JPH07244105A - Bridged solder detecting method by board inspecting device for mounting board - Google Patents
Bridged solder detecting method by board inspecting device for mounting boardInfo
- Publication number
- JPH07244105A JPH07244105A JP6060046A JP6004694A JPH07244105A JP H07244105 A JPH07244105 A JP H07244105A JP 6060046 A JP6060046 A JP 6060046A JP 6004694 A JP6004694 A JP 6004694A JP H07244105 A JPH07244105 A JP H07244105A
- Authority
- JP
- Japan
- Prior art keywords
- probes
- resistance value
- measurement
- pattern
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はインサーキットテスタ等
の基板検査装置を用いて行う実装基板に設けたパターン
間のブリッジ半田の検出方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting bridge solder between patterns provided on a mounting board, which is carried out using a board inspection device such as an in-circuit tester.
【０００２】[0002]
【従来の技術】従来、実装基板即ち多数の電子部品を半
田付けしたプリント基板はインサーキットテスタを用い
て、その基板の必要な測定点に適宜測定プローブを接触
させ、それ等の各部品の電気的測定によって基板の良否
の判定を行っている。この種のインサーキットテスタに
は被検査基板を検査治具たるフィクスチュアー（ピンボ
ード）上に載せて固定するピンボード方式のものと、被
検査基板を載せる測定台上にＸ−Ｙユニットを設置する
Ｘ−Ｙ方式のものとがある。そして、ピンボード方式で
はボード上に被検査基板の測定点の数に等しい数の測定
プローブを測定点の位置に対応させて立設し、被検査基
板をフィクスチュアー上に載せることにより、各測定プ
ローブを各測定点にそれぞれ接触する。一方、Ｘ−Ｙ方
式ではＸ軸方向に可動するアームの上に、Ｙ軸方向に可
動するＺ軸ユニットを備え、そのＺ軸ユニットで測定プ
ローブをＺ軸方向に可動可能に支持し、Ｘ−Ｙユニット
を制御することにより、測定プローブを基板の上方から
Ｘ軸、Ｙ軸、Ｚ軸方向にそれぞれ適宜移動して、予め設
定した各測定点に順次接触する。なお、Ｘ−Ｙ方式では
１部品毎に複数個の測定点を同時に測定しなければなら
ないので、インサーキットテスタに通常複数個のＸ−Ｙ
ユニットを備え付ける。2. Description of the Related Art Conventionally, a mounting board, that is, a printed circuit board to which a large number of electronic components are soldered, uses an in-circuit tester, and a measuring probe is appropriately contacted with a necessary measuring point on the board to electrically connect the components. The quality of the substrate is determined by dynamic measurement. This type of in-circuit tester includes a pin board type in which the board to be inspected is mounted and fixed on a fixture (pin board) which is an inspection jig, and an XY unit is placed on the measuring table on which the board to be inspected is placed. There is an XY system installed. In the pinboard method, a number of measurement probes equal to the number of measurement points on the board to be inspected are erected on the board in correspondence with the positions of the measurement points, and the board to be inspected is placed on the fixture. The measuring probe is brought into contact with each measuring point. On the other hand, in the XY system, a Z-axis unit that moves in the Y-axis direction is provided on an arm that moves in the X-axis direction, and the Z-axis unit movably supports the measurement probe in the Z-axis direction. By controlling the Y unit, the measurement probe is appropriately moved in the X-axis, Y-axis, and Z-axis directions from above the substrate to sequentially contact the preset measurement points. In the XY method, it is necessary to simultaneously measure a plurality of measurement points for each component.
Install a unit.
【０００３】このようなＸ−Ｙ方式インサーキットテス
タを用いて、被検査基板に設けたパターン間のブリッジ
半田を検出する場合、通常図８に示すように測定部の抵
抗測定回路１０に接続する一方の測定プローブ１２を実
装基板１４に設けた多数のパターン中の検査の対象とな
る一方のパターン１６に接触するように操作し、他方の
測定プローブ１８を他方のパターン２０と接触するよう
に操作した後、両プローブ１２、１８の間に定電圧を印
加し、電流を測定して抵抗値を算出する。そして、その
抵抗値をしきい値と比べ、抵抗値がしきい値を超えてい
れば、パターン１６、２０の間がオープン状態で正常で
あり、しきい値以下であれば、パターン１６、２０の間
が半田２２で接続されたブリッジ半田の状態で不良であ
ると判定している。なお、基板に設けた多数のパターン
のパターン間のブリッジ半田の有無を検査する箇所は予
めデータとして記憶させておき、設定順に従って繰り返
して同様に検査をする。When the bridge solder between the patterns provided on the substrate to be inspected is detected by using such an XY type in-circuit tester, it is usually connected to the resistance measuring circuit 10 of the measuring section as shown in FIG. One of the measuring probes 12 is operated so as to contact one of the patterns 16 to be inspected among the many patterns provided on the mounting substrate 14, and the other measuring probe 18 is operated so as to contact the other pattern 20. After that, a constant voltage is applied between the two probes 12 and 18, the current is measured, and the resistance value is calculated. Then, the resistance value is compared with a threshold value, and if the resistance value exceeds the threshold value, the pattern 16 and 20 is normally in an open state, and if the resistance value is less than or equal to the threshold value, the patterns 16 and 20 are compared. It is determined that there is a defect in the state of the bridge solder which is connected by the solder 22 between. It should be noted that the locations to be inspected for the presence or absence of bridge solder between the patterns of a large number of patterns provided on the board are stored in advance as data, and the inspection is repeated in the same order as the setting order.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな測定プローブを接触するパターンの幅は狭いもので
は０．２〜０．３ｍｍ程であり、最近ますます狭くなる
傾向にある。それ故、測定プローブをパターンに接触さ
せ難い。このため、接触ミスにより測定プローブがパタ
ーンから外れることがあるが、一方の測定プローブがパ
ターンから外れても抵抗値は無限大となるため、ブリッ
ジ半田の有無を検査していないのにもかかわらず、正常
であると判定してしまう。又、接触してもパターン上に
存在する半田付け用フラックス（やに）に接触させてし
まうと、フラックスは絶縁物であるため、やはり抵抗値
は無限大となり、ブリッジ半田の有無を検査していない
のにもかかわらず、正常であると判定してしまう。However, the width of the pattern in contact with such a measurement probe is about 0.2 to 0.3 mm, which tends to become narrower recently. Therefore, it is difficult to bring the measurement probe into contact with the pattern. For this reason, the measurement probe may come off the pattern due to a contact error.However, even if one measurement probe comes off the pattern, the resistance value becomes infinite. , It is determined to be normal. In addition, even if it comes in contact with the soldering flux (or ni) existing on the pattern, since the flux is an insulator, the resistance value becomes infinite and the presence or absence of bridge solder is inspected. Even if there is not, it will be judged to be normal.
【０００５】本発明はこのような従来の問題点に着目し
てなされたものであり、基板検査装置を用いて、実装基
板に設けたパターン間のブリッジ半田を正確に検出する
方法を提供することを目的とする。The present invention has been made in view of such conventional problems, and provides a method for accurately detecting bridge solder between patterns provided on a mounting board by using a board inspection apparatus. With the goal.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明による実装基板の基板検査装置によるブリッ
ジ半田検出方法では抵抗測定回路３０に接続する複数本
の測定プローブ３２、３４、３６、３８を備えた基板検
査装置を用いて、実装基板２４に設けたパターン２６、
２８の間のブリッジ半田の検出を行なう。その際、上記
測定プローブ３２、３４、３６、３８の内、２本の第
１、第２測定プローブ３２、３４を互いの先端が僅か離
れるように配置して一方のパターン２６に接触するよう
にし、更に２本の第３、第４測定プローブ３６、３８を
互いの先端が僅か離れるように配置して他方のパターン
２８に接触するようにした後、第１、第２測定プローブ
３２、３４の間の抵抗値を測定し、その抵抗値としきい
値とを比べて第１、第２測定プローブ３２、３４のパタ
ーン２６に対する接触状態の良否を判定し、その接触状
態が良好の場合に第３、第４測定プローブ３６、３８の
間の抵抗値を測定し、その抵抗値としきい値とを比べて
第３、第４測定プローブ３６、３８のパターン２８に対
する接触状態の良否を判定し、その接触状態が良好の場
合に第１又は第２測定プローブ３２、３４と第３又は第
４測定プローブ３６、３８の間の抵抗値を測定し、その
抵抗値としきい値とを比べてブリッジ半田の有無を判定
する。In order to achieve the above object, in the bridge solder detection method by the board inspection apparatus for a mounting board according to the present invention, a plurality of measurement probes 32, 34, 36 connected to the resistance measuring circuit 30, Pattern 26 provided on the mounting substrate 24 by using the substrate inspection apparatus including the
The bridge solder between 28 is detected. At that time, of the above-mentioned measurement probes 32, 34, 36, 38, two first and second measurement probes 32, 34 are arranged so that their tips are slightly apart from each other so as to come into contact with one pattern 26. Further, after arranging two third and fourth measurement probes 36 and 38 so that their tips are slightly apart from each other so as to contact the other pattern 28, the first and second measurement probes 32 and 34 are The resistance value between the two is measured, the resistance value and the threshold value are compared to determine whether the contact state of the first and second measurement probes 32 and 34 with respect to the pattern 26 is good, and when the contact state is good, the third , The resistance value between the fourth measurement probes 36 and 38 is measured, and the resistance value and the threshold value are compared to determine whether the contact state of the third and fourth measurement probes 36 and 38 with respect to the pattern 28 is good or bad. When contact is good Or a second measurement probe 32 the resistance value between the third and fourth measuring probe 36 measures, determines the presence or absence of a bridge of solder than the resistance value and the threshold.
【０００７】又、同様の手順を踏んで第１、第２測定プ
ローブ３２、３４の一方のパターン２６に対する接触状
態が良好であると判定し、更に第３、第４測定プローブ
３６、３８の他方のパターン２８に対する接触状態が良
好であると判定した後、４端子法により第１、第２測定
プローブ３２、３４と第３、第４測定プローブ３６、３
８の間の抵抗値を測定し、その抵抗値としきい値とを比
べてブリッジ半田の有無を判定する。Further, following the same procedure, it is judged that the contact state of one of the first and second measuring probes 32 and 34 with the pattern 26 is good, and the other of the third and fourth measuring probes 36 and 38 is further judged. After determining that the contact state with the pattern 28 is good, the first and second measurement probes 32 and 34 and the third and fourth measurement probes 36 and 3 are determined by the four-terminal method.
The resistance value between 8 is measured, and the presence or absence of bridge solder is determined by comparing the resistance value with a threshold value.
【０００８】そして、同一パターン６４に接触する２本
の測定プローブ７０、７２を一体型にしたプローブユニ
ット６２にして用いると好ましくなる。Then, it is preferable to use the two measuring probes 70 and 72 that come into contact with the same pattern 64 as an integrated probe unit 62.
【０００９】[0009]
【作用】上記のように構成し、抵抗測定回路３０により
第１、第２測定プローブ３２、３４の間に直流の定電圧
を印加し、電流を測定して抵抗値を算出し、その抵抗値
としきい値とを比べる。そして、抵抗値がしきい値を超
えている場合には第１、第２測定プローブ３２、３４の
少なくとも一方がパターン２６に接触不良であると判定
し、抵抗値がしきい値以下の場合には第１、第２測定プ
ローブ３２、３４が共にパターン２６と良好に接触して
いると判定する。この結果、第１、第２測定プローブ３
２、３４のパターン２６に対する接触状態の良否が明ら
かになる。そこで、第１、第２測定プローブ３２、３４
が共にパターン２６に良好に接触していることを確認し
た後、同様にして第３、第４測定プローブ３６、３８の
間の抵抗値を算出し、その抵抗値としきい値とを比べ
る。すると、やはり第３、第４測定プローブ３６、３８
のパターン２８に対する接触状態の良否が明らかにな
る。そこで、更に第３、第４測定プローブ３６、３８も
共にパターン２８に良好に接触していることを確認した
後、同様にして第１又は第２測定プローブ３２、３４と
第３又は第４測定プローブ３６、３８との間の抵抗値を
算出し、その抵抗値としきい値とを比べる。すると、ブ
リッジ半田の有無を判定できる。With the above configuration, the resistance measuring circuit 30 applies a constant DC voltage between the first and second measuring probes 32 and 34, measures the current, calculates the resistance value, and then calculates the resistance value. And the threshold value. When the resistance value exceeds the threshold value, it is determined that at least one of the first and second measurement probes 32 and 34 has a poor contact with the pattern 26, and when the resistance value is less than or equal to the threshold value. Determines that both the first and second measurement probes 32 and 34 are in good contact with the pattern 26. As a result, the first and second measurement probes 3
The quality of the contact state with respect to the patterns 26 of 2, 34 becomes clear. Therefore, the first and second measurement probes 32, 34
After confirming that both are in good contact with the pattern 26, the resistance value between the third and fourth measurement probes 36 and 38 is calculated in the same manner, and the resistance value is compared with the threshold value. Then, after all, the third and fourth measurement probes 36, 38
The quality of the contact state with respect to the pattern 28 becomes clear. Therefore, after confirming that both the third and fourth measurement probes 36 and 38 are in good contact with the pattern 28, the first or second measurement probe 32 or 34 and the third or fourth measurement are similarly performed. The resistance value between the probes 36 and 38 is calculated, and the resistance value is compared with the threshold value. Then, the presence or absence of bridge solder can be determined.
【００１０】又、同様にして、第１、第２測定プローブ
３２、３４が共にパターン２６に良好に接触し、第３、
第４測定プローブ３６、３８が共にパターン２８に良好
に接触していることを確認した後、今度は４端子法によ
り両パターン２６、２８の間の抵抗値を算出する。その
際、例えば第１、第２測定プローブ３２、３４の一方を
抵抗測定回路３０の＋ソース端子に接続し、他方を＋セ
ンス端子に接続し、第３、第４測定プローブ３６、３８
の一方を−ソース端子に接続し、他方を−センス端子に
接続する。すると、±センス端子に接続する各測定プロ
ーブ３２又は３４、３６又は３８の接触抵抗値が極めて
小さくなって無視できる。Similarly, both the first and second measuring probes 32 and 34 are in good contact with the pattern 26, and
After confirming that both the fourth measurement probes 36 and 38 are in good contact with the pattern 28, the resistance value between the patterns 26 and 28 is calculated by the four-terminal method this time. At that time, for example, one of the first and second measurement probes 32 and 34 is connected to the + source terminal of the resistance measurement circuit 30 and the other is connected to the + sense terminal, and the third and fourth measurement probes 36 and 38 are connected.
One is connected to the-source terminal and the other is connected to the-sense terminal. Then, the contact resistance value of each measurement probe 32 or 34, 36 or 38 connected to the ± sense terminals becomes extremely small and can be ignored.
【００１１】又、同一パターン６４に接触する２本の測
定プローブ７０、７２を一体型にしたプローブユニット
６２を用いると、２本の測定プローブ７０、７２を同時
に取り扱い、或いは操作できる。しかも、一体化する２
本の測定プローブ７０、７２の先端を至近距離に接近さ
せて固定できる。Further, by using the probe unit 62 in which the two measuring probes 70 and 72 contacting the same pattern 64 are integrated, the two measuring probes 70 and 72 can be simultaneously handled or operated. Moreover, it is integrated 2
The tips of the book measuring probes 70, 72 can be fixed by approaching them at a close range.
【００１２】[0012]
【実施例】以下、添付図面に基づいて、本発明の実施例
を説明する。図１は本発明による実装基板の基板検査装
置によるブリッジ半田検出方法の実施時における抵抗測
定回路に接続する４本の測定プローブと被検査基板のパ
ターンとの接触状態を示す図である。図中、２４は被検
査基板、２６はその基板２４に設けた検査の対象となっ
ている一方のパターン、２８は他方のパターンである。
なお、基板２４に存在するその他のパターンは省略し
た。又、３０は直流定電圧源、電流測定回路等を備えた
抵抗測定回路、３２、３４は互いの先端を僅か離すよう
に配置して一方のパターン２６に接触させた第１、第２
測定プローブ、３６、３８は互いの先端を僅か離すよう
に配置して他方のパターン２８に接触させた第３、第４
測定プローブ、４０はそれ等の抵抗測定回路３０と４測
定プローブ３２、３４、３６、３８との間に介在する信
号切換回路を備えたスキャナである。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing a contact state between four measurement probes connected to a resistance measuring circuit and a pattern of a substrate to be inspected when a method of detecting bridge solder by a substrate inspection device for a mounting substrate according to the present invention is carried out. In the figure, reference numeral 24 is a substrate to be inspected, 26 is one pattern to be inspected provided on the substrate 24, and 28 is the other pattern.
The other patterns existing on the substrate 24 are omitted. Further, 30 is a resistance measuring circuit provided with a DC constant voltage source, a current measuring circuit, etc., and 32 and 34 are first and second electrodes arranged so that their tips are slightly separated from each other and brought into contact with one pattern 26.
The measurement probes 36 and 38 are arranged so that their tips are slightly apart from each other, and are brought into contact with the other pattern 28, that is, the third and fourth probes.
Measuring probes 40 are scanners with signal switching circuits interposed between the resistance measuring circuit 30 and the four measuring probes 32, 34, 36, 38.
【００１３】図２は図１に示した抵抗測定回路を有する
Ｘ−Ｙ方式インサーキットテスタの構成を示すブロック
図である。図中、４２はＸ−Ｙ方式インサーキットテス
タ、４４はその操作部、４６はＸ−Ｙ−Ｚ制御部、４８
は測定部、５０はコントローラである。この操作部４４
にはキーボード、表示装置、プリンタ、フロッピーディ
スクドライバ等の入出力機器を備える。そして、Ｘ−Ｙ
−Ｚ制御部４６により４組のＸ−Ｙユニット（図示な
し）にそれぞれ備えたサーボモータ等を駆動し、それ等
のＸ−Ｙユニットを制御して、各Ｘ−Ｙユニットに備え
たプローブ３２、３４、３６、３８を測定台上でＸ軸、
Ｙ軸、Ｚ軸方向にそれぞれ適宜移動する。又、測定部４
８は抵抗測定回路３０を有し、適宜の直流定電圧、信号
等をスキャナ４０を介して各Ｘ−Ｙユニットに備えたプ
ローブ３２、３４、３６、３８に与え、それ等のプロー
ブ３２、３４、３６、３８が接触するパターン２６、２
６等に流れる電流等を検出し、抵抗等の測定を行なう。FIG. 2 is a block diagram showing the configuration of an XY type in-circuit tester having the resistance measuring circuit shown in FIG. In the figure, 42 is an X-Y type in-circuit tester, 44 is an operating section thereof, 46 is an XYZ control section, 48
Is a measuring unit, and 50 is a controller. This operation unit 44
Includes input / output devices such as a keyboard, a display device, a printer, and a floppy disk driver. And XY
The -Z controller 46 drives the servo motors and the like respectively provided in the four sets of XY units (not shown), and controls these XY units to provide the probe 32 provided in each XY unit. , 34, 36, 38 on the measuring table on the X-axis,
It appropriately moves in the Y-axis and Z-axis directions. Also, the measuring unit 4
The reference numeral 8 has a resistance measuring circuit 30, which supplies appropriate DC constant voltage, signals, etc., via the scanner 40 to the probes 32, 34, 36, 38 provided in the respective XY units, and these probes 32, 34. , 36, 38 contact patterns 26, 2
The current etc. flowing through 6 etc. is detected and the resistance etc. are measured.
【００１４】これ等の操作部４４、Ｘ−Ｙ−Ｚ制御部４
６、測定部４８はＣＰＵを備えたコントローラ５０によ
ってそれぞれ制御する。コントローラ５０は例えば図３
に示すようなマイクロコンピュータであり、ＣＰＵ（中
央処理装置）５２、ＲＯＭ（読み出し専用メモリ）５
４、ＲＡＭ（読み出し書き込み可能メモリ）５６、入出
力ポート５８、バスライン６０等から構成されている。
ＣＰＵ５０はマイクロコンピュータの中心となる頭脳部
に相当し、プログラムの命令に従って全体に対する制御
を実行すると共に、算術、論理演算を行ない、その結果
も一時的に記憶する。又、周辺装置に対しても適宜制御
を行なっている。ＲＯＭ５４にはＸ−Ｙ方式インサーキ
ットテスタ４２の全体を制御するための制御プログラム
等が格納されている。又、ＲＡＭ５６は外部から入力し
たデータ、ブリッジ半田検出処理プログラム、各プロー
ブ３２、３４、３６、３８を用いて検出したデータ、そ
れ等のデータからＣＰＵ５２で演算したデータ等の各種
データを記憶する。入出力ポート５８には操作部４４、
Ｘ−Ｙ−Ｚ制御部４６、測定部４８等が接続する。バス
ライン６０はそれ等を接続するためのアドレスバスライ
ン、データバスライン、制御バスライン等を含み、周辺
装置とも適宜結合する。These operation section 44, XYZ control section 4
6. The measuring unit 48 is controlled by the controller 50 having a CPU. The controller 50 is, for example, as shown in FIG.
And a CPU (central processing unit) 52, a ROM (read-only memory) 5
4, a RAM (readable / writable memory) 56, an input / output port 58, a bus line 60, and the like.
The CPU 50 corresponds to a central brain portion of the microcomputer, executes control of the whole according to instructions of a program, performs arithmetic and logical operations, and temporarily stores the result. Further, the peripheral devices are also appropriately controlled. The ROM 54 stores a control program and the like for controlling the entire XY in-circuit tester 42. Further, the RAM 56 stores various data such as data input from the outside, bridge solder detection processing program, data detected using the probes 32, 34, 36, 38, and data calculated by the CPU 52 from these data. The input / output port 58 has an operation unit 44,
The XYZ control unit 46, the measurement unit 48, etc. are connected. The bus line 60 includes an address bus line, a data bus line, a control bus line, and the like for connecting them, and is also properly connected to peripheral devices.
【００１５】図４、図５はＰ1 〜Ｐ3 のステップからな
る実装基板のブリッジ半田検出処理プログラムによる動
作を示すフローチャートである。実装基板に設けた多数
のパターンのパターン間のブリッジ半田を検査する場
合、先ずＰ1 で設定順に従って、図１に示すように検査
対象となる１箇所の両パターン２６、２８の必要箇所
に、第１〜第４測定プローブ３２、３４、３６、３８の
各先端がそれぞれ接触するようにプロービングする。そ
の際、第１、第２測定プローブ３２、３４は一方のパタ
ーン２６に互いの先端が僅か離れるように配置してプロ
ービングし、第３、第４測定プローブ３６、３８は他方
のパターン２８にやはり互いの先端が僅か離れるように
配置してプロービングする。FIG. 4 and FIG. 5 are flow charts showing the operation by the bridge solder detection processing program of the mounting board which comprises steps P1 to P3. When inspecting the bridge solder between a number of patterns provided on the mounting board, first, in accordance with the setting order in P1, as shown in FIG. Probing is performed so that the tips of the first to fourth measurement probes 32, 34, 36, 38 are in contact with each other. At that time, the first and second measurement probes 32 and 34 are arranged on the one pattern 26 so that the tips thereof are slightly apart from each other to perform probing, and the third and fourth measurement probes 36 and 38 are also formed on the other pattern 28. Place the tips so that they are slightly separated from each other and perform probing.
【００１６】そして、その１箇所のブリッジ半田の有無
の検査を開始する。先ず、Ｐ21で抵抗測定回路３０によ
りスキャナ４０を介し、第１、第２測定プローブ３２、
３４の間に直流の定電圧を印加し、電流を測定して抵抗
値を算出した後、その抵抗値としきい値とを比べ、抵抗
値がしきい値を超えているか判定する。ＹＥＳの場合は
第１、第２測定プローブ３２、３４のパターン２６に対
する接触状態が不良である。即ち、プロービング時の位
置ずれによる接触ミスにより第１、第２測定プローブ３
２、３４の少なくとも一方がパターン２６に接触してい
ない、或いは接触していてもフラックス上に接触してい
る。そこで、Ｐ22へ行き、検査結果を接触不良と表示し
或いは記録して、その基板２４に対する以後のブリッジ
半田の有無の検査を中止し、その基板２４を再検査品と
する。Then, the inspection for the presence / absence of the bridge solder at the one place is started. First, at P21, the resistance measuring circuit 30 passes through the scanner 40 and the first and second measuring probes 32,
A constant DC voltage is applied between 34, current is measured to calculate a resistance value, and the resistance value is compared with a threshold value to determine whether the resistance value exceeds the threshold value. In the case of YES, the contact state of the first and second measurement probes 32 and 34 with respect to the pattern 26 is poor. That is, the first and second measurement probes 3 are caused by a contact error due to a position shift during probing.
At least one of 2, 34 is not in contact with the pattern 26, or even if it is in contact, it is in contact with the flux. Therefore, the process goes to P22, the inspection result is displayed or recorded as a contact failure, and the subsequent inspection of the presence or absence of bridge solder on the board 24 is stopped, and the board 24 is re-inspected.
【００１７】Ｐ21でＮＯの場合、第１、第２測定プロー
ブ３２、３４のパターン２６に対する接触状態が良好で
ある。そこで、Ｐ23へ行く。Ｐ23でも同様にして第３、
第４測定プローブ３６、３８の間の抵抗値を算出した
後、その抵抗値としきい値とを比べ、抵抗値がしきい値
を超えているか判定する。ＹＥＳの場合はやはり第３、
第４測定プローブ３６、３８のパターン２８に対する接
触状態が不良である。そこで、Ｐ22へ行き、検査結果を
接触不良と表示する等して検査を中止し、基板２４を再
検査品にする。Ｐ23でＮＯの場合も、第３、第４測定プ
ローブ３６、３８のパターン２８に対する接触状態が良
好である。そこで、Ｐ24へ行く。When P21 is NO, the contact state of the first and second measurement probes 32 and 34 with the pattern 26 is good. Then, go to P23. Similarly for P23, the third,
After calculating the resistance value between the fourth measurement probes 36 and 38, the resistance value is compared with the threshold value to determine whether the resistance value exceeds the threshold value. If yes, after all,
The contact state of the fourth measurement probes 36 and 38 with respect to the pattern 28 is poor. Therefore, the process goes to P22, the inspection result is displayed as a contact failure, and the inspection is stopped to make the substrate 24 a re-inspected product. Also in the case of NO in P23, the contact state of the third and fourth measurement probes 36, 38 with the pattern 28 is good. So, go to P24.
【００１８】Ｐ24では同様にして第１、第３測定プロー
ブ３２、３６の間の抵抗値を算出した後、その抵抗値と
しきい値とを比べ、抵抗値がしきい値を超えているか判
定する。ＮＯの場合、ブリッジ半田である。そこで、Ｐ
25へ行き、検査結果をブリッジ半田で不良と表示する等
して検査を中止し、基板２４を不良品とする。ＹＥＳの
場合ブリッジ半田でない。そこでＰ26へ行き、検査結果
を良と表示する。なお、上記しきい値は数Ω〜数ＭΩの
範囲から選ぶ。In P24, similarly, after calculating the resistance value between the first and third measurement probes 32 and 36, the resistance value is compared with the threshold value to determine whether the resistance value exceeds the threshold value. . In the case of NO, it is bridge solder. So P
Going to 25, the inspection result is indicated as defective by the bridge solder and the inspection is stopped, and the substrate 24 is made a defective product. If YES, it is not bridge solder. Then, go to P26 and display the inspection result as good. The threshold value is selected from the range of several Ω to several MΩ.
【００１９】このようにして、Ｐ26で検査結果を良、即
ちブリッジ半田でないと表示等したときのみ、Ｐ3 へ行
く。Ｐ3 では基板２４のブリッジ半田を検査すべき全箇
所を検査したのか判定する。ＮＯの場合はＰ1 へ戻り、
次の検査の対象となる箇所の両パターンに第１〜第４測
定プローブ３２、３４、３６、３８をそれぞれプロービ
ングする。そして、Ｐ2 へ行き、その箇所につき同様の
手順を経て、第１〜第４測定プローブ３２、３４、３
６、３８の両パターンに対する接触の良、不良、ブリッ
ジ半田の有無を検査する。このようにして、先の箇所の
検査結果が良の場合のみ次の箇所の検査に移り、各箇所
につき同様の検査を繰り返し、全箇所を検査する。この
結果、全ての箇所の検査結果が良の場合に基板を良品と
する。なお、Ｐ24のステップでは第１、第３測定プロー
ブ３２、３６の間の抵抗値を算出したが、第１、第４測
定プローブ３２、３８の間の抵抗値を算出し、又は第
２、第３測定プローブ３４、３６の間の抵抗値を算出
し、或いは第２、第４測定プローブ３４、３８の間の抵
抗値を算出してしきい値と比べてもよい。In this way, the process goes to P3 only when the inspection result is good at P26, that is, when it is indicated that it is not the bridge solder. At P3, it is judged whether or not all the parts to be inspected for the bridge solder of the board 24 have been inspected. If NO, return to P1
The first to fourth measurement probes 32, 34, 36, 38 are probed on both patterns of the next inspection target. Then, go to P2, and follow the same procedure for that portion, and the first to fourth measurement probes 32, 34, 3
Good and bad contact with both patterns 6 and 38 and presence / absence of bridge solder are inspected. In this way, only when the inspection result of the previous part is good, the process moves to the inspection of the next part, and the same inspection is repeated for each part to inspect all parts. As a result, when the inspection results of all the parts are good, the board is determined to be good. In the step of P24, the resistance value between the first and third measurement probes 32 and 36 was calculated, but the resistance value between the first and fourth measurement probes 32 and 38 was calculated, or the resistance value between the second and third measurement probes 32 and 36 was calculated. The resistance value between the three measurement probes 34 and 36 may be calculated, or the resistance value between the second and fourth measurement probes 34 and 38 may be calculated and compared with the threshold value.
【００２０】上記実施例では両パターン２６、２８の間
の抵抗値の測定を２端子法によって行なったが、４端子
法によって行なうこともできる。その際には、例えば第
１、第２測定プローブ３２、３４の一方を抵抗測定回路
の＋側のソース端子に接続し、他方を＋側のセンス端子
に接続し、更に第３、第４測定プローブ３６、３８の一
方を−側のソース端子に接続し、他方を−側のセンス端
子に接続する。そして、抵抗測定回路より±ソース端子
の間に定電流を流し、±センス端子の間に発生する電圧
を検出し、両パターン２６、２８の間の抵抗値を算出し
て測定する。このような４端子法によると、±センス端
子に接続する各測定プローブ３２又は３４、３６又は３
８の接触抵抗値は極めて小さく無視できるようになる。In the above embodiment, the resistance value between the patterns 26 and 28 is measured by the two-terminal method, but it may be measured by the four-terminal method. In that case, for example, one of the first and second measurement probes 32 and 34 is connected to the + side source terminal of the resistance measurement circuit, and the other is connected to the + side sense terminal, and the third and fourth measurements are made. One of the probes 36 and 38 is connected to the-side source terminal, and the other is connected to the-side sense terminal. Then, a constant current is made to flow between the ± source terminals from the resistance measuring circuit, the voltage generated between the ± sense terminals is detected, and the resistance value between both patterns 26 and 28 is calculated and measured. According to such a four-terminal method, each measurement probe 32 or 34, 36 or 3 connected to the ± sense terminals
The contact resistance value of No. 8 is extremely small and can be ignored.
【００２１】上記実施例では第１〜第４測定プローブ３
２、３４、３６、３８として、それぞれ独立の測定プロ
ーブを使用したが、図６に示すような同軸型プローブユ
ニット６２をパターン６４に接触されて使用し、或いは
図７に示すようなバラレル型プローブユニット６６をパ
ターン６８に接触させて使用することもできる。この同
軸型プローブユニット６２は筒状の測定プローブ７０と
その内部に挿入した棒状の測定プローブ７２とを互いに
絶縁して一体型にした同軸型のプローブユニットであ
り、その先端側は両測定プローブ７０、７２の先端を揃
えて突出状態を等しくするが、後端側は測定プローブ７
２の後端部を測定プローブ７０の後端より少し突出す
る。又、パラレル型プローブユニット６６は２本の測定
プローブ７４、７６を並行に並べ絶縁して一体型にした
パラレル型のプローブユニットであり、２本の測定プロ
ーブ７４、７６は先端、後端共に揃えて突出状態を等し
くする。In the above embodiment, the first to fourth measuring probes 3
Although independent measurement probes are used as 2, 34, 36, and 38, a coaxial probe unit 62 as shown in FIG. 6 is used in contact with the pattern 64, or a parallel probe as shown in FIG. The unit 66 can also be used by contacting the pattern 68. The coaxial probe unit 62 is a coaxial probe unit in which a cylindrical measurement probe 70 and a rod-shaped measurement probe 72 inserted therein are insulated from each other to form an integrated type, and the tip side thereof is both measurement probes 70. , 72 to align the tips so that the protruding state is the same, but the rear end side is the measurement probe 7
The rear end of 2 is slightly projected from the rear end of the measurement probe 70. The parallel type probe unit 66 is a parallel type probe unit in which two measuring probes 74 and 76 are arranged in parallel and insulated to form an integrated type, and the two measuring probes 74 and 76 are aligned at both the front end and the rear end. To equalize the protruding state.
【００２２】このようなプローブユニット６２又は６４
を用いると、２本の測定プローブ７０、７２又は７４、
７６を同時に操作できる。それ故、検査時に２組のＸ−
Ｙユニットを操作すればよく、４組のＸ−Ｙユニットを
操作するのもより、操作時間を短縮して、基板のブリッ
ジ半田の有無の判定を高速化できる。しかも、測定プロ
ーブ７０、７２或いは７４、７６の先端を至近距離に接
近させて固定し、プローブユニット６２又は６６をコン
パクト化することができるので、パターン幅の狭いもの
でも一層対応可能になる。Such a probe unit 62 or 64
With two measuring probes 70, 72 or 74,
You can operate 76 at the same time. Therefore, two X-
It suffices to operate the Y unit, and it is possible to shorten the operation time and to speed up the determination of the presence or absence of bridge solder on the board as compared with the case of operating four sets of XY units. Moreover, since the tips of the measurement probes 70, 72 or 74, 76 can be fixed close to each other at a close distance and the probe unit 62 or 66 can be made compact, it is possible to further cope with a narrow pattern width.
【００２３】因みに、ピンボード方式の場合には基板の
例えば最も離れた２隅部にある２パターンに２本ずつ測
定プローブを立て、両測定プローブ間の抵抗値をそれぞ
れ測定すると、両パターンに対する測定プローブの接触
の良、不良を判定することにより、検査治具と基板との
位置ずれの有無を検査することもできる。Incidentally, in the case of the pinboard system, two measurement probes are set up in two patterns at two corners of the substrate which are most distant from each other, and the resistance value between both measurement probes is measured. It is also possible to inspect whether or not there is a positional deviation between the inspection jig and the substrate by determining whether the contact of the probe is good or bad.
【００２４】[0024]
【発明の効果】以上説明した本発明によれば、請求項１
ではブリッジ半田の検査の対象となる両パターンに対す
る各測定プローブの接触状態がいずれも良好であり、測
定プローブの位置ずれによる接触ミスやパターン上に存
在するフラックスとの接触等のないことを確認した上
で、ブリッジ半田の有無の判定を行なうため、実装基板
に設けたパターン間のブリッジ半田を正確に検出でき
る。According to the present invention described above, claim 1
Then, it was confirmed that the contact state of each measurement probe for both patterns to be inspected for bridge solder was good, and there was no contact error due to displacement of the measurement probe or contact with flux existing on the pattern. Since the presence / absence of the bridge solder is determined above, the bridge solder between the patterns provided on the mounting board can be accurately detected.
【００２５】請求項２ではブリッジ半田の検査の対象と
なる両パターンに対する各測定プローブの接触状態がい
ずれも良好であり、測定プローブの位置ずれによる接触
ミスやパターン上に存在するフラックスとの接触等のな
いことを確認した上で、４端子法により±センス端子に
接続する各測定プローブの接触抵抗値を極めて小さくし
て、パターン間の抵抗値を測定し、ブリッジ半田の有無
の判定を行なうため、実装基板に設けたパターン間のブ
リッジ半田を一層正確に検出できる。In the second aspect, the contact state of each measurement probe with respect to both patterns to be inspected for the bridge solder is good, and the contact error due to the displacement of the measurement probe, the contact with the flux existing on the pattern, etc. In order to determine the presence or absence of bridge solder by making sure that the contact resistance value of each measuring probe connected to the ± sense terminal is extremely small by the 4-terminal method and measuring the resistance value between patterns by confirming that there is no The bridge solder between the patterns provided on the mounting board can be detected more accurately.
【００２６】請求項３では同一パターンに接触する２本
の測定プローブを一体型にしたプローブユニットを用い
て、同一パターンに対して２本の測定プローブを同時に
取り扱い或いは操作できるため、各測定プローブをそれ
ぞれ個々的に取り扱い或いは操作するものより、取り扱
い或いは操作時間を短縮して、ブリッジ半田の有無の判
定を高速化できる。しかも、一体化する２測定プローブ
の先端を至近距離に接近させて固定し、プローブユニッ
トをコンパクト化することができるため、パターン幅の
小さなものにも対応でき、検出に好適となる。In the third aspect, since the two measuring probes that are in contact with the same pattern can be handled or operated at the same time by using the probe unit in which the two measuring probes are integrated, the two measuring probes can be handled or operated simultaneously. It is possible to shorten the handling or operating time and speed up the determination of the presence / absence of bridge solder, as compared with the case of individually handling or operating. Moreover, since the tips of the two measuring probes to be integrated are brought close to each other at a short distance and fixed, and the probe unit can be made compact, it is possible to deal with a small pattern width, which is suitable for detection.
【図１】本発明による実装基板の基板検査装置によるブ
リッジ半田検出方法の実施時における抵抗測定回路に接
続する４本の測定プローブと被検査基板の２パターンと
の接触状態を示す図である。FIG. 1 is a diagram showing a contact state between four measurement probes connected to a resistance measuring circuit and two patterns on a substrate to be inspected when a bridge solder detection method is performed by a substrate inspection device for a mounting substrate according to the present invention.
【図２】同抵抗測定回路を有するＸ−Ｙ方式インサーキ
ットテスタの構成を示すブロック図である。FIG. 2 is a block diagram showing a configuration of an XY type in-circuit tester having the resistance measuring circuit.
【図３】同Ｘ−Ｙ方式インサーキットテスタのコントロ
ーラの構成を示すブロック図である。FIG. 3 is a block diagram showing a configuration of a controller of the XY type in-circuit tester.
【図４】同コントローラのメモリに格納する実装基板の
ブリッジ半田検出処理プログラムによる動作を示すフロ
ーチャートである。FIG. 4 is a flowchart showing an operation by a bridge solder detection processing program of a mounting board stored in a memory of the controller.
【図５】同ブリッジ半田検出処理プログラムのサブルー
チンによる動作を示すフローチャートである。FIG. 5 is a flowchart showing an operation by a subroutine of the bridge solder detection processing program.
【図６】同抵抗測定回路に接続する２本の測定プローブ
を一体化した同軸型プローブユニットの被検査基板に設
けたパターンに対する接触状態を示す図である。FIG. 6 is a view showing a contact state of a coaxial probe unit in which two measurement probes connected to the same resistance measuring circuit are integrated with a pattern provided on a substrate to be inspected.
【図７】同抵抗測定回路に接続する２本の測定プローブ
を一体化したパラレル型プローブユニットの被検査基板
に設けたパターンに対する接触状態を示す図である。FIG. 7 is a view showing a contact state of a parallel type probe unit in which two measurement probes connected to the same resistance measuring circuit are integrated with a pattern provided on a substrate to be inspected.
【図８】従来の実装基板の基板検査装置によるブリッジ
半田検出方法の実施時における抵抗測定回路に接続する
２本の測定プローブと被検査基板の２パターンとの接触
状態を示す図である。FIG. 8 is a diagram showing a contact state between two measurement probes connected to a resistance measurement circuit and two patterns on a substrate to be inspected when a bridge solder detection method is performed by a conventional substrate inspection device for a mounting substrate.
２４…実装基板 ２６、２８、６４、６８…パターン
３０…抵抗測定回路 ３２、３４、３６、３８、７０、７２、７４、７６…測
定プローブ ４０…スキャナ ４２…Ｘ−Ｙ方式インサ
ーキットテスタ ４４…操作部 ４６…Ｘ−Ｙ−Ｚ制御
部 ４８…測定部 ５０…コントローラ ６２…同軸型
プローブユニット ６６…パラレル型プローブユニット24 ... Mounting board 26, 28, 64, 68 ... Pattern
30 ... Resistance measuring circuit 32, 34, 36, 38, 70, 72, 74, 76 ... Measuring probe 40 ... Scanner 42 ... XY system in-circuit tester 44 ... Operation part 46 ... XYZ control part 48 ... Measuring unit 50 ... Controller 62 ... Coaxial probe unit 66 ... Parallel probe unit
Claims (3)
ローブを備えた基板検査装置を用いて、実装基板に設け
たパターン間のブリッジ半田を検出する方法において、
上記測定プローブの内、２本の第１、第２測定プローブ
を互いの先端が僅か離れるように配置して一方のパター
ンに接触するようにし、更に２本の第３、第４測定プロ
ーブを互いの先端が僅か離れるように配置して他方のパ
ターンに接触するようにした後、第１、第２測定プロー
ブ間の抵抗値を測定し、その抵抗値としきい値とを比べ
て第１、第２測定プローブのパターンに対する接触状態
の良否を判定し、その接触状態が良好の場合に第３、第
４測定プローブ間の抵抗値を測定し、その抵抗値としき
い値とを比べて第３、第４測定プローブのパターンに対
する接触状態の良否を判定し、その接触状態が良好の場
合に第１又は第２測定プローブと第３又は第４測定プロ
ーブ間の抵抗値を測定し、その抵抗値としきい値とを比
べてブリッジ半田の有無を判定することを特徴とする実
装基板の基板検査装置によるブリッジ半田検出方法。1. A method of detecting bridge solder between patterns provided on a mounting board by using a board inspection device equipped with a plurality of measuring probes connected to a resistance measuring circuit,
Of the above-mentioned measurement probes, two first and second measurement probes are arranged so that their tips are slightly apart from each other so as to be in contact with one pattern, and further two third and fourth measurement probes are connected to each other. Of the first probe and the second probe are arranged so as to be in contact with the other pattern, and the resistance value between the first and second measurement probes is measured, and the resistance value is compared with the threshold value. 2 The quality of the contact state with respect to the pattern of the measurement probe is determined, and when the contact state is good, the resistance value between the third and fourth measurement probes is measured, and the resistance value is compared with a threshold value. The quality of the contact state with respect to the pattern of the fourth measurement probe is determined, and when the contact state is good, the resistance value between the first or second measurement probe and the third or fourth measurement probe is measured and used as the resistance value. Compare the threshold with bridge solder Bridge solder detection method by the substrate inspection device mounting board, characterized by determining the presence or absence.
ローブを備えた基板検査装置を用いて、実装基板に設け
たパターン間のブリッジ半田を検出する方法において、
上記測定プローブの内、２本の第１、第２測定プローブ
を互いの先端が僅か離れるように配置して一方のパター
ンに接触するようにし、更に２本の第３、第４測定プロ
ーブを互いの先端が僅か離れるように配置して他方のパ
ターンに接触するようにした後、第１、第２測定プロー
ブ間の抵抗値を測定し、その抵抗値としきい値とを比べ
て第１、第２測定プローブのパターンに対する接触状態
の良否を判定し、その接触状態が良好の場合に第３、第
４測定プローブ間の抵抗値を測定し、その抵抗値としき
い値とを比べて第３、第４測定プローブのパターンに対
する接触状態の良否を判定し、その接触状態が良好の場
合に４端子法により第１、第２測定プローブと第３、第
４測定プローブ間の抵抗値を測定し、その抵抗値としき
い値とを比べてブリッジ半田の有無を判定することを特
徴とする実装基板の基板検査装置によるブリッジ半田検
出方法。2. A method for detecting bridge solder between patterns provided on a mounting board using a board inspection device equipped with a plurality of measuring probes connected to a resistance measuring circuit,
Of the above-mentioned measurement probes, two first and second measurement probes are arranged so that their tips are slightly apart from each other so as to be in contact with one pattern, and further two third and fourth measurement probes are connected to each other. Of the first probe and the second probe are arranged so as to be in contact with the other pattern, and the resistance value between the first and second measurement probes is measured, and the resistance value is compared with the threshold value. 2 The quality of the contact state with respect to the pattern of the measurement probe is determined, and when the contact state is good, the resistance value between the third and fourth measurement probes is measured, and the resistance value is compared with a threshold value. The quality of the contact state with respect to the pattern of the fourth measurement probe is determined, and when the contact state is good, the resistance value between the first and second measurement probes and the third and fourth measurement probes is measured by the 4-terminal method, Compare the resistance value with the threshold value and Bridge solder detection method by the substrate inspection device mounting substrate and judging the presence or absence of Tsu di solder.
ーブを一体型にしたプローブユニットを用いることを特
徴とする請求項１又は２記載の実装基板の基板検査装置
によるブリッジ半田検出方法。3. A bridge solder detection method by a board inspection device for a mounting board according to claim 1, wherein a probe unit in which two measurement probes that contact the same pattern are integrated is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6060046A JPH07244105A (en) | 1994-03-04 | 1994-03-04 | Bridged solder detecting method by board inspecting device for mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6060046A JPH07244105A (en) | 1994-03-04 | 1994-03-04 | Bridged solder detecting method by board inspecting device for mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07244105A true JPH07244105A (en) | 1995-09-19 |
Family
ID=13130755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6060046A Pending JPH07244105A (en) | 1994-03-04 | 1994-03-04 | Bridged solder detecting method by board inspecting device for mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07244105A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100363294B1 (en) * | 1999-08-06 | 2002-12-05 | 가부시키가이샤 도쿄 웰드 | Probe tangency detecting method and probe tangency detecting apparatus |
| KR100532396B1 (en) * | 1998-11-04 | 2006-01-27 | 삼성전자주식회사 | Chip contact resistance determination method of the chip and wafer test method using the same |
| JP2013238435A (en) * | 2012-05-14 | 2013-11-28 | Hioki Ee Corp | Substrate inspection device and substrate inspection method |
| CN117665544A (en) * | 2024-02-01 | 2024-03-08 | 合肥晶合集成电路股份有限公司 | Wafer acceptance test method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107467U (en) * | 1984-12-19 | 1986-07-08 | ||
| JPS6379075A (en) * | 1986-09-22 | 1988-04-09 | Nippon Seiko Kk | Continuity test apparatus |
-
1994
- 1994-03-04 JP JP6060046A patent/JPH07244105A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107467U (en) * | 1984-12-19 | 1986-07-08 | ||
| JPS6379075A (en) * | 1986-09-22 | 1988-04-09 | Nippon Seiko Kk | Continuity test apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100532396B1 (en) * | 1998-11-04 | 2006-01-27 | 삼성전자주식회사 | Chip contact resistance determination method of the chip and wafer test method using the same |
| KR100363294B1 (en) * | 1999-08-06 | 2002-12-05 | 가부시키가이샤 도쿄 웰드 | Probe tangency detecting method and probe tangency detecting apparatus |
| JP2013238435A (en) * | 2012-05-14 | 2013-11-28 | Hioki Ee Corp | Substrate inspection device and substrate inspection method |
| CN117665544A (en) * | 2024-02-01 | 2024-03-08 | 合肥晶合集成电路股份有限公司 | Wafer acceptance test method |
| CN117665544B (en) * | 2024-02-01 | 2024-06-11 | 合肥晶合集成电路股份有限公司 | Wafer acceptance test method |
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