JPH0690027A - Light emitting device and its manufacture - Google Patents
Light emitting device and its manufactureInfo
- Publication number
- JPH0690027A JPH0690027A JP4240652A JP24065292A JPH0690027A JP H0690027 A JPH0690027 A JP H0690027A JP 4240652 A JP4240652 A JP 4240652A JP 24065292 A JP24065292 A JP 24065292A JP H0690027 A JPH0690027 A JP H0690027A
- Authority
- JP
- Japan
- Prior art keywords
- block body
- back surface
- light emitting
- hole
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示装置のバック
ライト、ファックス等の光源アレー、各種操作にパネル
の表示用として用いられる発光装置およびその製造方法
に関し、特に表面実装用チップ部品型の発光装置および
その製造方法に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight of a liquid crystal display device, a light source array for fax or the like, a light emitting device used for displaying a panel for various operations, and a method for manufacturing the same, and more particularly to a surface mounting chip component type. The present invention relates to a light emitting device and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】チップ部品型発光装置の分野で、リード
レスタイプのものとしては、近年、絶縁性の基材に立体
配線パターンをメッキ形成し、これに発光素子を搭載す
るものをある。そして、特に出願人は、図２（Ａ）〜
（Ｆ）に示す提案例１や、図３（Ａ）〜（Ｅ）に示す提
案例２を考えた。これらは、いずれも、リードフレーム
を一切使用せず、絶縁ブロック体１に凹部２を設け、か
つ凹部２の底面にスルーホール３を形成し、これらに立
体配線パターン４を直接形成し、これを基材として発光
素子５（ＬＥＤ）を搭載したものである。2. Description of the Related Art In the field of chip component type light emitting devices, leadless type devices have recently been formed by plating a three-dimensional wiring pattern on an insulating base material and mounting light emitting elements thereon. And, in particular, the applicant is shown in FIG.
Proposed example 1 shown in (F) and proposed example 2 shown in FIGS. 3 (A) to 3 (E) were considered. In all of these, the lead frame is not used at all, the concave portion 2 is provided in the insulating block body 1, the through hole 3 is formed in the bottom surface of the concave portion 2, and the three-dimensional wiring pattern 4 is directly formed in these, and this is formed. A light emitting element 5 (LED) is mounted as a base material.
【０００３】いずれも、凹部２の底面のスルーホール３
に透光性封止樹脂６が充填されることにより、半田処理
時等の信頼性が確保されている。In each case, the through hole 3 on the bottom of the recess 2 is used.
By being filled with the translucent sealing resin 6, the reliability at the time of soldering is secured.
【０００４】[0004]
【発明が解決しようとする課題】（１）提案例１，２に
おいて、図４の如く、透光性封止樹脂６を凹部２および
スルーホール３に注入する際、スルーホール３から絶縁
ブロック体１の裏面に漏れ出て、効率的な樹脂注入がで
きないおそれがある。(1) In Proposed Examples 1 and 2, when the translucent sealing resin 6 is injected into the recess 2 and the through hole 3 as shown in FIG. There is a possibility that it may leak to the back surface of No. 1 and efficient resin injection may not be possible.
【０００５】これを防ぐため、図２（Ｅ）の如く、絶縁
ブロック体１の裏面に、ガラスエポキシ樹脂製等の耐熱
性テープ８を貼りつけて樹脂注入する必要があった。そ
うすると、製造プロセスが一工程増大してしまい、工程
効率化の要請に反する。In order to prevent this, as shown in FIG. 2 (E), it was necessary to attach a heat resistant tape 8 made of glass epoxy resin or the like to the back surface of the insulating block 1 and inject the resin. Then, the manufacturing process is increased by one step, which goes against the request for process efficiency.
【０００６】（２）デバイス完成後、発光した場合、発
光素子５が搭載されている凹部２の底面にスルーホール
３があると、発光素子５からの光の一部がスルーホール
３から逃げてしまい、凹部底面での反射効率、すなわち
発光装置の発光効率が悪くなるという欠点があった。(2) When light is emitted after the device is completed, if there is a through hole 3 in the bottom surface of the recess 2 in which the light emitting element 5 is mounted, part of the light from the light emitting element 5 escapes from the through hole 3. Therefore, there is a drawback that the reflection efficiency on the bottom surface of the concave portion, that is, the luminous efficiency of the light emitting device is deteriorated.
【０００７】（３）図５の如く、外部の実装基板９に半
田付けした際、半田ボール７が電極の下側にもぐり込む
ことがある。そうすると、絶縁ブロック体１が実装基板
９から浮き上がって（半田ブリッジ）不安定となり、場
合によっては電極の接続が断線してしまうことから、信
頼性が低下する。(3) As shown in FIG. 5, when soldered to the external mounting substrate 9, the solder ball 7 may dig into the lower side of the electrode. Then, the insulating block body 1 floats from the mounting substrate 9 (solder bridge) and becomes unstable, and the connection of the electrodes is broken in some cases, so that the reliability is lowered.
【０００８】本発明は、上記課題に鑑み、製造プロセス
の効率化、発光効率の向上、信頼性の向上を図り得る発
光装置の提供を目的とする。In view of the above problems, it is an object of the present invention to provide a light emitting device capable of improving the efficiency of the manufacturing process, improving the luminous efficiency, and improving the reliability.
【０００９】[0009]
【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１（Ａ）〜（Ｆ）の如く、絶縁ブロッ
ク体１１の上面に凹部１２が形成され、該凹部１２の底
面から絶縁ブロック体１１の裏面にかけてスルーホール
１３が形成され、該凹部１２およびスルーホール１３の
所定部分に複数の配線金属層１４，１５が形成され、該
配線金属層１４，１５に発光素子１６が搭載および結線
され、前記凹部１２が透光性封止樹脂１７で樹脂封止さ
れたリードレス型発光装置において、前記絶縁ブロック
体１１の裏面からスルーホール１３にかけて、前記透光
性封止樹脂１７が絶縁ブロック体１１の裏面に樹脂漏れ
するのを防止する裏面絶縁層１８が形成されたものであ
る。As shown in FIGS. 1 (A) to 1 (F), a recess 12 is formed on the upper surface of an insulating block body 11, and a bottom surface of the recess 12 is formed. To the back surface of the insulating block body 11, a through hole 13 is formed, a plurality of wiring metal layers 14 and 15 are formed in predetermined portions of the recess 12 and the through hole 13, and the light emitting element 16 is formed on the wiring metal layers 14 and 15. In the leadless type light emitting device that is mounted and connected, and the recess 12 is resin-sealed with the translucent sealing resin 17, the translucent sealing resin 17 extends from the back surface of the insulating block body 11 to the through hole 13. A back surface insulating layer 18 is formed on the back surface of the insulating block body 11 to prevent resin leakage.
【００１０】本発明請求項２による課題解決手段は、請
求項１記載の裏面絶縁層１８は、絶縁ブロック体１１の
裏面側に一定の厚み寸法で突出形成されたものである。According to a second aspect of the present invention, the back surface insulating layer 18 according to the first aspect is formed on the back surface side of the insulating block body 11 so as to have a certain thickness.
【００１１】本発明請求項３による課題解決手段は、請
求項１記載の裏面絶縁層１８として、光反射性の高い材
質が用いられたことを特徴とする発光装置。According to a third aspect of the present invention, a light emitting device is characterized in that a material having high light reflectivity is used as the back surface insulating layer 18 according to the first aspect.
【００１２】本発明請求項４による課題解決手段は、絶
縁ブロック体１１の上面に凹部１２を形成し、該凹部１
２の底面から絶縁ブロック体１１の裏面にかけてスルー
ホール１３を形成し、該凹部１２およびスルーホール１
３の所定部分に複数の配線金属層１４，１５を形成し、
前記絶縁ブロック体１１の裏面からスルーホール１３に
かけて、前記透光性封止樹脂１７を絶縁ブロック体１１
の裏面に樹脂漏れするのを防止する裏面絶縁層１８を形
成し、前記配線金属層１４，１５に発光素子１６を搭載
および結線し、前記凹部１２を透光性封止樹脂１７で樹
脂封止するものである。According to a fourth aspect of the present invention, a recess 12 is formed in an upper surface of an insulating block body 11, and the recess 1 is formed.
Through holes 13 are formed from the bottom surface of the insulating block body 11 to the back surface of the insulating block body 11.
A plurality of wiring metal layers 14 and 15 are formed on a predetermined portion of 3,
The translucent sealing resin 17 is applied to the insulating block body 11 from the back surface of the insulating block body 11 to the through hole 13.
A back surface insulating layer 18 for preventing resin leakage is formed on the back surface of the device, a light emitting element 16 is mounted and connected to the wiring metal layers 14 and 15, and the recess 12 is resin-sealed with a translucent sealing resin 17. To do.
【００１３】[0013]
【作用】上記請求項１，４による課題解決手段におい
て、凹部１２内に発光素子１６を搭載後、透光性封止樹
脂１７を注入する際、スルーホール１３を裏面絶縁層１
８にて塞いでいるため、透光性封止樹脂１７が、絶縁ブ
ロック体１１の裏面に漏れ出るのを防止できる。In the means for solving the problems according to claims 1 and 4, when the light-transmitting sealing resin 17 is injected after the light emitting element 16 is mounted in the recess 12, the through hole 13 is formed in the back surface insulating layer 1.
Since it is closed by 8, the translucent sealing resin 17 can be prevented from leaking to the back surface of the insulating block body 11.
【００１４】請求項２では、半田処理時に、絶縁ブロッ
ク体１１の裏面の一定の厚みの裏面絶縁層１８を外部実
装基板に密接しながら半田付けする。この際、配線金属
層１４，１５と裏面絶縁層１８とは、材質が異なるた
め、半田が配線金属層１４，１５を伝って流れても、裏
面絶縁層１８の裏面にもぐりこむことはない。そうする
と、半田ホールが発生して半田ブリッジが発生するのを
防止できる。In the second aspect, the back surface insulating layer 18 having a constant thickness on the back surface of the insulating block body 11 is soldered while being in close contact with the external mounting substrate during the soldering process. At this time, since the wiring metal layers 14 and 15 and the back surface insulating layer 18 are made of different materials, even if the solder flows along the wiring metal layers 14 and 15, the solder does not dig into the back surface of the back surface insulating layer 18. Then, it is possible to prevent the generation of solder holes and the formation of solder bridges.
【００１５】請求項３では、発光素子１６の発光時に、
光反射効率の良い裏面絶縁層１８にて発光素子１６から
の光を上方へ反射することで、発光反射率を向上する。In claim 3, when the light emitting element 16 emits light,
By reflecting the light from the light emitting element 16 upward by the back surface insulating layer 18 having high light reflection efficiency, the light emission reflectance is improved.
【００１６】[0016]
【実施例】本実施例の一実施例の発光装置は、図１
（Ａ）〜（Ｆ）の如く、絶縁ブロック体１１の上面に凹
部１２が形成され、該凹部１２の底面から絶縁ブロック
体１１の裏面にかけてスルーホール１３が形成され、該
凹部１２およびスルーホール１３の所定部分に複数の配
線金属層１４，１５が形成され、該配線金属層１４，１
５に発光素子１６（ＬＥＤ）が搭載および結線され、前
記凹部１２が透光性封止樹脂１７で樹脂封止されたリー
ドレス型発光装置において、前記絶縁ブロック体１１の
裏面からスルーホール１３にかけて、前記透光性封止樹
脂１７が絶縁ブロック体１１の裏面に樹脂漏れするのを
防止する裏面絶縁層１８が形成されている。EXAMPLE A light emitting device according to an example of this example is shown in FIG.
As in (A) to (F), the recess 12 is formed on the upper surface of the insulating block body 11, and the through hole 13 is formed from the bottom surface of the recess 12 to the back surface of the insulating block body 11. The recess 12 and the through hole 13 are formed. A plurality of wiring metal layers 14 and 15 are formed on predetermined portions of the wiring metal layers 14 and 1,
In the leadless type light emitting device in which the light emitting element 16 (LED) is mounted and connected to the wiring 5, and the recess 12 is resin-sealed with the translucent sealing resin 17, from the back surface of the insulating block body 11 to the through hole 13. A back surface insulating layer 18 is formed to prevent the translucent sealing resin 17 from leaking to the back surface of the insulating block body 11.
【００１７】前記絶縁ブロック体１１は、図１（Ａ）〜
（Ｆ）の如く、例えば、絶縁性の高いポリイミド樹脂等
が用いられ、複数個のデバイスが一枚の大型基板で一度
に金型成形され、後述のように素子搭載および樹脂封止
後、単一デバイスごとにダイシング分割される。The insulating block 11 is shown in FIG.
As shown in (F), for example, a highly insulating polyimide resin or the like is used, and a plurality of devices are mold-molded at one time with one large substrate. The dicing is divided for each device.
【００１８】前記凹部１２は、図１（Ａ）（Ｃ）（Ｅ）
の如く、前記絶縁ブロック体１１の金型成形時に同時に
形成され、その側壁は、発光素子１６からの光を上方へ
効率よく反射すべく、傾斜されている。The recess 12 is shown in FIGS. 1 (A) (C) (E).
As described above, the insulating block body 11 is formed at the same time when the insulating block body 11 is molded, and its side wall is inclined so as to efficiently reflect the light from the light emitting element 16 upward.
【００１９】前記スルーホール１３は、図１（Ａ）
（Ｃ）（Ｅ）（Ｆ）の如く、前記凹部１２の底部の両端
部に一個づつ合計二個形成されている。The through hole 13 is shown in FIG.
As in (C), (E) and (F), two are formed, one at each end of the bottom of the recess 12.
【００２０】前記配線金属層１４，１５は、図１（Ａ）
（Ｂ）（Ｃ）（Ｅ）（Ｆ）の如く、前記発光素子１６を
搭載する搭載用配線部１４と、前記発光素子１６と金属
細線２２を介して結線される結線用配線部１５とからな
る。いずれも、マスキング処理等の手法を用いてメッキ
形成されたもので、各スルーホール１３を経由し、絶縁
ブロック体１１の裏面部まで連続的に形成される。The wiring metal layers 14 and 15 are shown in FIG.
As in (B), (C), (E), and (F), from the mounting wiring portion 14 on which the light emitting element 16 is mounted, and the wiring wiring portion 15 that is connected to the light emitting element 16 via the thin metal wire 22. Become. Each of them is formed by plating using a technique such as masking, and is continuously formed to the back surface of the insulating block body 11 via each through hole 13.
【００２１】前記発光素子１６は、図１（Ａ）（Ｃ）
（Ｅ）の如く、前記搭載用配線部１４に導電ペースト２
４にて接着され、結線用配線部１５に金属細線２２で結
線される。The light emitting element 16 is shown in FIGS.
As shown in (E), the conductive paste 2 is applied to the mounting wiring portion 14.
4, and the metal wire 22 is connected to the wiring portion 15 for connection.
【００２２】前記透光性封止樹脂１７は、図１（Ｃ）
（Ｅ）の如く、例えば透明度の高いエポキシ樹脂等が用
いられる。The translucent sealing resin 17 is shown in FIG.
As shown in (E), for example, a highly transparent epoxy resin or the like is used.
【００２３】前記裏面絶縁層１８は、図１（Ｃ）（Ｅ）
（Ｆ）の如く、絶縁ブロック体１１の裏面側に均一な一
定の厚み寸法で突出形成され、前記スルーホール１３の
内部にまではいり込み、スルーホール１３を裏面からふ
さぐよう形成されている。裏面絶縁層１８の材質として
は、発光素子１６からの光を上方へ反射するよう、白色
等の光反射性を有するエポキシ樹脂あるいはアクリル樹
脂等が用いられるが、該裏面絶縁層１８が凹部１２の底
面より上方にもり上がると、金属細線２２の配線金属層
１５への接着性が悪くなるため、スルーホール１３内に
注入する際に凹部１２の底面より上方に越えないような
絶縁粘度に設定されている。つまり、絶縁ブロック体１
１の裏面およびスルーホール１３内のみに充填されてい
る。The back surface insulating layer 18 is formed as shown in FIGS.
As shown in (F), the insulating block body 11 is formed so as to project on the back surface side with a uniform thickness and is inserted into the through hole 13 so as to cover the through hole 13 from the back surface. As the material of the back surface insulating layer 18, epoxy resin or acrylic resin having light reflectivity such as white is used so as to reflect the light from the light emitting element 16 upward. If the metal fine wire 22 rises above the bottom surface, the adhesion of the thin metal wire 22 to the wiring metal layer 15 deteriorates. Therefore, when injected into the through hole 13, the insulating viscosity is set so as not to exceed the bottom surface of the recess 12. ing. That is, the insulating block body 1
It is filled only in the back surface of No. 1 and in the through hole 13.
【００２４】上記構成の発光装置は、次のように製造さ
れる。The light emitting device having the above structure is manufactured as follows.
【００２５】まず、絶縁ブロック体１１の上面に凹部１
２を形成し、該凹部１２の底面から絶縁ブロック体１１
の裏面にかけてスルーホール１３を形成する。First, the concave portion 1 is formed on the upper surface of the insulating block body 11.
2 is formed, and the insulating block body 11 is formed from the bottom surface of the recess 12.
Through holes 13 are formed on the back surface of the.
【００２６】次に、凹部１２およびスルーホール１３の
所定部分に複数の配線金属層１４，１５を形成する。Next, a plurality of wiring metal layers 14 and 15 are formed in predetermined portions of the recess 12 and the through hole 13.
【００２７】そして、絶縁ブロック体１１の裏面からス
ルーホール１３にかけて、透光性封止樹脂１７が絶縁ブ
ロック体１１の裏面に樹脂漏れするのを防止する裏面絶
縁層１８を形成する。Then, a back surface insulating layer 18 is formed from the back surface of the insulating block body 11 to the through hole 13 to prevent the translucent sealing resin 17 from leaking to the back surface of the insulating block body 11.
【００２８】その後、配線金属層１４，１５に発光素子
１６を搭載および結線し、凹部１２を透光性封止樹脂１
７で樹脂封止して、発光装置が完成する。Thereafter, the light emitting element 16 is mounted and connected to the wiring metal layers 14 and 15, and the recess 12 is filled with the light-transmitting sealing resin 1.
The light emitting device is completed by resin sealing with 7.
【００２９】この際、裏面絶縁層１８にてスルーホール
１３内を塞いでいるため、透光性封止樹脂１７が絶縁ブ
ロック体１１の裏面側に漏れるのを防止できる。したが
って、絶縁ブロック体１１の裏面に樹脂漏れ防止用のテ
ープを貼り付けなくても樹脂注入できる。At this time, since the inside of the through hole 13 is closed by the back surface insulating layer 18, the translucent sealing resin 17 can be prevented from leaking to the back surface side of the insulating block body 11. Therefore, the resin can be injected without attaching the resin leakage preventing tape to the back surface of the insulating block body 11.
【００３０】また、上記発光装置を外部の実装基板に半
田実装する際、絶縁ブロック体１１の裏面に形成された
一定の厚みの裏面絶縁層１８を外部実装基板に密接しな
がら半田付けする。ここで、裏面絶縁層１８を、絶縁ブ
ロック体１１の裏面側に均一な厚み寸法で突出形成して
いるので、半田が配線金属層１４，１５を伝って流れて
も、配線金属層１４，１５と裏面絶縁層１８とは材質が
異なるため、裏面絶縁層１８の裏面にもぐりこむことは
ない。そうすると、半田ボールが発生して半田ブリッジ
が発生するのを防止できる。When the light emitting device is mounted on an external mounting board by soldering, the back surface insulating layer 18 having a constant thickness formed on the back surface of the insulating block body 11 is soldered to the external mounting board while being in close contact therewith. Here, since the back surface insulating layer 18 is formed so as to project on the back surface side of the insulating block body 11 with a uniform thickness dimension, even if the solder flows along the wiring metal layers 14 and 15, the wiring metal layers 14 and 15 are also formed. Since the back insulating layer 18 and the back insulating layer 18 are made of different materials, the back insulating layer 18 does not dig into the back surface of the back insulating layer 18. Then, it is possible to prevent a solder ball from being generated and a solder bridge to be generated.
【００３１】また、使用時には、裏面絶縁層１８として
白色等の光反射性の材料を用いることで、発光時の光反
射効率を向上できる。Further, at the time of use, by using a light-reflecting material such as white as the back surface insulating layer 18, the light reflection efficiency at the time of light emission can be improved.
【００３２】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.
【００３３】例えば、上記実施例では、各デバイスにつ
きスルーホールを二個形成していたが、一個でもよく、
また多色化のため等で三個以上形成したタイプにも適用
できる。For example, in the above embodiment, two through holes were formed for each device, but one may be formed.
Further, it can be applied to a type in which three or more are formed for multicoloring.
【００３４】[0034]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１，４によると、絶縁ブロック体の裏面からスルー
ホールにかけて裏面絶縁層を形成しているので、樹脂注
入時に、絶縁ブロック体の裏面に樹脂漏れ防止用のテー
プを貼り付けなくても、透光性封止樹脂が絶縁ブロック
体の裏面に樹脂漏れするのを防止できる。したがって、
提案例１，２のように、絶縁ブロック体１の裏面に樹脂
漏れ用の耐熱性テープを貼りつける必要がなくなり、そ
の分、製造効率を向上できる。As is apparent from the above description, according to claims 1 and 4 of the present invention, since the back surface insulating layer is formed from the back surface of the insulating block body to the through hole, the resin of the insulating block body is formed at the time of resin injection. It is possible to prevent the translucent sealing resin from leaking to the back surface of the insulating block body without attaching a resin leak preventing tape to the back surface. Therefore,
As in Proposed Examples 1 and 2, it is not necessary to attach a heat-resistant tape for resin leakage to the back surface of the insulating block body 1, and the manufacturing efficiency can be improved accordingly.
【００３５】請求項２によると、裏面絶縁層を、絶縁ブ
ロック体の裏面側に一定の厚み寸法で突出形成している
ので、半田実装時に半田ブリッジが生じることを防ぎ
得、断線を防止して、信頼性を向上できる。According to the second aspect of the present invention, since the back surface insulating layer is formed on the back surface side of the insulating block body so as to project with a certain thickness, it is possible to prevent a solder bridge from occurring during solder mounting, and to prevent disconnection. , The reliability can be improved.
【００３６】請求項３によると、裏面絶縁層として、光
反射性の高い材質を用いているので、発光時の光反射効
率を向上できるといった優れた効果がある。According to the third aspect, since the back surface insulating layer is made of a material having high light reflectivity, there is an excellent effect that the light reflection efficiency at the time of light emission can be improved.
【図１】本発明の一実施例を示す発光装置であって、
（Ａ）は平面図、（Ｂ）は右側面図、（Ｃ）は（Ａ）の
Ａ−Ａ断面図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＢ−
Ｂ断面図、（Ｆ）は底面図FIG. 1 is a light emitting device showing an embodiment of the present invention,
(A) is a plan view, (B) is a right side view, (C) is a sectional view taken along line AA of (A), (D) is a front view, and (E) is B- of (A).
B sectional view, (F) bottom view
【図２】提案例１の発光装置であって、（Ａ）は平面
図、（Ｂ）は右側面図、（Ｃ）は（Ａ）のＣ−Ｃ断面
図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＤ−Ｄ断面図、
（Ｆ）は底面図2A and 2B show a light emitting device of Proposed Example 1, where FIG. 2A is a plan view, FIG. 2B is a right side view, FIG. 2C is a sectional view taken along line CC of FIG. 2A, and FIG. (E) is a cross-sectional view taken along line DD of (A),
(F) is a bottom view
【図３】提案例２の発光装置であって、（Ａ）は平面
図、（Ｂ）は右側面図、（Ｃ）は（Ａ）のＣ−Ｃ断面
図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＤ−Ｄ断面図FIG. 3 is a light emitting device of Proposed Example 2, where (A) is a plan view, (B) is a right side view, (C) is a sectional view taken along line CC of (A), and (D) is a front view. (E) is a cross-sectional view taken along line DD of (A).
【図４】従来の発光装置の絶縁ブロック体のスルーホー
ルから透光性封止樹脂が裏面側に漏れ出る様子を示す図FIG. 4 is a diagram showing how the translucent sealing resin leaks from the through hole of the insulating block body of the conventional light emitting device to the back surface side.
【図５】従来の発光装置の絶縁ブロック体の半田実装時
に半田ブリッジが発生した状態を示す図FIG. 5 is a view showing a state in which a solder bridge is generated during solder mounting of an insulating block body of a conventional light emitting device.
１１ 絶縁ブロック体 １２ 凹部 １３ スルーホール １４，１５ 配線金属層 １６ 発光素子 １７ 透光性封止樹脂 １８ 裏面絶縁層 11 Insulation Block 12 Concave 13 Through Hole 14, 15 Wiring Metal Layer 16 Light-Emitting Element 17 Translucent Sealing Resin 18 Backside Insulation Layer
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年１０月１５日[Submission date] October 15, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項４[Name of item to be corrected] Claim 4
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１１】 本発明請求項３による課題解決手段は、
請求項１記載の裏面絶縁層１８として、光反射性の高い
材質が用いられたものである。The problem solving means according to claim 3 of the present invention is
As the back insulating layer 18 of claim 1 wherein, in which high light reflectivity material was used.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】 本発明請求項４による課題解決手段は、
絶縁ブロック体１１の上面に凹部１２を形成し、該凹部
１２の底面から絶縁ブロック体１１の裏面にかけてスル
ーホール１３を形成し、該凹部１２およびスルーホール
１３の所定部分に複数の配線金属層１４，１５を形成
し、前記絶縁ブロック体１１の裏面からスルーホール１
３にかけて、前記透光性封止樹脂１７が絶縁ブロック体
１１の裏面に樹脂漏れするのを防止する裏面絶縁層１８
を形成し、前記配線金属層１４，１５に発光素子１６を
搭載および結線し、前記凹部１２を透光性封止樹脂１７
で樹脂封止するものである。The problem solving means according to claim 4 of the present invention is
A concave portion 12 is formed on the upper surface of the insulating block body 11, a through hole 13 is formed from the bottom surface of the concave portion 12 to the back surface of the insulating block body 11, and a plurality of wiring metal layers 14 are formed at predetermined portions of the concave portion 12 and the through hole 13. , 15 are formed, and the through hole 1 is formed from the back surface of the insulating block body 11.
The back surface insulating layer 18 for preventing the translucent sealing resin 17 from leaking to the back surface of the insulating block body 11 over the range of 3.
Is formed, the light emitting element 16 is mounted on and connected to the wiring metal layers 14 and 15, and the recess 12 is filled with a translucent sealing resin 17.
The resin is sealed with.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Name of item to be corrected] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１５】 請求項３では、発光素子１６の発光時
に、光反射効率の良い裏面絶縁層１８にて発光素子１６
からの光を上方へ反射することで、光反射率を向上す
る。According to a third aspect of the present invention, when the light emitting element 16 emits light, the back surface insulating layer 18 having good light reflection efficiency is used.
The light reflectance is improved by reflecting the light from the upward direction.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１７[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１７】 前記絶縁ブロック体１１は、図１（Ａ）
〜（Ｆ）の如く、例えば、絶縁性の高い液晶ポリマー、
またはポリフェニレンサルファイド（ＰＰＳ）等が用い
られ、複数個のデバイスが一枚の大型基板で一度に金型
成形され、後述のように素子搭載および樹脂封止後、単
一デバイスごとにダイシング分割される。The insulating block body 11 is shown in FIG.
~ (F), for example, a liquid crystal polymer having a high insulating property ,
Alternatively, polyphenylene sulfide (PPS) or the like is used, and a plurality of devices are die-molded at one time on one large substrate, and after mounting the elements and resin-sealing as described later, dicing is divided into individual devices. .
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３４[Correction target item name] 0034
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３４】[0034]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１，４によると、絶縁ブロック体の裏面からスルー
ホールにかけて裏面絶縁層を形成しているので、樹脂注
入時に、絶縁ブロック体の裏面に樹脂漏れ防止用のテー
プを貼り付けなくても、透光性封止樹脂が絶縁ブロック
体の裏面に樹脂漏れするのを防止できる。したがって、
提案例１，２のように、絶縁ブロック体の裏面に樹脂漏
れ用の耐熱性テープを貼りつける必要がなくなり、その
分、製造効率を向上できる。As is apparent from the above description, according to claims 1 and 4 of the present invention, since the back surface insulating layer is formed from the back surface of the insulating block body to the through hole, the resin of the insulating block body is formed at the time of resin injection. It is possible to prevent the translucent sealing resin from leaking to the back surface of the insulating block body without attaching a resin leak preventing tape to the back surface. Therefore,
As in Proposed Examples 1 and 2, it is not necessary to attach a heat-resistant tape for resin leakage to the back surface of the insulating block body , and the manufacturing efficiency can be improved accordingly.
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の一実施例を示す発光装置であって、
（Ａ）は平面図、（Ｂ）は右側面図、（Ｃ）は（Ａ）の
Ａ−Ａ断面図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＢ−
Ｂ断面図、（Ｆ）は底面図FIG. 1 is a light emitting device showing an embodiment of the present invention,
(A) is a plan view, (B) is a right side view, (C) is a sectional view taken along line AA of (A), (D) is a front view, and (E) is B- of (A).
B sectional view, (F) bottom view
【図２】提案例１の発光装置であって、（Ａ）は平面
図、（Ｂ）は右側面図、（Ｃ）は（Ａ）のＡ−Ａ断面
図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＢ−Ｂ断面図、
（Ｆ）は底面図[2] A light emitting device of the Proposed Example 1, (A) is a plan view, (B) is a right side view, A of (C) is (A) - A cross-sectional view, (D) is a front view, (E) is B of (a) - B cross section,
(F) is a bottom view
【図３】提案例２の発光装置であって、（Ａ）は平面
図、（Ｂ）は右側面図、（Ｃ）は（Ａ）のＡ−Ａ断面
図、（Ｄ）は正面図、（Ｅ）は（Ａ）のＢ−Ｂ断面図[Figure 3] A light-emitting device of the proposed Example 2, (A) is a plan view, (B) is a right side view, A of (C) is (A) - A cross-sectional view, (D) is a front view, (E) is the (a) B - B cross section
【図４】従来の発光装置の絶縁ブロック体のスルーホー
ルから透光性封止樹脂が裏面側に漏れ出る様子を示す図FIG. 4 is a diagram showing how the translucent sealing resin leaks from the through hole of the insulating block body of the conventional light emitting device to the back surface side.
【図５】従来の発光装置の絶縁ブロック体の半田実装時
に半田ブリッジが発生した状態を示す図FIG. 5 is a view showing a state in which a solder bridge is generated during solder mounting of an insulating block body of a conventional light emitting device.
【符号の説明】 １１ 絶縁ブロック体 １２ 凹部 １３ スルーホール １４，１５ 配線金属層 １６ 発光素子 １７ 透光性封止樹脂 １８ 裏面絶縁層[Explanation of reference numerals] 11 Insulation block body 12 Recessed portion 13 Through hole 14, 15 Wiring metal layer 16 Light emitting element 17 Translucent sealing resin 18 Back surface insulating layer
Claims (4)
れ、該凹部の底面から絶縁ブロック体の裏面にかけてス
ルーホールが形成され、該凹部およびスルーホールの所
定部分に複数の配線金属層が形成され、該配線金属層に
発光素子が搭載および結線され、前記凹部が透光性封止
樹脂で樹脂封止されたリードレス型発光装置において、
前記絶縁ブロック体の裏面からスルーホールにかけて、
前記透光性封止樹脂が絶縁ブロック体の裏面に樹脂漏れ
するのを防止する裏面絶縁層が形成されたことを特徴と
する発光装置。1. A recess is formed on an upper surface of an insulating block body, a through hole is formed from a bottom surface of the recess to a back surface of the insulating block body, and a plurality of wiring metal layers are formed on predetermined portions of the recess and the through hole. A leadless type light emitting device in which a light emitting element is mounted and connected to the wiring metal layer and the recess is resin-sealed with a translucent sealing resin,
From the back side of the insulating block to the through hole,
A light emitting device, wherein a back surface insulating layer is formed on the back surface of the insulating block to prevent the resin from leaking.
ック体の裏面側に一定の厚み寸法で突出形成されたこと
を特徴とする発光装置。2. The light emitting device according to claim 1, wherein the back surface insulating layer is formed on the back surface side of the insulating block body so as to have a certain thickness.
射性の高い材質が用いられたことを特徴とする発光装
置。3. The light emitting device according to claim 1, wherein a material having high light reflectivity is used as the back surface insulating layer.
該凹部の底面から絶縁ブロック体の裏面にかけてスルー
ホールを形成し、該凹部およびスルーホールの所定部分
に複数の配線金属層を形成し、前記絶縁ブロック体の裏
面からスルーホールにかけて、前記透光性封止樹脂を絶
縁ブロック体の裏面に樹脂漏れするのを防止する裏面絶
縁層を形成し、前記配線金属層に発光素子を搭載および
結線し、前記凹部を透光性封止樹脂で樹脂封止すること
を特徴とする発光装置の製造方法。4. A recess is formed on the upper surface of the insulating block body,
A through hole is formed from the bottom surface of the concave portion to the back surface of the insulating block body, a plurality of wiring metal layers are formed in predetermined portions of the concave portion and the through hole, and the translucency is provided from the back surface of the insulating block body to the through hole. A back surface insulating layer is formed to prevent the sealing resin from leaking to the back surface of the insulating block body, a light emitting element is mounted and connected to the wiring metal layer, and the recess is resin-sealed with a translucent sealing resin. A method for manufacturing a light-emitting device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4240652A JP2826020B2 (en) | 1992-09-09 | 1992-09-09 | Light emitting device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4240652A JP2826020B2 (en) | 1992-09-09 | 1992-09-09 | Light emitting device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0690027A true JPH0690027A (en) | 1994-03-29 |
| JP2826020B2 JP2826020B2 (en) | 1998-11-18 |
Family
ID=17062681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4240652A Expired - Lifetime JP2826020B2 (en) | 1992-09-09 | 1992-09-09 | Light emitting device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2826020B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001045181A1 (en) * | 1999-12-17 | 2001-06-21 | Yoon Sun Kwan | Led lamp having female type leads formed on pcb |
| JP2002171042A (en) * | 2000-12-01 | 2002-06-14 | Nichia Chem Ind Ltd | Led unit and its manufacturing method |
| JP2004029468A (en) * | 2002-06-26 | 2004-01-29 | Taiwan Lite On Electronics Inc | Method of manufacturing color section display unit |
| WO2008059650A1 (en) * | 2006-11-14 | 2008-05-22 | Harison Toshiba Lighting Corp. | Light emitting device, its manufacturing method and its mounted substrate |
-
1992
- 1992-09-09 JP JP4240652A patent/JP2826020B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001045181A1 (en) * | 1999-12-17 | 2001-06-21 | Yoon Sun Kwan | Led lamp having female type leads formed on pcb |
| JP2002171042A (en) * | 2000-12-01 | 2002-06-14 | Nichia Chem Ind Ltd | Led unit and its manufacturing method |
| JP2004029468A (en) * | 2002-06-26 | 2004-01-29 | Taiwan Lite On Electronics Inc | Method of manufacturing color section display unit |
| WO2008059650A1 (en) * | 2006-11-14 | 2008-05-22 | Harison Toshiba Lighting Corp. | Light emitting device, its manufacturing method and its mounted substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2826020B2 (en) | 1998-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6495861B1 (en) | Light-emitting semiconductor chip | |
| CN101036239B (en) | Chip component type light emitting device and wiring board for the same | |
| JPH1187780A (en) | Light emitting device | |
| KR100653497B1 (en) | Light-emitting chip device with case | |
| US8357950B2 (en) | Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device | |
| US8847272B2 (en) | Light emitting device | |
| JPH11177129A (en) | Chip type led, led lamp and led display | |
| JP3930710B2 (en) | Chip-type light emitting diode and manufacturing method thereof | |
| KR101252676B1 (en) | Semiconductor Light Emitting Device | |
| JP2002185046A (en) | Chip-part type led and its manufacturing method | |
| JPH11186590A (en) | Chip-type led | |
| JPH07211940A (en) | Planar emission type led light emitting device and its manufacture | |
| JP4593201B2 (en) | Chip component type light emitting device and wiring board therefor | |
| JPH0690027A (en) | Light emitting device and its manufacture | |
| JP2915706B2 (en) | Light emitting device | |
| JP2825387B2 (en) | Light emitting element | |
| JPH09213115A (en) | Surface light emission lighting system | |
| JP2826019B2 (en) | Light emitting device and method of manufacturing the same | |
| KR101370790B1 (en) | Bar type light emitting device | |
| JP2003008072A (en) | Light emitting diode | |
| JP3032958B2 (en) | LED light emitting device and method of manufacturing the same | |
| KR100969141B1 (en) | Light emitting diode package | |
| JPH0537010A (en) | Reflective photointerrupter | |
| JP2005026503A (en) | Semiconductor light emitting device and its manufacturing method | |
| JP2000091645A (en) | Semiconductor light emitting device and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080911 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080911 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090911 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090911 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100911 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110911 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120911 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term |