JPH09148776A - Module structure for electronic device - Google Patents

Module structure for electronic device

Info

Publication number
JPH09148776A
JPH09148776A JP31108595A JP31108595A JPH09148776A JP H09148776 A JPH09148776 A JP H09148776A JP 31108595 A JP31108595 A JP 31108595A JP 31108595 A JP31108595 A JP 31108595A JP H09148776 A JPH09148776 A JP H09148776A
Authority
JP
Japan
Prior art keywords
slit
functional blocks
circuit board
printed circuit
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31108595A
Other languages
Japanese (ja)
Inventor
Masaharu Suematsu
雅春 末松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP31108595A priority Critical patent/JPH09148776A/en
Publication of JPH09148776A publication Critical patent/JPH09148776A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

Abstract

PROBLEM TO BE SOLVED: To improve shielding effect by a method wherein a part of one of shielding cases, which houses a printed board, is brought into contact with the other shielding case passing through a slit, and an EMI gasket is provided between the shielding cases. SOLUTION: A plurality of functional blocks, for example, three of them of 1a to 1c are arranged on a printed board 1, and each of the functional blocks 1a to 1c is divided by providing a slit 1d. The wiring between each of the functional blocks 1a to 1c is wired through a wiring pattern 1e between slit 1d. Two shielding cases 2 and 3 are formed in the shape in line with the slit 1d, and a part of the shield case 3 passes through the shit 1d and comes in contact with the other shielding case 2. An EMI gasket 6 is installed in the groove 3b provided in the shield case 3, and the electromagnetic disturbance between each of the functional blocks 1a to 1c is prevented by improving high frequency connection.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、通信機等の電子機
器における高周波回路モジュール等、シールドを要求さ
れるモジュール構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module structure requiring a shield such as a high frequency circuit module in an electronic device such as a communication device.

【０００２】[0002]

【従来の技術】図５は従来のモジュール構造の１例を示
す正面図、図６は図５のＡ−Ａ線矢視断面図、図７は図
５のＢ−Ｂ線矢視断面図、図８は従来におけるプリント
基板の１例を示す正断面図である。この従来例は、電子
機器の高周波回路モジュールなど一般的なモジュール構
造を示す。プリント基板１に３つの機能ブロック１ａ〜
１ｃを配置し、各ブロック間をアースパターン１ｆで区
分する。アースパターン１ｆはプリント基板１の両面に
設け、スルーホールで電気的に接続する。各機能ブロッ
ク１ａ〜１ｃ間の配線は、アースパターン１ｆを一部削
除し、プリント基板１を収めるシールドケース２，３に
それぞれ切欠２ａ，３ａを設けて配線パターン１ｅを通
して配線する。シールドケース２，３はアースパターン
１ｆに合せた形状で製作し、シールドケース２，３でプ
リント基板１を挟み、ねじ４で固定する。５，６はワイ
ヤーメッシュ，導電性ゴム、金属製板バネ等のＥＭＩ(e
lectro magnetic interference：電磁的妨害）ガスケッ
トで、シールドケース２，３にそれぞれ設けた溝２ｂ，
３ｂに装着し、高周波的な接続を改善して各機能ブロッ
ク１ａ〜１ｃ相互間の電磁的妨害を回避する。5 is a front view showing an example of a conventional module structure, FIG. 6 is a sectional view taken along the line AA of FIG. 5, FIG. 7 is a sectional view taken along the line BB of FIG. FIG. 8 is a front sectional view showing an example of a conventional printed circuit board. This conventional example shows a general module structure such as a high frequency circuit module of an electronic device. The printed circuit board 1 has three functional blocks 1a to
1c is arranged and each block is divided by an earth pattern 1f. The ground patterns 1f are provided on both sides of the printed board 1 and are electrically connected through through holes. The wiring between the functional blocks 1a to 1c is formed by partially removing the ground pattern 1f and providing cutouts 2a and 3a in the shield cases 2 and 3 for accommodating the printed circuit board 1 and wiring through the wiring pattern 1e. The shield cases 2 and 3 are manufactured in a shape that matches the ground pattern 1f, and the printed board 1 is sandwiched between the shield cases 2 and 3 and fixed with screws 4. 5 and 6 are wire mesh, conductive rubber, EMI (e.
Electromagnetic interference) A gasket 2 is a groove 2b provided in each of the shield cases 2 and 3,
3b to improve high-frequency connection and avoid electromagnetic interference between the functional blocks 1a to 1c.

【０００３】[0003]

【発明が解決しようとする課題】上記従来例にあって
は、プリント基板両面のアースパターン１ｆをスルーホ
ールで接続しているが、高周波的に十分な接続が出来
ず、その結果シールドケース２と３が高周波的に同電位
にならず、期待するシールド効果を得る事が出来ない場
合がある。In the above-mentioned conventional example, the ground patterns 1f on both sides of the printed circuit board are connected by through holes, but the connection cannot be sufficiently made in terms of high frequency, and as a result, the shield case 2 is formed. There is a case where 3 does not have the same electric potential at high frequencies and the expected shield effect cannot be obtained.

【０００４】[0004]

【課題を解決するための手段】本発明モジュール構造
は、上記の課題を解決するため、図３，図４に示すよう
にプリント基板１にスリット１ｄを設け、プリント基板
１を収める一方のシールドケース３の一部を、前記スリ
ット１ｄを貫通して他方のシールドケース２に接触させ
ると共に、両シールドケース２，３間にＥＭＩガスケッ
ト６を装着することを特徴とする。In order to solve the above-mentioned problems, the module structure of the present invention has one shield case in which the printed board 1 is provided with a slit 1d as shown in FIGS. Part of 3 is penetrated through the slit 1d and brought into contact with the other shield case 2, and an EMI gasket 6 is mounted between the shield cases 2 and 3.

【０００５】[0005]

【発明の実施の形態】図１は本発明モジュール構造の実
施の形態を示す正面図、図２は図１のＡ−Ａ線矢視断面
図、図３は図１のＢ−Ｂ線矢視断面図、図４は本発明に
おけるプリント基板の１例を示す正面図である。この形
態は、プリント基板１に複数の、例えば３つの機能ブロ
ック１ａ〜１ｃを配置し、各ブロック１ａ〜１ｃ間はス
リット１ｄを設けて区分する。各機能ブロック１ａ〜１
ｃ間の配線は、スリット１ｄ間に配線パターン１ｅを通
して配線する。２つのシールドケース２，３は、スリッ
ト１ｄに合せた形状で製作し、一方のシールドケース３
の一部はスリット１ｄを貫通して他方のシールドケース
２と接触する。プリント基板１の外周はシールドケース
２，３より小さくし、両シールドケース２，３内に収
め、シールドケース２，３でプリント基板１を挟み、ね
じ４で固定する。６はワイヤーメッシュ，導電性ゴム、
金属製板バネ等のＥＭＩガスケットで、シールドケース
３に設けた溝３ｂに装着し、高周波的接続を改善して、
各機能ブロック１ａ〜１ｃ間の電磁的妨害を回避する。
シールドケース２，３の切欠２ａ，３ａは配線パターン
１ｅの逃げである。1 is a front view showing an embodiment of a module structure of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a view taken along the line BB of FIG. A sectional view and FIG. 4 are front views showing an example of a printed circuit board according to the present invention. In this form, a plurality of, for example, three functional blocks 1a to 1c are arranged on the printed circuit board 1, and slits 1d are provided between the blocks 1a to 1c for division. Each functional block 1a-1
The wiring between c is wired through the wiring pattern 1e between the slits 1d. The two shield cases 2 and 3 are manufactured in a shape matching the slit 1d, and one shield case 3
Part of the penetrating through the slit 1d contacts the other shield case 2. The outer circumference of the printed circuit board 1 is made smaller than the shield cases 2 and 3 and is housed in both shield cases 2 and 3. The printed circuit board 1 is sandwiched between the shield cases 2 and 3 and fixed with screws 4. 6 is a wire mesh, conductive rubber,
With an EMI gasket such as a metal leaf spring, install it in the groove 3b provided in the shield case 3 to improve the high frequency connection,
Electromagnetic interference between the functional blocks 1a to 1c is avoided.
The cutouts 2a and 3a of the shield cases 2 and 3 are escapes of the wiring pattern 1e.

【０００６】[0006]

【発明の効果】上述のようにプリント基板１にスリット
１ｄを設け、プリント基板１を収める一方のシールドケ
ース３の一部を、前記スリット１ｄを貫通して他方のシ
ールドケース２に接触させると共に、両シールドケース
２，３間にＥＭＩガスケット６を装着することを特徴と
するので、高価なＥＭＩガスケットの使用量及び装着時
間を半減でき、安価に実施することができると共に良好
なシールド効果を得ることができる。As described above, the slit 1d is provided in the printed circuit board 1 and a part of the one shield case 3 for accommodating the printed circuit board 1 penetrates the slit 1d and contacts the other shield case 2. Since the EMI gasket 6 is mounted between the two shield cases 2 and 3, the amount of the expensive EMI gasket used and the mounting time can be reduced by half, and the cost can be reduced and the good shielding effect can be obtained. You can

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明モジュール構造の実施の形態を示す正面
図である。FIG. 1 is a front view showing an embodiment of a module structure of the present invention.

【図２】図１のＡ−Ａ線矢視断面図である。FIG. 2 is a sectional view taken along line AA of FIG.

【図３】図１のＢ−Ｂ線矢視断面図である。FIG. 3 is a sectional view taken along the line BB of FIG.

【図４】本発明におけるプリント基板の１例を示す正面
図である。FIG. 4 is a front view showing an example of a printed circuit board according to the present invention.

【図５】従来のモジュール構造の１例を示す正面図であ
る。FIG. 5 is a front view showing an example of a conventional module structure.

【図６】図５のＡ−Ａ線矢視断面図である。6 is a cross-sectional view taken along the line AA of FIG.

【図７】図５のＢ−Ｂ線矢視断面図である。7 is a cross-sectional view taken along the line BB of FIG.

【図８】従来におけるプリント基板の１例を示す正断面
図である。FIG. 8 is a front sectional view showing an example of a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

１ プリント基板 １ａ〜１ｃ 機能ブロック １ｄ スリット １ｅ 配線パターン １ｆ アースパターン ２，３ シールドケース ２ａ，３ａ 切欠 ２ｂ，３ｂ 溝 ４ ねじ ６ ＥＭＩガスケット 1 Printed circuit board 1a-1c Functional block 1d Slit 1e Wiring pattern 1f Earth pattern 2,3 Shield case 2a, 3a Notch 2b, 3b Groove 4 Screw 6 EMI gasket

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 プリント基板にスリットを設け、プリン
ト基板を収める一方のシールドケースの一部を、前記ス
リットを貫通して他方のシールドケースに接触させると
共に、両シールドケース間にＥＭＩガスケットを装着す
ることを特徴とする電子機器のモジュール構造。1. A printed circuit board is provided with a slit, a part of one shield case for accommodating the printed circuit board is brought into contact with the other shield case through the slit, and an EMI gasket is mounted between both shield cases. A module structure of an electronic device, which is characterized in that 【請求項２】 プリント基板の機能ブロック別に分ける
区分け部にスリットを設けることを特徴とする請求項１
の電子機器のモジュール構造。2. A slit is provided in a dividing portion which is divided into functional blocks of a printed circuit board.
Electronic device modular structure.
JP31108595A 1995-11-29 1995-11-29 Module structure for electronic device Pending JPH09148776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31108595A JPH09148776A (en) 1995-11-29 1995-11-29 Module structure for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31108595A JPH09148776A (en) 1995-11-29 1995-11-29 Module structure for electronic device

Publications (1)

Publication Number Publication Date
JPH09148776A true JPH09148776A (en) 1997-06-06

Family

ID=18012952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31108595A Pending JPH09148776A (en) 1995-11-29 1995-11-29 Module structure for electronic device

Country Status (1)

Country Link
JP (1) JPH09148776A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003096500A1 (en) * 2002-05-14 2003-11-20 Sumitomo Electric Industries, Ltd. Optical module
JP2008177417A (en) * 2007-01-19 2008-07-31 Hitachi Kokusai Denki Engineering:Kk Shield method
JP2012028611A (en) * 2010-07-26 2012-02-09 Nec Access Technica Ltd Mobile electronic apparatus, and support member of electric substrate
WO2012050050A1 (en) * 2010-10-15 2012-04-19 三菱重工業株式会社 Inverter module and inverter integrated motor-driven compressor
JP2013016556A (en) * 2011-06-30 2013-01-24 Toshiba Corp Electronic apparatus and printed circuit board
WO2018221280A1 (en) * 2017-06-01 2018-12-06 サンデン・オートモーティブコンポーネント株式会社 Inverter-integrated electric compressor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003096500A1 (en) * 2002-05-14 2003-11-20 Sumitomo Electric Industries, Ltd. Optical module
JP2008177417A (en) * 2007-01-19 2008-07-31 Hitachi Kokusai Denki Engineering:Kk Shield method
JP2012028611A (en) * 2010-07-26 2012-02-09 Nec Access Technica Ltd Mobile electronic apparatus, and support member of electric substrate
WO2012050050A1 (en) * 2010-10-15 2012-04-19 三菱重工業株式会社 Inverter module and inverter integrated motor-driven compressor
JP2012087630A (en) * 2010-10-15 2012-05-10 Mitsubishi Heavy Ind Ltd Inverter module and inverter integrated motor-driven compressor
CN103222176A (en) * 2010-10-15 2013-07-24 三菱重工业株式会社 Inverter module and inverter integrated motor-riven compressor
US9293969B2 (en) 2010-10-15 2016-03-22 Mitsubishi Heavy Industries, Ltd. Inverter module and inverter integrated electric compressor
CN103222176B (en) * 2010-10-15 2017-03-15 三菱重工业株式会社 Inverter module and inverter-integrated type electric compressor
EP2629412A4 (en) * 2010-10-15 2018-03-14 Mitsubishi Heavy Industries, Ltd. Inverter module and inverter integrated motor-driven compressor
JP2013016556A (en) * 2011-06-30 2013-01-24 Toshiba Corp Electronic apparatus and printed circuit board
US8711574B2 (en) 2011-06-30 2014-04-29 Kabushiki Kaisha Toshiba Electronic device and printed circuit board
WO2018221280A1 (en) * 2017-06-01 2018-12-06 サンデン・オートモーティブコンポーネント株式会社 Inverter-integrated electric compressor

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