JPH07121529B2 - Mold protector - Google Patents
Mold protectorInfo
- Publication number
- JPH07121529B2 JPH07121529B2 JP2074676A JP7467690A JPH07121529B2 JP H07121529 B2 JPH07121529 B2 JP H07121529B2 JP 2074676 A JP2074676 A JP 2074676A JP 7467690 A JP7467690 A JP 7467690A JP H07121529 B2 JPH07121529 B2 JP H07121529B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- value
- movable platen
- limit value
- difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
- B29C45/844—Preventing damage caused by obstructions or foreign matter caught between mould halves during mould closing, e.g. moulded parts or runners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 《産業上の利用分野》 この発明は、射出成形機などの金型の保護装置に関する
もので、金型の合わせ面にかみ込んだ異物によって金型
が損傷するのを防止する装置に関するものである。Description: TECHNICAL FIELD The present invention relates to a mold protection device for an injection molding machine or the like, which prevents a mold from being damaged by foreign matter caught in a mating surface of the mold. It relates to a device for preventing.
《従来の技術》 射出成形では、固定金型と可動金型で形成される空所に
高圧の樹脂を注入して成形品を得るが、このとき可動金
型は高い射出圧に耐えるために固定金型に強固に押圧さ
れ、固定金型と可動金型の合わせ面には強大な面圧が加
わっている。型が開いたときに型の合わせ面に異物が付
着した場合、そのまま型締めが行われると、強大な型締
力が異物をかみ込んだ一点に集中して型の合わせ面を損
傷する。そこで型閉じ、即ち型締力をかけないで固定金
型と可動金型の合わせ面を閉じた状態で可動金型の位置
を検出し、金型の合わせ面がぴったりと閉じているかど
うかを検出する金型保護手段が採用されている。《Prior Art》 In injection molding, high-pressure resin is injected into the space formed by a fixed mold and a movable mold to obtain a molded product. At this time, the movable mold is fixed to withstand high injection pressure. It is pressed firmly by the mold and a strong surface pressure is applied to the mating surface of the fixed mold and the movable mold. When foreign matter adheres to the mating surface of the mold when the mold is opened, if the mold is clamped as it is, a strong mold clamping force concentrates on one point where the foreign matter is caught and damages the mating surface of the mold. Therefore, the mold is closed, that is, the position of the movable mold is detected while the mating surfaces of the fixed mold and the movable mold are closed without applying the mold clamping force, and it is detected whether or not the mating surfaces of the mold are exactly closed. A die protection means is adopted.
この場合における可動プラテンの位置は、第２図に示す
ように、可動プラテン６と支持プラテン４との位置関係
をリミットスイッチやエンコーダ10などで検出する構造
が採用される。可動プラテン６の位置を支持プラテン４
との関係で検出しているのは、金型12、13の厚さが変わ
った場合にも一定のストロークで可動プラテン６の位置
を検出できるようにするためである。For the position of the movable platen in this case, as shown in FIG. 2, a structure is employed in which the positional relationship between the movable platen 6 and the support platen 4 is detected by a limit switch, an encoder 10, or the like. Supports the position of the movable platen 6
The reason for this is that the position of the movable platen 6 can be detected with a constant stroke even when the thickness of the molds 12, 13 changes.
そして従来は型閉じ時の可動プラテン６の位置が初期位
置よりある限界値以上変化したときに金型12、13の合わ
せ面14に異物がかみ込んだと判断し、型締め動作を中止
して金型を開き、警報を発するようにしている。Then, conventionally, when the position of the movable platen 6 at the time of mold closing changed from the initial position by a certain limit value or more, it was determined that a foreign matter was caught in the mating surface 14 of the molds 12 and 13, and the mold clamping operation was stopped. The mold is opened and an alarm is issued.
《発明が解決しようとする課題》 ところが射出成形では、成形作業に伴って金型12、13お
よびプラテン３、６の温度が上昇し、これらの部材の熱
膨張によって、型閉じ時における可動プラテン６の位置
が初期値からずれてくる。上述した従来の装置では、金
型の合わせ面がぴったりと閉じたかどうかを判定する判
定データの中に、この熱膨張による誤差が入り込んでく
ることになる。そこでこれを避けるために、金型12、13
やプラテン３、６をプレヒートしてから、可動プラテン
６の初期位置の設定を行うという方法が採用されてい
る。<< Problems to be Solved by the Invention >> However, in injection molding, the temperatures of the molds 12 and 13 and the platens 3 and 6 rise along with the molding work, and the thermal expansion of these members causes the movable platen 6 to close when the mold is closed. The position of shifts from the initial value. In the above-described conventional apparatus, the error due to the thermal expansion is included in the determination data for determining whether the mating surface of the mold is exactly closed. So to avoid this, molds 12, 13
Also, a method of preheating the platens 3 and 6 and then setting the initial position of the movable platen 6 is adopted.
しかしながらそのような方法を採用しても、周囲温度の
変化、成形条件の変化、温度条件の変化等により経時的
な誤差が入り込み、現実的な金型12、13の合わせ面の位
置検出精度はせいぜい0.15〜0.3mmが限界であり、それ
以上の精度で金型の合わせ面の当接状態を検出しようと
すると、誤検出によって成形作業が度々中断されるとい
う問題があった。However, even if such a method is adopted, a temporal error is introduced due to a change in ambient temperature, a change in molding conditions, a change in temperature conditions, etc., and the position detection accuracy of the mating surfaces of the molds 12 and 13 is not realistic. The limit is at most 0.15 to 0.3 mm, and if it is attempted to detect the contact state of the mating surface of the mold with accuracy higher than that, there is a problem that the molding operation is frequently interrupted due to erroneous detection.
この発明は、以上の問題を解決し、金型12、13の合わせ
面の当接状態をより高い精度で検出することができる金
型保護装置を得ることを課題としている。An object of the present invention is to solve the above problems and to obtain a mold protection device capable of detecting the contact state of the mating surfaces of the molds 12 and 13 with higher accuracy.
《課題を解決するための手段》 この発明の装置では、ある成形サイクルにおける型閉じ
時の可動プラテン６の位置を正常に成形動作が行われた
前回の成形サイクルにおける型閉じ時の可動プラテンの
位置と比較することによって金型12、13の合わせ面14の
当接状態を検出するようにしている。ここで言う前回の
成形サイクルは、必ずしも直前の回の成形サイクルを意
味するものではなく、２回前あるいは３回前など、時間
的に近接した成形サイクルのものであればよい。<< Means for Solving the Problem >> In the apparatus of the present invention, the position of the movable platen 6 at the time of mold closing in a certain molding cycle is set to the position of the movable platen at the mold closing in the previous molding cycle in which the normal molding operation was performed. The contact state of the mating surfaces 14 of the molds 12 and 13 is detected by comparing with. The previous molding cycle referred to here does not necessarily mean the molding cycle of the immediately preceding cycle, and may be a molding cycle that is close in time, such as two times before or three times before.
この発明の装置は、可動プラテン６の位置を検出する位
置検出手段21と前回の成形サイクルにおける型閉じ時の
位置情報を記憶する記憶手段22と、型閉じ時における可
動プラテンの位置の差の許容限界値を設定する限界値設
定手段25とを備え、さらに現在の成形サイクルにおける
型閉じ時の可動プラテン６の位置と上記記憶手段22に記
憶された位置との差を演算する演算手段及びその演算結
果と設定された許容限界値とを比較する比較手段を備え
ている。上記演算手段及び比較手段は、現実にはマイク
ロコンピュータのCPU27によって構成される。The apparatus of the present invention includes a position detection means 21 for detecting the position of the movable platen 6, a storage means 22 for storing position information at the time of mold closing in the previous molding cycle, and an allowance for a difference in position of the movable platen at mold closing. A limit value setting means 25 for setting a limit value is further provided, and a calculating means for calculating the difference between the position of the movable platen 6 at the time of mold closing in the current molding cycle and the position stored in the storage means 22 and the calculation thereof. Comparing means for comparing the result with the set allowable limit value is provided. The calculation means and the comparison means are actually configured by the CPU 27 of the microcomputer.
そして型閉じ時に検出された可動プラテン６の位置と上
記記憶手段22に記憶された値との差が限界値設定手段25
に設定された限界値以内になったときにのみ型締め動作
が行われるようにする。ここで型閉じ動作とは、型締め
力を作用させることなく固定金型12と可動金型13の合わ
せ面を当接させる動作であり、型締め動作とは、可動金
型13を固定金型12に強固に押圧する動作である。The difference between the position of the movable platen 6 detected when the mold is closed and the value stored in the storage means 22 is the limit value setting means 25.
The mold clamping operation is performed only when the limit value set in is reached. Here, the mold closing operation is an operation of bringing the mating surfaces of the fixed mold 12 and the movable mold 13 into contact with each other without applying a mold clamping force. It is an operation to press firmly to 12.
可動金型13を駆動する型締め装置７は、直圧式、トグル
式、機械ロック直圧式などの種々のものがあるが、この
発明の装置は、型締め装置の種類に関わりなく採用が可
能である。There are various types of mold clamping devices 7 for driving the movable mold 13, such as direct pressure type, toggle type, and mechanical lock direct pressure type. The device of the present invention can be adopted regardless of the type of the mold clamping device. is there.
上述のような現在の成形サイクルと前回の成形サイクル
との可動プラテン６の型閉じ時の位置の増分量に基づく
金型合わせ面の状態検出と共に、従来と同様に可動プラ
テン６の型閉じ時の位置の初期値からの絶対値の偏差が
ある限界値を越えたときにも型締めを行わないようにす
ることができる。さらに各回の成形サイクルにおける上
記増分値を累積して記憶し、その累積値がある限界値を
越えたときにも型締め動作を行わないようにして、絶対
値と増分値の両面から金型の保護を行うことも可能であ
る。As described above, the state of the mold mating surface is detected based on the incremental amount of the position of the movable platen 6 when the mold is closed between the current molding cycle and the previous molding cycle. It is possible not to perform mold clamping even when the deviation of the absolute value from the initial value of the position exceeds a certain limit value. Furthermore, the above-mentioned increment values in each molding cycle are accumulated and stored, and even when the accumulated value exceeds a certain limit value, the mold clamping operation is not performed, and the absolute value and the increment value are used to determine the mold value. It is also possible to provide protection.
《作用》 以上のように、可動プラテン６の型閉じ時の位置を前回
の成形サイクルにおける型閉じ時の位置と比較してやれ
ば、金型12、13の温度変化などの緩やかな条件変化に対
する可動プラテン６の位置変動をキャンセルすることが
でき、この増分値と比較する限界値の値を従来の絶対値
と比較する限界値の値よりほぼ一桁小さくすることがで
きる。<Operation> As described above, if the position of the movable platen 6 when the mold is closed is compared with the position when the mold is closed in the previous molding cycle, the movable platen 6 with respect to the gradual condition change such as the temperature change of the molds 12 and 13 is compared. The position fluctuation of 6 can be canceled, and the value of the limit value to be compared with this increment value can be made smaller by one digit than the value of the limit value to be compared with the conventional absolute value.
また本発明では、可動プラテンの位置検出手段21と、型
閉じ時の可動プラテンの位置情報を記憶する記憶手段22
と、２回の成形サイクルの間での型閉じ時の可動プラテ
ンの位置の差の限界値を設定する増分限界値設定手段25
と、現在の可動プラテンの位置と記憶手段22の内容との
差を演算してその演算結果を限界値と比較する演算およ
び比較手段27とを備えることにより、初期値と現在値と
の差は演算判定して指令されることとなる。つまり第１
回目の可動プラテンの位置を記憶手段によって記憶し、
第２回目以降の可動プラテンの位置を記憶し、かつ第１
回目と第２回目、第２回目と第３回目・・・の位置の差
の増分限界値設定手段によって、前回の差と増分限界値
とを比較しているので、当初の基準値は０ではない。従
って絶対限界値設定手段と、増分限界値設定手段とによ
って得られる基準値と許容値とは差が狭く、成形サイク
ルの当初から精度の高い位置検出ができるという大きな
特徴を有している。In the present invention, the movable platen position detection means 21 and the storage means 22 for storing the position information of the movable platen when the mold is closed.
And an incremental limit value setting means 25 for setting a limit value of the difference in the position of the movable platen when the mold is closed between the two molding cycles.
And the comparison means 27 for calculating the difference between the current position of the movable platen and the contents of the storage means 22 and comparing the calculation result with a limit value, the difference between the initial value and the current value is It will be instructed by the calculation. That is, the first
The position of the movable platen for the second time is stored by the storage means,
The position of the movable platen after the second time is memorized, and the first
Since the increment limit value setting means for the difference between the positions of the second time and the second time, the second time and the third time ... Compares the previous difference and the increment limit value, the initial reference value is 0. Absent. Therefore, the difference between the reference value and the allowable value obtained by the absolute limit value setting means and the incremental limit value setting means is narrow, and it has a great feature that the position can be detected with high accuracy from the beginning of the molding cycle.
《実施例》 第１図ないし第３図は、この発明の一実施例を示した図
である。第２図は射出成形機を模式的に示す側面図で、
１はベッド、２は射出ユニット、３はベッド１に固定さ
れた固定プラテン、４はベッド１上で固定プラテン３に
接近離隔する方向に摺動自在に装着された支持プラテ
ン、５は固定プラテン３と支持プラテン４との間に装架
されたタイバー、６はタイバー５に沿って摺動する可動
プラテン、７は支持プラテン４と可動プラテン６との間
に介装される型締め装置、８は支持プラテン４に固定さ
れた検出器フレーム、９は検出器フレーム８に回転自在
に支持されたピニオン、10はピニオン９と実質上一体の
ロータリーエンコーダ、11は可動プラテン６に固定され
てピニオン９に噛合しているラック、12は固定プラテン
３に固定された固定金型、13は可動プラテン６に固定さ
れた可動金型、14は固定金型12と可動金型13の合わせ面
である。<< Embodiment >> FIGS. 1 to 3 are views showing an embodiment of the present invention. FIG. 2 is a side view schematically showing the injection molding machine,
Reference numeral 1 is a bed, 2 is an injection unit, 3 is a fixed platen fixed to the bed 1, 4 is a support platen slidably mounted on the bed 1 in a direction toward and away from the fixed platen 3, and 5 is a fixed platen 3. A tie bar mounted between the support platen 4 and the support platen 4, a movable platen 6 sliding along the tie bar 5, a mold clamping device 7 interposed between the support platen 4 and the movable platen 6, and 8 A detector frame fixed to the support platen 4, 9 is a pinion rotatably supported by the detector frame 8, 10 is a rotary encoder substantially integrated with the pinion 9, and 11 is a pinion 9 fixed to the movable platen 6. The rack is meshed with, 12 is a fixed mold fixed to the fixed platen 3, 13 is a movable mold fixed to the movable platen 6, and 14 is a mating surface of the fixed mold 12 and the movable mold 13.
ロータリーエンコーダ10はアブソリュートエンコーダお
よびパルスエンコーダのいずれも採用が可能である。ロ
ータリーエンコーダ10に代えてリニアエンコーダを用い
て支持プラテン４と可動プラテン６の位置関係を検出す
ることももちろん可能である。The rotary encoder 10 can be either an absolute encoder or a pulse encoder. It is of course possible to detect the positional relationship between the support platen 4 and the movable platen 6 using a linear encoder instead of the rotary encoder 10.
第１図はこの発明の一実施例のプロック図で、プラテン
位置検出手段21は、前記ロータリーエンコーダ10と図示
しないカウンタによって形成され、可動プラテン６の位
置を検出している。前回値メモリ22、累積値メモリ23、
絶対限界値設定器24、増分限界値設定器25および累積限
界値設定器26は電子的なメモリによって構成される。比
較手段、演算手段及びメモリ値変換手段は、マイクロコ
ンピュータのCPU27によって構成される。FIG. 1 is a block diagram of an embodiment of the present invention. The platen position detecting means 21 is formed by the rotary encoder 10 and a counter (not shown), and detects the position of the movable platen 6. Previous value memory 22, cumulative value memory 23,
The absolute limit value setter 24, the incremental limit value setter 25 and the cumulative limit value setter 26 are constituted by electronic memories. The comparing means, the calculating means, and the memory value converting means are configured by the CPU 27 of the microcomputer.
第３図はCPU27の処理手順を示したフローチャートであ
る。図中δ１は絶対限界値設定器24に設定された値であ
り、0.15〜0.3mmのオーダである。δ２は増分限界値設
定器25に設定された値であり、0.02mm程度のオーダであ
る。δ３は累積限界値設定器26に設定された値であり、
上記δ１とほぼ等しいオーダの値である。FIG. 3 is a flow chart showing the processing procedure of the CPU 27. In the figure, δ 1 is a value set in the absolute limit value setting device 24 and is on the order of 0.15 to 0.3 mm. δ 2 is a value set in the increment limit value setting device 25, and is on the order of 0.02 mm. δ 3 is a value set in the cumulative limit value setting device 26,
The value is on the order of approximately equal to δ 1 .
型締め装置７に型閉じが指令された状態において、プラ
テン位置検出手段21から検出された現在値が許容絶対値
δ１より小さければ、前回値メモリ22から前回値を読み
込んで現在値と前回値の差を演算し、その差が許容増分
値δ２より大きいか小さいかを調べる。これが許容増分
値δ２より小さければ、累積値メモリ23から累積値を読
み込み、これに上記現在値と前回値の差を加算したもの
が許容累積値δ３より大きいか小さいかを判定する。こ
れらの全ての値が許容値δ１、δ２及びδ３以下であれ
ば、型閉じが正規に完了したと判断し、可動プラテン位
置の現在値から前回値メモリ22の内容を引いたものを累
積値メモリ23の内容に加算し、現在値を前回値メモリ22
の内容とする。そして型締め動作に移行し、可動プラテ
ン６と固定プラテン３を強固に締結する。When the mold closing device 7 is instructed to close the mold and the current value detected by the platen position detection means 21 is smaller than the allowable absolute value δ 1 , the previous value is read from the previous value memory 22 and the current value and the previous value are read. Is calculated, and it is checked whether the difference is larger or smaller than the allowable increment value δ 2 . If this is smaller than the allowable increment value δ 2 , the cumulative value is read from the cumulative value memory 23, and it is determined whether the value obtained by adding the difference between the present value and the previous value is larger or smaller than the allowable cumulative value δ 3 . If all of these values are equal to or less than the allowable values δ 1 , δ 2, and δ 3, it is determined that the mold closing has been completed normally, and the value obtained by subtracting the contents of the previous value memory 22 from the current value of the movable platen position is determined. The current value is added to the contents of the accumulated value memory 23 and the current value 22
And the contents. Then, the mold clamping operation is performed, and the movable platen 6 and the fixed platen 3 are firmly fastened.
もし検出された可動プラテン６の位置が上記の許容値δ
１、δ２及びδ３のいずれかを満足しなかったときは、
型閉じ動作が指令されてからの時間を計時しているタイ
マがタイムアップしているかどうかを調べ、もしタイム
アップしていなければ、前述した判定動作を繰り返す。
もしこのときタイマがタイムアップしていれば、何らか
の原因によって固定金型12と可動金型13の合わせ面14が
完全に当接していないことを意味するので、警報を発し
型を開いて成形作業を中断する。If the detected position of the movable platen 6 is the above allowable value δ,
When any of 1 , δ 2 and δ 3 is not satisfied,
It is checked whether or not the timer, which measures the time after the mold closing operation is commanded, has timed out. If not, the above-mentioned determination operation is repeated.
If the timer times out at this time, it means that the mating surfaces 14 of the fixed mold 12 and the movable mold 13 are not completely in contact with each other for some reason. To suspend.
《発明の効果》 以上説明したこの発明の装置によれば、型閉じ時におけ
る金型の合わせ面の当接状態を従来よりはるかに高い精
度で検出することが可能となり、従来検出できなかった
微細な異物のかみ込みも確実に検出することができるか
ら、より微細な瑕からも金型を保護できるという効果が
ある。<Effects of the Invention> According to the apparatus of the present invention described above, it is possible to detect the contact state of the mating surface of the mold at the time of mold closing with a much higher accuracy than before, and it is possible to detect a minute amount that could not be detected conventionally. Since it is possible to reliably detect even the presence of foreign matter, it is possible to protect the die from finer flaws.
第１図ないし第３図はこの発明の一実施例を示した図
で、第１図は装置の構成を示すブロック図、第２図は射
出成形機を模式的に示した側面図、第３図は制御手順を
示すフローチャートである。 図中、 6:可動プラテン、7:型締め装置 10:エンコーダ、12,13……金型 14:金型の合わせ面、27:CPU1 to 3 are views showing an embodiment of the present invention, FIG. 1 is a block diagram showing the constitution of the apparatus, FIG. 2 is a side view schematically showing an injection molding machine, and FIG. The figure is a flow chart showing the control procedure. In the figure, 6: Movable platen, 7: Mold clamping device 10: Encoder, 12, 13 …… Mold 14: Mold mating surface, 27: CPU
Claims (3)
と、前回の成形サイクルにおける型閉じ時の可動プラテ
ンの位置情報を記憶する記憶手段（22）と、２回の成形
サイクルの間での型閉じ時の可動プラテンの位置の差の
限界値を設定する増分限界値設定手段（25）と、現在の
成形サイクルにおける型閉じ時の可動プラテンの位置と
前記記憶手段（22）に記憶された位置との差を演算して
その演算結果を上記限界値と比較する演算及び比較手段
（27）とを備え、上記演算結果が上記限界値を越えてい
ないことを条件として型締め動作を行うことを特徴とす
る、金型保護装置。1. A position detecting means (21) for a movable platen (6).
And a storage means (22) for storing the position information of the movable platen when the mold is closed in the previous molding cycle, and the limit value of the difference between the positions of the movable platen when the mold is closed between the two molding cycles. And the difference between the position of the movable platen when the mold is closed in the current molding cycle and the position stored in the storage unit (22), and the calculation result is the above-mentioned limit value. And a comparing means (27) for performing a mold clamping operation, the mold clamping operation being performed on condition that the calculation result does not exceed the limit value.
ン（６）の型閉じ時の位置の初期値と現在値との差を検
出可能で、上記初期値と現在値との差の限界値を設定す
る絶対限界値設定手段（24）を備え、現在の成形サイク
ルにおける型閉じ時の可動プラテン（６）の位置とその
初期位置との差が上記限界値を越えていないことを条件
として型締め動作を行うことを特徴とする、請求項１記
載の金型保護装置。2. The position detecting means (21) according to the preceding paragraph is capable of detecting the difference between the initial value and the current value of the position of the movable platen (6) when the mold is closed, and detects the difference between the initial value and the current value. An absolute limit value setting means (24) for setting a limit value is provided, and it is required that the difference between the position of the movable platen (6) and the initial position when the mold is closed in the current molding cycle does not exceed the above limit value. The mold protector according to claim 1, wherein the mold clamping operation is performed as.
形サイクルにおける位置と前回の成形サイクルにおける
位置の差の累積値を記憶する累積値記憶手段（23）と、
上記累積値の限界値を設定する累積限界値設定手段（2
6）とを備え、上記累積値が上記限界値を越えていない
ことを条件として型締め動作を行うことを特徴とする、
請求項１又は２記載の金型保護装置。3. A cumulative value storage means (23) for storing a cumulative value of a difference between a position of a movable platen (6) at the time of mold closing in a current molding cycle and a position in a previous molding cycle.
Cumulative limit value setting means (2
6) is provided, and the mold clamping operation is performed on condition that the cumulative value does not exceed the limit value.
The mold protection device according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074676A JPH07121529B2 (en) | 1990-03-23 | 1990-03-23 | Mold protector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074676A JPH07121529B2 (en) | 1990-03-23 | 1990-03-23 | Mold protector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03274112A JPH03274112A (en) | 1991-12-05 |
| JPH07121529B2 true JPH07121529B2 (en) | 1995-12-25 |
Family
ID=13554073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2074676A Expired - Fee Related JPH07121529B2 (en) | 1990-03-23 | 1990-03-23 | Mold protector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07121529B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6158718B2 (en) * | 2014-01-17 | 2017-07-05 | 株式会社ソディック | Automatic mold protection setting value calculation method for injection molding machines |
| WO2024089851A1 (en) * | 2022-10-27 | 2024-05-02 | ファナック株式会社 | Determination device and determination method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716780B2 (en) * | 1985-05-27 | 1995-03-01 | 東芝機械株式会社 | Automatic mold clamping force adjuster with foreign material detection function between molds |
-
1990
- 1990-03-23 JP JP2074676A patent/JPH07121529B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03274112A (en) | 1991-12-05 |
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