JPH07162161A - Manufacture of electronic equipment housing - Google Patents
Manufacture of electronic equipment housingInfo
- Publication number
- JPH07162161A JPH07162161A JP34054693A JP34054693A JPH07162161A JP H07162161 A JPH07162161 A JP H07162161A JP 34054693 A JP34054693 A JP 34054693A JP 34054693 A JP34054693 A JP 34054693A JP H07162161 A JPH07162161 A JP H07162161A
- Authority
- JP
- Japan
- Prior art keywords
- metal shell
- thermoplastic resin
- adhesive
- adhesive layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、薄形、軽量の電子機器
筐体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin and lightweight electronic device housing.
【０００２】[0002]
【従来の技術】従来から、半導体装置など電子回路を実
装した電子機器を収納する筐体は、熱可塑性樹脂の射出
成形により製造され、意匠的な外観と電子回路を実装す
る内部機構部とを合わせ持った成形体が使用されてい
る。2. Description of the Related Art Conventionally, a housing for accommodating an electronic device having an electronic circuit mounted therein such as a semiconductor device has been manufactured by injection molding of a thermoplastic resin and has a design appearance and an internal mechanism portion for mounting the electronic circuit. A molded body with a joint is used.
【０００３】ところが最近の電子機器においては、軽量
化、小形化、高密度化等が飛躍的に進んでおり、これら
の電子機器を収納する筐体に対しても、肉厚が薄くて軽
量であることが要求されている。However, in recent electronic devices, weight reduction, downsizing, high density, and the like have been dramatically advanced, and even a housing for housing these electronic devices is thin and lightweight. Is required to be.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
電子機器の筐体においては、肉厚が限界まで薄くなって
おり、熱可塑性樹脂の強度と加工性の点からこれ以上薄
肉化することが困難であった。そこで樹脂に比べて強度
が格段に大きい金属を筐体の外殻とし、その内側の内部
機構部をＡＢＳ樹脂やポリプロピレン樹脂のような熱可
塑性樹脂により成形することが考えられているが、従来
は金属と熱可塑性樹脂とを接着することが難しかった。
また、アウトサート成形のように金属側に穴を明けてア
ンダーカットを設けることにより、金属外殻と熱可塑性
樹脂の内部機構部とを接着することも考えられるが、金
属外殻が筐体の意匠外観を兼ねているため、意匠を損な
わずにこの方法を取ることが難しかった。However, in the case of the conventional electronic equipment, the wall thickness is as thin as possible, and it is difficult to further reduce the wall thickness in view of the strength and workability of the thermoplastic resin. Met. Therefore, it has been considered that a metal whose strength is significantly larger than that of resin is used as the outer shell of the housing and the inner internal mechanical portion is molded with a thermoplastic resin such as ABS resin or polypropylene resin. It was difficult to bond the metal and the thermoplastic resin.
It is also conceivable to bond the metal outer shell and the internal mechanical part of the thermoplastic resin by forming a hole on the metal side and providing an undercut as in the outsert molding, but the metal outer shell is Since it also has a design appearance, it was difficult to take this method without damaging the design.
【０００５】本発明は、上記の問題を解決するためにな
されたもので、薄くて軽量で、金属外殻と熱可塑性樹脂
性の内部機構部とが強固に接着された信頼性の高い電子
機器筐体の製造方法を提供しようとするものである。The present invention has been made to solve the above-mentioned problems, and is a thin and lightweight electronic device with high reliability in which a metal outer shell and a thermoplastic resin internal mechanism portion are firmly bonded together. It is intended to provide a method for manufacturing a housing.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと鋭意研究を重ねた結果、芯材に接着剤
を含浸させた接着層を、金属外殻の内側に設けて熱可塑
性樹脂の成形をすることによって、上記の目的を達成で
きることを見いたし、本発明を完成したものである。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that an adhesive layer in which a core material is impregnated with an adhesive is provided inside a metal shell. The present invention has been completed by finding that the above objects can be achieved by molding a thermoplastic resin.
【０００７】即ち、本発明は、片面に繊維状の芯材に接
着剤を含浸させた接着層を有する金属板を、プレス加工
により前記接着層を内側とする金属外殻成形体を成形し
た後、前記金属外殻成形体を射出成形金型内に装着し、
次いで内側の接着層上に熱可塑性樹脂を射出成形して内
部機構部を前記金属外殻成形体と一体に形成することを
特徴とする電子機器筐体の製造方法である。That is, according to the present invention, after a metal plate having an adhesive layer on one surface of which a fibrous core material is impregnated with an adhesive is pressed, a metal outer shell formed body having the adhesive layer inside is formed. , Mounting the metal outer shell molded body in an injection molding mold,
Then, a thermoplastic resin is injection-molded on the inner adhesive layer to form the internal mechanism portion integrally with the metal outer shell molded body, which is a method for manufacturing an electronic device housing.
【０００８】本発明において用いる繊維状の芯材に接着
剤を含浸させた接着層を有する金属板としては、軽くて
加工性の良いアルミニウム、亜鉛合金やマグネシウム合
金等からなる厚さ 0.3〜 1.5mm板状体を使用することが
できる。ここでの接着層は繊維状の芯材に接着剤を含浸
させたものから構成されている。接着剤としては、エポ
キシ樹脂系、フェノール樹脂系、レゾルシノール樹脂系
の熱硬化性接着剤、酢酸ビニル樹脂系、シアノアクリレ
ート系等の熱可塑性接着剤、アクリロニトリルゴム系、
環化ゴム系、シリコーン系等のエラストマー系接着剤、
およびこれらの混合系の接着剤等が使用される。そして
これらの接着剤は、金属板と内部機構部成形用の熱可塑
性樹脂部を接着することができるものであればよく、特
に限定されるものではない。接着剤を含浸させる繊維状
の芯材としては、天然繊維、有機繊維、無機繊維からな
る織布又は不織布を使用することができる。この芯材に
接着剤を含浸させたものを接着層として金属板の片側に
接着させる。A metal plate having an adhesive layer in which a fibrous core material is impregnated with an adhesive, which is used in the present invention, has a thickness of 0.3 to 1.5 mm made of aluminum, a zinc alloy, a magnesium alloy or the like which is light and has good workability. Plates can be used. The adhesive layer here is composed of a fibrous core material impregnated with an adhesive. As the adhesive, epoxy resin type, phenol resin type, resorcinol resin type thermosetting adhesive, vinyl acetate resin type, cyanoacrylate type thermoplastic adhesive, acrylonitrile rubber type,
Elastomer adhesives such as cyclized rubber and silicone
And an adhesive or the like of a mixed system of these is used. These adhesives are not particularly limited as long as they can bond the metal plate and the thermoplastic resin portion for molding the internal mechanism portion. As the fibrous core material impregnated with the adhesive, a woven or non-woven fabric made of natural fibers, organic fibers or inorganic fibers can be used. This core material impregnated with an adhesive is adhered to one side of the metal plate as an adhesive layer.
【０００９】本発明において、内部機構部を形成する熱
可塑性樹脂としては、ＡＢＳ樹脂、ポリスチレン樹脂、
ポリプロピレン樹脂、変性ポリフェニレンエーテル樹
脂、ポリアミド樹脂、ポリカーポネート樹脂、ポリエチ
レンテレフタレート樹脂等が挙げられ、接着層によって
金属板と接合するものであればとくに制限はなく使用で
き、内部機構部に要求される特性によってこれらの樹脂
を任意に選択することができる。In the present invention, as the thermoplastic resin forming the internal mechanism portion, ABS resin, polystyrene resin,
Examples thereof include polypropylene resin, modified polyphenylene ether resin, polyamide resin, polycarbonate resin, polyethylene terephthalate resin, etc., as long as they can be bonded to a metal plate by an adhesive layer, they can be used without particular limitation, and are required for internal mechanical parts. These resins can be arbitrarily selected depending on the characteristics.
【００１０】本発明の電子機器筐体の製造方法は、ま
ず、繊維状の芯材に接着剤を含浸させた接着層を片面に
有する金属板を、プレス型に入れて前記接着層が内側に
なるようにプレス加工を行い所定の筐体の金属外殻成形
体を成形する。そして、得られた金属外殻成形体を射出
成形金型内に装着し、成形体の内面上すなわち接着層上
に熱硬化性樹脂を射出成形して内部機構部を金属外殻成
形体と一体に形成させて電子機器の筐体とする。In the method of manufacturing an electronic device casing of the present invention, first, a metal plate having an adhesive layer on one surface of which a fibrous core material is impregnated with an adhesive is placed in a press die and the adhesive layer is placed inside. The metal outer shell molded body of a predetermined housing is molded by performing press working so that Then, the obtained metal outer shell molded body is mounted in an injection molding die, and a thermosetting resin is injection-molded on the inner surface of the molded body, that is, on the adhesive layer to integrate the internal mechanism portion with the metal outer shell molded body. To form an electronic device housing.
【００１１】[0011]
【作用】本発明の電子機器筐体の製造方法によれば、金
属板からなる外殻成形体が外側に設けられているので、
機械的強度が大きく、従って、肉厚を薄く軽量化させる
ことができた。また金属板上に設けた接着層を繊維状の
芯材に接着剤を含浸させた構造としたことにより、接着
層上に熱可塑性樹脂が射出成形される際の熱や圧力によ
って、接着剤が流されることを防止し、かつ接着後は芯
材が接着剤の熱による膨張を小さくするため、金属板と
のずれによる剥がれをなくし、金属外殻成形体と内部機
構部との接着強度の優れた、接着により意匠外観が損な
われることのない電子機器筐体を製造することができ
た。According to the method of manufacturing the electronic device casing of the present invention, since the outer shell molded body made of a metal plate is provided on the outside,
The mechanical strength was high, and therefore the thickness was thin and the weight was light. In addition, since the adhesive layer provided on the metal plate has a structure in which a fibrous core material is impregnated with the adhesive, the adhesive can be formed by heat or pressure when the thermoplastic resin is injection-molded on the adhesive layer. It prevents the core material from flowing away and reduces the expansion of the core material due to the heat of the adhesive after bonding, so it does not peel off due to misalignment with the metal plate, and has excellent adhesive strength between the metal outer shell molded body and the internal mechanism part. In addition, it was possible to manufacture an electronic device housing in which the design appearance is not impaired by adhesion.
【００１２】[0012]
【実施例】以下、図面を用いて本発明を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.
【００１３】図１（a ）〜（c ）は、本発明の電子機器
筐体の製造方法にかかる一実施例の工程を説明するため
の断面図である。1 (a) to 1 (c) are cross-sectional views for explaining the steps of one embodiment of the method for manufacturing an electronic equipment casing of the present invention.
【００１４】図１（a ）に示すように、ガラス繊維の不
織布に接着剤を含浸させた接着層１として、接着性シー
トＮＰ６０５（ソニーケミカル社製、商品名）を厚さ
0.6mmのアルミニウム板２上に重ね、130 ℃に加熱した
ロール中を通して接着層１を有する金属板３を得た。次
いで図１（b ）に示すように、得られた金属板３をプレ
ス型に入れ接着層１が内側になるようにプレス加工を行
い、所定形状に成形した金属外殻成形体４とした。これ
を図１（c ）に示すように、形成すべき内部機構部と同
一形状のキャビティを有する射出成形金型５内にインサ
ートした後、シリンダー内で加熱流動化した熱可塑性樹
脂６、ＪＳＲＡＢＳ１０（日本合成ゴム社製、ＡＢＳ樹
脂、商品名）をスプルー７を通して射出成形金型５のキ
ャビティ内に圧入充填し、内部機構部８を形成するとと
もに、接着性シートの熱硬化性樹脂をその熱および圧力
で接着剤として結合させ冷却して筐体を製造した。As shown in FIG. 1 (a), an adhesive sheet NP605 (manufactured by Sony Chemical Co., Ltd., product name) having a thickness is used as an adhesive layer 1 obtained by impregnating a nonwoven fabric of glass fiber with an adhesive.
A metal plate 3 having an adhesive layer 1 was obtained by passing it over a 0.6 mm aluminum plate 2 and passing it through a roll heated to 130 ° C. Next, as shown in FIG. 1 (b), the obtained metal plate 3 was put into a press die and press-worked so that the adhesive layer 1 was on the inside to obtain a metal outer shell formed body 4 formed into a predetermined shape. As shown in FIG. 1 (c), this was inserted into an injection molding die 5 having a cavity having the same shape as the internal mechanical portion to be formed, and then the thermoplastic resin 6, JSRABS10 (heated and fluidized in the cylinder, ABS resin, trade name) made by Japan Synthetic Rubber Co., Ltd. is press-fitted into the cavity of the injection molding die 5 through the sprue 7 to form the internal mechanism portion 8 and the thermosetting resin of the adhesive sheet The case was manufactured by bonding as an adhesive with pressure and cooling.
【００１５】このような実施例で製造された筐体は、表
１に示したようにＡＢＳ樹脂単体で成形された従来の筐
体に比べ、肉厚が薄くて軽くしかも強度が極めて大き
い。As shown in Table 1, the case manufactured in such an embodiment has a smaller thickness, lighter weight, and extremely high strength as compared with the conventional case formed of ABS resin alone.
【００１６】こうして得られた筐体は、同様な方法で成
形された他方の側のケースと組にして半導体装置のよう
な電子機器の筐体として使用される。The housing thus obtained is used as a housing for electronic equipment such as a semiconductor device in combination with the other case formed by the same method.
【００１７】すなわち、図２に示したように回路基板９
の両面にそれぞれ回路部品１０が実装された部品実装回
路基板１１（電子機器）を中央に配置し、その上下に両
側にそれぞれ実施例で得られた筐体を被せ、回路基板９
を内部機構部８のボスにねじ止めすることにより、筐体
を組み立て固定する。That is, as shown in FIG. 2, the circuit board 9
The component-mounting circuit boards 11 (electronic devices) having the circuit components 10 mounted on both sides of are placed at the center, and the casing obtained in the embodiment is covered on the upper and lower sides thereof, respectively.
The case is assembled and fixed by screwing to the boss of the internal mechanism section 8.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の電子機器筐体の製造方法によれば、金属外
殻成形体と内部機構部とが強固に接着され、薄くて軽量
で強度の大きい電子機器用の筐体が得られる。As is clear from the above description and Table 1, according to the method for manufacturing an electronic device housing of the present invention, the metal outer shell molded body and the internal mechanism portion are firmly bonded to each other, and are thin and lightweight. Thus, a housing for electronic equipment having high strength can be obtained.
【図１】図１（a ）〜（c ）は、本発明の電子機器筐体
の製造方法にかかる一実施例の工程を説明するための断
面図である。1 (a) to 1 (c) are cross-sectional views for explaining steps of an embodiment according to a method for manufacturing an electronic device housing of the present invention.
【図２】図２は、実施例で得られた筐体に電子機器を収
納固定した状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state in which an electronic device is housed and fixed in the housing obtained in the embodiment.
【符号の説明】 １ 接着層 ２ アルミニウム板 ３ 金属板 ４ 金属外殻成形体 ５ 射出成形金型 ６ 熱可塑性樹脂 ７ スプルー ８ 内部機構部 ９ 回路基板 １０ 回路部品 １１ 部品実装回路基板[Explanation of reference numerals] 1 adhesive layer 2 aluminum plate 3 metal plate 4 metal outer shell molded body 5 injection molding die 6 thermoplastic resin 7 sprue 8 internal mechanism section 9 circuit board 10 circuit component 11 component mounting circuit board
Claims (1)
た接着層を有する金属板を、プレス加工により前記接着
層を内側とする金属外殻成形体を成形した後、前記金属
外殻成形体を射出成形金型内に装着し、次いで内側の接
着層上に熱可塑性樹脂を射出成形して内部機構部を前記
金属外殻成形体と一体に成形することを特徴とする電子
機器筐体の製造方法。1. A metal plate having an adhesive layer on one surface of which a fibrous core material is impregnated with an adhesive is pressed to form a metal outer shell formed body having the adhesive layer inside, and then the metal outer shell is formed. An electronic device in which a shell molded body is mounted in an injection molding die, and then a thermoplastic resin is injection-molded on an inner adhesive layer to integrally mold an internal mechanical portion with the metal outer shell molded body. Manufacturing method of housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34054693A JPH07162161A (en) | 1993-12-08 | 1993-12-08 | Manufacture of electronic equipment housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34054693A JPH07162161A (en) | 1993-12-08 | 1993-12-08 | Manufacture of electronic equipment housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07162161A true JPH07162161A (en) | 1995-06-23 |
Family
ID=18338025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34054693A Pending JPH07162161A (en) | 1993-12-08 | 1993-12-08 | Manufacture of electronic equipment housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07162161A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012073775A1 (en) * | 2010-12-02 | 2012-06-07 | 東レ株式会社 | Method for producing metal composite, and chassis for electronic equipment |
| JP2012131221A (en) * | 2010-12-02 | 2012-07-12 | Toray Ind Inc | Method for producing metal composite |
| JP2012183820A (en) * | 2011-02-15 | 2012-09-27 | Toray Ind Inc | Chassis for electronic equipment |
| JP2012206503A (en) * | 2011-03-17 | 2012-10-25 | Toray Ind Inc | Method for producing metal composite |
| JP2012206504A (en) * | 2011-03-17 | 2012-10-25 | Toray Ind Inc | Method for producing metal composite |
| KR101362720B1 (en) * | 2013-03-14 | 2014-02-14 | 주식회사 우전앤한단 | Manufacturing method for exterior casing of mobile device |
-
1993
- 1993-12-08 JP JP34054693A patent/JPH07162161A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012073775A1 (en) * | 2010-12-02 | 2012-06-07 | 東レ株式会社 | Method for producing metal composite, and chassis for electronic equipment |
| JP2012131221A (en) * | 2010-12-02 | 2012-07-12 | Toray Ind Inc | Method for producing metal composite |
| CN103237646A (en) * | 2010-12-02 | 2013-08-07 | 东丽株式会社 | Method for producing metal composite, and chassis for electronic equipment |
| CN103237646B (en) * | 2010-12-02 | 2015-07-22 | 东丽株式会社 | Method for producing metal composite, and chassis for electronic equipment |
| US9505177B2 (en) | 2010-12-02 | 2016-11-29 | Toray Industries, Inc. | Method for producing a metal composite |
| JP2012183820A (en) * | 2011-02-15 | 2012-09-27 | Toray Ind Inc | Chassis for electronic equipment |
| JP2012206503A (en) * | 2011-03-17 | 2012-10-25 | Toray Ind Inc | Method for producing metal composite |
| JP2012206504A (en) * | 2011-03-17 | 2012-10-25 | Toray Ind Inc | Method for producing metal composite |
| KR101362720B1 (en) * | 2013-03-14 | 2014-02-14 | 주식회사 우전앤한단 | Manufacturing method for exterior casing of mobile device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5038412B2 (en) | Metal resin composite | |
| CA2586855C (en) | Multi-functional structural circuits | |
| JPH07124995A (en) | Preparation of box for electronic instrument | |
| JP5071214B2 (en) | Electronic device casing and method of manufacturing electronic device casing | |
| US5705104A (en) | Method for embedding conductors in a structure | |
| JPH07162161A (en) | Manufacture of electronic equipment housing | |
| WO2017221921A1 (en) | Case and method for producing case | |
| CN105578364B (en) | The production method and loudspeaker monomer of vibrational system | |
| JPH06334377A (en) | Electronic equipment case body | |
| CN110087851B (en) | Electronic control device | |
| US5995374A (en) | Resin-coated mount substrate and method of producing the same | |
| EP0511014B1 (en) | Integrally molded printed circuit board and method of making the same | |
| JPH0946082A (en) | Case for electric/electronic apparatus and its manufacture | |
| CN111491469A (en) | Core-shell with various filler materials for enhanced thermal conductivity | |
| JPH05269787A (en) | Production of housing of electronic machinery | |
| JPH0758477A (en) | Integral-type electromagnetic shielding molded body and manufacture thereof | |
| JPH11317569A (en) | Flexible printed wiring board | |
| JPH05114664A (en) | Manufacture of electronic equipment case | |
| JP2005093905A (en) | Electronic substrate unit | |
| JP2004330509A (en) | Electronic device housing and its molding method | |
| JP2000286565A (en) | Enclosure for electronic equipment | |
| JP2889318B2 (en) | Electronic equipment | |
| JPS6380597A (en) | Manufacture of injection-molded unit with circuit | |
| JPH031992A (en) | Ic card and manufacture of ic card | |
| JPH08148855A (en) | Cabinet for electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Effective date: 20040323 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040524 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050111 |