JPH07235796A - High frequency circuit wherein multilayer substrate is used - Google Patents
High frequency circuit wherein multilayer substrate is usedInfo
- Publication number
- JPH07235796A JPH07235796A JP6027212A JP2721294A JPH07235796A JP H07235796 A JPH07235796 A JP H07235796A JP 6027212 A JP6027212 A JP 6027212A JP 2721294 A JP2721294 A JP 2721294A JP H07235796 A JPH07235796 A JP H07235796A
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- frequency circuit
- multilayer substrate
- pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguides (AREA)
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は多層基板を用いた高周波
回路に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit using a multilayer substrate.
【０００２】[0002]
【従来の技術】従来技術では，基板でトランスを作成す
る場合，２層基板により相対するパターンを形成するこ
とで構成していた。2. Description of the Related Art In the prior art, when a transformer is formed on a substrate, a two-layer substrate is used to form opposing patterns.
【０００３】[0003]
【発明が解決しようとする課題】この方法ではパターン
が外に露出しているため，高周波が放射しやすく，他の
回路に影響することが多かった。このため，高周波シー
ルド対策が必要となり，装置の大型化につながる欠点が
ある。本発明では，これらの欠点を除去し，小型で安定
した高周波回路を作成することを目的とする。In this method, since the pattern is exposed to the outside, high frequencies are likely to be radiated and often affect other circuits. For this reason, it is necessary to take measures against high-frequency shielding, which has the drawback of increasing the size of the device. An object of the present invention is to eliminate these drawbacks and to make a compact and stable high frequency circuit.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するた
め，高周波シールド用に多層基板のトランスの外側のパ
ターンをアースとすることでその内部のトランスを形成
しているパターンからの高周波の放射をおさえる効果を
持たせるようにしたものである。In order to achieve the above object, a pattern on the outer side of a transformer of a multi-layer substrate for high-frequency shielding is grounded so that high-frequency radiation from the pattern forming the transformer inside the multi-layered substrate is prevented. It is designed to have a holding effect.
【０００５】[0005]
【作用】その結果，トランス回路の高周波はシールドさ
れ，他の回路に影響を与えることはなくなる。As a result, the high frequency of the transformer circuit is shielded and does not affect other circuits.
【０００６】[0006]
【実施例】以下にこの発明の実施例を図１に，回路図を
図２に示す。これは４層基板で構成したバラントランス
で，内層パターン（１）２にスルーホールにより接続さ
れている端子５と内層パターン（２）３からアースパタ
ーン１に同様に接続されている端子８がアンバランス側
となる。バランス側が端子６，端子７側となる。端子５
に入力された信号は内層パターン（１）２と内層パター
ン（２）３で結合し，端子６，端子７ではバランス出力
となる。この回路はアースパターン１でサンドイッチさ
れているため，高周波の外部への放射はほとんどなく，
他の回路への影響はない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention is shown in FIG. 1 and a circuit diagram is shown in FIG. This is a balun transformer composed of a four-layer board, in which the terminal 5 connected to the inner layer pattern (1) 2 by a through hole and the terminal 8 similarly connected from the inner layer pattern (2) 3 to the ground pattern 1 are not connected. Be on the balance side. The balance side is terminals 6 and 7. Terminal 5
The signals input to are combined by the inner layer pattern (1) 2 and the inner layer pattern (2) 3 and are balanced output at the terminals 6 and 7. Since this circuit is sandwiched by the earth pattern 1, there is almost no radiation of high frequencies to the outside,
There is no effect on other circuits.
【０００７】また，バラントランスの他，方向性結合
器，ハイブリッドリング，ラットレース回路，分配器も
内層のパターンで同様に構成できる。さらに，６層以上
の多層基板を使うことにより，内部４層で上記回路１つ
を構成し，外側には別の回路を実装できる。この場合，
高周波回路の高密度実装を可能とするため，ハイブリッ
ドＩＣ等に応用できる。In addition to the balun transformer, a directional coupler, a hybrid ring, a rat race circuit, and a distributor can be similarly constructed with an inner layer pattern. Furthermore, by using a multi-layer substrate having 6 or more layers, one circuit can be configured with four layers inside and another circuit can be mounted on the outside. in this case,
Since it enables high-density mounting of high-frequency circuits, it can be applied to hybrid ICs.
【０００８】[0008]
【発明の効果】この発明により，多層基板の外側のパタ
ーンをアースとすることで，容易にシールド効果を持た
せることができ，小型で安定した回路とすることができ
る。According to the present invention, the pattern on the outer side of the multilayer substrate is grounded, so that the shield effect can be easily provided, and the circuit can be made compact and stable.
【図１】本発明の一実施例を示す４層基板の断面図であ
る。FIG. 1 is a cross-sectional view of a four-layer substrate showing an embodiment of the present invention.
【図２】本発明の一実施例を示すバラントランスの回路
図である。FIG. 2 is a circuit diagram of a balun transformer showing an embodiment of the present invention.
１ アースパターン ２ 内層パターン（１） ３ 内層パターン（２） ４ 基板材質 ５，６，７，８ 端子（スルーホール） 1 Ground pattern 2 Inner layer pattern (1) 3 Inner layer pattern (2) 4 Substrate material 5, 6, 7, 8 Terminal (through hole)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０３Ｈ 7/38 Ａ 7/48 Ａ Ｈ０５Ｋ 3/46 Ｑ 6921−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI Technical indication location H03H 7/38 A 7/48 A H05K 3/46 Q 6921-4E
Claims (1)
の相対する２つのパターンによりトランスを形成し，そ
のトランスをはさみこむようにシールド用パターンを構
成したことを特徴とする多層基板を用いた高周波回路。1. A multi-layered substrate having a multi-layered substrate having three or more layers, wherein a transformer is formed by two patterns facing each other, and a shield pattern is formed so as to sandwich the transformer. High frequency circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6027212A JPH07235796A (en) | 1994-02-25 | 1994-02-25 | High frequency circuit wherein multilayer substrate is used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6027212A JPH07235796A (en) | 1994-02-25 | 1994-02-25 | High frequency circuit wherein multilayer substrate is used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07235796A true JPH07235796A (en) | 1995-09-05 |
Family
ID=12214808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6027212A Pending JPH07235796A (en) | 1994-02-25 | 1994-02-25 | High frequency circuit wherein multilayer substrate is used |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07235796A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008537849A (en) * | 2005-04-08 | 2008-09-25 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Integrated circuit transformer devices for on-chip millimeter wave applications |
| JP2010278387A (en) * | 2009-06-01 | 2010-12-09 | Mitsubishi Electric Corp | High-breakdown-voltage flat transformer |
-
1994
- 1994-02-25 JP JP6027212A patent/JPH07235796A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008537849A (en) * | 2005-04-08 | 2008-09-25 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Integrated circuit transformer devices for on-chip millimeter wave applications |
| JP2010278387A (en) * | 2009-06-01 | 2010-12-09 | Mitsubishi Electric Corp | High-breakdown-voltage flat transformer |
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