JPH07106294A - Liquid circulation treatment equipment - Google Patents
Liquid circulation treatment equipmentInfo
- Publication number
- JPH07106294A JPH07106294A JP25302993A JP25302993A JPH07106294A JP H07106294 A JPH07106294 A JP H07106294A JP 25302993 A JP25302993 A JP 25302993A JP 25302993 A JP25302993 A JP 25302993A JP H07106294 A JPH07106294 A JP H07106294A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- liquid
- bubbles
- supply nozzle
- bubble removing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液体を循環させて電子
部品をメッキ、洗浄等を行う技術に関し、特に噴流メッ
キに適用して有効な技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for circulating a liquid to plate and clean electronic parts, and more particularly to a technique effective when applied to jet plating.
【０００２】[0002]
【従来の技術】液体を循環させて電子部品をメッキ、洗
浄等を行う従来の液体循環処理装置の一例として、噴流
メッキ装置が挙げられる。2. Description of the Related Art A jet plating apparatus is an example of a conventional liquid circulation processing apparatus that circulates a liquid to plate and clean electronic components.
【０００３】その噴流メッキ装置を図２に示す。図２に
おける１はメッキ対象の電子部品（ウエーハ）、２はメ
ッキ処理槽、２Ａは外槽、３は気泡除去槽、４は薬液、
５は薬液フィルタ、６は循環ポンプである。The jet plating apparatus is shown in FIG. In FIG. 2, 1 is an electronic component (wafer) to be plated, 2 is a plating treatment tank, 2A is an outer tank, 3 is a bubble removing tank, 4 is a chemical solution,
Reference numeral 5 is a chemical liquid filter, and 6 is a circulation pump.
【０００４】従来の噴流メッキ装置は、図２に示すよう
に、メッキ処理槽２で薬液４を噴流させてウエーハ１に
メッキを行い、噴流後の薬液を外槽２Ａを経由して循環
ポンプ６でメッキ処理槽２に戻し、薬液を循環させるも
のであった。In the conventional jet plating apparatus, as shown in FIG. 2, a chemical solution 4 is jetted in a plating tank 2 to plate a wafer 1 and the jetted chemical solution is circulated through an outer tank 2A and a circulation pump 6 Then, it was returned to the plating treatment tank 2 and the chemical solution was circulated.
【０００５】更に、この噴流メッキ時に用いられる薬液
には、循環中に薬液中の異物を取り除くフィルタ５や、
メッキ処理槽２から外槽２Ａへオーバーフローし、落下
すること等により気泡が混入するため、フィルタ５の後
に気泡除去槽３を設け、気泡の浮力を利用し、気泡のみ
を気泡除去槽３の上部に逃がして、気泡のない薬液をメ
ッキ処理槽２に戻すようにしていた。Further, the chemical solution used in the jet plating includes a filter 5 for removing foreign matters in the chemical solution during circulation,
Since air bubbles are mixed from the plating tank 2 to the outer tank 2A and dropped and the like, a bubble removing tank 3 is provided after the filter 5 and only the bubbles are placed above the bubble removing tank 3 by utilizing the buoyancy of the bubbles. The chemical liquid having no bubbles was returned to the plating treatment tank 2.
【０００６】[0006]
【発明が解決しようとする課題】本発明者は、上記従来
技術を検討した結果、以下のような問題を見いだした。DISCLOSURE OF THE INVENTION The present inventors have found the following problems as a result of examining the above prior art.
【０００７】従来の液体循環処理装置における気泡除去
槽では、循環する液体中に混入した気泡が大きい場合
は、気泡を気泡除去槽の上部へ逃がすことができるが、
気泡が小さい場合は、逃がすことができず、そのまま処
理槽に送られてしまい、その気泡が液体と混入して電子
部品に噴出され、電子部品への液体の接触を妨げるとい
う問題があった。In the bubble removing tank in the conventional liquid circulation processing apparatus, when the bubbles mixed in the circulating liquid are large, the bubbles can be escaped to the upper part of the bubble removing tank.
When the bubbles are small, they cannot be escaped and are sent to the processing tank as they are, and the bubbles are mixed with the liquid and ejected to the electronic component, which impedes the contact of the liquid with the electronic component.
【０００８】また、粘性がある液体を使用する場合は、
液体に混入した比較的大きい気泡でも気泡除去槽の上部
へ逃がすことができないという問題があった。When a viscous liquid is used,
There is a problem that even relatively large bubbles mixed in the liquid cannot escape to the upper part of the bubble removal tank.
【０００９】本発明の目的は、液体循環処理装置におい
て、液体に混入する微小な気泡まで除去することが可能
な技術を提供することにある。It is an object of the present invention to provide a technique capable of removing even minute bubbles mixed in a liquid in a liquid circulation treatment device.
【００１０】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述及び添付図面によって明らか
になるであろう。The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
【００１１】[0011]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
下記のとおりである。Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.
【００１２】液体を循環させて電子部品をメッキ、洗浄
等を行う処理槽と循環ポンプとフィルタとを配管で繋い
だ液体循環処理装置において、前記フィルタと処理槽の
間に、エア抜きバルブと供給ノズルと吐出口を有する密
封された容器からなる気泡除去槽を繋げ、前記エア抜き
バルブは、気泡除去槽の天井部分に設け、前記吐出口
は、気泡除去槽の底部分に設け、前記供給ノズルは、循
環する液体が気泡除去槽の上部方向に噴き上がるような
形状にし、その供給ノズルの噴き出し口は、吐出口から
所定の距離を隔てた所に設ける。In a liquid circulation processing apparatus in which a liquid is circulated to plate and clean electronic parts, a circulation pump and a filter are connected by piping, an air bleed valve and a supply are provided between the filter and the processing tank. A bubble removing tank consisting of a sealed container having a nozzle and a discharge port is connected, the air bleeding valve is provided in a ceiling portion of the bubble removing tank, and the discharge port is provided in a bottom portion of the bubble removing tank. Has a shape such that the circulating liquid is jetted upward in the bubble removing tank, and the jet outlet of the supply nozzle is provided at a position separated from the discharge port by a predetermined distance.
【００１３】また、前記気泡除去槽の容器の一部または
全部を透明または半透明な樹脂にする。Further, a part or the whole of the container of the bubble removing tank is made of transparent or translucent resin.
【００１４】[0014]
【作用】上述した手段によれば、液体を循環させて電子
部品をメッキ、洗浄等を行う処理槽と循環ポンプとフィ
ルタとを配管で繋いだ液体循環処理装置において、前記
フィルタと処理槽の間に、エア抜きバルブと供給ノズル
と吐出口を有する密封された容器からなる気泡除去槽を
繋げ、前記エア抜きバルブは、気泡除去槽の天井部分に
設け、前記吐出口は、気泡除去槽の底部分に設け、前記
供給ノズルは、循環する液体が気泡除去槽の上部方向に
噴き上がるような形状にし、その供給ノズルの噴き出し
口は、吐出口から所定の距離を隔てた所に設けることに
より、供給ノズルの噴き出し口から出た気泡が混入した
液体が気泡除去槽内を対流して吐出口に送られるので、
気泡が浮力により気泡除去槽の上部方向に逃げることが
できる十分な時間を確保でき、処理槽に送られる液体に
混入する微小な気泡まで除去することが可能になる。According to the above-mentioned means, in the liquid circulation processing apparatus in which the processing tank for circulating the liquid to perform plating and cleaning of electronic parts, the circulation pump and the filter are connected by the pipe, between the filter and the processing tank. The air removal valve, the supply nozzle, and a bubble removal tank consisting of a sealed container having a discharge port are connected to each other, the air removal valve is provided in a ceiling portion of the bubble removal tank, and the discharge port is a bottom of the bubble removal tank. Provided in a portion, the supply nozzle is shaped such that the circulating liquid is jetted upward in the bubble removing tank, and the jet outlet of the feed nozzle is provided at a position separated from the discharge port by a predetermined distance. Since the liquid mixed with the bubbles emitted from the outlet of the supply nozzle is convected in the bubble removal tank and sent to the outlet,
It is possible to secure a sufficient time for bubbles to escape to the upper part of the bubble removal tank due to buoyancy, and it is possible to remove even minute bubbles mixed in the liquid sent to the processing tank.
【００１５】以下、本発明の構成について、実施例とと
もに説明する。The structure of the present invention will be described below together with embodiments.
【００１６】なお、実施例を説明するための全図におい
て、同一機能を有するものは同一符号を付け、その繰り
返しの説明は省略する。In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.
【００１７】[0017]
【実施例】本発明による実施例の液体循環処理装置につ
いて図を用いて詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A liquid circulation processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
【００１８】図１は、本発明の一実施例のウエーハの噴
流メッキ処理装置の構成を示したものである。図１にお
いて、１はウエーハ、２はメッキ処理槽、２Ａは外槽、
３は気泡除去槽、４は薬液（銀メッキ液）、５は薬液フ
ィルタ、６は循環ポンプ（マグネットポンプ）、７はエ
ア溜め、８はエア抜きバルブ、９はＪ型供給ノズル、１
０は吐出口である。FIG. 1 shows the construction of a jet plating apparatus for wafers according to an embodiment of the present invention. In FIG. 1, 1 is a wafer, 2 is a plating tank, 2A is an outer tank,
3 is a bubble removing tank, 4 is a chemical solution (silver plating solution), 5 is a chemical solution filter, 6 is a circulation pump (magnet pump), 7 is an air reservoir, 8 is an air vent valve, 9 is a J-type supply nozzle, 1
Reference numeral 0 is a discharge port.
【００１９】上述の気泡除去槽３は、密封された透明な
樹脂からなり、エア溜め７、エア抜きバルブ８、Ｊ型供
給ノズル９、吐出口１０を有し、中には薬液４が入って
いる。The above-mentioned bubble removing tank 3 is made of a transparent and sealed resin and has an air reservoir 7, an air bleeding valve 8, a J-shaped supply nozzle 9 and a discharge port 10 in which the chemical solution 4 is contained. There is.
【００２０】そして、その全体の高さは４５０ｍｍであ
り、Ｊ型供給ノズル９の噴き出し口は気泡除去槽３の底
から１５０ｍｍの高さにある。The overall height is 450 mm, and the ejection port of the J-type supply nozzle 9 is 150 mm above the bottom of the bubble removing tank 3.
【００２１】また、気泡除去槽３を透明にすることによ
り、薬液４の量を容易に確認できる。Further, by making the bubble removing tank 3 transparent, the amount of the chemical liquid 4 can be easily confirmed.
【００２２】なお、本実施例の気泡除去槽３は直方体で
あるが、立方体や球面体でもよく、透明でなくても薬液
の量を知る手段、例えば、液面センサや液面確認用チュ
ーブを設ければよい。Although the bubble removing tank 3 of this embodiment is a rectangular parallelepiped, it may be a cube or a spherical body, and a means for knowing the amount of the chemical liquid even if it is not transparent, such as a liquid level sensor or a liquid level confirmation tube, is used. It should be provided.
【００２３】更に、供給ノズルもＪ型であるが、循環す
る液体が気泡除去槽の上部方向に噴き上がるような形状
に構成され、その供給ノズルの噴き出し口は、吐出口か
ら所定の距離を隔てた所に設けれる形であればよい。Further, although the supply nozzle is also J-shaped, it is constructed so that the circulating liquid squirts upward in the bubble removing tank, and the spout of the supply nozzle is separated from the discharge port by a predetermined distance. Any form can be used as long as it is provided in a different place.
【００２４】そして、その供給ノズルの噴き出し口の高
さは、気泡除去槽内の天井部分での気泡の跳ね返りを考
慮に入れると、気泡除去槽の高さの１／３程度の位置に
設けるのが好ましく、供給ノズルの噴き出し口から吐出
口までの距離は、できるだけ離れていることが好まし
い。The height of the ejection port of the supply nozzle is set at a position of about 1/3 of the height of the bubble removing tank in consideration of the bounce of the bubbles in the ceiling portion of the bubble removing tank. It is preferable that the distance from the ejection port of the supply nozzle to the ejection port is as large as possible.
【００２５】次に、本実施例のメッキ処理装置の動作に
ついて説明する。Next, the operation of the plating apparatus of this embodiment will be described.
【００２６】まず、本実施例のメッキ処理装置における
薬液４の循環経路は、図１に示すように、ウエーハ１に
噴流させた薬液４が、処理槽２から外槽２Ａに流れ落
ち、外槽２Ａを経て循環ポンプ（マグネットポンプ）６
によりフィルタ５に送られ、ゴミなどの異物をを取り除
き、その後、Ｊ型供給ノズル９を経て気泡除去槽３に送
られ、気泡除去槽３の吐出口から処理槽２に送られ、再
びウエーハ１に噴流させることからなる。このとき、前
述の薬液４が処理槽２から外槽２Ａに流れ落ちる際に、
気泡が混入し、その気泡が混入した薬液４がマグネット
ポンプ６、フィルタ５を経て気泡除去槽３に送られる。First, as shown in FIG. 1, the circulation path of the chemical liquid 4 in the plating apparatus of the present embodiment is such that the chemical liquid 4 jetted onto the wafer 1 flows down from the processing tank 2 to the outer tank 2A, and the outer tank 2A. Circulation pump (magnet pump) 6
Is sent to the filter 5 to remove foreign matters such as dust, then sent to the bubble removing tank 3 through the J-type supply nozzle 9, sent from the discharge port of the bubble removing tank 3 to the processing tank 2, and again to the wafer 1 It consists of making a jet. At this time, when the chemical solution 4 flows down from the processing tank 2 to the outer tank 2A,
Bubbles are mixed in, and the chemical liquid 4 in which the bubbles are mixed is sent to the bubble removal tank 3 through the magnet pump 6 and the filter 5.
【００２７】気泡除去槽３に送られた薬液４は、Ｊ型供
給ノズル９の噴き出し口から気泡除去槽３の上部方向に
噴出され、薬液４中の気泡は浮力により気泡除去槽３の
天井部分に設けたエア溜め７に溜まり、気泡が除去され
た薬液のみが吐出口１０に送られる。なお、エア溜め７
に溜まったエアは、エア抜きバルブで抜く。The chemical solution 4 sent to the bubble removing tank 3 is ejected from the ejection port of the J-type supply nozzle 9 toward the upper part of the bubble removing tank 3, and the bubbles in the chemical solution 4 are buoyant to the ceiling portion of the bubble removing tank 3. Only the chemical liquid that has accumulated in the air reservoir 7 provided in the above and the bubbles have been removed is sent to the discharge port 10. The air reservoir 7
The air that has accumulated in is removed by the air release valve.
【００２８】そして、気泡が除去された薬液を吐出口１
０を経て処理槽２に送り、メッキ処理を行う。Then, the chemical liquid from which the air bubbles have been removed is discharged from the discharge port 1.
After passing 0, it is sent to the processing tank 2 to perform a plating process.
【００２９】このように、気泡除去槽３に送られてくる
気泡を含んだ薬液４は、Ｊ型供給ノズル９を経て、対流
させて吐出口に送られるので、気泡が浮力により気泡除
去槽の上部方向に逃げることができる十分な時間を気泡
除去槽内で確保でき、薬液４に混入する微小な気泡まで
除去することができる。In this way, the chemical liquid 4 containing bubbles sent to the bubble removing tank 3 is sent to the discharge port by convection through the J-shaped supply nozzle 9, so that the bubbles are buoyant in the bubble removing tank. Sufficient time to escape to the upper direction can be secured in the bubble removal tank, and even minute bubbles mixed in the chemical liquid 4 can be removed.
【００３０】また、気泡除去槽３にて薬液を対流させる
ことにより、薬液は撹拌され、活性化が常に行われる。
これにより、薬品の長寿命化が可能となる。Further, by causing convection of the chemical liquid in the bubble removing tank 3, the chemical liquid is stirred and activated at all times.
As a result, the life of the chemical can be extended.
【００３１】更に、本実施例では、薬液を循環させる循
環ポンプとして、マグネットポンプを用いたが、マグネ
ットポンプを用いられず、脈動があるダイアフラムポン
プを用いなければならない薬液、例えば、強酸を使用す
る場合、気泡除去槽３にて薬液を対流させることによ
り、ポンプによる脈動を緩和することができる。Further, in the present embodiment, the magnet pump was used as the circulation pump for circulating the chemical solution, but a chemical solution, for example, a strong acid, which does not use the magnet pump but requires a pulsating diaphragm pump is used. In this case, the pulsation due to the pump can be alleviated by convection of the chemical liquid in the bubble removing tank 3.
【００３２】そして、噴流メッキ処理に用いられる薬液
の絶対量を処理槽だけでなく、気泡除去槽に分散して確
保するので、処理槽を小型化できる。Since the absolute amount of the chemical solution used in the jet plating treatment is dispersed and secured not only in the treatment tank but also in the bubble removal tank, the treatment tank can be downsized.
【００３３】以上、本発明者によってなされた発明をメ
ッキ処理装置を実施例に挙げ、それに基づき具体的に説
明したが、本発明は、前記実施例に限定されるものでは
なく、例えば、洗浄装置、エッチング処理装置等にも適
用可能である。The invention made by the present inventor has been described above with reference to a plating apparatus as an embodiment and is specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and for example, a cleaning apparatus. The present invention can also be applied to etching processing equipment and the like.
【００３４】[0034]
【発明の効果】本願において開示される発明のうち代表
的なものによって得られる効果を簡単に説明すれば、下
記のとおりである。The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
【００３５】本発明の液体循環処理装置において、気泡
除去槽に送られてくる気泡を含んだ薬液は、Ｊ型供給ノ
ズルを経て、対流させて吐出口に送られるので、気泡が
浮力により気泡除去槽の上部方向に逃げることができる
十分な時間を気泡除去槽内で確保でき、薬液に混入する
微小な気泡まで除去することが可能となる。In the liquid circulation treatment apparatus of the present invention, since the chemical liquid containing bubbles sent to the bubble removal tank is sent to the discharge port by convection through the J-type supply nozzle, the bubbles are removed by buoyancy. It is possible to secure a sufficient time in the bubble removing tank to allow the bubbles to escape to the upper part of the tank, and it is possible to remove even minute bubbles mixed in the chemical liquid.
【００３６】また、気泡除去槽にて薬液を対流させるこ
とにより、薬液は撹拌され、活性化が常に行われ、薬品
の長寿命化できる。Further, by causing convection of the chemical liquid in the bubble removing tank, the chemical liquid is agitated and always activated, and the life of the chemical can be extended.
【００３７】更に、本実施例では、薬液を循環させる循
環ポンプとして、マグネットポンプを用いたが、マグネ
ットポンプを用いられず、脈動があるダイアフラムポン
プを用いなければならない薬液、例えば、強酸を使用す
る場合、気泡除去槽にて薬液を対流させることにより、
ポンプによる脈動を緩和することができる。Further, in the present embodiment, the magnet pump was used as the circulation pump for circulating the chemical solution, but a chemical solution, for example, a strong acid, which does not use the magnet pump but requires a pulsating diaphragm pump is used. In this case, by convection of the chemical solution in the bubble removal tank,
The pulsation due to the pump can be reduced.
【００３８】そして、気泡除去槽を透明にすることによ
り、薬液の量を容易に確認できる。By making the bubble removing tank transparent, the amount of the chemical solution can be easily confirmed.
【図１】本発明の一実施例であるウエーハの噴流メッキ
処理装置の構成を示した図である。FIG. 1 is a diagram showing a configuration of a jet plating apparatus for a wafer which is an embodiment of the present invention.
【図２】従来のウエーハの噴流メッキ処理装置の構成を
示した図である。FIG. 2 is a view showing a configuration of a conventional wafer jet plating apparatus.
【符号の説明】 １…ウエーハ、２…メッキ処理槽、２Ａ…外槽、３…気
泡除去槽、４…薬液（銀メッキ液）、５…薬液フィル
タ、６…循環ポンプ（マグネットポンプ）、７…エア溜
め、８…エア抜きバルブ、９…Ｊ型供給ノズル、１０…
吐出口。[Explanation of Codes] 1 ... Wafer, 2 ... Plating tank, 2A ... Outer tank, 3 ... Bubble removing tank, 4 ... Chemical solution (silver plating solution), 5 ... Chemical solution filter, 6 ... Circulation pump (magnet pump), 7 ... Air reservoir, 8 ... Air bleeding valve, 9 ... J-type supply nozzle, 10 ...
Outlet.
Claims (2)
浄等を行う処理槽と循環ポンプとフィルタとを配管で繋
いだ液体循環処理装置において、前記フィルタと処理槽
の間に、エア抜きバルブと供給ノズルと吐出口を有する
密封された容器からなる気泡除去槽を配管で繋げ、前記
エア抜きバルブは、気泡除去槽の天井部分に設けられ、
前記吐出口は、気泡除去槽の底部分に設けられ、前記供
給ノズルは、循環する液体が気泡除去槽の上部方向に噴
き上がるような形状に構成され、その供給ノズルの噴き
出し口は、吐出口から所定の距離を隔てた所に設けられ
たことを特徴とする液体循環処理装置。1. A liquid circulation processing apparatus, in which a processing tank for circulating an liquid to plate and clean electronic parts, a circulation pump and a filter are connected by a pipe, and an air vent valve is provided between the filter and the processing tank. And a bubble removing tank consisting of a sealed container having a supply nozzle and a discharge port are connected by a pipe, and the air vent valve is provided in a ceiling portion of the bubble removing tank,
The discharge port is provided in the bottom portion of the bubble removal tank, and the supply nozzle is configured so that the circulating liquid sprays upward in the bubble removal tank, and the discharge port of the supply nozzle is the discharge port. A liquid circulation processing device, characterized in that the liquid circulation processing device is provided at a position separated by a predetermined distance from.
が、透明または半透明な樹脂からなることを特徴とする
請求項１に記載の液体循環処理装置。2. The liquid circulation processing apparatus according to claim 1, wherein a part or all of the container of the bubble removing tank is made of a transparent or translucent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25302993A JPH07106294A (en) | 1993-10-08 | 1993-10-08 | Liquid circulation treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25302993A JPH07106294A (en) | 1993-10-08 | 1993-10-08 | Liquid circulation treatment equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07106294A true JPH07106294A (en) | 1995-04-21 |
Family
ID=17245493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25302993A Pending JPH07106294A (en) | 1993-10-08 | 1993-10-08 | Liquid circulation treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106294A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001032081A (en) * | 1999-07-19 | 2001-02-06 | Electroplating Eng Of Japan Co | Additive feeding device |
| SG160262A1 (en) * | 2008-10-02 | 2010-04-29 | United Microelectronics Corp | Buffer apparatus and thin film deposition system |
| US8328938B2 (en) | 2008-08-21 | 2012-12-11 | United Microelectronics Corp. | Buffer apparatus and thin film deposition system |
| KR20200015858A (en) * | 2017-07-10 | 2020-02-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Plating system with reduced air splash |
| CN116988051A (en) * | 2023-09-27 | 2023-11-03 | 圆周率半导体(南通)有限公司 | Excellent electroless copper plating equipment and copper plating method thereof |
-
1993
- 1993-10-08 JP JP25302993A patent/JPH07106294A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001032081A (en) * | 1999-07-19 | 2001-02-06 | Electroplating Eng Of Japan Co | Additive feeding device |
| US8328938B2 (en) | 2008-08-21 | 2012-12-11 | United Microelectronics Corp. | Buffer apparatus and thin film deposition system |
| SG160262A1 (en) * | 2008-10-02 | 2010-04-29 | United Microelectronics Corp | Buffer apparatus and thin film deposition system |
| KR20200015858A (en) * | 2017-07-10 | 2020-02-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Plating system with reduced air splash |
| TWI774797B (en) * | 2017-07-10 | 2022-08-21 | 美商應用材料股份有限公司 | Plating systems having reduced air entrainment |
| US11739434B2 (en) | 2017-07-10 | 2023-08-29 | Applied Materials, Inc. | Plating systems having reduced air entrainment |
| CN116988051A (en) * | 2023-09-27 | 2023-11-03 | 圆周率半导体(南通)有限公司 | Excellent electroless copper plating equipment and copper plating method thereof |
| CN116988051B (en) * | 2023-09-27 | 2023-12-22 | 圆周率半导体(南通)有限公司 | Excellent electroless copper plating equipment and copper plating method thereof |
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