JPH07188994A - Composite plating method of hollow member - Google Patents
Composite plating method of hollow memberInfo
- Publication number
- JPH07188994A JPH07188994A JP34861293A JP34861293A JPH07188994A JP H07188994 A JPH07188994 A JP H07188994A JP 34861293 A JP34861293 A JP 34861293A JP 34861293 A JP34861293 A JP 34861293A JP H07188994 A JPH07188994 A JP H07188994A
- Authority
- JP
- Japan
- Prior art keywords
- composite plating
- cylinder
- plating solution
- hollow member
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、中空部材の筒内に複合
メッキ液を流通させて中空部材の内面に複合メッキを施
すに際し、密着性の高い複合メッキを得るための方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for obtaining a composite plating having high adhesion when a composite plating solution is circulated in a cylinder of a hollow member to apply the composite plating to the inner surface of the hollow member.
【０００２】[0002]
【従来の技術】従来、例えば自動車のエンジンのシリン
ダの内周面の耐磨耗性を向上させるため、例えばシリン
ダの筒内に硫酸ニッケル液に炭化珪素の微粒子を懸濁さ
せた複合メッキ液を流通させ、シリンダ内面にニッケル
と炭化珪素を共析させて耐磨耗性を向上させるような方
法が知られている。そして、このような方法では、一般
にシリンダ内部に隙間をもたせて電極を挿入し、シリン
ダ側を母材電極に接続するとともに筒内の隙間に複合メ
ッキ液を導入することで、中空部材内面にニッケルと炭
化珪素を共析させるようにしている。2. Description of the Related Art Conventionally, for example, in order to improve the wear resistance of the inner peripheral surface of a cylinder of an automobile engine, for example, a composite plating solution in which fine particles of silicon carbide are suspended in nickel sulfate solution is used in the cylinder of the cylinder. There is known a method of circulating and coprecipitating nickel and silicon carbide on the inner surface of the cylinder to improve wear resistance. In such a method, generally, the electrode is inserted with a gap inside the cylinder, the cylinder side is connected to the base material electrode, and the composite plating solution is introduced into the gap in the cylinder, so that the nickel is formed on the inner surface of the hollow member. And silicon carbide are co-deposited.
【０００３】[0003]
【発明が解決しようとする課題】ところで、このような
複合メッキにおいては、金属相であるニッケルマトリク
ス中に炭化珪素の微粒子が包み込まれるような状態でシ
リンダ内周面に共析するが、炭化珪素の微粒子が当初か
ら多く共析すると母材との密着性が低下するという問題
があった。このため、当初はニッケルを主体として母材
との密着性を高め、その後、メッキ層の表面側に微粒子
を多く共析させて耐磨耗性を向上させることが望ましか
った。By the way, in such composite plating, silicon carbide fine particles are codeposited on the inner peripheral surface of the cylinder in such a state that fine particles of silicon carbide are enclosed in a nickel matrix which is a metal phase. If a large amount of fine particles of (1) were co-deposited from the beginning, there was a problem that the adhesion to the base material was reduced. For this reason, initially, it was desired to increase the adhesion to the base material with nickel as the main component, and then to elute a large amount of fine particles on the surface side of the plating layer to improve the wear resistance.
【０００４】[0004]
【課題を解決するための手段】かかる課題を解決するた
め、本発明は中空部材の筒内に隙間をもって挿入電極を
遊挿し、この筒内の隙間に向けて液送管から送られる複
合メッキ液を流通させるとともに、中空部材に母材電極
を接続して中空部材の内周面に複合メッキを施すように
した複合メッキ方法において、隙間内における複合メッ
キ液の流速を、流入開始から所定時間経過後遅くするよ
うにした。In order to solve the above problems, the present invention provides a composite plating solution in which an insertion electrode is loosely inserted into a hollow member cylinder with a gap and is fed from a liquid feed pipe toward the gap in the cylinder. In the composite plating method in which the base material electrode is connected to the hollow member to perform the composite plating on the inner peripheral surface of the hollow member, the flow rate of the composite plating solution in the gap is set to a predetermined time from the start of inflow. I tried to make it later.
【０００５】また、複合メッキ液の流速を遅くすると同
時に、複合メッキ液中に気泡を発生させるための気体の
供給を開始するようにした。また、複合メッキ液の流速
を遅くすると同時に、前記挿入電極と中空部材間の電流
密度を高めるようにした。Further, the flow rate of the composite plating solution is slowed down, and at the same time, supply of gas for generating bubbles in the composite plating solution is started. Further, the flow velocity of the composite plating solution was slowed down, and at the same time, the current density between the insertion electrode and the hollow member was increased.
【０００６】[0006]
【作用】複合メッキ液を流動させながら複合メッキを施
す場合、メッキ液の流速が速くなると微粒子の共析量が
少なくなり、流速を遅くすると共析量が増加する。従っ
て、メッキ液の流入開始時に流速を速めておくことで、
母材表面に金属相主体のメッキ層を形成して密着性を高
める。そして、所定時間経過後、流速を遅くして微粒子
の共析を多くする。When composite plating is performed while flowing the composite plating solution, the higher the flow rate of the plating solution, the smaller the amount of eutectoid particles, and the slower the flow rate, the greater the amount of eutectoid. Therefore, by increasing the flow velocity at the beginning of inflow of the plating solution,
A metal layer-based plating layer is formed on the surface of the base material to enhance adhesion. Then, after a lapse of a predetermined time, the flow rate is decreased to increase the eutectoid of fine particles.
【０００７】また、複合メッキ液中に気泡を混入させれ
ば、気泡が通過する際に微粒子が押し除けられて内周面
側に向けて押込まれ、共析量が増加するため、流速を遅
くすると同時に液中に気体を供給して気泡を発生させ
る。更に、電流密度とメッキ速度との関係において、電
流密度を上げればメッキ速度が高まるため、流速を遅く
すると同時に電流密度を上げる。Further, if air bubbles are mixed in the composite plating solution, the fine particles are pushed away toward the inner peripheral surface side when the air bubbles pass, and the amount of eutectoid increases, so that the flow velocity becomes slow. At the same time, gas is supplied into the liquid to generate bubbles. Further, in terms of the relationship between the current density and the plating rate, increasing the current density increases the plating rate, so the flow rate is slowed and the current density is increased at the same time.
【０００８】[0008]
【実施例】本発明の中空部材の複合メッキ方法の実施例
について添付した図面に基づき説明する。図１は複合メ
ッキ液の流速とメッキ処理時間、及び該流速と微粒子の
分散度の関係図、図２は複合メッキ装置の要部の縦断面
図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the composite plating method for hollow members according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram showing the relationship between the flow rate of the composite plating solution and the plating treatment time, and the flow rate and the degree of dispersion of fine particles, and FIG.
【０００９】本発明の複合メッキ方法は、図２に示すよ
うな装置１の治具台２上に載置されるシリンダブロック
Ｗのシリンダ内面に複合メッキを施す際に適用され、こ
の装置１は、シリンダブロックＷの上面を押え付ける押
え治具３と、上方からシリンダ内に隙間ｓをもって遊挿
される挿入電極４と、この隙間ｓに複合メッキ液を導入
する液送管５を備えている。The composite plating method of the present invention is applied when the composite plating is applied to the inner surface of the cylinder of the cylinder block W placed on the jig base 2 of the apparatus 1 as shown in FIG. A holding jig 3 for holding the upper surface of the cylinder block W, an insertion electrode 4 loosely inserted into the cylinder from above with a gap s, and a liquid feed pipe 5 for introducing a composite plating solution into the gap s.
【００１０】そして、下方の治具台２と上方の押え治具
の内部には、夫々メッキ液を流通させることの出来る流
通孔２ａ、３ａが設けられ、下方の治具台２の流通孔２
ａは液送管５とシリンダのメッキ液導入部Ｗａを連通せ
しめるように構成され、上方の押え治具３の流通孔３ａ
はシリンダのメッキ液導出部Ｗｂと戻し管６を連通せし
めるように構成されている。Then, inside the lower jig base 2 and the upper holding jig, there are provided through holes 2a and 3a, respectively, through which the plating solution can flow, and the through hole 2 of the lower jig stand 2 is provided.
a is configured to connect the liquid feed pipe 5 and the plating liquid introduction part Wa of the cylinder, and is a through hole 3a of the upper holding jig 3.
Is configured to connect the plating liquid lead-out portion Wb of the cylinder and the return pipe 6.
【００１１】また、前記液送管５の上流側には不図示の
複合メッキ液槽、及び圧送ポンプ等が設けられており、
また途中には複合メッキ液中にエアを供給するエア供給
管７が接続されている。そしてこのエアによって複合メ
ッキ液中に気泡ｂを形成する。尚、この複合メッキ液は
水１リットル当たりに硫酸ニッケル４００ｇ、ホウ酸３
５ｇ、サッカリンナトリウム２．５ｇを加えて硬度調整
したＰＨ＝４のものを用い、炭化珪素の微粒子６０ｇを
懸濁させたものである。On the upstream side of the liquid feed pipe 5, there are provided a composite plating liquid tank (not shown), a pressure feed pump, etc.
An air supply pipe 7 for supplying air into the composite plating solution is connected midway. Then, the air forms bubbles b in the composite plating solution. This composite plating solution contains 400 g of nickel sulfate and 3 parts of boric acid per 1 liter of water.
The hardness was adjusted by adding 5 g and 2.5 g of sodium saccharin to PH = 4, and 60 g of silicon carbide fine particles were suspended.
【００１２】また、前記シリンダブロックＷには複数の
開口部が設けられているため、かかる開口部を各シール
部材８、８で覆うようにしている。Since the cylinder block W is provided with a plurality of openings, the openings are covered by the respective seal members 8, 8.
【００１３】また、治具台２には気泡ｂを均一に分散さ
せるための気泡分散部材１０を設け、この気泡分散部材
１０の円周方向に沿って設けた流通孔１１を、前記隙間
ｓの下方に臨ませている。Further, the jig base 2 is provided with a bubble dispersion member 10 for uniformly dispersing the bubbles b, and a circulation hole 11 provided along the circumferential direction of the bubble dispersion member 10 is provided in the gap s. It is facing down.
【００１４】そして、液送管５を介して複合メッキ液を
シリンダブロックＷの隙間ｓ内に向けて圧送するととも
に、挿入電極４とシリンダブロックＷ間に電流を流すこ
とによって、シリンダ内面に複合メッキを施す。Then, the composite plating solution is pressure-fed through the liquid delivery pipe 5 into the gap s of the cylinder block W, and a current is passed between the insertion electrode 4 and the cylinder block W, whereby the inner surface of the cylinder is subjected to composite plating. Give.
【００１５】また、上方のメッキ液導出部Ｗｂから流出
した混合メッキ液は戻し管６を経てメッキ液槽に戻され
る。The mixed plating solution flowing out of the upper plating solution outlet Wb is returned to the plating solution tank through the return pipe 6.
【００１６】ところで、隙間ｓ内を流動する複合メッキ
液の流速を、例えば１５cm/s程度に設定した場合、図５
に示すように、メッキ層の炭化珪素（Ｓｉｃ）の共析量
は、シリンダブロックＷの界面からメッキ層の表面まで
一様に約２〜５wt％程度であり、特にシリンダブロック
Ｗの界面側にも多くの微粒子が共析されるため、シリン
ダ内面との密着性が低下するという問題がある。By the way, when the flow velocity of the composite plating liquid flowing in the gap s is set to, for example, about 15 cm / s, FIG.
As shown in FIG. 5, the amount of eutectoid silicon carbide (Sic) in the plating layer is about 2 to 5 wt% uniformly from the interface of the cylinder block W to the surface of the plating layer, and especially on the interface side of the cylinder block W. However, since a large amount of fine particles are co-deposited, there is a problem that the adhesion to the inner surface of the cylinder is reduced.
【００１７】そこで、本案は当初、ニッケル（Ｎｉ）の
析出割合を多くし、充分な密着性が得られた時点から炭
化珪素（Ｓｉｃ）を多く共析させるようにしている。Therefore, in the present invention, initially, the precipitation ratio of nickel (Ni) is increased, and a large amount of silicon carbide (Sic) is co-deposited from the time when sufficient adhesion is obtained.
【００１８】そして、密着性を高めるための具体的手段
として、メッキ液の流速を当初は速く、その後遅く変化
させる。Then, as a specific means for increasing the adhesion, the flow rate of the plating solution is initially increased and then changed slowly.
【００１９】つまり、一般に微粒子の共析量とメッキ液
流速の関係は、微粒子の懸濁量が同一（６０ｇ／ｌ）で
あるという条件下では、図３に示すように、横軸のメッ
キ液の流速（cm/s）を上げれば縦軸の微粒子（Ｓｉｃ）
の共析量（wt％）が低下するという関係がある。That is, in general, the relationship between the eutectoid amount of fine particles and the flow rate of the plating solution is, as shown in FIG. 3, under the condition that the suspension amount of the fine particles is the same (60 g / l). If the flow velocity (cm / s) is increased, the fine particles on the vertical axis (Sic)
There is a relation that the amount of eutectoid (wt%) decreases.
【００２０】そこで、この性質を利用して、本案では図
１に示すように、操作を開始してから約９０秒間はメッ
キ液の流速を４８cm/sにセットし、その後流速を約１５
cm/sに下げる。Therefore, by utilizing this property, in the present invention, as shown in FIG. 1, the flow rate of the plating solution is set to 48 cm / s for about 90 seconds after the operation is started, and then the flow rate is set to about 15 seconds.
Lower to cm / s.
【００２１】また、図４に示すように、縦軸に示すメッ
キ速度（μ/min）は、横軸に示す電流密度（Ａ/dm2）に
比例しており、電流密度（Ａ/dm2）を高めればメッキ速
度（μ/min）が上がるため、本案では、メッキ液の流速
を遅くするとほぼ同時に電流密度を高めて処理速度を上
げるようにしている。Further, as shown in FIG. 4, the plating speed on the vertical axis (μ / min) is proportional to the current density indicated on the horizontal axis (A / dm 2), current density (A / dm 2 ), The plating speed (μ / min) increases. Therefore, in this proposal, the current density is increased at the same time as the plating solution flow speed is decreased to increase the processing speed.
【００２２】尚、図４は、原子価２、グラム当量２９．
３４５、比重８．８５、電気化学当量０．３０１４（mg
/クーロン）、１Ａ/dm2通電析出量０．２０６（μ/mi
n）のニッケル（Ｎｉ）のメッキ速度であり、陰極電流
効率を１００％とし、Ｓｉｃ共析によるみかけ上の効率
アップを無視したものである。In FIG. 4, the valence is 2, the gram equivalent is 29.
345, specific gravity 8.85, electrochemical equivalent 0.3014 (mg
/ Coulomb), 1A / dm 2 Current deposition amount 0.206 (μ / mi
n) Nickel (Ni) plating rate, the cathode current efficiency was set to 100%, and the apparent increase in efficiency due to Sic eutectoid was ignored.
【００２３】そして、かかる操作によって母材との密着
性を高めることが出来、しかも迅速に処理することが出
来る。By such an operation, the adhesion with the base material can be enhanced and the processing can be carried out quickly.
【００２４】そして実験の結果では、図１に示すよう
に、シリンダ内面から約４μｍの厚みのメッキ層には殆
ど微粒子（Ｓｉｃ）が共析されず、また、約２２分間で
約１１５μｍのメッキ層が得られることが判った。そし
て、流速を約１５cm/sに下げた時点から、微粒子の共析
量は約２〜５wt％であり、耐磨耗性の向上のために充分
である。As a result of the experiment, as shown in FIG. 1, almost no fine particles (Sic) were co-deposited on the plating layer having a thickness of about 4 μm from the inner surface of the cylinder, and the plating layer having a thickness of about 115 μm was formed in about 22 minutes. It was found that The eutectoid amount of the fine particles is about 2 to 5 wt% from the time when the flow rate is reduced to about 15 cm / s, which is sufficient for improving the wear resistance.
【００２５】ところで、本案では微粒子の共析を促進さ
せるため、エア供給管７からメッキ液中にエアを供給し
気泡ｂを発生させるようにしているが、このエアの供給
も流速を遅くすると同時に開始するようにしている。By the way, in the present invention, in order to promote the eutectoid of fine particles, air is supplied from the air supply pipe 7 into the plating solution to generate the bubbles b, but the supply of this air also slows down the flow velocity and at the same time. I'm trying to get started.
【００２６】そして、約１５cm/sの流速で流動するメッ
キ液中に気泡ｂを発生させると、気泡ｂは周囲の微粒子
を押し除けるように上昇し、この押し除けられた微粒子
はシリンダ内面に近接して共析効果が高まる。When bubbles b are generated in the plating solution flowing at a flow rate of about 15 cm / s, the bubbles b rise so as to push out surrounding fine particles, and the pushed-off fine particles approach the inner surface of the cylinder. And the eutectoid effect is enhanced.
【００２７】この結果、流速を遅くしたことによる微粒
子の共析促進効果と、気泡ｂによる微粒子共析効果によ
ってより多量の炭化珪素（Ｓｉｃ）を共析させることが
出来る。As a result, a larger amount of silicon carbide (Sic) can be co-deposited by the effect of promoting the co-deposition of the fine particles by decreasing the flow velocity and the effect of the co-deposition of the particles by the bubbles b.
【００２８】[0028]
【発明の効果】以上のように、本発明の複合メッキ方法
は、メッキ液の流入開始時に流速を速めておき、所定時
間経過後に流速を遅くするようにしたため、母材との密
着性を高めるとともに、メッキ層の表面側の微粒子の共
析を多くすることが出来る。また、それと同時に複合メ
ッキ液中に気泡を混入させるようにすれば、一層共析量
を増やすことが出来る。更に、流速を遅くするとほぼ同
時に電流密度を上げることでメッキ処理時間の短縮が図
られる。As described above, according to the composite plating method of the present invention, the flow velocity is increased at the start of the inflow of the plating solution and is reduced after the elapse of a predetermined time, so that the adhesion with the base material is improved. At the same time, the eutectoid of the fine particles on the surface side of the plating layer can be increased. At the same time, if air bubbles are mixed in the composite plating solution, the amount of eutectoid can be further increased. Further, by decreasing the flow velocity, the current density is increased almost at the same time, so that the plating processing time can be shortened.
【図１】本方法による複合メッキ液の流速とメッキ処理
時間、及び流速と微粒子の共析量の関係図FIG. 1 is a diagram showing the relationship between the flow rate of the composite plating solution and the plating treatment time, and the flow rate and the eutectoid amount of fine particles according to this method
【図２】複合メッキ装置の要部の縦断面図FIG. 2 is a vertical cross-sectional view of the main part of the composite plating apparatus.
【図３】メッキ液流速と微粒子の共析量の関係図[Fig. 3] Relationship between the flow rate of plating solution and the amount of eutectoid particles
【図４】電流密度とメッキ速度の関係図[Figure 4] Relationship between current density and plating speed
【図５】通常の複合メッキ液の流速とメッキ処理時間、
及び流速と微粒子の共析量の関係図[Fig. 5] Normal composite plating solution flow rate and plating treatment time,
Of flow rate and flow rate and eutectoid amount of fine particles
１ 複合メッキ装置 ４ 挿入電極 ５ 液送管 ７ エア供給管 ｓ 隙間 Ｗ シリンダブロック 1 Composite plating device 4 Insertion electrode 5 Liquid feed pipe 7 Air supply pipe s Gap W Cylinder block
Claims (3)
を遊挿し、この筒内の隙間に向けて液送管から送られる
複合メッキ液を流通させるとともに、中空部材に母材電
極を接続して中空部材の内周面に複合メッキを施すよう
にした複合メッキ方法において、前記隙間内における複
合メッキ液の流速を、流入開始から所定時間経過後遅く
することを特徴とする中空部材の複合メッキ方法。1. An insertion electrode is loosely inserted into a hollow member cylinder with a gap, and a composite plating solution sent from a liquid feed pipe is circulated toward the gap in the cylinder while a base material electrode is connected to the hollow member. In the composite plating method in which the inner peripheral surface of the hollow member is subjected to composite plating, the flow velocity of the composite plating solution in the gap is slowed after a predetermined time has elapsed from the start of inflow, and the composite plating of the hollow member is performed. Method.
時に、複合メッキ液中に気泡を発生させるための気体の
供給を開始することを特徴とする請求項１に記載の中空
部材の複合メッキ方法。2. The method of composite plating a hollow member according to claim 1, wherein the supply of gas for generating bubbles in the composite plating solution is started at the same time when the flow rate of the composite plating solution is reduced. .
ぼ同時に、前記挿入電極と中空部材間の電流密度を高め
ることを特徴とする請求項１又は請求項２に記載の中空
部材の複合メッキ方法。3. The method of composite plating a hollow member according to claim 1, wherein the current density between the insertion electrode and the hollow member is increased substantially at the same time when the flow velocity of the composite plating solution is reduced. .
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5348612A JP2723167B2 (en) | 1993-12-27 | 1993-12-27 | Composite plating method for hollow members |
| US08/364,237 US5540829A (en) | 1993-12-27 | 1994-12-27 | Composite plating method for hollow member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5348612A JP2723167B2 (en) | 1993-12-27 | 1993-12-27 | Composite plating method for hollow members |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07188994A true JPH07188994A (en) | 1995-07-25 |
| JP2723167B2 JP2723167B2 (en) | 1998-03-09 |
Family
ID=18398182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5348612A Expired - Fee Related JP2723167B2 (en) | 1993-12-27 | 1993-12-27 | Composite plating method for hollow members |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2723167B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19702366A1 (en) * | 1996-01-24 | 1997-08-07 | Toyoda Gosei Kk | Coating a metal substrate |
| US5865976A (en) * | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
| JP2002047598A (en) * | 2000-05-17 | 2002-02-15 | Miba Gleitlager Ag | Method for separating dispersed layer on surface of work piece direct current manner |
| JP2011038137A (en) * | 2009-08-07 | 2011-02-24 | Honda Motor Co Ltd | Surface treatment apparatus for inside surface of cylinder barrel, and surface treatment method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293636A (en) * | 1976-02-02 | 1977-08-06 | Suzuki Motor Co | Method of composite plating inner surfaces of cylinder |
| JPS52109439A (en) * | 1976-03-10 | 1977-09-13 | Suzuki Motor Co | Composite plating method |
| JPH05171454A (en) * | 1991-12-20 | 1993-07-09 | Kanai Hiroyuki | Dispersion plating method |
-
1993
- 1993-12-27 JP JP5348612A patent/JP2723167B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293636A (en) * | 1976-02-02 | 1977-08-06 | Suzuki Motor Co | Method of composite plating inner surfaces of cylinder |
| JPS52109439A (en) * | 1976-03-10 | 1977-09-13 | Suzuki Motor Co | Composite plating method |
| JPH05171454A (en) * | 1991-12-20 | 1993-07-09 | Kanai Hiroyuki | Dispersion plating method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5865976A (en) * | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
| DE19702366A1 (en) * | 1996-01-24 | 1997-08-07 | Toyoda Gosei Kk | Coating a metal substrate |
| DE19702366C2 (en) * | 1996-01-24 | 2002-10-31 | Toyoda Gosei Kk | coating process |
| JP2002047598A (en) * | 2000-05-17 | 2002-02-15 | Miba Gleitlager Ag | Method for separating dispersed layer on surface of work piece direct current manner |
| JP2011038137A (en) * | 2009-08-07 | 2011-02-24 | Honda Motor Co Ltd | Surface treatment apparatus for inside surface of cylinder barrel, and surface treatment method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2723167B2 (en) | 1998-03-09 |
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