JPH07202468A - Case for audio unit - Google Patents

Case for audio unit

Info

Publication number
JPH07202468A
JPH07202468A JP35311693A JP35311693A JPH07202468A JP H07202468 A JPH07202468 A JP H07202468A JP 35311693 A JP35311693 A JP 35311693A JP 35311693 A JP35311693 A JP 35311693A JP H07202468 A JPH07202468 A JP H07202468A
Authority
JP
Japan
Prior art keywords
pattern
exterior
substrate
lines
audio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP35311693A
Other languages
Japanese (ja)
Other versions
JP2822304B2 (en
Inventor
Shin Nakagawa
伸 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5353116A priority Critical patent/JP2822304B2/en
Publication of JPH07202468A publication Critical patent/JPH07202468A/en
Application granted granted Critical
Publication of JP2822304B2 publication Critical patent/JP2822304B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate eddy current loss while exhibiting the shielding effect by forming a conductive material layer, having a pattern of a group of independent fine lines, partially or entirely on the surface of a case for housing an audio unit. CONSTITUTION:A top plate 5 and a bottom plate 6 comprise printed wiring boards 7 of glass epoxy resin and the copper foil part 8 formed thereon is etched into a predetermined pattern. A large number of fine dividing lines 9 are etched contiguously in parallel on the surface of the substrate 7 and forming a pattern along with one fine line intersecting perpendicularly. Consequently, the copper foil part 8 of the substrate 7 is divided by the etched deviding lines 9 into a band of thin lines. When the substrate 7 is fixed to an audio amplifier 1 by screws, the substrate 7 is grounded, at the outer periphery thereof, to the chassis of the audio amplifier 1 because the copper part 8 is left thereat and thereby the shielding effect is achieved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、オーディオアンプな
どの音響機器装置に関するもので、特に良好な音質を得
るための音響機器の外装体構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an audio equipment such as an audio amplifier, and more particularly to an exterior structure of an audio equipment for obtaining good sound quality.

【0002】[0002]

【従来の技術】音響機器は、いつの時代にもより良い音
質が求められ、様々な観点から改良が続けられている。
2. Description of the Related Art Audio equipment is always required to have better sound quality, and is being improved from various viewpoints.

【0003】音響機器における音質に影響を与える原因
としては、回路方式、回路構成素子などの直接的な音響
信号に関係する要素に止まらず、音響機器の外装体の構
造や構成材質といった間接的な構成要素も無視できない
ことは、既に知られたところである。
The factors that affect the sound quality of the audio equipment are not limited to the elements related to the direct audio signal such as the circuit system and the circuit constituent elements, but also the indirect factors such as the structure and the constituent material of the exterior body of the audio equipment. It is already known that components cannot be ignored.

【0004】しかし、音響機器では音質の良否が耳で聴
いて違いがあるのに測定データに表すのは難しいという
ことがよくある。例えばスイッチを通すことによる音質
の劣化も、接点部分の材質の差、これは金が優れている
と言われるが、その事実を測定で表すことが難しい。ま
た、電線の線材の純度を上げても音質は変化するが、こ
れについても定量的な測定が出来ていないのが現状であ
る。しかしいずれも理論的には種々の損失を伴わないも
のは殆どの場合良い結果をもたらす。
[0004] However, it is often difficult to represent the quality of sound quality in audio equipment, even though there is a difference when the quality of sound is heard by the ear. For example, it is said that even if the sound quality is deteriorated by passing a switch, the difference in the material of the contact portion, gold is superior, but it is difficult to measure that fact. Moreover, even if the purity of the wire material of the electric wire is increased, the sound quality changes, but the current situation is that quantitative measurement cannot be performed for this as well. However, neither theoretically results in good results in most cases without various losses.

【0005】従来からもオーディオアンプなど音響機器
の外装ケースが鉄材で構成されたものに比べ、アルミニ
ウム材を用いたものに音質が良いものが多いと言われた
ことから外装ケースが注目され始めた。そして、外装ケ
ースのカバーを外して試聴すると更に音質の向上が見ら
れることが知られている。
It has been said that there are many cases in which the sound quality is good in the aluminum material as compared with the case in which the outer case of the audio equipment such as the audio amplifier is made of the iron material in the past. . It is known that the sound quality can be further improved when the cover of the outer case is removed and the sample is listened to.

【0006】このような音質の変化(劣化)の原因は、
機器の外装部材に発生する渦電流による損失によるもの
と一般に言われている。これは鉄材は音質が悪く、アル
ミニウム材が良く、薄いアルミニウムの蒸着層や箔は更
に音質の向上が見られ、一番良いのがこのような外装材
を用いないものであると言われている事実をうまく説明
できるからである。
The cause of such a change (deterioration) in sound quality is
It is generally said that this is due to the loss due to the eddy current generated in the exterior member of the device. It is said that iron material has poor sound quality, aluminum material is good, and thin aluminum vapor-deposited layers and foils further improve sound quality, and it is said that the best thing is not to use such an exterior material. This is because the facts can be explained well.

【0007】渦電流は材質の透磁率をμ、材質の抵抗を
Rとすれば、μ2 /Rに比例する。そこでμの大きい鉄
の場合これが二乗で効いてくるので渦電流による損失が
大きく音質が大変悪くなる。一方アルミニウムはμが1
に近く、大して大きな値とはならない。更にアルミニウ
ムの蒸着層や箔ではRの値が大きくなることから更に良
い方向に向かい、究極的にはこのような構成材がなけれ
ば、渦電流は0となって影響が出なくなるという具合で
ある。
The eddy current is proportional to μ 2 / R, where μ is the permeability of the material and R is the resistance of the material. Therefore, in the case of iron with a large μ, this is effective as a square, so the loss due to eddy current is large and the sound quality becomes very poor. On the other hand, for aluminum, μ is 1
It is close to and does not become a big value. Furthermore, in the case of a vapor-deposited layer or foil of aluminum, the value of R becomes large, so that it goes in a better direction. Ultimately, without such a component, the eddy current becomes 0 and no influence is exerted. .

【0008】[0008]

【発明が解決しようとする課題】このようなことから、
音響機器の外装材の構造は渦電流を発生させないものと
するのが良いことになる。このためには鉄、アルミニウ
ムといった導電性の部材を用いず、木材やプラスチック
などの絶縁性部材とするか、外装部材を省略してしまう
ことが考えられる。
DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The structure of the exterior material of the audio equipment should be such that it does not generate eddy currents. For this purpose, it is conceivable to use an insulating member such as wood or plastic without using a conductive member such as iron or aluminum, or to omit the exterior member.

【0009】しかし外装ケース部材を省略してしまうこ
とは、音響機器としての形態を成さないことや、電気的
な安全性の確保などから実施は困難である。また外装材
を絶縁部材で構成した場合はシールド効果が得られず、
ラジオや無線機の妨害を受けたり、電源部のハムを引い
たりしてノイズが発生し実用上障害がある。
However, it is difficult to omit the outer case member because it does not form a form as an audio device and ensures electrical safety. Also, when the exterior material is made of an insulating material, the shielding effect cannot be obtained,
Noise is generated due to interference from radios and radios, or hums in the power supply section, causing practical problems.

【0010】そこでこの発明はシールド効果を持たせつ
つ、しかも渦電流損を発生させない音響機器の外装体構
造を得ることで優れた音質性能を有する音響機器を得よ
うとするものである。
Therefore, the present invention is intended to obtain an audio device having excellent sound quality by obtaining an exterior structure of an audio device which has a shielding effect and does not cause eddy current loss.

【0011】[0011]

【課題を解決するための手段】この発明は、上記の目的
を達成するために、音響機器を収納する外装ケース等の
外装部材の一部もしくは全面に相互に独立、すなわち隣
接する導電性層と分断されかつ近接した帯状の細線群か
らなるパターンを持つ導電性部材層を形成したものを用
いたことを特徴としている。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a part or the whole of an exterior member such as an exterior case for accommodating audio equipment, which is independent of each other, that is, adjacent conductive layers. It is characterized in that a conductive member layer having a pattern of a group of strip-shaped fine lines that are divided and adjacent to each other is used.

【0012】またこの発明は、相互に独立しかつ近接し
た細線群からなるパターンは、印刷配線基板の印刷配線
により形成されたもの。あるいは、絶縁性部材表面に導
電部材を蒸着もしくは印刷処理により形成したものであ
ることも特徴としている。
Further, according to the present invention, the pattern consisting of a group of fine lines independent of each other and adjacent to each other is formed by the printed wiring of the printed wiring board. Alternatively, it is also characterized in that a conductive member is formed on the surface of the insulating member by vapor deposition or printing.

【0013】更にこの発明では、互に独立しかつ近接し
た細線群からなるパターンを有する印刷配線基板もしく
は絶縁部材が、音響機器の外装ケースの一部もしくは全
部のパネルを兼ねるものであることも特徴としている。
Further, according to the present invention, the printed wiring board or the insulating member having a pattern of fine wire groups independent of each other and adjacent to each other also serves as a panel of a part or all of the exterior case of the audio equipment. I am trying.

【0014】更にこの発明は、導電性部材の細線群のパ
ターンの線幅を5mm以下とすることも特徴としてい
る。
Further, the present invention is characterized in that the line width of the pattern of the fine wire group of the conductive member is 5 mm or less.

【0015】[0015]

【作用】以上の構成のように、この発明によれば音響機
器を収納する外装部材の導電性層が相互に独立し、かつ
近接して配置された帯状の細線からなり、細線どうしは
接地のため最小限の箇所で各々電気的に接続されてい
る。
As described above, according to the present invention, the conductive layers of the exterior member for accommodating the audio equipment are made of strip-shaped thin wires arranged independently of each other and in close proximity to each other, and the thin wires are grounded. Therefore, they are electrically connected to each other at the minimum points.

【0016】このため、音響機器のトランス等の磁気に
より誘起された渦電流は導電性部材からなる細線部分に
発生するが、パターンは細い帯状のため大きな渦電流と
はならず渦電流損が極めて僅かとなる。この結外装部材
に発生する渦電流による損失を音質への悪影響が無視で
き得る範囲に抑制することができる。しかも導電層を印
刷配線基板の導電パターンなどのように薄層とすれば、
従来の金属製ケースなどに比べて抵抗値が高く、この点
からも渦電流を低減できる。
Therefore, the eddy current induced by magnetism of the transformer of the audio equipment is generated in the thin wire portion made of the conductive member, but since the pattern is a thin band, it does not become a large eddy current and eddy current loss is extremely large. Only a few. It is possible to suppress the loss due to the eddy current generated in the binding member within a range in which the adverse effect on the sound quality can be ignored. Moreover, if the conductive layer is a thin layer such as a conductive pattern of a printed wiring board,
The resistance value is higher than that of a conventional metal case, and the eddy current can be reduced also from this point.

【0017】更にこの発明では、細線状の導電部材から
なるパターンが隣接して形成されているのでこのパター
ンを接地すれば、外部からのハムなどによるノイズに対
して従来と変わりなくシールド効果が得られる。
Further, according to the present invention, since the pattern made of the thin wire-shaped conductive member is formed adjacently, if the pattern is grounded, the shielding effect against noise due to external hum and the like can be obtained. To be

【0018】[0018]

【実施例】以下実施例にしたがってこの発明を説明す
る。図1は、この発明の音響機器の外装構造を持つ実施
例を示す斜視図である。図はオーディオアンプ1の組み
立て状態を示している。オーディオアンプ1は、内部に
回路基板やトランス、スイッチ等の回路部品が収納され
ており、前面の操作パネル2には、各種のスイッチ、つ
まみ類が取付けられている。また背面は各種機器との接
続端子等を備えた背面パネル3からなり、前後の操作パ
ネル2および背面パネル3の側面は側面パネル4により
形成されている。
EXAMPLES The present invention will be described below with reference to examples. FIG. 1 is a perspective view showing an embodiment having an exterior structure of an audio device of the present invention. The figure shows the assembled state of the audio amplifier 1. The audio amplifier 1 has circuit components such as a circuit board, a transformer, and a switch housed therein, and various switches and knobs are attached to a front operation panel 2. The rear surface is formed of a rear panel 3 having connection terminals for various devices, and the side surfaces of the front and rear operation panels 2 and the rear panel 3 are formed by side panels 4.

【0019】更にこのオーディオアンプ1の上面並びに
底面部には、各々天板5および底板6がネジ等の既知の
手段で取り付けられるようになっており、これらのパネ
ルによって外装ケースが構成される。なお10は、天板
5および底板6の取付けのためのネジ孔である。
Further, a top plate 5 and a bottom plate 6 are attached to the top and bottom of the audio amplifier 1 by known means such as screws, and these panels constitute an exterior case. Reference numeral 10 is a screw hole for attaching the top plate 5 and the bottom plate 6.

【0020】天板5および底板6は、ガラスエポキシ樹
脂を基板とする印刷配線基板7からなり、基板上の銅箔
部8は通常の印刷回路形成と同じ手段により所定のパタ
ーンがエッチングされて形成されている。このエッチン
グによる分断線9は、図2に示すように基板7の表面に
直線の細線が隣接して平行に多数形成され、かつこれら
の細線と直行する一本の細線とからなる魚骨状のパター
ンをしている。
The top plate 5 and the bottom plate 6 are formed of a printed wiring board 7 having a glass epoxy resin as a substrate, and a copper foil portion 8 on the substrate is formed by etching a predetermined pattern by the same means as in the formation of a usual printed circuit. Has been done. As shown in FIG. 2, the dividing line 9 formed by this etching has a fish-bone-like shape in which a number of straight thin lines are formed in parallel with each other on the surface of the substrate 7 and which are perpendicular to each other. Have a pattern.

【0021】したがって、基板7の銅箔部8はエッチン
グによる分断線9によって一定の帯状の細線に分断され
ることになる。そしてこの基板7をオーディオアンプ1
にネジ止めすれば、基板7の外周は銅箔部8が残存して
いるから、ネジ孔10を介してオーディオアンプ1のシ
ャーシに接地されシールド効果を得ることができる。
Therefore, the copper foil portion 8 of the substrate 7 is divided by the dividing line 9 by etching into a thin strip-shaped wire. The board 7 is connected to the audio amplifier 1
If the copper foil portion 8 remains on the outer periphery of the substrate 7 by screwing it in, it is grounded to the chassis of the audio amplifier 1 through the screw hole 10 and a shield effect can be obtained.

【0022】次に音質の変化について実験を行った。実
験は図1に示す構造のオーディオアンプ1を用い、天板
5と底板6のパターンを変化させてみた。比較の例とし
ては、天板5及び底板6を除去した場合と、天板5及び
底板6にパターン形成前の全面に銅箔部8が形成された
ものを準備し、試聴を行なった。次に、図2に示すパタ
ーンとなるように銅箔部8にカッターで分断線9を入
れ、銅箔部8を帯状の細線群に分断した。この分断によ
って図2中でLで示されるパターン細線の幅をまず10
mmとして試聴を行い、次に細線を更に半分の幅すなわ
ち5mmとなるように分断線9を中間部に入れて増や
し、最後にLが2.5mmとなるように更に細分化させ
て各々試聴を行なった。
Next, an experiment was conducted on changes in sound quality. In the experiment, the audio amplifier 1 having the structure shown in FIG. 1 was used, and the patterns of the top plate 5 and the bottom plate 6 were changed. As a comparative example, a case where the top plate 5 and the bottom plate 6 were removed and a case where the top plate 5 and the bottom plate 6 each having the copper foil portion 8 formed on the entire surface before the pattern formation were prepared and auditioned. Next, a dividing line 9 was inserted into the copper foil portion 8 with a cutter so as to form the pattern shown in FIG. 2, and the copper foil portion 8 was divided into strip-shaped fine wire groups. Due to this division, the width of the pattern thin line indicated by L in FIG.
mm, and then the fine line is further increased to half the width, that is, 5 mm by inserting the dividing line 9 in the middle part, and finally further subdivided so that L becomes 2.5 mm. I did.

【0023】試聴は、天板5、底板6の無いものを聞き
これを基準とした。次にパターンを形成しない全面が銅
箔で覆われをものを装着して音を聞き比較すると、これ
は音が悪くすぐに違いがわかった。次に細線の幅が10
mmのものを装着して試聴すると音質の低下は少なくは
なったが、やはり劣化は分かってしまう。更に細線の幅
を5mmとしたものでは、気のせいか音が変わるかとい
った程度極めて微少な変化となり、幅が2.5mmのも
のでは全く判別ができなくなった。
In the sample listening, the one without the top plate 5 and the bottom plate 6 was heard and used as a reference. Next, when the sound was compared by wearing a copper foil covered with copper foil on which the entire pattern was not formed, the sound was bad and the difference was immediately found. Next, the width of the thin line is 10
The sound quality is less deteriorated when the mm-sized one is attached and the sample is heard, but the deterioration is still apparent. Furthermore, if the width of the thin line is 5 mm, the change is extremely small to some extent because the sound is changed due to anxiety, and if the width is 2.5 mm, it cannot be discriminated at all.

【0024】以上のことから、細線の幅Lを5mm以下
にすればパネルを除去したものと音質上の差異のないも
のが得られることが判明した。またエッチングやカット
により形成した絶縁部分の幅は隣接する導電パターンを
分断すれば本発明の目的を達成できるから、特にこの幅
については限定されない。しかしこの幅が大きくなると
シールド効果が低下するので、シールド効果を勘案して
設定すればよい。
From the above, it has been found that if the width L of the thin wire is set to 5 mm or less, a product having no difference in sound quality from the product without the panel can be obtained. Further, the width of the insulating portion formed by etching or cutting can achieve the object of the present invention if the adjacent conductive patterns are divided, and therefore the width is not particularly limited. However, the shield effect decreases as the width increases, so the shield effect may be set.

【0025】図3は、本発明の他の実施例を示したもの
で、印刷配線基板7の表面に形成するパターンを示して
いる。この実施例では、基板7の銅箔部8を外周部を含
めてエッチング除去し、図1のものとは逆に導電パター
ンである銅箔部8を魚骨状に残存させたものである。こ
のような形態であっても導電層は相互に独立した帯状の
細線形状となっているので同様に渦電流を低減させ、か
つシールド効果が得られる。ただこの実施例の場合に
は、基板7をアンプに取り付けただけではネジ孔10を
通じて導電パターンの接地が出来ないので、導電パター
ンの何れかの箇所にリード線を接続し、このリード線を
オーディオアンプ1のアース部分に電気的に接続して接
地を行う必要がある。
FIG. 3 shows another embodiment of the present invention, showing a pattern formed on the surface of the printed wiring board 7. In this embodiment, the copper foil portion 8 of the substrate 7 including the outer peripheral portion is removed by etching, and the copper foil portion 8 which is a conductive pattern is left in the shape of a fish bone contrary to the one shown in FIG. Even in such a form, since the conductive layers are in the form of strip-shaped thin wires independent of each other, the eddy current can be similarly reduced and the shield effect can be obtained. However, in the case of this embodiment, since the conductive pattern cannot be grounded through the screw hole 10 only by attaching the board 7 to the amplifier, a lead wire is connected to any part of the conductive pattern and the lead wire is connected to the audio device. It is necessary to electrically connect to the ground portion of the amplifier 1 for grounding.

【0026】図4は、絶縁性部材面に形成する導電層の
細線パターンの他の実施例を示したもので、同図(a)
は、縦横方向へ分断線9を適宜区分して形成したもの。
同図(b)は、分断線9を斜め方向に平行に設けたも
の。同図(c)は、交差する斜め直線から縦横方向へ枝
状に分断線9を形成したものである。
FIG. 4 shows another embodiment of the fine line pattern of the conductive layer formed on the surface of the insulating member.
Is formed by appropriately dividing the dividing line 9 in the vertical and horizontal directions.
In the same figure (b), the dividing line 9 is provided parallel to the diagonal direction. In the same figure (c), a dividing line 9 is formed in a branch shape in the vertical and horizontal directions from the intersecting diagonal straight lines.

【0027】この発明の実施例では、オーディオアンプ
1の天板5と底板6としてガラスエポキシ樹脂の印刷配
線基板7に所定のパターンを形成したものを用いたが、
この発明はこのような形態に限定されるものではなく、
絶縁性部材面に蒸着により所定の導電性パターンを形成
したものや、導電性インクにより所定のパターンを印刷
したものなどを用いることもできる。
In the embodiment of the present invention, the top plate 5 and the bottom plate 6 of the audio amplifier 1 are formed by forming a predetermined pattern on the printed wiring board 7 made of glass epoxy resin.
The present invention is not limited to such a form,
It is also possible to use one having a predetermined conductive pattern formed on the surface of the insulating member by vapor deposition, one having a predetermined pattern printed with a conductive ink, or the like.

【0028】また、実施例では印刷配線基板7を外装ケ
ースのうち専有面積の大きい天板5および底板6部分に
印刷配線基板7自体をパネルとして用いたが、これは外
装ケースの側面部など他の部分に使用することも可能で
ある。更に印刷配線基板を用いず、シート状の縁性部材
表面に所定の導電性パターンを形成したものを木製ある
いはプラスチック製などの音響機器外装部材の内面等に
貼り付ける構成としてもよい。
In the embodiment, the printed wiring board 7 itself is used as a panel for the top plate 5 and the bottom plate 6 of the outer case, which have a large occupied area, but the printed wiring board 7 itself is used as a panel. It is also possible to use for the part of. Further, the printed wiring board may not be used, and a sheet-shaped rim member having a predetermined conductive pattern formed thereon may be attached to the inner surface or the like of an audio equipment exterior member made of wood or plastic.

【0029】[0029]

【発明の効果】以上述べたようにこの発明によれば、音
響機器において、機器のシールド効果を持たせながら、
渦電流損による音質の劣化を防止する外装体構造を得る
ことができる。
As described above, according to the present invention, in the audio equipment, while providing the shielding effect of the equipment,
It is possible to obtain an exterior body structure that prevents deterioration of sound quality due to eddy current loss.

【0030】しかもこの外装構造は、既存の印刷配線基
板等を用いることができるので機械的強度の維持や、汎
用性に富み、しかも製造コスト等もさほどかからないと
いった効果も得られるものである。
Moreover, since the existing printed wiring board or the like can be used for this exterior structure, it is possible to obtain the effects of maintaining mechanical strength, being versatile, and being inexpensive in manufacturing.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明のオーディオアンプの組み立て構造を
示す斜視図である。
FIG. 1 is a perspective view showing an assembly structure of an audio amplifier according to the present invention.

【図2】この発明で用いる、外装ケースの天板あるいは
底板の構造を示す平面図である。
FIG. 2 is a plan view showing a structure of a top plate or a bottom plate of an exterior case used in the present invention.

【図3】この発明で用いる、外装ケースの天板あるいは
底板の構造を示す他の実施例の平面図である。
FIG. 3 is a plan view of another embodiment showing the structure of the top plate or bottom plate of the outer case used in the present invention.

【図4】この発明の、導電層のパターンの他の実施例を
示す平面図である。
FIG. 4 is a plan view showing another embodiment of the pattern of the conductive layer of the present invention.

【符号の説明】[Explanation of symbols]

1 オーディオアンプ 2 操作パネル 3 背面パネル 4 側面パネル 5 天板 6 底板 7 基板 8 銅箔部 9 分断線 10 ネジ孔 1 Audio Amplifier 2 Operation Panel 3 Rear Panel 4 Side Panel 5 Top Plate 6 Bottom Plate 7 Substrate 8 Copper Foil 9 Break Line 10 Screw Hole

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 音響機器を収納する外装部材の一部もし
くは全面に、相互に独立しかつ近接した細線群からなる
パターンを持つ導電性部材層を形成したものを用いたこ
とを特徴とする音響機器の外装体構造。
1. An acoustic device characterized in that a conductive member layer having a pattern of fine wire groups which are independent and close to each other is formed on a part or the whole surface of an exterior member for housing an audio device. Equipment exterior body structure.
【請求項2】 相互に独立しかつ近接した細線群からな
るパターンは、印刷配線基板の印刷配線により形成され
たものであるところの請求項1記載の音響機器の外装体
構造。
2. The exterior structure of an audio device according to claim 1, wherein the pattern composed of a group of fine lines that are independent of each other and close to each other is formed by the printed wiring of the printed wiring board.
【請求項3】 相互に独立しかつ近接した細線群からな
るパターンは、絶縁性部材表面に導電部材を蒸着もしく
は印刷処理により形成したものであるところの請求項1
記載の音響機器の外装体構造。
3. The pattern comprising a group of fine lines independent of each other and adjacent to each other is formed by vapor deposition or printing treatment of a conductive member on the surface of an insulating member.
The exterior structure of the described audio equipment.
【請求項4】 相互に独立しかつ近接した細線群からな
るパターンを有する印刷配線基板もしくは絶縁部材が、
音響機器の外装ケースの一部もしくは全部のパネルであ
るところの請求項1ないし請求項3記載の音響機器の外
装体構造。
4. A printed wiring board or an insulating member having a pattern composed of fine wire groups which are independent of each other and close to each other,
The exterior body structure for an audio device according to any one of claims 1 to 3, which is a panel of a part or all of the exterior case of the audio device.
【請求項5】 細線群の導電性部材層パターンの線幅が
5mm以下であるところの請求項1ないし請求項4記載
の音響機器の外装体構造。
5. The exterior structure for an audio device according to claim 1, wherein the conductive member layer pattern of the fine wire group has a line width of 5 mm or less.
JP5353116A 1993-12-29 1993-12-29 Exterior structure of audio equipment Expired - Fee Related JP2822304B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5353116A JP2822304B2 (en) 1993-12-29 1993-12-29 Exterior structure of audio equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5353116A JP2822304B2 (en) 1993-12-29 1993-12-29 Exterior structure of audio equipment

Publications (2)

Publication Number Publication Date
JPH07202468A true JPH07202468A (en) 1995-08-04
JP2822304B2 JP2822304B2 (en) 1998-11-11

Family

ID=18428680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5353116A Expired - Fee Related JP2822304B2 (en) 1993-12-29 1993-12-29 Exterior structure of audio equipment

Country Status (1)

Country Link
JP (1) JP2822304B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007298514A (en) * 2006-04-28 2007-11-15 Biosense Webster Inc Reduced magnetic field distortion in medical tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52136624U (en) * 1976-04-12 1977-10-17
JPS55108785U (en) * 1979-01-25 1980-07-30
JPS61292897A (en) * 1985-06-20 1986-12-23 大日本印刷株式会社 Electrostatic breakdown prevention panel and manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52136624U (en) * 1976-04-12 1977-10-17
JPS55108785U (en) * 1979-01-25 1980-07-30
JPS61292897A (en) * 1985-06-20 1986-12-23 大日本印刷株式会社 Electrostatic breakdown prevention panel and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007298514A (en) * 2006-04-28 2007-11-15 Biosense Webster Inc Reduced magnetic field distortion in medical tool

Also Published As

Publication number Publication date
JP2822304B2 (en) 1998-11-11

Similar Documents

Publication Publication Date Title
US20040012462A1 (en) Feed-through filter having improved shielding and mounting functions
JPH06131919A (en) Flexible wiring cable
JPH0745982A (en) Connecting structure for shield case and printed wiring board
JPH06164265A (en) Microwave amplifier
JPH0544837B2 (en)
US4859977A (en) Insulator device for power transformer
JPH07202468A (en) Case for audio unit
JPS62115813A (en) Shielded device
JP2741090B2 (en) Printed board
US4205855A (en) Sound reproducing apparatus
JPH09148776A (en) Module structure for electronic device
JP2000216586A (en) Multilayer printed circuit board
JPH098488A (en) Method of designing circuit board and circuit board
JP2002176231A (en) Double-sided flexible circuit board
US5250753A (en) Wire assembly for electrically conductive circuits
US20230421966A1 (en) Electret microphone
CA1284771C (en) Device for attenuating noise in electrical apparatus
JPH05136593A (en) Shield structure
WO2021125166A1 (en) Wiring circuit board
JPH021920Y2 (en)
JPH0126151Y2 (en)
JPH05335771A (en) Electromangetic wave shielding structure
JPH0652906A (en) Earthing plate
JPH04132300A (en) Printed board
JP3100060U (en) High frequency unit

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees