JPH05114664A - Manufacture of electronic equipment case - Google Patents
Manufacture of electronic equipment caseInfo
- Publication number
- JPH05114664A JPH05114664A JP12815391A JP12815391A JPH05114664A JP H05114664 A JPH05114664 A JP H05114664A JP 12815391 A JP12815391 A JP 12815391A JP 12815391 A JP12815391 A JP 12815391A JP H05114664 A JPH05114664 A JP H05114664A
- Authority
- JP
- Japan
- Prior art keywords
- molded
- die
- outer shell
- synthetic resin
- internal mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】［発明の目的］[Object of the Invention]
【０００２】[0002]
【産業上の利用分野】本発明は、薄型、軽量の電子機器
の筐体を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin and lightweight electronic device housing.
【０００３】[0003]
【従来の技術】従来から、半導体装置のような電子機器
を収納する筐体としては、熱可塑性樹脂の射出成形によ
り製造され、意匠的な外観と電子回路等を実装する内部
機構部とを合せ持った成形体が使用されている。2. Description of the Related Art Conventionally, a housing for housing electronic equipment such as a semiconductor device has been manufactured by injection molding of a thermoplastic resin, and has a design appearance and an internal mechanical portion for mounting an electronic circuit or the like. A molded body that has been used.
【０００４】ところで最近の電子機器においては、軽量
化、小型化、高密度化等が飛躍的に進んでおり、これら
の電子機器を収納する筐体に対しても、肉厚が薄くて軽
量であることが要求されている。By the way, in recent electronic devices, weight reduction, miniaturization, high density, etc. have been dramatically advanced, and even a housing for housing these electronic devices is thin and lightweight. Is required to be.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
電子機器の筐体においては、肉厚が限界まで薄くなって
おり、熱可塑性樹脂の強度と加工性の点からこれ以上薄
肉化することが困難であった。However, in the case of the conventional electronic equipment, the wall thickness is as thin as possible, and it is difficult to further reduce the wall thickness in view of the strength and workability of the thermoplastic resin. Met.
【０００６】そこで、樹脂に比べて強度が格段に大きい
金属を筐体の外殻とし、その内側の内部機構部をポリエ
チレン、ポリプロピレンのような熱可塑性樹脂により成
形することが考えられているが、金属と熱可塑性樹脂と
では、接着することが難しかった。また、アウトサート
成形のように、金属側に穴を開けてアンダーカットを設
けることにより、金属外殻と熱可塑性樹脂の内部機構部
とを接着することも考えられるが、金属外殻が筐体の意
匠外観を兼ねているため、意匠を損なわずにこの方法を
採ることが難しかった。Therefore, it has been considered that a metal having a strength significantly higher than that of resin is used as the outer shell of the housing, and the inner mechanical portion inside the housing is molded with a thermoplastic resin such as polyethylene or polypropylene. It was difficult to bond the metal and the thermoplastic resin. It is also possible to bond the metal outer shell and the internal mechanism part of the thermoplastic resin by forming a hole in the metal side and providing an undercut like the outsert molding, but the metal outer shell is the case. Since it also has a design appearance, it was difficult to adopt this method without damaging the design.
【０００７】本発明はこれらの問題を解決するためにな
されたもので、薄く軽量で、金属外殻と熱可塑性樹脂製
の内部機構部とが強固に接着された電子機器筐体を製造
する方法を提供することを目的とする。The present invention has been made in order to solve these problems, and is a method of manufacturing a thin and lightweight electronic device housing in which a metal outer shell and an internal mechanical portion made of a thermoplastic resin are firmly bonded together. The purpose is to provide.
【０００８】［発明の構成］[Structure of Invention]
【０００９】[0009]
【課題を解決するための手段】本発明の電子機器筐体の
製造方法は、金属板の片面に接着性合成樹脂層を設けて
なるラミネート板を、プレス加工により前記合成樹脂層
が内側になる所定の筐体外殻形状に成形した後、得られ
た外殻成形体を射出成形金型内に装着し、前記合成樹脂
層上に熱可塑性樹脂を射出成形し、内部機構部を一体に
形成することを特徴としている。According to the method of manufacturing an electronic device housing of the present invention, a laminated plate having an adhesive synthetic resin layer provided on one side of a metal plate is pressed to make the synthetic resin layer inside. After molding into a predetermined casing outer shell shape, the obtained outer shell molded body is mounted in an injection molding die, and a thermoplastic resin is injection-molded on the synthetic resin layer to integrally form an internal mechanism portion. It is characterized by
【００１０】本発明において金属板としては、軽くて加
工性の良いアルミニウムや亜鉛合金からなる、厚さが0.
5mm 〜0.7mm の板状体を使用することができる。In the present invention, the metal plate is made of aluminum or zinc alloy which is light and has good workability and has a thickness of 0.
Plates of 5 mm to 0.7 mm can be used.
【００１１】また、接着性合成樹脂としては、前記金属
との接着性に優れかつ後述する熱可塑性樹脂とも良好な
接着性を有する、エチレン−酢酸ビニル共重合体樹脂
（ＥＶＡ）やエチレン−アクリル酸エチル共重合体樹脂
（ＥＥＡ）などを使用することができる。ここで、ＥＶ
Ａの市販品としては、ノバテック（三菱化成（株）社の
商品名）、 ？ポリマー（日本石油化学（株）社の商品
名）、ショウフレックス（昭和電工（株）社の商品名）
などがあり、ＥＥＡの市販品としては、ニュクレル（三
井デュポンポリケミカル（株）社の商品名）などが挙げ
られる。As the adhesive synthetic resin, ethylene-vinyl acetate copolymer resin (EVA) or ethylene-acrylic acid, which has excellent adhesiveness to the above-mentioned metal and also has good adhesiveness to the thermoplastic resin described later Ethyl copolymer resin (EEA) or the like can be used. Where EV
The commercially available products of A include Novatec (trade name of Mitsubishi Kasei Co., Ltd.) ,? Polymer (trade name of Nippon Petrochemical Co., Ltd.), Showflex (trade name of Showa Denko KK)
As a commercially available product of EEA, Nucrel (trade name of Mitsui DuPont Polychemical Co., Ltd.) and the like can be mentioned.
【００１２】これらの接着性合成樹脂の層は、30μm 〜
100 μm の厚さとすることが好ましく、これを前記金属
板の片面に形成するには、例えば押出しラミネートする
か、あるいはフィルム状に加工したものを、熱プレスや
熱ロールにより貼着するなどの方法を採ることができ
る。The layer of these adhesive synthetic resins has a thickness of 30 μm
The thickness is preferably 100 μm. To form this on one surface of the metal plate, for example, extrusion laminating or film processing and pasting with a hot press or a heat roll is performed. Can be taken.
【００１３】さらに本発明において、このようなラミネ
ート金属板をプレス加工した外殻成形体の前記接着性合
成樹脂層上に射出成形される熱可塑性樹脂としては、ポ
リエチレンまたはポリプロピレンを使用することができ
る。Further, in the present invention, polyethylene or polypropylene can be used as the thermoplastic resin injection-molded on the adhesive synthetic resin layer of the outer shell molded body obtained by pressing such a laminated metal plate. ..
【００１４】[0014]
【作用】本発明の電子機器筐体の製造方法においては、
まず金属板の片面に接着性合成樹脂層が設けられたラミ
ネート金属板を、プレス型に入れて接着性合成樹脂層が
内側になるようなプレス加工を行い、例えば皿形や箱形
の筐体外殻形状に成形する。In the method of manufacturing the electronic equipment casing of the present invention,
First, a laminated metal plate with an adhesive synthetic resin layer provided on one side of a metal plate is placed in a press die and pressed so that the adhesive synthetic resin layer is on the inside. Form into a shell shape.
【００１５】次いで、得られた外殻成形体を射出成形金
型内の所定の位置に装着し、成形体の内周面上すなわち
前記合成樹脂層上に熱可塑性樹脂を射出成形することに
より、内部機構部が金属外殻と一体に形成される。Then, the obtained outer shell molded body is mounted at a predetermined position in an injection molding die, and a thermoplastic resin is injection-molded on the inner peripheral surface of the molded body, that is, on the synthetic resin layer. The internal mechanism portion is integrally formed with the metal outer shell.
【００１６】このように製造された筐体は、金属で構成
された外殻成形体が挿設されているので、機械的強度が
大きく、肉厚を薄く軽量にすることができる。Since the outer shell molded body made of metal is inserted in the housing manufactured as described above, it has high mechanical strength and can be made thin and lightweight.
【００１７】また、このような金属外殻成形体の内側に
接着性合成樹脂層が設けられ、その上に熱可塑性樹脂が
射出成形されて内部機構部が形成されているので、金属
外殻成形体と内部機構部との接着強度が極めて大きく、
かつ接着により意匠外観が損なわれない。Further, since an adhesive synthetic resin layer is provided on the inside of such a metal outer shell molded body and a thermoplastic resin is injection-molded thereon to form an internal mechanism portion, the metal outer shell molded body is formed. The adhesive strength between the body and the internal mechanism is extremely high,
Moreover, the design does not deteriorate due to adhesion.
【００１８】[0018]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１９】図１（ａ）〜（ｄ）は、本発明の電子機器
筐体の製造方法の一実施例を説明するための断面図であ
る。1 (a) to 1 (d) are cross-sectional views for explaining an embodiment of a method for manufacturing an electronic equipment casing of the present invention.
【００２０】実施例においては、まず図１（ａ）に示す
ように、厚さ0.5mm のアルミニウム板１の片面に厚さ50
μm のＥＶＡフィルム２を重ね、これを130 ℃の温度で
熱プレスして接合させる。次いで、図１（ｂ）に示すよ
うに、得られたラミネート板３をプレス型４に入れてＥ
ＶＡフィルム２面側が内側になるようにプレス加工を行
い、所定の矩形皿形形状に成形した後、図１（ｃ）に示
すように、周囲の不要部をトリミングして外殻成形体５
とする。次いで、図１（ｄ）に示すように、この外殻成
形体５を、形成すべき内部機構部と同一形状のキャビテ
イを有する射出成形金型６内にインサートした後、シリ
ンダ内で加熱流動化されポリエチレン７をスプルー８を
通って金型６キャビティ内に圧入充填し固化させる。In the embodiment, first, as shown in FIG. 1 (a), a thickness of 50 mm is formed on one side of an aluminum plate 1 having a thickness of 0.5 mm.
An EVA film 2 having a thickness of .mu.m is superposed, and this is hot pressed at a temperature of 130.degree. Then, as shown in FIG. 1 (b), the obtained laminated plate 3 is put into a press die 4 and E
After press working so that the VA film 2 surface side is the inside, and after molding into a predetermined rectangular dish shape, as shown in FIG. 1C, the peripheral unnecessary portion is trimmed to form the outer shell molded body 5.
And Next, as shown in FIG. 1 (d), this outer shell molded body 5 is inserted into an injection molding die 6 having a cavity of the same shape as the internal mechanism portion to be formed, and then heated and fluidized in the cylinder. Then, the polyethylene 7 is pressed into the cavity of the mold 6 through the sprue 8 to be solidified.
【００２１】こうして得られた筐体は、下表に示すよう
に、ＡＢＳ樹脂単独で成形された従来の筐体に比べ、肉
厚が薄くて軽くしかも強度が極めて大きい。As shown in the table below, the housing thus obtained is thinner, lighter, and extremely stronger than a conventional housing molded of ABS resin alone.
【００２２】 表 実施例で得られた筐体 従来の筐体 外殻肉厚 0.5mm 1.5mm 重量 1.35Kg/m2 1.58Kg/m2 曲げ弾性率 700000Kg/ cm2 25000Kg/ cm2 このような実施例で得られた筐体は、同様な方法で成形
された他方の側のケースと組にして、半導体装置のよう
な電子機器の筐体として使用される。Table Cases Obtained in Examples Conventional Case Outer Shell Thickness 0.5 mm 1.5 mm Weight 1.35 Kg / m 2 1.58 Kg / m 2 Flexural Modulus 700000 Kg / cm 2 25000 Kg / cm 2 The case obtained in the example is used as a case of an electronic device such as a semiconductor device in combination with a case on the other side formed by a similar method.
【００２３】すなわち、図２に示すように、回路基板９
の両面にそれぞれ回路部品１０が実装された部品実装回
路基板１１（電子機器）を中央に配置し、その上下両側
にそれぞれ実施例で得られた筐体を被せ、回路基板９を
筐体の内部機構部１２のボスにねじ止めすることにより
固定する。That is, as shown in FIG.
A component mounting circuit board 11 (electronic device) having circuit components 10 mounted on both surfaces thereof is arranged in the center, and the casing obtained in the embodiment is covered on both upper and lower sides thereof, and the circuit board 9 is placed inside the casing. It is fixed by being screwed to the boss of the mechanism section 12.
【００２４】[0024]
【発明の効果】以上説明したように本発明の製造方法に
よれば、金属外殻と内部機構部とが強固に接着され、薄
く軽量で強度の大きい電子機器用の筐体が得られる。As described above, according to the manufacturing method of the present invention, the metal outer shell and the internal mechanism portion are firmly bonded to each other, and a thin, lightweight, and strong casing for electronic equipment can be obtained.
【図１】本発明の電子機器筐体の製造方法の一実施例を
説明するための断面図。FIG. 1 is a cross-sectional view for explaining one embodiment of a method for manufacturing an electronic device housing according to the present invention.
【図２】実施例で得られた筐体に電子機器を収納固定し
た状態を示す断面図。FIG. 2 is a cross-sectional view showing a state in which an electronic device is housed and fixed in the housing obtained in the example.
１………アルミニウム板 ２………ＥＶＡフィルム ３………ラミネート板 ４………プレス型 ５………外殻成形体 ６………射出成形金型 ７………ポリエチレン ８………スプルー ９………回路基板 １０……回路部品 １１……部品実装回路板 １２……内部機構部 1 ………… Aluminum plate 2 ………… EVA film 3 ………… Laminate plate 4 ………… Press mold 5 ………… Outer shell molded product 6 ………… Injection mold 7 ……… Polyethylene 8 ……… Sprue 9: Circuit board 10: Circuit component 11: Component mounting circuit board 12: Internal mechanism
Claims (3)
てなるラミネート板を、プレス加工により前記合成樹脂
層が内側になる所定の筐体外殻形状に成形した後、得ら
れた外殻成形体を射出成形金型内に装着し、前記合成樹
脂層上に熱可塑性樹脂を射出成形し、内部機構部を一体
に形成することを特徴とする電子機器筐体の製造方法。1. An outer shell obtained by molding a laminated plate having an adhesive synthetic resin layer on one surface of a metal plate into a predetermined casing outer shell shape with the synthetic resin layer inside by press working. A method for manufacturing an electronic device housing, comprising mounting a molded body in an injection molding die, injection molding a thermoplastic resin on the synthetic resin layer, and integrally forming an internal mechanism portion.
ル共重合体樹脂、またはエチレン−アクリル酸エチル共
重合体樹脂である請求項１記載の電子機器筐体の製造方
法。2. The method for manufacturing an electronic device casing according to claim 1, wherein the adhesive synthetic resin is an ethylene-vinyl acetate copolymer resin or an ethylene-ethyl acrylate copolymer resin.
リプロピレンである請求項１または２記載の電子機器筐
体の製造方法。3. The method for manufacturing an electronic equipment casing according to claim 1, wherein the thermoplastic resin is polyethylene or polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12815391A JPH05114664A (en) | 1991-05-31 | 1991-05-31 | Manufacture of electronic equipment case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12815391A JPH05114664A (en) | 1991-05-31 | 1991-05-31 | Manufacture of electronic equipment case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05114664A true JPH05114664A (en) | 1993-05-07 |
Family
ID=14977696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12815391A Pending JPH05114664A (en) | 1991-05-31 | 1991-05-31 | Manufacture of electronic equipment case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05114664A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872699A (en) * | 1995-07-25 | 1999-02-16 | Fujitsu Limited | Electronic apparatus, housing for electronic apparatus and housing manufacturing method |
| KR20160129068A (en) * | 2014-04-04 | 2016-11-08 | 알프스 덴키 가부시키가이샤 | Method for manufacturing electronic component |
| CN106233457A (en) * | 2014-05-15 | 2016-12-14 | 英特尔公司 | Molding combined housing for integrated circuit package |
-
1991
- 1991-05-31 JP JP12815391A patent/JPH05114664A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872699A (en) * | 1995-07-25 | 1999-02-16 | Fujitsu Limited | Electronic apparatus, housing for electronic apparatus and housing manufacturing method |
| KR20160129068A (en) * | 2014-04-04 | 2016-11-08 | 알프스 덴키 가부시키가이샤 | Method for manufacturing electronic component |
| CN106233457A (en) * | 2014-05-15 | 2016-12-14 | 英特尔公司 | Molding combined housing for integrated circuit package |
| JP2017516309A (en) * | 2014-05-15 | 2017-06-15 | インテル コーポレイション | Molded composite enclosure for integrated circuit assemblies |
| US10056308B2 (en) | 2014-05-15 | 2018-08-21 | Intel Corporation | Molded composite enclosure for integrated circuit assembly |
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|---|---|---|---|
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