JP2009091597A - Treatment apparatus - Google Patents

Treatment apparatus Download PDF

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JP2009091597A
JP2009091597A JP2007260410A JP2007260410A JP2009091597A JP 2009091597 A JP2009091597 A JP 2009091597A JP 2007260410 A JP2007260410 A JP 2007260410A JP 2007260410 A JP2007260410 A JP 2007260410A JP 2009091597 A JP2009091597 A JP 2009091597A
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processing
treatment
processing liquid
tank
liquid
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Hiroshi Koike
博 小池
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Japan Envirotic Industry Co Ltd
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Japan Envirotic Industry Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment apparatus having a simple structure and used for a plating treatment. <P>SOLUTION: In the treatment apparatus, a pair of left and right overflow gutters 2, 2 are arranged along the longitudinal direction in the upper part of a treatment tank body 1 filled with a treating liquid S, a treating liquid suction groove is opened along the longitudinal direction on the bottom of the treatment tank 1, a treating liquid receiver 5 is arranged in the lower side of the suction groove, a treating liquid circulation path 6 communicates with the treating liquid receiver 5 and the pair of the left and right overflow gutters 2, 2 and a material W to be treated which is a thin sheet is suspended between the pair of the left and right gutters 2, 2 and moves along the right gutters 2, 2. In the treatment apparatus, the downward flow of the treating liquid S from the overflow gutters 7, 7 toward the tank bottom part suction groove is generated in both side of the material W to be treated to prevent the floatation of the material W to be treated from the lower part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば薄物金属シートに電気メッキ処理を施こす際に使用される処理装置に関するものである。   The present invention relates to a processing apparatus used, for example, when electroplating a thin metal sheet.

従来、この種の処理装置にあっては、処理液を充填した処理槽本体内を通過する薄物シートの両側から上下複数段に配置した処理液噴射ノズルから処理液を噴射することによって、該薄物シート下部からの浮き上がりを防止し、もって均一な処理を施こす構成が提供されている（特許文献１，２参照）。   Conventionally, in this type of processing apparatus, the thin material is ejected from the processing liquid jet nozzles arranged in a plurality of upper and lower stages from both sides of the thin sheet passing through the processing tank body filled with the processing liquid. There has been provided a configuration in which lifting from the lower part of the sheet is prevented and uniform processing is performed (see Patent Documents 1 and 2).

特表２００３−５１４１２５号Special table 2003-514125 特開２００２−１２９３８１号Japanese Patent Laid-Open No. 2002-129281

上記従来の方法では、処理槽本体内に処理液噴射ノズルを左右複数段設置しなければならず、装置の構造が複雑になり、装置が高価になり、またメンテナンスにも不利になること、また左右のノズルからの処理液噴射圧をバランスしないと、薄物が出来なくなること、そのために左右のノズルからの処理液噴射圧の調整に労力を要すること、等の問題点がある。   In the above conventional method, the treatment liquid jet nozzles must be installed in a plurality of stages on the left and right in the treatment tank body, the structure of the apparatus becomes complicated, the apparatus becomes expensive, and it is disadvantageous for maintenance. If the treatment liquid injection pressures from the left and right nozzles are not balanced, there is a problem that a thin object cannot be formed, and that adjustment of the treatment liquid injection pressures from the left and right nozzles requires labor.

本発明は、上記従来の問題点を解決するための手段として、処理液Sが充填される処理槽本体１の上部には、長手方向に沿って左右一対の溢流樋２，２を配置し、該処理槽１の底部には長手方向に沿って処理液吸引溝３を開口せしめ、該吸引溝３の下側には処理液受器５を配置し、該処理液受器５と該左右一対の溢流樋２，２との間に処理液循環経路６を連絡せしめ、薄物シートである被処理材Wを該左右一対の溢流樋２，２の間から垂下させつつ該溢流樋２，２に沿って移動させる処理装置を提供するものである。
本発明のより好ましい態様は、該処理槽本体１の左右上縁に沿って受樋７，７をそれぞれ配置し、該受樋７，７から該処理液受器５に処理液流下経路８を連絡している態様である。
該処理液受器５内は上下に複数段穴明き隔壁１６によって区画されていることが好ましく、該処理槽１はメッキ処理槽であり、該処理液Sはメッキ処理液であることが好ましい。 In the present invention, as a means for solving the above-mentioned conventional problems, a pair of left and right overflow basins 2 and 2 are arranged along the longitudinal direction on the upper part of the processing tank main body 1 filled with the processing liquid S. A treatment liquid suction groove 3 is opened along the longitudinal direction at the bottom of the treatment tank 1, and a treatment liquid receiver 5 is disposed below the suction groove 3. The treatment liquid circulation path 6 is connected between the pair of overflow ridges 2 and 2, and the material to be treated W, which is a thin sheet, is suspended from between the pair of left and right overflow ridges 2 and 2. A processing apparatus that moves along the lines 2 and 2 is provided.
In a more preferred embodiment of the present invention, receiving rods 7 and 7 are arranged along the left and right upper edges of the processing tank main body 1, respectively, and a processing liquid flow path 8 is provided from the receiving rods 7 and 7 to the processing liquid receiver 5. It is the aspect which is contacting.
The inside of the processing liquid receiver 5 is preferably partitioned by a multi-stage perforated partition wall 16 in the vertical direction, the processing tank 1 is a plating processing tank, and the processing liquid S is preferably a plating processing liquid. .

〔作用〕
処理槽１の一端から薄物シートである被処理材Wを垂下して、該処理槽１内の処理液Sに浸漬し、他端側へ移動させつつ該被処理材Wを該処理液Sによって処理する。
この際、該左右一対の溢流樋２，２から処理液Sを槽内上部に溢流させ、槽内処理液Sを該処理槽１底部の吸引溝３に吸引せしめると、該被処理材Wの両側に処理液S下行流が発生し、該被処理材Wの下部からの浮き上がりが防止され直立状態となる。
吸引溝３に吸引された処理液Sは処理液受器５に蓄積され、処理液循環路６より該溢流樋２，２に戻される。
更に処理槽本体１の左右上縁から溢流した処理液Sは受樋７，７に受けられ、処理液流下経路８によって処理液受器５に流下蓄積される。
該処理液受器１５の上下複数段を穴明き隔壁１６によって区画すると、該受器１５内の処理液が該隔壁１６の穴１７を通るとき整流され、その結果槽内の処理液Sの流れが均一化される。
本発明の処理装置はメッキ処理に特に有用である。 [Action]
The material W to be treated, which is a thin sheet, is suspended from one end of the treatment tank 1 and immersed in the treatment liquid S in the treatment tank 1 and moved to the other end side while the treatment material W is moved by the treatment liquid S. To process.
At this time, when the processing liquid S overflows from the pair of left and right overflow basins 2 and 2 and the processing liquid S in the tank is sucked into the suction groove 3 at the bottom of the processing tank 1, the material to be processed A descending flow of the processing liquid S is generated on both sides of W, and the material W to be lifted from the lower portion is prevented and is in an upright state.
The processing liquid S sucked into the suction groove 3 is accumulated in the processing liquid receiver 5 and returned to the overflow tanks 2 and 2 from the processing liquid circulation path 6.
Further, the processing liquid S overflowing from the left and right upper edges of the processing tank main body 1 is received by the receptacles 7 and 7 and is flowed down and accumulated in the processing liquid receiver 5 by the processing liquid flow path 8.
When the upper and lower stages of the processing liquid receiver 15 are partitioned by the perforated partition wall 16, the processing liquid in the receiver 15 is rectified when passing through the hole 17 of the partition wall 16, and as a result, the processing liquid S in the tank is rectified. The flow is made uniform.
The processing apparatus of the present invention is particularly useful for plating.

〔効果〕
本発明では、処理槽内にノズル等を配置しなくても良いので、処理装置の構造が簡単になり安価に提供出来るし、またメンテナンス的にも有利になる。
更に槽内処理液に下行流を発生させて被処理材Wの下部の浮き上がりを防止するので、ノズルからの処理液噴射圧をバランスさせるような労力や手間が省略される。 〔effect〕
In the present invention, since it is not necessary to arrange a nozzle or the like in the treatment tank, the structure of the treatment apparatus is simplified and can be provided at a low cost, and it is advantageous in terms of maintenance.
Furthermore, since a descending flow is generated in the processing liquid in the tank to prevent the lower portion of the material W to be lifted, labor and labor for balancing the processing liquid injection pressure from the nozzles are omitted.

本発明の第１実施例を図１から図３に示す。
各図において、１はメッキ処理槽本体であり、該メッキ処理槽本体１の上部には長手方向に沿って左右一対の溢流樋２，２が配置されており、該処理槽１の底部中央には長手方向に沿って処理液吸引溝３が開口しており、該吸引溝３の左右上縁からはガイド板４，４が斜め上方に差出されている。 A first embodiment of the present invention is shown in FIGS.
In each figure, 1 is a plating tank body, and a pair of left and right overflow ridges 2 and 2 are arranged along the longitudinal direction on the upper part of the plating tank body 1. The processing liquid suction groove 3 is opened along the longitudinal direction, and the guide plates 4 and 4 are projected obliquely upward from the left and right upper edges of the suction groove 3.

該処理槽本体１の吸引溝３の下側には処理液受器５が配置され、該受器５と左右一対の溢流樋２，２との間には循環ポンプPが介在する処理液循環経路６および枝経路６A,６Aが連絡している。   A processing liquid receiver 5 is disposed below the suction groove 3 of the processing tank body 1, and a processing liquid in which a circulation pump P is interposed between the receiver 5 and the pair of left and right overflow ridges 2, 2. The circulation path 6 and the branch paths 6A and 6A are in communication.

更に該処理槽本体１の左右上縁に沿っては受樋７，７が配置され、該受樋７，７からは該受器５に処理液流下経路８がそれぞれ連絡している。   Further, receptacles 7 and 7 are arranged along the left and right upper edges of the treatment tank body 1, and a treatment liquid flow path 8 communicates with the receptacle 5 from the receptacles 7 and 7, respectively.

該処理槽本体１には、例えば銅メッキ液、ニッケルメッキ等のメッキ液が処理液Sとして充填され、該処理槽本体１の一端からはクリップ９によって支持されたプリント基板等の薄物シートWが浸漬される。該薄物シートWは、例えば、ポリイミド、アラミド等の樹脂の薄物シートである。   The processing tank main body 1 is filled with, for example, a plating liquid such as copper plating solution or nickel plating as the processing liquid S. From one end of the processing tank main body 1, a thin sheet W such as a printed circuit board supported by a clip 9 is provided. Soaked. The thin sheet W is, for example, a thin sheet of resin such as polyimide or aramid.

該処理槽において、図３に示すようにクリップ９の上端部がコの字状に屈曲した係合部１１を有する懸垂板１０に垂下支持されており、該懸垂板１０の係合部１１は処理槽本体１上方長手方向に配設されている陰極バー１３に摺動可能に面接触的に係合し、更に該懸垂板１０の係合部１１には該陰極バー１３と平行して配設されている駆動ベルト１２が連絡している。かくして該薄物シートである被処理材Wは該陰極バー１３から懸垂板１０を介して懸垂され、かつ陰極が接続され、該駆動ベル１２を図示しない駆動源によって槽本体１の一端から他端に向けて移動させれば、該被処理材Wは該懸垂板１０を介して陰極バー１３に沿って槽本体の一端から他端に移動するようにされている。更に該処理槽本体１内には左右一対の陽極板１４，１４が挿入されている。   In the processing tank, as shown in FIG. 3, the upper end portion of the clip 9 is suspended and supported by a suspension plate 10 having an engagement portion 11 bent in a U shape, and the engagement portion 11 of the suspension plate 10 is The cathode bar 13 disposed in the longitudinal direction above the treatment tank main body 1 is slidably engaged in surface contact. Further, the engaging portion 11 of the suspension plate 10 is arranged in parallel with the cathode bar 13. The installed drive belt 12 is in communication. Thus, the material W to be processed, which is the thin sheet, is suspended from the cathode bar 13 via the suspension plate 10 and connected to the cathode, and the drive bell 12 is connected from one end of the tank body 1 to the other end by a drive source (not shown). When moved in the direction, the workpiece W is moved from one end to the other end of the tank body along the cathode bar 13 via the suspension plate 10. Further, a pair of left and right anode plates 14 are inserted into the processing tank body 1.

上記構成において、槽内の処理液Sは槽底部の左右一対のガイド板４，４にガイドされて受器５に流下し、該受器５から処理液循環経路６、枝経路６A,６Aを介して循環ポンプPによって左右一対の溢流樋２，２に循環され、該溢流樋２，２から溢流して槽内上部に戻される。したがって槽内処理液Sには溢流樋２，２から槽内への溢流、吸引溝３からの吸引によって図２矢印に示すように被処理材Wの左右側に下行流が発生し、該下行流によって該被処理材Wは下部から浮上するのを防止され、極板１４，１４に正対する直立状態となる。該被処理材Wはこの状態で前記したように駆動ベルト１２に懸垂板１０を介して槽本体１の一端から他端に図１矢印に示すように摺動し、この間に所定のメッキが均一に施される。   In the above configuration, the processing liquid S in the tank is guided by a pair of left and right guide plates 4 and 4 at the bottom of the tank and flows down to the receiver 5, and from the receiver 5, the processing liquid circulation path 6 and branch paths 6A and 6A are passed through. The circulation pump P circulates the pair of left and right overflow troughs 2 and 2, overflows from the overflow troughs 2 and 2, and returns to the upper part in the tank. Accordingly, in the tank treatment liquid S, overflow from the overflow ridges 2 and 2 into the tank and suction from the suction groove 3 causes a descending flow to be generated on the left and right sides of the workpiece W as shown by arrows in FIG. The material W to be treated is prevented from floating from the lower portion by the descending flow, and is brought into an upright state facing the electrode plates 14 and 14. In this state, the workpiece W slides from one end of the tank body 1 to the other end of the tank body 1 via the suspension plate 10 as shown in the arrow of FIG. To be applied.

更に槽本体１の左右上縁から溢流した処理液Sは受樋７，７内に流入し、該受樋７，７から流下経路８を介して受器５内に流入する。
なお槽本体１の液位ｈは一定に保たれることが望ましく、そのためには循環ポンプPによる受樋７，７から常時液が受器５内に流入するように処理液循環量を調節する。 Further, the processing liquid S overflowing from the left and right upper edges of the tank body 1 flows into the receptacles 7 and 7 and flows into the receiver 5 from the receptacles 7 and 7 through the flow-down path 8.
In addition, it is desirable that the liquid level h of the tank body 1 is kept constant. For this purpose, the processing liquid circulation amount is adjusted so that the liquid always flows into the receiver 5 from the receptacles 7 and 7 by the circulation pump P. .

図４から図６には本発明の第２実施例が示される。
本実施例では槽本体１の底部の吸引溝３の下側に配置されている受器１５内は穴明き隔壁１６によって二段に区画されている。
この実施例では吸引溝３によって受器１５内に吸引された処理液Sは長手方向に沿って配列されている隔壁１６の複数個の穴１７によって長手方向に均等に分散されることによって槽内の下行流が均一化され、第一実施例よりも一層均一なメッキ処理が達成される。流下経路８A,８Bは図６に示すように、循環経路６の異なった位置に接続されてもよい。 4 to 6 show a second embodiment of the present invention.
In this embodiment, the inside of the receiver 15 disposed below the suction groove 3 at the bottom of the tank body 1 is divided into two stages by a perforated partition wall 16.
In this embodiment, the processing liquid S sucked into the receiver 15 by the suction groove 3 is evenly dispersed in the longitudinal direction by the plurality of holes 17 of the partition wall 16 arranged along the longitudinal direction, whereby the inside of the tank. The downstream flow is made uniform, and a more uniform plating process is achieved than in the first embodiment. The flow-down paths 8A and 8B may be connected to different positions of the circulation path 6 as shown in FIG.

上記実施例では受器１５内は隔壁１６，１６によって二段に区画されたが、更に図７に示すように二段の隔壁２６，２６によって三段に区画されてもよい。この場合は二段の隔壁２６，２６の穴２７，２７によって下行流の均一化がより精密に行われる。また隔壁は三段以上にされてもよい。   In the above embodiment, the receiver 15 is divided into two stages by the partition walls 16 and 16, but may be further divided into three stages by the two-stage partition walls 26 and 26 as shown in FIG. In this case, the downstream flow is made more uniform by the holes 27, 27 of the two-stage partition walls 26, 26. Moreover, a partition may be made into three steps or more.

本実施例の場合は、左右の受樋７，７から処理液を流下させる流下経路８A、８Bは別々に循環経路６の循環ポンプP上流側に合流する。該流下経路８A,８B、循環経路６にはそれぞれバルブV1,V2,V3が介在され、バルブV1,V2,V3によって処理液の循環量を調節する。   In the case of the present embodiment, the flow-down paths 8A and 8B for flowing the processing liquid from the left and right receptacles 7 and 7 are separately joined to the upstream side of the circulation pump P of the circulation path 6. Valves V1, V2, and V3 are interposed in the flow-down paths 8A and 8B and the circulation path 6, respectively, and the circulation amount of the processing liquid is adjusted by the valves V1, V2, and V3.

上記二つの実施例はいずれも電気メッキ処理に関するものであったが、本発明では無電解メッキ処理、電気泳動塗装処理等、電気メッキ以外の処理も対象とされる。   Both of the two embodiments described above relate to electroplating, but the present invention also covers processes other than electroplating, such as electroless plating and electrophoretic coating.

本発明では、構造が簡単な、安価なかつメンテナンスに有利な処理装置が提供され、該処理装置によれば、被処理材に均一な処理を行なうことが保証されるから、産業上利用可能である。   The present invention provides a processing apparatus that has a simple structure, is inexpensive, and is advantageous for maintenance, and according to the processing apparatus, it is guaranteed that uniform processing is performed on a material to be processed, and is therefore industrially applicable. .

図１〜図３は本発明の実施例１を、図４〜図６は実施例２を、図７は他の実施例を示すものである。
説明斜視図 横断面図 上部説明図 横断面図 底部吸引溝平面図 他の経路接続方式の説明図 他の実施例の横断面図 1 to 3 show a first embodiment of the present invention, FIGS. 4 to 6 show a second embodiment, and FIG. 7 shows another embodiment.
Perspective view Cross section Upper explanatory drawing Cross section Bottom suction groove plan view Illustration of other route connection methods Cross-sectional view of another embodiment

符号の説明Explanation of symbols

１ 処理槽本体
２ 溢流樋
３ 吸引溝
５ 処理液受器
６ 処理液循環経路
７ 受樋
８ 処理液流下経路
１６ 隔壁
S 処理液
W 被処理材
DESCRIPTION OF SYMBOLS 1 Processing tank main body 2 Overflow gutter 3 Suction groove 5 Process liquid receptacle 6 Process liquid circulation path 7 Receptacle 8 Process liquid flow path 16 Partition
S treatment liquid
W Material to be treated

Claims (4)

処理液が充填される処理槽本体の上部には、長手方向に沿って左右一対の溢流樋を配置し、該処理槽の底部には長手方向に沿って処理液吸引溝を開口せしめ、該吸引溝の下側には処理液受器を配置し、該処理液受器と該左右一対の溢流樋との間に処理液循環経路を連絡せしめ、薄物シートである被処理材を該左右一対の溢流樋の間から垂下させつつ該溢流樋に沿って移動させることを特徴とする処理装置。   A pair of left and right overflow ridges are arranged along the longitudinal direction at the top of the treatment tank main body filled with the treatment liquid, and a treatment liquid suction groove is opened along the longitudinal direction at the bottom of the treatment tank. A processing liquid receiver is disposed below the suction groove, and a processing liquid circulation path is connected between the processing liquid receiver and the pair of left and right overflows so that the material to be processed, which is a thin sheet, is placed on the left and right sides. A processing apparatus, wherein the apparatus is moved along the overflow basin while drooping from between a pair of overflow basins. 該処理槽本体の左右上縁に沿って受樋をそれぞれ配置し、該受樋から該処理液受器に処理液流下経路を連絡した請求項１に記載の処理装置。   The processing apparatus according to claim 1, wherein receptacles are arranged along the left and right upper edges of the treatment tank main body, and a treatment liquid flow path is communicated from the receptacle to the treatment solution receiver. 該処理液受器内は上下に複数段穴明き隔壁によって区画されている請求項１または２に記載の処理装置。   The processing apparatus according to claim 1 or 2, wherein the inside of the processing liquid receiver is partitioned by a multi-stage perforated partition wall. 該処理槽はメッキ処理槽であり、該処理液はメッキ処理液である請求項１〜３いずれか１項に記載の処理装置。

The processing apparatus according to claim 1, wherein the processing tank is a plating processing tank, and the processing liquid is a plating processing liquid.

JP2007260410A 2007-10-03 2007-10-03 Treatment apparatus Pending JP2009091597A (en)

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CN109989100A (en) * 2017-11-28 2019-07-09 丸仲工业株式会社 The electrolytic plating apparatus of the easy horizontal carrying formula of maintenance inspection operation
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