JPH0727634Y2 - Air-cooled fin structure - Google Patents
Air-cooled fin structureInfo
- Publication number
- JPH0727634Y2 JPH0727634Y2 JP1241189U JP1241189U JPH0727634Y2 JP H0727634 Y2 JPH0727634 Y2 JP H0727634Y2 JP 1241189 U JP1241189 U JP 1241189U JP 1241189 U JP1241189 U JP 1241189U JP H0727634 Y2 JPH0727634 Y2 JP H0727634Y2
- Authority
- JP
- Japan
- Prior art keywords
- air
- heat transfer
- hole
- filler
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】 〔概要〕 各電子種機器の構成に広く使用されるプリント板の実装
された集積回路素子の空冷フィン構造に関し、 集積回路素子から空冷フィンへの伝熱効率を向上すると
ともに、集積回路素子の破壊を防止することができる新
しい空冷フィンの構造の提供を目的とし、 複数枚の薄板を一定間隔で積層した形状の一端面に凹部
を形成して、集積回路素子の伝熱板に固着するリング状
の接合面を設け、該凹部から他端面に貫通する貫通孔を
穿設した高熱伝導性の空冷フィンと、該伝熱板と上記凹
部で形成される空間および該貫通孔に充填する高熱伝導
性の充填剤と、該貫通孔に圧入して該充填剤の流出を防
ぐ封止部材とから構成される。Detailed Description of the Invention [Outline] The structure of an air-cooling fin for an integrated circuit device mounted on a printed board, which is widely used in the construction of various electronic devices, improves the heat transfer efficiency from the integrated circuit device to the air-cooling fin. , In order to provide a new structure of air-cooled fins that can prevent the destruction of integrated circuit elements, heat is transferred to integrated circuit elements by forming a recess on one end surface of a shape in which multiple thin plates are stacked at regular intervals. A highly heat-conductive air-cooling fin having a ring-shaped joint surface fixed to the plate and having a through hole penetrating from the recess to the other end surface, a space formed by the heat transfer plate and the recess, and the through hole. And a sealing member that press-fits into the through hole to prevent the filler from flowing out.
本考案は、各電子種機器の構成に広く使用されるプリン
ト板の実装された集積回路素子の空冷フィン構造に関す
る。The present invention relates to an air-cooled fin structure for an integrated circuit device mounted with a printed board, which is widely used in the construction of various electronic devices.
最近、大型電算機等に装着されるプリント板は、高密度
集積化した集積回路素子（以下LSiと略称する）が高密
度に実装されてその発熱量が増大しているため、LSiの
伝熱板に空冷フィンを接合して強制空冷により各LSiを
冷却する方法が採用されている。しかし、強制空冷時に
おいてその冷却能力を向上させるためには風速を大きく
するか、或いはフィンを含めた集積回路素子自体の伝熱
効率を良くする必要があるが、風速の増大は騒音の増大
に結び付き易いために、空冷フィンとLSiの伝熱板間の
伝熱効率を向上することができる新しい空冷フィン構造
が要求されている。Recently, printed circuit boards mounted on large-scale computers etc. have high-density integrated circuit elements (hereinafter abbreviated as LSi) that are highly densely mounted and the amount of heat generated is increasing. The method of joining each plate with air cooling fins and cooling each LSi by forced air cooling is adopted. However, in order to improve the cooling capacity during forced air cooling, it is necessary to increase the wind speed or improve the heat transfer efficiency of the integrated circuit element itself including the fins, but an increase in wind speed leads to an increase in noise. Therefore, a new air-cooling fin structure that can improve the heat transfer efficiency between the air-cooling fin and the LSi heat transfer plate is required.
従来広く使用されている空冷フィン構造は、第３図に示
すように熱伝導性の優れた薄板を一定の間隔で複数枚積
層した形状に形成して、表面積を大きくした空冷フィン
３の接合面3aと、LSi2の上面に配設された伝熱板２−１
とを例えばエポキシ系の接着剤４を介して当接させ、そ
の接着剤４を経時硬化させることによりLSi2に空冷フィ
ン３を接合した構造か、または前記接合面3aと伝熱板２
−１を半田付けすることにより接合してプリント配線基
板１に実装している。The air-cooled fin structure which has been widely used in the past is formed by laminating a plurality of thin plates having excellent thermal conductivity at a constant interval as shown in FIG. 3a and heat transfer plate 2-1 arranged on the upper surface of LSi2
Are contacted with each other via an epoxy adhesive 4, and the adhesive 4 is cured over time, so that the air-cooled fins 3 are bonded to the LSi2, or the bonding surface 3a and the heat transfer plate 2 are joined together.
-1 is joined by soldering and mounted on the printed wiring board 1.
以上説明した従来の空冷フィン構造で問題となるのは、
発熱体であるLSi上の伝熱板と熱伝導性の優れた放熱体
である空冷フィンの接合面を、空冷フィンより熱伝導率
の低い接着剤で接合しているため空冷フィンへの熱伝導
率が接着剤により少なくなって、実装したLSiの冷却効
率が低くなるという問題が生じている。The problem with the conventional air-cooled fin structure described above is that
The heat transfer plate on the LSi, which is a heating element, and the air-cooling fin, which is a heat-dissipating element with excellent thermal conductivity, are joined with an adhesive that has a lower thermal conductivity than the air-cooling fin, so that heat conduction to the air-cooling fin is achieved. There is a problem that the cooling rate of the mounted LSi becomes low because the rate is reduced by the adhesive.
また、空冷フィンの接合面とLSi上の伝熱板を半田付け
により接合するとその伝熱効率は向上するが、半田付け
時の温度ショックがLSiの素子の信頼性性に、また、空
冷フィンと伝熱板の熱膨張差が半田接合の信頼性に悪影
響を及ぼすという問題も生じている。Also, if the joint surface of the air-cooled fin and the heat transfer plate on the LSi are joined by soldering, the heat transfer efficiency will be improved, but the temperature shock during soldering will improve the reliability of the LSi element and the heat transfer between the air-cooled fin and There is also a problem that the difference in thermal expansion of the hot plates adversely affects the reliability of solder joints.
本考案は上記のような問題点に鑑み、LSiから空冷フィ
ンへの伝熱効率を向上するとともに、素子の破壊を防止
することができる新しい空冷フィン構造の提供を目的と
する。In view of the above problems, it is an object of the present invention to provide a new air-cooling fin structure capable of improving the heat transfer efficiency from LSi to the air-cooling fins and preventing the destruction of elements.
本考案は、第２図に示すように複数枚の薄板を一定間隔
で積層した形状の一端面に凹部13bを形成して、接着剤
４によりLSi2の伝熱板２−１に固着するリング状の接合
面13aを設け、他端面から該凹部13bに貫通する貫通孔13
cを穿設した高熱伝導性の空冷フィン13と、第１図に示
すように該伝熱板２−１と上記凹部13bで形成される空
間と該貫通孔13cに充填する高熱伝導性の充填剤14と、
空冷フィン13の貫通孔13cに圧入して該充填剤14の流出
を防ぐ封止部材15とから構成される。According to the present invention, as shown in FIG. 2, a recess 13b is formed on one end surface of a plurality of thin plates laminated at regular intervals, and a ring shape is fixed to the heat transfer plate 2-1 of the LSi2 with an adhesive 4. Of the through hole 13 that penetrates the concave portion 13b from the other end surface.
Highly thermally conductive air-cooled fins 13 having holes c formed therein, a space formed by the heat transfer plate 2-1 and the recess 13b and the through hole 13c as shown in FIG. Agent 14 and
It is composed of a sealing member 15 which is press-fitted into the through hole 13c of the air-cooled fin 13 to prevent the filler 14 from flowing out.
本考案では、熱伝導性の優れた空冷フィン13の接合面13
aとLSi2の伝熱板２−１を接着剤４で固着することで形
成される空間に、熱伝導率が高く，且つ流動性を有する
充填剤14を充填して貫通孔13cの開口側が封止している
ため、LSi2で発生する熱は接着剤４の部分より熱伝導率
の高い充填剤14を経由して空冷フィン13に伝熱されて放
熱するので、LSiの冷却効率が向上するとともに素子の
破壊を防止することが可能となる。In the present invention, the joint surface 13 of the air-cooled fin 13 having excellent thermal conductivity is used.
The space formed by fixing the heat transfer plate 2-1 of a and LSi2 with the adhesive 4 is filled with the filler 14 having high thermal conductivity and fluidity, and the opening side of the through hole 13c is sealed. Since it is stopped, the heat generated in LSi2 is transferred to the air-cooled fins 13 via the filler 14 having a higher thermal conductivity than the adhesive 4 portion, and radiates heat, so that the cooling efficiency of LSi is improved. It is possible to prevent the destruction of the element.
以下第１図および第２図について本考案の実施例を説明
する。An embodiment of the present invention will be described below with reference to FIGS.
第１図は本実施例による空冷フィン構造を示す断面図，
第２図は本実施例の空冷フィンの斜視図を示し、図中に
おいて、第３図と同一部材には同一記号が付してある
が、その他の13はLSiの発熱を放熱する空冷フィン,14は
LSiの発熱を空冷フィンに熱伝導する充填剤,15は充填剤
の流出を防止する封止部材である。FIG. 1 is a sectional view showing an air-cooled fin structure according to this embodiment,
FIG. 2 shows a perspective view of the air-cooling fin of the present embodiment. In the figure, the same members as those in FIG. 3 are denoted by the same symbols, but the other 13 are air-cooling fins that radiate the heat generated by LSi, 14 is
A filler 15 that conducts heat of LSi to the air-cooled fins is a sealing member that prevents the filler from flowing out.
空冷フィン13は、第２図に示すように熱伝導性の優れた
金属，例えば銅合金、又はアルミニウム合金より薄板を
一定の間隔で複数枚積層した形状に成形して、従来と同
じく一端面にLSi2の伝熱板２−１と接合するように形成
した接着面に、一定深さの円形凹部13bを形成すること
によりリング状の接合面13aを設けて、その凹部13bから
他方の端面に到る軸心を貫通した細径の貫通孔13cを穿
設したものである。As shown in FIG. 2, the air-cooled fin 13 is formed by laminating a plurality of thin plates made of a metal having excellent thermal conductivity, for example, a copper alloy or an aluminum alloy at regular intervals, and has one end surface formed in the same manner as the conventional one. A ring-shaped joint surface 13a is provided by forming a circular recess 13b having a constant depth on the bonding surface formed so as to be bonded to the heat transfer plate 2-1 of LSi2, and the recess 13b reaches the other end surface. A small-diameter through hole 13c that penetrates the shaft center is formed.
充填剤14は、流動性を有して熱伝導性が良い金属，例え
ば水銀、或いはダイヤモンド粉末等を含む熱伝導率の高
いグリースである。The filler 14 is a grease having a high thermal conductivity containing a metal having fluidity and a high thermal conductivity, such as mercury or diamond powder.
封止部材15は、第１図に示すように空冷フィン13の貫通
孔13cに圧入することができる直径の短い金属ピンであ
る。The sealing member 15 is a metal pin having a short diameter that can be press-fitted into the through hole 13c of the air cooling fin 13 as shown in FIG.
上記部材を使用した空冷フィンの構造は、第１図に示す
ようにLSi2の上面に配設された伝熱板２−１に接着剤４
を塗布して空冷フィン13の接合面13aを当接させ、その
接着剤４を経時硬化させてLSi2と空冷フィン３を接合さ
せることにより伝熱板２−１と上記凹部13bで空間を形
成する。そして、注射器等を使用して空冷フィン13の貫
通孔13c上部より前記空間に充填剤14を注入し、その充
填剤14が外部に流出をないように貫通孔13cの上部を封
止部材15により閉鎖される。As shown in FIG. 1, the structure of the air-cooled fin using the above-mentioned members is such that the adhesive 4 is applied to the heat transfer plate 2-1 arranged on the upper surface of LSi2.
Is applied to bring the joining surface 13a of the air-cooling fin 13 into contact, and the adhesive 4 is cured over time to join the LSi2 and the air-cooling fin 3 to form a space between the heat transfer plate 2-1 and the recess 13b. . Then, the filler 14 is injected into the space from the upper portion of the through hole 13c of the air-cooled fin 13 using a syringe or the like, and the upper portion of the through hole 13c is sealed by the sealing member 15 so that the filler 14 does not flow out. Will be closed.
その結果、熱伝導性の優れた空冷フィン13の接合面13a
とLSi2の伝熱板２−１を接着剤４で固着することで形成
される空間に、熱伝導率の高い充填剤14が充填されてLS
i2の熱は充填剤14を経由して空冷フィン13から放熱する
ので、LSiの冷却効率が向上するとともにその破壊を防
止することができる。As a result, the joint surface 13a of the air-cooled fin 13 having excellent thermal conductivity
And the LSi2 heat transfer plate 2-1 are fixed to each other with an adhesive 4, a space 14 formed with a high thermal conductivity filler 14 is filled.
Since the heat of i2 is radiated from the air-cooled fin 13 via the filler 14, the cooling efficiency of LSi can be improved and its destruction can be prevented.
以上の説明から明らかなように本考案によれば極めて簡
単な構造で、LSiから冷却フィンへの伝熱効率を向上さ
せるとともに、LSiの破壊を防止することができる等の
利点があり、著しい経済的及び、信頼性向上の効果が期
待できる空冷フィン構造を提供することができる。As is clear from the above description, according to the present invention, the structure is extremely simple, and the heat transfer efficiency from the LSi to the cooling fins can be improved and the LSi can be prevented from being destroyed. In addition, it is possible to provide an air-cooled fin structure that can be expected to improve reliability.
第１図は本考案の一実施例による空冷フィン構造を示す
断面図、 第２図は本実施例の空冷フィンを示す斜視図、 第３図は従来の空冷フィン構造を示す正面図である。 図において、 １はプリント基板、２はLSi、２−１は伝熱板、４は接
着剤、13は空冷フィン、13aは接合面、13bは凹部、13c
は貫通孔、14は充填剤、15は封止部材、を示す。FIG. 1 is a sectional view showing an air cooling fin structure according to an embodiment of the present invention, FIG. 2 is a perspective view showing an air cooling fin of this embodiment, and FIG. 3 is a front view showing a conventional air cooling fin structure. In the figure, 1 is a printed circuit board, 2 is a LSi, 2-1 is a heat transfer plate, 4 is an adhesive, 13 is an air cooling fin, 13a is a joint surface, 13b is a concave portion, 13c.
Is a through hole, 14 is a filler, and 15 is a sealing member.
Claims (1)
一端面に凹部（13b）を形成して、集積回路素子（２）
の伝熱板（２−１）に固着するリング状の接合面（13
a）を設け、該凹部（13b）から他端面に貫通する貫通孔
（13c）を穿設した高熱伝導性の空冷フィン（13）と、 該伝熱板（２−１）と上記凹部（13b）で形成される空
間および該貫通孔（13c）に充填する高熱伝導性の充填
剤（14）と、 該貫通孔（13c）に圧入して該充填剤（14）の流出を防
ぐ封止部材（15）とから構成されるてなることを特徴と
する空冷フィン構造。1. An integrated circuit device (2) comprising: a recess (13b) formed on one end surface of a plurality of thin plates laminated at regular intervals.
Ring-shaped joint surface (13) that is fixed to the heat transfer plate (2-1) of
a), and a highly heat-conductive air-cooling fin (13) having a through hole (13c) penetrating from the recess (13b) to the other end surface, the heat transfer plate (2-1) and the recess (13b). ) And a filler having high thermal conductivity to be filled in the through hole (13c) and a sealing member for press-fitting into the through hole (13c) to prevent the filler (14) from flowing out. (15) An air-cooled fin structure comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241189U JPH0727634Y2 (en) | 1989-02-03 | 1989-02-03 | Air-cooled fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241189U JPH0727634Y2 (en) | 1989-02-03 | 1989-02-03 | Air-cooled fin structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104642U JPH02104642U (en) | 1990-08-20 |
| JPH0727634Y2 true JPH0727634Y2 (en) | 1995-06-21 |
Family
ID=31221833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1241189U Expired - Lifetime JPH0727634Y2 (en) | 1989-02-03 | 1989-02-03 | Air-cooled fin structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727634Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4710735B2 (en) * | 2006-06-22 | 2011-06-29 | 株式会社デンソー | Manufacturing method of electronic device |
| JP5120320B2 (en) * | 2009-04-09 | 2013-01-16 | 富士通株式会社 | Package structure, printed circuit board on which the package structure is mounted, and electronic apparatus having the printed circuit board |
| JP5348121B2 (en) * | 2010-12-21 | 2013-11-20 | 株式会社デンソー | Electronic equipment |
| CN117957648A (en) * | 2021-09-21 | 2024-04-30 | 三菱电机株式会社 | Power semiconductor device and method for manufacturing power semiconductor device |
-
1989
- 1989-02-03 JP JP1241189U patent/JPH0727634Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104642U (en) | 1990-08-20 |
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