通常シリコン、セラミック、ガラス、樹
脂等よりなり、電極は、通常、圧電素子駆動ＩＣの電極
接続用電極３１ａと、外部リード線接続用の電極３１ｂ
と、グランド電極用の電極３１ｃとから成り、これら電
極が基板３０上にパターニングされている。このよう
に、電極がパターニングされた基板３０上に、概略の位
置決めによって圧電素子３２を、たとえば、接着等の手
段により接合している。つぎに、この圧電素子３２にス
リット３３の加工を、たとえば、切削加工等により行
う。スリット３３の巾を３０〜４０μｍ、圧電素子３２
の巾を８０〜９０μｍ程度で加工することにより８本／
ｍｍ程度の集積化が可能となる。これは通常のダイシン
グソー等により十分加工可能である。9 and 10 are perspective views for explaining an example of an ink jet head previously proposed by the present applicant, the substrate 30 is usually made of silicon, ceramic, glass, resin or the like, and the electrodes are usually made of Electrode 31a for connecting the piezoelectric element driving IC and electrode 31b for connecting the external lead wire
And an electrode 31c for the ground electrode, and these electrodes are patterned on the substrate 30. In this way, the piezoelectric element 32 is bonded to the substrate 30 having the electrodes patterned by approximate positioning, for example, by means such as adhesion. Next, the slit 33 is formed in the piezoelectric element 32 by, for example, cutting. The width of the slit 33 is 30 to 40 μm, and the piezoelectric element 32 is
8 pieces by processing the width of 80 ~ 90 μm
It is possible to achieve integration of about mm. This can be sufficiently processed with an ordinary dicing saw or the like.
【０００５】図１１は、図１０のＡ−Ａ線断面図で、同
図は、上述のごとくしてスリット３３を形成した後の図
で、このスリット加工によって圧電素子３２が実質的に
分離されるのと同時に電極パターンも分離・独立され
る。つまり、このとき圧電素子３２と同時に基板３０も
一部加工することになる。また、基板３０の前面（図１
１のＭ部）は、グランド電極３１ｃを分離しないように
するため加工をしないようにしている。このあとで、駆
動ＩＣ３４（分離した電極のパターンのピッチに合わせ
て電極が配置されている）をチップフローなどによって
取付ける。基板３０の材質を適当に選択することによっ
て、駆動ＩＣ３４の放熱を十分に行うことも可能とな
る。FIG. 11 is a sectional view taken along the line AA of FIG. 10, which shows the slit 33 formed as described above, and the piezoelectric element 32 is substantially separated by this slit processing. At the same time, the electrode patterns are separated and independent. That is, at this time, the substrate 30 is partially processed at the same time as the piezoelectric element 32. In addition, the front surface of the substrate 30 (see FIG.
The M part 1) is not processed so as not to separate the ground electrode 31c. After that, the drive IC 34 (where the electrodes are arranged according to the pitch of the pattern of the separated electrodes) is attached by a chip flow or the like. By appropriately selecting the material of the substrate 30, it becomes possible to sufficiently dissipate heat from the drive IC 34.
【０００６】[0006]
【発明が解決しようとする課題】しかし、図８に示した
従来技術では、画像品質の向上あるいは印字スピードの
高速化等でノズルの集積化が進み、圧電素子が増加され
た場合、ヘッド本体２５上に配設される選択電極２３の
配置が複雑になり、工程に時間がかかり、電極間の距離
も短かくなり、ショートする恐れもでてくる。However, in the prior art shown in FIG. 8, when the number of piezoelectric elements is increased due to the progress of nozzle integration due to the improvement of image quality or the increase of printing speed, the head main body 25 The arrangement of the selection electrode 23 arranged above becomes complicated, the process takes time, the distance between the electrodes becomes short, and there is a risk of short circuit.
【０００７】また、図９乃至図１１に示した本出願人が
先に提案した技術によると、電極間のショートは防止で
きるが、各圧電素子のグランド電極を分離しないように
圧電素子の前面でスリット加工を中断し、共通電極とし
ているため、スリット加工中に圧電素子が破損する恐れ
があり、歩留まりが悪い。Further, according to the technique previously proposed by the applicant of the present invention shown in FIGS. 9 to 11, a short circuit between electrodes can be prevented, but the front surface of the piezoelectric element is prevented so as not to separate the ground electrode of each piezoelectric element. Since the slit processing is interrupted and the common electrode is used, the piezoelectric element may be damaged during the slit processing, resulting in poor yield.
【０００８】本発明は、上述のごとき実情に鑑みてなさ
れたもので、特に、高密度に集積されたアクチュエータ
から外部への電気的接続において、ショートを防止し、
更には、加工性、組立性を向上させ、費用の低減を図る
と共に信頼性を向上させたインクジェットヘッドを提供
することを目的とする。The present invention has been made in view of the above-mentioned circumstances, and in particular, in the electrical connection from the high density integrated actuators to the outside, a short circuit is prevented,
Furthermore, it is an object of the present invention to provide an inkjet head having improved workability and assemblability, cost reduction, and reliability.
【０００９】[0009]
【課題を解決するための手段】本発明は、上記課題を解
決するために、（１）実行部と非実行部を有し、所定の
ピッチで１列に分断された複数の積層型圧電素子から成
り、該積層型圧電素子の少なくとも一部に外部選択電極
部材と外部共通電極部材が配置されたアクチュエータを
有し、前記外部共通電極部材が前記積層型圧電素子の実
行部から離れて配設されていること、或いは、（２）実
行部と非実行部を有し、所定のピッチで１列に分断され
た複数の積層型圧電素子から成り、該積層型圧電素子の
少なくとも一部に外部選択電極部材と外部共通電極部材
が配置されたアクチュエータを有し、前記積層型圧電素
子の非実行部上に前記積層型圧電素子を選択的に駆動さ
せるための駆動ＩＣを有すること、或いは、（３）実行
部と非実行部を有し、所定のピッチで１列に分断された
複数の積層型圧電素子から成り、該積層型圧電素子の少
なくとも一部に外部選択電極部材と外部共通電極部材が
配置されたアクチュエータを有し、前記積層型圧電素子
を選択的に駆動させるための駆動ＩＣの少なくとも一部
が、前記積層型圧電素子および補助部材上に配置されて
いること、更には、（４）前記駆動ＩＣは少なくとも一
部が支持部材に接合されていること、更には、（５）前
記支持部材に電気回路がパターニングされ、前記駆動Ｉ
Ｃは少なくともその一部が、前記支持部材を介して前記
積層型圧電素子の外部電極部材と電気的に接合されてい
ること、更には、（６）前記支持部材は、前記積層型圧
電素子の外部電極部材と電気的に接合する部分に、スル
ーホールを有すること、更には、（７）前記積層型圧電
素子の外部電極部材が光硬化性樹脂によって、他の部材
と電気的に接合されていることを特徴としたものであ
る。In order to solve the above-mentioned problems, the present invention provides (1) a plurality of laminated piezoelectric elements having an execution part and a non-execution part and divided into one row at a predetermined pitch. An actuator having an external selection electrode member and an external common electrode member arranged on at least a part of the multilayer piezoelectric element, wherein the external common electrode member is arranged apart from an execution portion of the multilayer piezoelectric element. Or (2) it is composed of a plurality of laminated piezoelectric elements having an execution portion and a non-execution portion and divided into one row at a predetermined pitch, and at least a part of the laminated piezoelectric element is externally connected. An actuator having a selection electrode member and an external common electrode member arranged thereon, and a drive IC for selectively driving the laminated piezoelectric element on a non-execution portion of the laminated piezoelectric element, or ( 3) Has an execution part and a non-execution part A laminated piezoelectric element that is divided into one row at a predetermined pitch, and has an actuator in which an external selection electrode member and an external common electrode member are arranged in at least a part of the laminated piezoelectric element. At least a part of a driving IC for selectively driving the piezoelectric element is disposed on the laminated piezoelectric element and the auxiliary member, and (4) at least a part of the driving IC is supported. And (5) an electric circuit is patterned on the support member, and the drive I
At least a part of C is electrically connected to the external electrode member of the laminated piezoelectric element via the supporting member, and (6) the supporting member is of the laminated piezoelectric element. A through hole is provided at a portion electrically connected to the external electrode member, and (7) the external electrode member of the laminated piezoelectric element is electrically connected to another member by a photocurable resin. It is characterized by being present.
【００１０】[0010]
【作用】外部共通電極部材を積層型圧電素子の実行部か
ら離して配置することで、外部共通電極部材での影響が
実行部に及びにくくする。また、積層型圧電素子の非実
行部の上に駆動ＩＣを配し、インクジェットをコンパク
トにする。また、駆動ＩＣを支える補助部材を配置する
ことで積層型圧電素子を小さくする。また、駆動ＩＣを
支持部材に取り付けてから圧電素子上に接合するように
することで、圧電素子上に接合する際の取扱いを楽に
し、かつ、圧電素子と直接駆動ＩＣが接しないようにす
ることで、圧電素子の実行部からの振動を駆動ＩＣに伝
えにくくする。更には、支持部材に電気回路をパターニ
ンクしておき、圧電素子と一括接合できるようにする。
更には、支持部材にスルーホールを設けることで、支持
部材の表裏間を電気的につなけるとともに、該スルーホ
ールにはんだを逃がすようにする。更には、電極等の接
合部に光硬化性樹脂を使うことで、熱による圧電素子の
劣化を防止する。By arranging the external common electrode member away from the execution portion of the laminated piezoelectric element, the influence of the external common electrode member is less likely to reach the execution portion. Further, the drive IC is arranged on the non-execution portion of the laminated piezoelectric element to make the inkjet compact. Further, by arranging an auxiliary member that supports the drive IC, the laminated piezoelectric element can be made smaller. In addition, by mounting the drive IC on the support member and then joining it on the piezoelectric element, the handling at the time of joining the piezoelectric element on the piezoelectric element is facilitated and the piezoelectric element and the drive IC are prevented from directly contacting each other. This makes it difficult to transmit the vibration from the execution portion of the piezoelectric element to the drive IC. Further, an electric circuit is patterned on the support member so that the piezoelectric element can be collectively bonded.
Furthermore, by providing a through hole in the supporting member, the front and back of the supporting member are electrically connected and the solder is allowed to escape into the through hole. Furthermore, by using a photo-curable resin for the joints such as electrodes, deterioration of the piezoelectric element due to heat is prevented.
【００１１】[0011]
【実施例】図１は、圧電材料と電極材料を交互に複数積
層してなる積層型圧電素子１の断面を示す図で、以下、
この積層型圧電素子（以下ＰＺＴ）１を所定ピッチで１
列に全長にわたり分断し、配列したアクチュエータを形
成した場合の電極の接合や取り出し法について説明す
る。EXAMPLE FIG. 1 is a view showing a cross section of a laminated piezoelectric element 1 formed by alternately laminating a plurality of piezoelectric materials and electrode materials.
This laminated piezoelectric element (hereinafter referred to as PZT) 1
A method of joining and taking out electrodes in the case of forming actuators that are divided into rows and arranged over the entire length will be described.
【００１２】図２は、ＰＺＴ１に外部選択電極２ｂ，外
部共通電極３ｂを配列した場合の断面図で、同図におい
て外部通電極３ｂは、内部選択電極２ａと内部共通電極
３ａの重なっているＰＺＴ１の実行部Ａから離れて配置
されている。なお、外部電極２ｂ，３ｂはＮｉ，ＡｇＰ
ｄ，Ａｕ，半田等で形成され、ＰＺＴ１の両面にて、各
内部電極２ａ，３ａと電気的に導通されている。FIG. 2 is a cross-sectional view in which the external selection electrode 2b and the external common electrode 3b are arranged in the PZT1. In FIG. 2, the external through electrode 3b is a PZT1 in which the internal selection electrode 2a and the internal common electrode 3a overlap each other. Is disposed away from the execution unit A of. The external electrodes 2b and 3b are made of Ni and AgP.
It is formed of d, Au, solder or the like, and is electrically connected to the internal electrodes 2a and 3a on both surfaces of the PZT 1.
【００１３】次に、所定のピッチでダイシングソー等に
よりＰＺＴ１を外部電極２ｂ，３ｂごと溝加工を施し、
複数Ｃｈ（チャンネル）を有するアクチェータを形成す
る。この際、外部共通電極３ｂは外部選択電極２ｂと同
様に溝加工によって各Ｃｈで分断されているので、電気
的に導通をとる必要がある。前述の図２の説明のよう
に、外部共通電極３ｂが、ＰＺＴ１の実行部Ａから十分
に離れていれば、外部共通電極３ｂの導通を取るための
導電性部材（半田、銀ペースト等）が内部電極内に入り
込んでも内部選択電極２ａとショートする心配がない。Next, the PZT 1 is grooved together with the external electrodes 2b and 3b with a dicing saw or the like at a predetermined pitch,
An actuator having a plurality of Chs (channels) is formed. At this time, since the external common electrode 3b is divided at each Ch by groove processing similarly to the external selection electrode 2b, it is necessary to establish electrical conduction. As described above with reference to FIG. 2, if the external common electrode 3b is sufficiently separated from the execution part A of the PZT 1, a conductive member (solder, silver paste, etc.) for establishing conduction of the external common electrode 3b is provided. Even if it enters into the internal electrode, there is no fear of short-circuiting with the internal selection electrode 2a.
【００１４】図３（ａ）は上記アクチュエータを駆動さ
せるための駆動ＩＣ４をＦＰＣ５とともにアクチェエー
タに実装した場合の断面図、図３（ｂ）は、図３（ａ）
中のＦＰＣ５の平面図で、駆動ＩＣ４の制御信号入力端
子４ｂは、アクチュエータの内部共通電極３ａしか配設
されていない非実行部Ｂ上で、ＦＰＣ５の入力信号パッ
ト５ａと半田等で電気的にパターン接合され、一方、駆
動ＩＣ４の出力信号端子４ａは、前記複数Ｃｈのアクチ
ュエータと同じ密度（ピッチ）に配列され、各ＰＺＴ１
の外部選択電極２ｂと光硬化性樹脂６で電気的に接合さ
れている。なお、駆動ＩＣ４への制御信号はＦＰＣ５を
介してＦＰＣ５の入力信号パット５ａから入力されてい
る。また、ＦＰＣ５は駆動ＩＣ４の支持部材になってお
り、また、前記出力信号端子４ａは、半田接合も可能で
あるが、光硬化性樹脂６を利用した方が熱によるＰＺＴ
１への熱ダメージが小さく、脱分極や容量低下等を起こ
さない。FIG. 3 (a) is a sectional view of the case where the drive IC 4 for driving the above actuator is mounted on the actuator together with the FPC 5, and FIG. 3 (b) is shown in FIG. 3 (a).
In the plan view of the FPC 5 inside, the control signal input terminal 4b of the drive IC 4 is electrically connected to the input signal pad 5a of the FPC 5 by soldering or the like on the non-execution portion B where only the internal common electrode 3a of the actuator is provided. On the other hand, the output signal terminals 4a of the drive ICs 4 are arranged in the same density (pitch) as the actuators of the plurality of Chs, and each PZT1 is patterned.
The external selection electrode 2b is electrically connected with the photo-curable resin 6. The control signal to the drive IC 4 is input from the input signal pad 5a of the FPC 5 via the FPC 5. Further, the FPC 5 serves as a supporting member for the driving IC 4, and the output signal terminal 4a can be soldered. However, the use of the photocurable resin 6 causes PZT due to heat.
Heat damage to 1 is small, and depolarization and capacity reduction do not occur.
【００１５】図４（ａ）はアクチュエータに駆動ＩＣ４
を実装した他の実施例の断面図、図４（ｂ）は、図４
（ａ）中のＦＰＣ５の平面図で、ＦＰＣ５はあらかじめ
駆動ＩＣ４の接合用のパット５ａ，５ｃ及び、外部電極
２ｂ，３ｂとの接合用のパターン５ｂ，５ｄ（電気回
路）をパターニングし、このＦＰＣ５に駆動ＩＣ４を接
合し、この駆動ＩＣ４を接合したＦＰＣ５をアクチュエ
ータの非実行部Ｂに接合している。FIG. 4A shows a drive IC 4 for the actuator.
4 is a sectional view of another embodiment in which FIG.
In the plan view of the FPC 5 in (a), the FPC 5 is formed by previously patterning the bonding pads 5a and 5c of the driving IC 4 and the bonding patterns 5b and 5d (electric circuit) with the external electrodes 2b and 3b. The drive IC 4 is joined to the FPC 5, and the FPC 5 to which the drive IC 4 is joined is joined to the non-execution portion B of the actuator.
【００１６】メインボードから出た制御信号はＦＰＣ５
を介して入力信号パッド５ａに接合されている駆動ＩＣ
４の制御信号入力端子４ｂから駆動ＩＣ４に入り、駆動
ＩＣ４の出力は出力信号端子４ａ、出力信号パット５
ｃ、選択電極用５ｄ、外部選択電極２ｂと伝わる。ＦＰ
Ｃ５のパターン５ｂ，５ｄのＰＺＴ１接合面側には半田
メッキが施されており、熱圧接によってＦＰＣ５とＰＺ
Ｔ１は半田接合されている。このとき、共通電極側のパ
ターンにより分断された外部共通電極３ｂを電気的に導
通させるが、半田が溝内に入り込んでも、内部選択電極
２ａは半田が入り込んだ場所には内層されていないの
で、電極間のショートは起こらない。The control signal output from the main board is FPC5.
IC bonded to the input signal pad 5a via
4 enters the drive IC 4 from the control signal input terminal 4b, and the output of the drive IC 4 is the output signal terminal 4a and the output signal pad 5.
c, 5d for selection electrode, and external selection electrode 2b. FP
Solder plating is applied to the PZT1 joint surface side of the C5 patterns 5b and 5d, and the FPC5 and PZ
T1 is soldered. At this time, the external common electrode 3b divided by the pattern on the common electrode side is electrically conducted. However, even if the solder enters the groove, the internal selection electrode 2a is not an inner layer at the place where the solder enters, No short circuit between electrodes occurs.
【００１７】図５（ａ）は前記アクチュエータに駆動Ｉ
Ｃ４を実装した更に他の実施例を示す断面図、図５
（ｂ）は、図５（ａ）中の支持部材７の平面図で、ＰＺ
Ｔ１の外部電極２ｂ，３ｂの配置してある非実行部Ｂ上
にガラエポ基板（支持部材）７を配置し、このガラエポ
基板７上に駆動ＩＣ４及びＦＰＣ５を接合している。FIG. 5A shows a drive I for the actuator.
Sectional drawing which shows the other Example which mounted C4, FIG.
5B is a plan view of the support member 7 in FIG.
The glass epoxy substrate (support member) 7 is arranged on the non-execution part B where the external electrodes 2b and 3b of T1 are arranged, and the drive IC 4 and the FPC 5 are bonded on the glass epoxy substrate 7.
【００１８】このガラエポ基板（支持部材）７には、一
面に駆動ＩＣ４や、ＦＰＣ５等を配接するための電気回
路、他の方の面に分断された外部共通電極３ｂに接する
ベタパターン７ｅが設けてあり、更に、このベタパター
ン７ｅと反対側の電気回路をつなぐスルーホール８を有
している。The glass epoxy substrate (supporting member) 7 is provided with an electric circuit for connecting the driving IC 4, the FPC 5 and the like on one surface, and a solid pattern 7e for contacting the divided external common electrode 3b on the other surface. Further, it has a through hole 8 for connecting an electric circuit on the opposite side of the solid pattern 7e.
【００１９】駆動ＩＣ４はガラエポ基板７上の入出力信
号パット７ａ，７ｂに半田接合によって接合される。制
御信号はＦＰＣ５を介して、基板７上の入力信号パット
７ａに結線されている制御信号入力端子４ｂに入力され
る。前記ＦＰＣ５とガラエポ基板７との接合は熱圧接に
よる半田接合または異方性導電膜による接合などを利用
しても良いし、コネクタによる機械的圧接でも良い。ま
た、溝加工時に分断されたＰＺＴ１の外部共通電極３ｂ
は、基板裏面のベタパターン７ｅと導電性接合部材で電
気的に接合され、基板スルーホール８を介して、ＦＰＣ
５及び、共通電極用パット７ｆ、駆動ＩＣ４とを結線し
ている。The drive IC 4 is joined to the input / output signal pads 7a and 7b on the glass epoxy substrate 7 by soldering. The control signal is input to the control signal input terminal 4b connected to the input signal pad 7a on the substrate 7 via the FPC 5. The FPC 5 and the glass epoxy substrate 7 may be joined to each other by soldering by thermocompression bonding, joining by an anisotropic conductive film, or mechanical pressing by a connector. Also, the external common electrode 3b of the PZT1 that was divided during the groove processing
Is electrically joined to the solid pattern 7e on the back surface of the substrate by a conductive joining member, and is connected to the FPC through the substrate through hole 8.
5, the common electrode pad 7f, and the drive IC 4 are connected.
【００２０】駆動ＩＣ４からの出力信号は、出力信号端
子４ａ，出力信号パット７ｂ，ワイヤボンディング用パ
ット７ｄ，ワイヤボンディング９を通って、ＰＺＴ１の
外部選択電極２ｂに出力される。また、前記ワイヤボン
ディング９の代わりにＦＰＣ５を用いて、基板７上の出
力信号とＰＺＴ１上の選択電極２ｂを結線しても良い。
ワイヤボンディング９をする際は、基板７を固定するた
めに、絶縁性の接着部材１０でＰＺＴ１と接合した方が
良い。The output signal from the drive IC 4 is output to the external selection electrode 2b of the PZT 1 through the output signal terminal 4a, the output signal pad 7b, the wire bonding pad 7d and the wire bonding 9. Further, instead of the wire bonding 9, the FPC 5 may be used to connect the output signal on the substrate 7 and the selection electrode 2b on the PZT 1.
When wire bonding 9 is performed, it is preferable to bond the PZT 1 with an insulating adhesive member 10 in order to fix the substrate 7.
【００２１】図４および図５に示した実施例において
は、駆動ＩＣ４をＰＺＴ１の非実行部Ｂ上に配置したＦ
ＰＣ５またはガラエポ基板７上に配置するようにした例
を示したが、このようにした方が、非実行部Ｂ上に直接
駆動ＩＣを配置する場合より、駆動による振動の影響が
無く、信頼性が高くなる。図４、図５に示す実施例にお
いて、駆動ＩＣ４とＦＰＣ５またはガラエポ基板７との
接合には、半田接合に限らず、光硬化性樹脂の収縮によ
る機械的圧接やワイヤボンディングが利用できる。ま
た、前記ＰＺＴ１は必要に応じてセラミック、ガラスな
どの基板上に支持する方が作業性が向上する。更に、図
５では支持部材にガラエポ基板を使ったが、これに限る
ことはなく、他の樹脂等でもよい。In the embodiment shown in FIG. 4 and FIG. 5, the drive IC 4 is arranged on the non-execution part B of the PZT 1 by F.
An example in which the drive IC is arranged on the PC 5 or the glass epoxy board 7 is shown. However, compared to the case where the drive IC is directly arranged on the non-execution part B, the influence of the vibration due to the drive is reduced and the reliability is improved. Becomes higher. In the embodiment shown in FIGS. 4 and 5, the drive IC 4 and the FPC 5 or the glass epoxy substrate 7 can be joined not only by soldering but also by mechanical pressure welding or wire bonding due to shrinkage of the photocurable resin. In addition, if the PZT1 is supported on a substrate such as ceramic or glass, the workability is improved, if necessary. Further, although the glass epoxy substrate is used as the supporting member in FIG. 5, the present invention is not limited to this, and other resin or the like may be used.
【００２２】図６は駆動ＩＣ４の一部を補助部材１１を
使用して保持するようにした場合の一実施例を示す図で
（ＰＺＴ外部電極とＩＣの結線等は図示せず）、この実
施例によると、ＰＺＴ１の非実行部が縮小化されるの
で、ＰＺＴ１の小形化、低コストが図れる。補助部材１
１としては、樹脂、ガラス、セラミック等を用いること
ができる。FIG. 6 is a view showing an embodiment in which a part of the driving IC 4 is held by using the auxiliary member 11 (the connection between the PZT external electrode and the IC is not shown). According to the example, the non-execution part of the PZT1 is reduced, so that the PZT1 can be downsized and the cost can be reduced. Auxiliary member 1
As 1, a resin, glass, ceramics or the like can be used.
【００２３】図７は本発明が適用されたインクジェット
ヘッドの断面図で、この実施例は、ＰＺＴ１のｄ３３方
向（厚み方向）の変位を利用して流路１２の容積を変化
させ、インク液をノズル１３より吐出するようにした場
合のインクジェットヘッドの概略構造図であるが、本発
明はこれに限らず、ｄ３１方向変位またはバイモルフ変
位を利用したヘッドにも適応できる。FIG. 7 is a cross-sectional view of an ink jet head to which the present invention is applied. In this embodiment, the volume of the flow path 12 is changed by utilizing the displacement of the PZT1 in the d33 direction (thickness direction) to change the ink liquid. FIG. 3 is a schematic structural diagram of an inkjet head when ejecting from a nozzle 13, but the present invention is not limited to this, and can be applied to a head using displacement in the d31 direction or bimorph displacement.
【００２４】[0024]
【発明の効果】以上の説明から明らかなように本発明に
は以下のような効果がある。 （１）請求項１に対応する効果：共通電極部材がＰＺＴ
の実行部から離れているので、分断された各共通電極の
溝間内部に導電性部材が、例えば、半田等が入り込んで
も選択電極とショートしない。よって、インクジェット
ヘッドの歩留り率がよくなる。 （２）請求項２に対応する効果：ＰＺＴの非実行部上に
駆動ＩＣを設けているので、ヘッドユニット全体の小型
化、低コストになる。 （３）請求項３に対応する効果：駆動ＩＣの保持の一部
が補助部材によって行われるので、ＰＺＴの非実行部分
を縮小することができ、低コスト化が図れる。 （４）請求項４に対応する効果：請求項２の効果に加
え、駆動ＩＣが支持部材に接合されているので、ＰＺＴ
の非実行部上に駆動ＩＣを配置する際に取り扱いが容易
になり、組立性が向上し、振動に対する信頼性も向上す
る。 （５）請求項５に対応する効果：請求項４の効果に加
え、駆動ＩＣの支持部材に回路がパターニングされてい
るので、駆動ＩＣとＰＺＴの外部電極との電気的接合が
支持部材を介して一括してでき組立性が向上する。 （６）請求項６に対応する効果：請求項４又は５の効果
に加え、駆動ＩＣの支持部材にスルーホールを有するの
で、ＰＺＴの外部電極接合面と駆動ＩＣ接合面とを電気
的に導通させることができ、更には、接合によってはみ
出した半田の逃げしろになり、はみ出しによる他部材と
のショートを防止する。 （７）請求項７に対応する効果：請求項２乃至６のうち
１項の効果に加え、ＰＺＴの外部電極と駆動ＩＣが光硬
化樹脂で接合されているので、熱によるＰＺＴの劣化
（脱分極、容量低下など）が無くなり、歩留り率がよく
なる。As is apparent from the above description, the present invention has the following effects. (1) Effect corresponding to claim 1: The common electrode member is PZT
Since the conductive member is separated from the execution part, the conductive member does not short-circuit with the selection electrode even if solder or the like enters inside the groove between the divided common electrodes. Therefore, the yield rate of the inkjet head is improved. (2) Effect corresponding to claim 2: Since the drive IC is provided on the non-execution part of the PZT, the size and cost of the entire head unit can be reduced. (3) Effect corresponding to claim 3: Since part of the holding of the drive IC is performed by the auxiliary member, the non-execution part of PZT can be reduced, and the cost can be reduced. (4) Effect corresponding to claim 4: In addition to the effect of claim 2, since the drive IC is joined to the support member, PZT
When the drive IC is arranged on the non-execution part, the handling becomes easy, the assemblability is improved, and the reliability against vibration is also improved. (5) Effect corresponding to claim 5: In addition to the effect of claim 4, since the circuit is patterned on the supporting member of the driving IC, the electric connection between the driving IC and the external electrode of the PZT is via the supporting member. As a whole, it improves the assemblability. (6) Effect corresponding to claim 6: In addition to the effect of claim 4 or 5, since the supporting member of the driving IC has a through hole, the external electrode bonding surface of the PZT and the driving IC bonding surface are electrically connected. In addition, the solder can be made to escape due to the joining, and a short circuit with other members due to the protrusion can be prevented. (7) Effect corresponding to claim 7: In addition to the effect according to claim 2 to claim 6, since the external electrode of the PZT and the driving IC are joined by a photo-curing resin, the PZT is deteriorated (de-coupled) by heat. Polarization, decrease in capacity, etc.) are eliminated, and the yield rate is improved.
【図１】 本発明の実施例に使う積層型圧電素子を説明
するための図である。FIG. 1 is a diagram for explaining a laminated piezoelectric element used in an example of the present invention.
【図２】 図１の積層型圧電素子に外部電極を配置した
図である。FIG. 2 is a diagram in which external electrodes are arranged on the laminated piezoelectric element of FIG.
【図３】 光硬化性樹脂を使い駆動ＩＣをアクチュエー
タの非実行部上接合した図である。FIG. 3 is a diagram in which a drive IC is bonded onto a non-execution portion of an actuator by using a photocurable resin.
【図４】 電気回路を設けたＦＰＣ上に駆動ＩＣを設
け、該ＦＰＣをアクチュエータに接合した図である。FIG. 4 is a diagram in which a driving IC is provided on an FPC provided with an electric circuit and the FPC is joined to an actuator.
【図５】 スルーホールを設けた支持部材を介して、ア
クチュエータに駆動ＩＣとＦＰＣを接合した図である。FIG. 5 is a diagram in which a drive IC and an FPC are joined to an actuator through a support member having a through hole.
【図６】 補助部材を用いて駆動ＩＣをアクチュエータ
に接合した図である。FIG. 6 is a diagram in which a drive IC is joined to an actuator by using an auxiliary member.
【図７】 ｄ３３変位の圧電素子を使ったインクジェッ
トヘッドの概略断面図である。FIG. 7 is a schematic cross-sectional view of an inkjet head using a piezoelectric element having a displacement of d33.
【図８】 従来のインクジェット記録ヘッドの他の例を
説明する平面図である。FIG. 8 is a plan view illustrating another example of a conventional inkjet recording head.
【図９】 従来のインクジェット記録ヘッドの製造工程
の一部を示す斜視図である。FIG. 9 is a perspective view showing a part of a manufacturing process of a conventional inkjet recording head.
【図１０】 図９に示した工程の後工程の一部を示す斜
視図である。10 is a perspective view showing a part of a step that is subsequent to the step shown in FIG.
【図１１】 図９，図１０に示したインクジェット記録
ヘッドの断面図（図１０のＡ−Ａ線断面図）である。11 is a cross-sectional view (cross-sectional view taken along the line AA of FIG. 10) of the inkjet recording head shown in FIGS. 9 and 10.
１…積層型圧電素子（ＰＺＴ）、２…選択電極、３…共
通電極、４…駆動ＩＣ、５…ＦＰＣ、６…光硬化性樹
脂、７…支持部材、８…スルーホール、９…ワイヤボン
ディング、１０…絶縁性接着材、１１…補助部材、１２
…流路、１３…ノズル、２０…上部電極、２１…圧電素
子、２２…ハンダ付け部、２３…ドット電極、２４…共
通電極、２５…本体、２６…下部電極、３０…基板、３
１ａ〜３１ｃ…電極、３２…圧電素子、３３…スリッ
ト、３４…駆動ＩＣ。DESCRIPTION OF SYMBOLS 1 ... Multilayer piezoelectric element (PZT), 2 ... Selection electrode, 3 ... Common electrode, 4 ... Drive IC, 5 ... FPC, 6 ... Photocurable resin, 7 ... Supporting member, 8 ... Through hole, 9 ... Wire bonding 10 ... Insulating adhesive, 11 ... Auxiliary member, 12
... flow path, 13 ... nozzle, 20 ... upper electrode, 21 ... piezoelectric element, 22 ... soldering part, 23 ... dot electrode, 24 ... common electrode, 25 ... body, 26 ... lower electrode, 30 ... substrate, 3
1a to 31c ... Electrodes, 32 ... Piezoelectric elements, 33 ... Slits, 34 ... Driving ICs.
Claims (7)
で１列に分断された複数の積層型圧電素子から成り、該
積層型圧電素子の少なくとも一部に外部選択電極部材と
外部共通電極部材が配置されたアクチュエータを有し、
前記外部共通電極部材が前記積層型圧電素子の実行部か
ら離れて配設されていることを特徴とするインクジェッ
トヘッド。1. A multilayer piezoelectric element having an execution part and a non-execution part and divided into one row at a predetermined pitch, wherein at least a part of the multilayer piezoelectric element has an external selection electrode member and an external part. Having an actuator in which the common electrode member is arranged,
An ink jet head, wherein the external common electrode member is arranged apart from an execution portion of the laminated piezoelectric element.
で１列に分断された複数の積層型圧電素子から成り、該
積層型圧電素子の少なくとも一部に外部選択電極部材と
外部共通電極部材が配置されたアクチュエータを有し、
前記積層型圧電素子の非実行部上に前記積層型圧電素子
を選択的に駆動させるための駆動ＩＣを有することを特
徴とするインクジェットヘッド。2. A multilayer piezoelectric element having an execution part and a non-execution part and divided into one row at a predetermined pitch, wherein at least a part of the multilayer piezoelectric element has an external selection electrode member and an external part. Having an actuator in which the common electrode member is arranged,
An inkjet head having a drive IC for selectively driving the laminated piezoelectric element on a non-execution portion of the laminated piezoelectric element.
で１列に分断された複数の積層型圧電素子から成り、該
積層型圧電素子の少なくとも一部に外部選択電極部材と
外部共通電極部材が配置されたアクチュエータを有し、
前記積層型圧電素子を選択的に駆動させるための駆動Ｉ
Ｃの少なくとも一部が、前記積層型圧電素子および補助
部材上に配置されていることを特徴とするインクジェッ
トヘッド。3. A laminated piezoelectric element having an execution portion and a non-execution portion and divided into one row at a predetermined pitch, wherein at least a part of the laminated piezoelectric element has an external selection electrode member and an external portion. Having an actuator in which the common electrode member is arranged,
Drive I for selectively driving the laminated piezoelectric element I
An inkjet head, wherein at least a part of C is arranged on the laminated piezoelectric element and an auxiliary member.
材に接合されていることを特徴とする請求項２記載のイ
ンクジェットヘッド。4. The inkjet head according to claim 2, wherein at least a part of the drive IC is joined to a support member.
され、前記駆動ＩＣは少なくともその一部が、前記支持
部材を介して前記積層型圧電素子の外部電極部材と電気
的に接合されていることを特徴とする請求項４記載のイ
ンクジェットヘッド。5. An electric circuit is patterned on the support member, and at least a part of the drive IC is electrically connected to an external electrode member of the laminated piezoelectric element via the support member. The inkjet head according to claim 4, which is characterized in that.
外部電極部材と電気的に接合する部分に、スルーホール
を有することを特徴とする請求項４又は５記載のインク
ジェットヘッド。6. The ink jet head according to claim 4, wherein the support member has a through hole at a portion electrically connected to the external electrode member of the laminated piezoelectric element.
硬化性樹脂によって、他の部材と電気的に接合されてい
ることを特徴とする請求項２乃至６のうちのいずれか１
項に記載のインクジェットヘッド。7. The external electrode member of the multi-layer piezoelectric element is electrically joined to another member by a photo-curable resin, according to any one of claims 2 to 6.
Inkjet head according to item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7998994A JPH07285219A (en) | 1994-04-19 | 1994-04-19 | Ink jet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7998994A JPH07285219A (en) | 1994-04-19 | 1994-04-19 | Ink jet head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07285219A true JPH07285219A (en) | 1995-10-31 |
Family
ID=13705726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7998994A Pending JPH07285219A (en) | 1994-04-19 | 1994-04-19 | Ink jet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07285219A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1086814A2 (en) * | 1999-09-27 | 2001-03-28 | Nec Corporation | Inkjet recording head and method for manufacturing same |
| JP2005288705A (en) * | 2004-03-31 | 2005-10-20 | Brother Ind Ltd | Head unit of inkjet printer, inkjet printer and signal transmission substrate used for it |
| US7167344B2 (en) | 2001-01-11 | 2007-01-23 | Alps Electric Co., Ltd. | Magnetic head actuator having finely movable tracking device |
-
1994
- 1994-04-19 JP JP7998994A patent/JPH07285219A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1086814A2 (en) * | 1999-09-27 | 2001-03-28 | Nec Corporation | Inkjet recording head and method for manufacturing same |
| EP1086814A3 (en) * | 1999-09-27 | 2001-09-19 | Nec Corporation | Inkjet recording head and method for manufacturing same |
| US7167344B2 (en) | 2001-01-11 | 2007-01-23 | Alps Electric Co., Ltd. | Magnetic head actuator having finely movable tracking device |
| JP2005288705A (en) * | 2004-03-31 | 2005-10-20 | Brother Ind Ltd | Head unit of inkjet printer, inkjet printer and signal transmission substrate used for it |
| JP4569151B2 (en) * | 2004-03-31 | 2010-10-27 | ブラザー工業株式会社 | Inkjet printer head unit, inkjet printer, and signal transmission board used therefor |
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