JPH07238397A - Dip plating device for sheet-like object - Google Patents
Dip plating device for sheet-like objectInfo
- Publication number
- JPH07238397A JPH07238397A JP2838594A JP2838594A JPH07238397A JP H07238397 A JPH07238397 A JP H07238397A JP 2838594 A JP2838594 A JP 2838594A JP 2838594 A JP2838594 A JP 2838594A JP H07238397 A JPH07238397 A JP H07238397A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- supply
- plated
- immersion
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 118
- 238000011084 recovery Methods 0.000 claims abstract description 24
- 238000007654 immersion Methods 0.000 claims description 26
- 239000007788 liquid Substances 0.000 abstract description 21
- 238000007598 dipping method Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばＩＣリードフレ
ームのような薄板状のめっき対象物にはんだめっきや銅
めっきなどを浸漬で施すのに用いられる浸漬めっき装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an immersion plating apparatus used for dipping solder plating, copper plating or the like on a thin plate-shaped object to be plated such as an IC lead frame.
【０００２】[0002]
【従来の技術】薄板状のめっき対象物、例えばＩＣリー
ドフレームにはんだや銅などのめっきを浸漬で施す装置
としては、例えば図３及び図４に示すようなものが知ら
れている。これらの装置は、何れも、箱状のめっき槽Ｓ
に満たしためっき液に一定の液流を与えつつ、このめっ
き液にめっき対象物Ｍを治具Ｊで吊り下げて所定時間浸
漬させることを基本的な構造としている。2. Description of the Related Art As an apparatus for dipping a thin plate-shaped object to be plated, for example, an IC lead frame, with solder, copper or the like by immersion, there is known one shown in FIGS. 3 and 4, for example. These devices are all box-shaped plating baths S
The basic structure is such that the plating target M is suspended by the jig J and dipped in the plating solution for a predetermined time while a constant flow of the plating solution is applied to the plating solution.
【０００３】このような構造にあって、めっき液に与え
る液流は、図３の場合には、めっき槽Ｓの一方の下側隅
に寝せて設けた供給手段Ｐからめっき液を矢印のように
流出させ、このめっき液を供給手段Ｐの設置側とは反対
側に設けたせき板Ｂを越えさせて回収部Ｒに回収するよ
うにし、これによりめっき対象物Ｍに沿った流れを与え
るようにしている。また図４の場合には、めっき対象物
Ｍの真下に寝せて設けた供給手段Ｐからめっき液を矢印
のように流出させ、このめっき液を左右両側に設けたせ
き板Ｂ、Ｂを越えさせて回収部Ｒ、Ｒに回収するように
してめっき対象物Ｍに沿った流れを与えるようにしてい
る。In such a structure, in the case of FIG. 3, the flow of the liquid to be applied to the plating solution is indicated by the arrow of the plating solution from the supply means P provided at one lower corner of the plating tank S. As described above, the plating solution is allowed to flow over the weir plate B provided on the side opposite to the side where the supply means P is installed, and is collected in the collecting section R, thereby giving a flow along the plating target M. I am trying. Further, in the case of FIG. 4, the plating solution is caused to flow out as shown by the arrow from the supply means P which is provided just below the object M to be plated, and the plating solution is passed over the weir plates B, B provided on both the left and right sides. By doing so, the flow along the object to be plated M is given so as to be recovered in the recovery parts R, R.
【０００４】これら従来の装置は、何れもかなり均一性
の高いめっきを施すことができるが、各図に見られるよ
うな液流がめっき対象物Ｍの表面の対応部位において非
対称的な流跡を描き、この流跡の非対称性乃至不均等性
の影響によるめっき状態のバラツキが生じ得る点で改善
の余地を残していた。Each of these conventional apparatuses can perform plating with a very high degree of uniformity, but as shown in each figure, the liquid flow has an asymmetrical trace on the corresponding portion of the surface of the object M to be plated. However, there was room for improvement in that variations in the plating state could occur due to the influence of the asymmetry or non-uniformity of the trace.
【０００５】[0005]
【発明が解決しようとする課題】従って本発明の目的
は、上記のような基本構造の浸漬めっき装置について、
より均一性の高いめっきを施せるようにすることにあ
る。Therefore, an object of the present invention is to provide an immersion plating apparatus having the above basic structure,
It is to be able to perform plating with higher uniformity.
【０００６】[0006]
【課題を解決するための手段】このような目的のため
に、本発明では、薄板状のめっき対象物をめっき槽内の
めっき液に吊下げて浸けた状態でめっき槽内のめっき液
に一定方向の流れを与えつつめっき処理するようになっ
ている浸漬めっき装置について、めっき対象物の左右各
側にほぼ対称に位置するようにして互いにほぼ同じ高さ
のせき板をめっき槽内に設け、一方のせき板により仕切
られた外側を供給部とすると共に、他方のせき板により
仕切られた外側を回収部とし、供給部から供給されるめ
っき液を供給部側のせき板を乗り越えさせて内側に流れ
込ませつつめっき対象物に沿った流れを経た後に回収部
側のせき板を乗り越えさせて回収部へ回収するようにし
ている。To achieve the above object, in the present invention, a thin plate-shaped object to be plated is suspended in a plating solution in a plating bath and immersed in the plating solution in the plating bath. In an immersion plating apparatus designed to perform a plating process while giving a directional flow, weirs having approximately the same height as each other are provided in the plating tank so as to be positioned substantially symmetrically on the left and right sides of the object to be plated, The outer side partitioned by one weir plate is used as the supply section, and the outer side partitioned by the other weir board is used as the recovery section, and the plating solution supplied from the supply section is passed over the weir board on the supply section side and the inner side. After passing through the flow along the object to be plated while flowing into the pipe, the barrier plate on the side of the collecting unit is passed over and the product is collected in the collecting unit.
【０００７】この浸漬めっき装置によると、めっき液の
供給レベルと回収レベルがそれぞれほぼ同じ高さの各せ
き板により与えられる、つまり供給レベルと回収レベル
がほぼ同じになるので、供給側から回収側に流れる液流
に、より水平に近い液跡を与えることができ、この結果
めっき対象物に沿う液流の液跡がめっき対象物の表面対
応部位において対称性が高くなり、従ってより均一性の
高いめっきを施せることになる。According to this immersion plating apparatus, the supply level and the recovery level of the plating solution are provided by the weirs having substantially the same height, that is, the supply level and the recovery level are substantially the same, so that from the supply side to the recovery side. It is possible to give a more horizontal liquid trace to the flowing liquid stream, and as a result, the liquid trace of the liquid flow along the object to be plated becomes more symmetric at the site corresponding to the surface of the object to be plated, and therefore more uniform. High plating can be applied.
【０００８】このような浸漬めっき装置については、い
わば左右が対称であるので、供給部と回収部を一定時間
ごとに交互に取り換えれるようにする、つまり一定時間
ごとに供給部であった側を回収部とし、回収部であった
側を供給部とする取り換えを行なうようにすると、流れ
の上流・下流による差異を相殺でき、さらに一層均一性
を高めることができる。In such an immersion plating apparatus, so to speak, the left and right are symmetrical, so that the supply section and the recovery section can be alternately replaced at regular intervals, that is, the side that was the supply section at regular intervals. When the recovery section is used and the side that was the recovery section is replaced with the supply section, the difference between the upstream and the downstream of the flow can be offset and the uniformity can be further improved.
【０００９】また同様の目的のために、本発明では、薄
板状のめっき対象物をめっき槽内のめっき液に吊下げて
浸けた状態でめっき槽内のめっき液に一定方向の流れを
与えつつめっき処理するようになっている浸漬めっき装
置について、めっき対象物を間にして一方の側に所定高
さを持ち上下方向に並べて複数の供給孔が形成された供
給手段を１乃至複数本立設すると共に、他方の側に、供
給手段の上端供給孔の高さとほぼ同じ高さが上端とされ
る複数の流出孔を上下方向で形成したせき板を設け、そ
して供給手段の各流出孔から供給されるめっき液を対象
物に沿った流れを経た後にせき板の流出孔を介してせき
板の外側の回収部へ回収するようにしている。For the same purpose, in the present invention, a thin plate-shaped object to be plated is suspended in a plating solution in a plating tank and immersed in the plating solution while applying a flow in a certain direction to the plating solution in the plating tank. Regarding an immersion plating apparatus adapted to perform plating treatment, one or a plurality of supply means having a predetermined height on one side and a plurality of supply holes formed in a row in the vertical direction with an object to be plated therebetween are provided upright. At the same time, the other side is provided with a weir plate in which a plurality of outflow holes whose upper end is approximately the same height as the height of the upper end supply hole of the supply means are formed in the up-and-down direction, and is supplied from each outflow hole of the supply means. After passing through the flow along the target object, the plating solution is collected in the collecting part outside the dam through the outflow hole of the dam.
【００１０】この浸漬めっき装置も縦に設けられた供給
手段とせき板との組み合わせにより、上記浸漬めっき装
置と同様に、めっき液の供給レベルと回収レベルを同一
化することでめっき状態の均一化を図っているものであ
るが、この場合には、供給手段の各供給孔とせき板の各
流出孔とがほぼ対となる関係になることで、それぞれで
同一的な供給レベルと回収レベルを形成することにな
り、さらに一層均一性を高めることができる。This immersion plating apparatus is also provided with a vertically-provided supply means and a weir plate, and as in the above-mentioned immersion plating apparatus, the supply level and the recovery level of the plating solution are equalized to make the plating state uniform. However, in this case, each supply hole of the supply means and each outflow hole of the weir plate are in a substantially paired relationship, so that the same supply level and recovery level can be obtained for each. As a result, the uniformity can be further improved.
【００１１】この浸漬めっき装置についても流れの上流
・下流による差異の相殺を取り入れるとさらに好まし
い。そのためには、めっき対象物を間にして供給手段及
びせき板をそれぞれ両側にほぼ対称に設け、両側の各供
給手段を一定時間ごとに切り替えて用いることができる
ようにする。It is more preferable that the immersion plating apparatus also incorporates offsetting of the difference between upstream and downstream of the flow. For that purpose, the supply means and the dam are provided substantially symmetrically on both sides with the object to be plated therebetween, and the supply means on both sides can be switched and used at regular intervals.
【００１２】[0012]
【実施例】以下、本発明の一実施例について説明する。
第１実施例による浸漬めっき装置は、図１に示すよう
に、やや細長い箱状のめっき槽１を有している。めっき
槽１内にはそれぞれめっき槽１の内面から一定の間隔を
おいて長手方向で向かい合うようにして左右一対でせき
板２ａ、２ｂが設けられており、この各せき板２ａ、２
ｂの外側にはめっき液の供給と回収に兼用できるように
された液路パイプ３ａ、３ｂが接続され、めっき液の供
給部４ａ、４ｂ又は回収部５ａ、５ｂとすることができ
るようにされている。EXAMPLES An example of the present invention will be described below.
The immersion plating apparatus according to the first embodiment has a slightly elongated box-shaped plating tank 1 as shown in FIG. In the plating tank 1, a pair of left and right weir plates 2a and 2b are provided so as to face each other in the longitudinal direction from the inner surface of the plating tank 1 at regular intervals.
On the outer side of b, liquid path pipes 3a and 3b, which are designed to be used for both supply and recovery of the plating solution, are connected so that they can be used as the supply sections 4a and 4b of the plating solution or the recovery sections 5a and 5b. ing.
【００１３】この浸漬めっき装置によるめっき処理は、
治具Ｊに吊り下げためっき対象物Ｍをめっき槽１内のめ
っき液に全体的に浸漬させ、この状態で一方の液路パイ
プ３ａから供給しためっき液を液路パイプ３ｂで回収し
つつ進められる。The plating process by this immersion plating apparatus is
The plating target M suspended on the jig J is wholly immersed in the plating solution in the plating tank 1, and in this state, the plating solution supplied from one of the solution path pipes 3a is collected by the solution path pipe 3b to proceed. To be
【００１４】この間、液路パイプ３ａから供給されため
っき液は、矢印の如く、せき板２ａを乗り越えて内側に
流れ込みつつめっき対象物Ｍに沿った流れを経た後にせ
き板２ｂを越えて回収部５ｂへ回収される……という液
流を形成する。これから分かるように、めっき液の供給
レベルと回収レベルがそれぞれほぼ同じ高さとなり、よ
り水平に近い液跡の液流を得ることができ、めっき対象
物Ｍに沿う液流の液跡がめっき対象物Ｍの表面対応部位
において対称性のより高いものとなり、より均一性の高
いめっきを施せる。During this time, the plating solution supplied from the liquid path pipe 3a goes over the weir plate 2a and flows inward as shown by the arrow, and after passing through the weir plate 2b, it goes over the weir plate 2b and recovers. 5b is collected and forms a liquid flow of. As can be seen from this, the supply level and the recovery level of the plating solution are substantially the same, so that a liquid flow of a more horizontal liquid trace can be obtained, and the liquid trace of the liquid flow along the plating object M is the plating target. The surface corresponding portion of the object M has higher symmetry, and plating with higher uniformity can be performed.
【００１５】特に、左右の対称性を利用してめっき液の
供給と回収について液路パイプ３ａと液路パイプ３ｂを
一定時間ごとに切り替えるようにすると、流れの上流・
下流による差異を相殺でき、さらに一層均一性を高める
ことができる。In particular, when the liquid passage pipe 3a and the liquid passage pipe 3b are switched at regular intervals for supplying and recovering the plating liquid by utilizing the left-right symmetry, the
The difference due to the downstream can be offset and the uniformity can be further enhanced.
【００１６】第２実施例による浸漬めっき装置は、図２
に示すように、同じく細長い箱状のめっき槽２１を有
し、このめっき槽２１内には、それぞれめっき槽２１の
内面から一定の間隔をおいて長手方向で向かい合うよう
にして左右一対で仕切りユニット２２ａ、２２ｂが設け
られている。各仕切りユニット２２ａ、２２ｂは、上下
方向に並べて複数の供給孔２３、２３、……を形成した
供給手段としてのそれぞれ２本ずつの供給パイプ２４
ａ、２４ｂと複数の流出孔２５、２５、……を上下方向
で形成したせき板２６ａ、２６ｂを組み合わせた構造と
され、この仕切りユニット２２ａ、２２ｂの外側は、そ
れぞれ図示せぬ回収パイプが接続され、めっき液の回収
部２７ａ、２７ｂとなるようにされている。The immersion plating apparatus according to the second embodiment is shown in FIG.
As shown in FIG. 5, there is also an elongated box-shaped plating tank 21. Inside the plating tank 21, a pair of left and right partition units are arranged so as to face each other in the longitudinal direction at regular intervals from the inner surface of the plating tank 21. 22a and 22b are provided. Each partition unit 22a, 22b has two supply pipes 24 as a supply means in which a plurality of supply holes 23, 23 ,.
a and 24b and a plurality of weir holes 25, 25, ... Formed in the up and down direction to form a structure in which weir plates 26a and 26b are combined. The plating solution recovery sections 27a and 27b are provided.
【００１７】この浸漬めっき装置によるめっき処理は、
同じく治具Ｊに吊り下げためっき対象物Ｍをめっき槽２
１内のめっき液に全体的に浸漬させ、この状態で一方の
供給パイプ２４ｂから供給しためっき液を反対側の回収
部２７ａで回収しつつ進められる。この間、供給パイプ
２４ｂから供給されためっき液は、矢印の如く、せき板
２６ａの流出孔２５、２５、……を通って回収部２７ａ
へ回収され、供給パイプ２４ｂの各供給孔２３、２３、
……とせき板２６ａの各流出孔２５、２５、……がほぼ
対となるように対応することにより、めっき液の供給レ
ベルと回収レベルがそれぞれについてほぼ同じ高さとな
っている。この結果、さらに一層均一性の高いめっきを
施せることは上記実施例における原理と同様である。こ
の場合にも必要に応じて供給パイプ２４ａと２４ｂとを
交互に切り替えて使用することにより、めっきの均一性
をさらに高めることができることも第１実施例と同様で
ある。The plating process by this immersion plating apparatus is
Similarly, the plating target M suspended from the jig J is placed in the plating tank 2
The plating solution in 1 is wholly dipped, and in this state, the plating solution supplied from one supply pipe 24b is collected by the collecting section 27a on the opposite side to proceed. During this time, the plating solution supplied from the supply pipe 24b passes through the outflow holes 25, 25, ...
To the respective supply holes 23, 23 of the supply pipe 24b,
The corresponding supply holes and the recovery levels of the plating solution have substantially the same height by correspondingly forming the outflow holes 25, 25, ... As a result, even more uniform plating can be performed, as in the principle of the above embodiment. Also in this case, the uniformity of plating can be further improved by alternately switching the supply pipes 24a and 24b to be used as needed, as in the first embodiment.
【００１８】尚、第２実施例については、供給パイプ２
４ａ、２４ｂを供給手段としたのに代えて、せき板２６
ａ、２６ｂを第１実施例のせき板２ａ、２ｂと同様に機
能させて供給手段とすることもできる。つまり、せき板
２６ａ又は２６ｂの流出孔２５、２５、……を供給手段
としての供給孔に利用する方式である。The supply pipe 2 is used in the second embodiment.
Instead of using 4a and 24b as the supply means, weir 26
It is also possible to make a and 26b function in the same manner as the weir plates 2a and 2b of the first embodiment to serve as the supply means. That is, this is a system in which the outflow holes 25, 25, ... Of the weir plate 26a or 26b are used as the supply holes as the supply means.
【００１９】[0019]
【発明の効果】以上説明したごとく本発明による浸漬め
っき装置は、めっき液の供給レベルと回収レベルがほぼ
同じになるようにされているので、めっき対象物の表面
対応部位における液流の液跡の対称性を上げることがで
き、より均一性の高いめっきを施せる。As described above, the immersion plating apparatus according to the present invention is designed so that the supply level and the recovery level of the plating solution are substantially the same, so that the trace of the liquid flow on the surface corresponding portion of the object to be plated. The symmetry of can be increased, and more uniform plating can be applied.
【図１】第１実施例による浸漬めっき装置を簡略化して
示す斜視図。FIG. 1 is a perspective view showing a simplified immersion plating apparatus according to a first embodiment.
【図２】第２実施例による浸漬めっき装置を簡略化して
示す斜視図。FIG. 2 is a perspective view showing a simplified immersion plating apparatus according to a second embodiment.
【図３】従来の浸漬めっき装置を簡略化して示す斜視
図。FIG. 3 is a perspective view showing a simplified conventional immersion plating apparatus.
【図４】従来の他の例による浸漬めっき装置を簡略化し
て示す斜視図。FIG. 4 is a perspective view showing a simplified immersion plating apparatus according to another conventional example.
１ めっき槽内 2a 、2b せき板 4a 、4b 供給部 5a 、5b 回収部 ２１ めっき槽内 24a 、24b 供給パイプ（供給手段） ２３ 供給孔 ２５ 流出孔 26a 、26b せき板 Ｍ めっき対象物 1 inside plating tank 2a, 2b weir plate 4a, 4b supply section 5a, 5b recovery section 21 inside plating tank 24a, 24b supply pipe (supply means) 23 supply hole 25 outflow hole 26a, 26b weir board M object to be plated
Claims (4)
っき液に吊下げて浸けた状態でめっき槽内のめっき液に
一定方向の流れを与えつつめっき処理するようになって
いる浸漬めっき装置において、めっき対象物の左右各側
にほぼ対称に位置するようにして互いにほぼ同じ高さの
せき板がめっき槽内に設けられ、一方のせき板により仕
切られた外側が供給部とされると共に、他方のせき板に
より仕切られた外側が回収部とされ、そして供給部から
供給されためっき液が供給部側のせき板を乗り越えて内
側に流れ込みつつめっき対象物に沿った流れを経た後に
回収部側のせき板を乗り越えて回収部へ回収されるよう
になっていることを特徴とする浸漬めっき装置。1. Immersion plating in which a thin plate-shaped object to be plated is suspended and immersed in a plating solution in a plating tank, and the plating solution in the plating tank is subjected to a unidirectional flow to perform plating treatment. In the apparatus, weirs having approximately the same height are provided in the plating tank so as to be positioned substantially symmetrically on the left and right sides of the object to be plated, and the outer side partitioned by one weir serves as the supply section. At the same time, the outer side partitioned by the other weir plate is used as a recovery unit, and the plating solution supplied from the supply unit passes through the weir plate on the supply unit side and flows inward while flowing along the object to be plated. An immersion plating apparatus characterized in that the immersion plating apparatus is adapted to be passed over a weir plate on the side of the recovery unit and to be recovered by the recovery unit.
取り換えれるようにした請求項１記載の浸漬めっき装
置。2. The immersion plating apparatus according to claim 1, wherein the supply section and the recovery section can be alternately replaced at regular intervals.
っき液に吊下げて浸けた状態でめっき槽内のめっき液に
一定方向の流れを与えつつめっき処理するようになって
いる浸漬めっき装置において、めっき対象物を間にして
一方の側に所定高さを持ち上下方向に並べて複数の供給
孔を形成した供給手段が立設されると共に、他方の側
に、供給手段の上端供給孔の高さとほぼ同じ高さが上端
とされる複数の流出孔を上下方向で形成したせき板が設
けられ、そして供給手段の各流出孔から供給されためっ
き液が対象物に沿った流れを経た後にせき板の流出孔を
介してせき板の外側の回収部へ回収されるようになって
いることを特徴とする浸漬めっき装置。3. Immersion plating in which a thin plate-shaped object to be plated is suspended and immersed in a plating solution in a plating tank, and the plating solution in the plating tank is subjected to a unidirectional flow to perform plating treatment. In the apparatus, a supply means having a predetermined height on one side and having a plurality of supply holes arranged vertically is formed upright with an object to be plated in between, and on the other side, an upper supply hole of the supply means is provided. Is provided with a weir plate in which a plurality of outflow holes whose height is almost the same as that of the upper end are formed in the vertical direction, and the plating solution supplied from each outflow hole of the supply means has flowed along the object. An immersion plating apparatus characterized in that it is later collected into a collecting section outside the dam through the outflow hole of the dam.
き板をそれぞれ両側にほぼ対称に設け、両側の各供給手
段を一定時間ごとに切り替えて用いることができるよう
にした請求項３記載の浸漬めっき装置。4. A supply means and a dam are provided substantially symmetrically on both sides with an object to be plated therebetween, and the supply means on both sides can be switched and used at regular intervals. Immersion plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2838594A JPH07238397A (en) | 1994-02-25 | 1994-02-25 | Dip plating device for sheet-like object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2838594A JPH07238397A (en) | 1994-02-25 | 1994-02-25 | Dip plating device for sheet-like object |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07238397A true JPH07238397A (en) | 1995-09-12 |
Family
ID=12247198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2838594A Pending JPH07238397A (en) | 1994-02-25 | 1994-02-25 | Dip plating device for sheet-like object |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07238397A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002309396A (en) * | 2001-04-11 | 2002-10-23 | Dainippon Printing Co Ltd | Plate-making plating method |
| CN104562125A (en) * | 2015-01-09 | 2015-04-29 | 深圳市奥美特科技有限公司 | Collecting device for sheet type integrated circuit plating equipment |
| KR102034466B1 (en) * | 2019-06-20 | 2019-10-21 | 지원석 | Operating Method of Satin Nickel Plating Tank With Improved Productivity |
-
1994
- 1994-02-25 JP JP2838594A patent/JPH07238397A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002309396A (en) * | 2001-04-11 | 2002-10-23 | Dainippon Printing Co Ltd | Plate-making plating method |
| CN104562125A (en) * | 2015-01-09 | 2015-04-29 | 深圳市奥美特科技有限公司 | Collecting device for sheet type integrated circuit plating equipment |
| KR102034466B1 (en) * | 2019-06-20 | 2019-10-21 | 지원석 | Operating Method of Satin Nickel Plating Tank With Improved Productivity |
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