JPH0677075A - Manufacture of monolithic ceramic electronic part - Google Patents
Manufacture of monolithic ceramic electronic partInfo
- Publication number
- JPH0677075A JPH0677075A JP25062992A JP25062992A JPH0677075A JP H0677075 A JPH0677075 A JP H0677075A JP 25062992 A JP25062992 A JP 25062992A JP 25062992 A JP25062992 A JP 25062992A JP H0677075 A JPH0677075 A JP H0677075A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- release film
- green sheet
- hole
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層チップインダクタ
等の積層セラミック電子部品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component such as a multilayer chip inductor.
【０００２】[0002]
【従来技術】スルーホールを設けたセラミックグリーン
シートの積層と剥離フィルムからの導体パターンの転写
により積層チップインダクタを作成する技術がある。2. Description of the Related Art There is a technique for producing a laminated chip inductor by laminating ceramic green sheets having through holes and transferring a conductor pattern from a release film.
【０００３】すなわち、図３（ａ）〜（ｃ）に示すよう
に、複数のセラミックグリーンシートからなるカバーシ
ート２上に、所定位置にスルーホール３を設けたスルー
ホール付グリーンシート５を置き（同図ａ）、前もって
導体パターン４を印刷しておいた透明な剥離フィルム６
の印刷面を下に向けて乗せ（同図ｂ）、上下から金属性
の対向する一対の平板で加圧、圧着した後、該フィルム
６を剥離して、スルーホール付グリーンシート５に導体
パターン４を転写する方法である（同図ｃ）。That is, as shown in FIGS. 3 (a) to 3 (c), a green sheet 5 with through holes having through holes 3 at predetermined positions is placed on a cover sheet 2 made of a plurality of ceramic green sheets ( In the same figure a), a transparent release film 6 on which the conductor pattern 4 has been printed in advance.
The printed surface of the sheet is placed downward (b in the same figure), and the film 6 is peeled off after pressure and pressure are applied by a pair of metallic flat plates facing each other from above and below, and the conductor pattern is formed on the green sheet 5 with through holes. 4 is the method of transferring (4) in FIG.
【０００４】さらに、上記転写法による積層チップイン
ダクタの積層工程を図４を参照して説明すると以下の通
りである。The stacking process of the multilayer chip inductor by the above transfer method will be described below with reference to FIG.
【０００５】複数のセラミックグリーンシートからなる
カバーシート２（同図ａ）の最上層にコイル導体引出し
口を有する導体パターン４を転写法により転写し（同図
ｂ）、次いでスルーホール付グリーンシート５を置き
（同図ｃ）、次の導体パターン４を転写する（同図
ｄ）。A conductor pattern 4 having a coil conductor outlet is transferred to the uppermost layer of a cover sheet 2 (a in the figure) composed of a plurality of ceramic green sheets by a transfer method (b in the figure), and then a green sheet 5 with through holes. Is placed (c in the same figure), and the next conductor pattern 4 is transferred (d in the same figure).
【０００６】次いで同様にスルーホール付グリーンシー
ト５を置き（同図ｅ）、これに次の導体パターン４を転
写する（同図ｆ）。Then, similarly, a green sheet 5 with through holes is placed (e in the same figure), and the next conductor pattern 4 is transferred to this (f in the same figure).
【０００７】このようにして、同図ｇ、ｈに見られるよ
うに、スルーホール付グリーンシートと導体パターンの
転写を繰り返して、所望の導体コイルが形成されるよう
に積層し、最後に、もう一方のコイル導体引出し口を有
する導体パターン４を転写した後（同図ｉ）、再び複数
のセラミックグリーンシートからなるカバーシート２を
積層して積層体を形成する（同図ｊ）。In this way, as shown in FIGS. 9A and 9B, the green sheet with through holes and the conductor pattern are repeatedly transferred to form a desired conductor coil, and finally laminated. After transferring the conductor pattern 4 having one coil conductor outlet (i in the same figure), the cover sheets 2 made of a plurality of ceramic green sheets are laminated again to form a laminated body (j in the same figure).
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、転写法
による従来のスルーホール部における導体パターンの接
続は、図２（ａ）〜（ｅ）に示すように、セラミックグ
リーンシート１に導体パターン４を転写し（同図ａ）、
この上にスルーホール３を有するグリーンシート５を乗
せ（同図ｂ及びｃ）、剥離フィルム６に印刷された導体
パターン４をプレスして転写する際、金属性の対向する
一対の平板で該グリーンシートと剥離フィルムとを挟ん
で圧着することにより行われる。However, in the conventional connection of the conductor pattern in the through hole portion by the transfer method, the conductor pattern 4 is transferred to the ceramic green sheet 1 as shown in FIGS. (Fig. A),
When a green sheet 5 having a through hole 3 is placed thereon (b and c in the same figure) and the conductor pattern 4 printed on a release film 6 is transferred by pressing, the green sheet is formed by a pair of metallic flat plates facing each other. It is performed by sandwiching the sheet and the release film and pressing them together.
【０００９】圧着によってスルーホール以外の導体パタ
ーンはセラミックグリーンシートに一様に加圧される
が、スルーホール部分は当該グリーンシートが欠如し、
空洞を形成し、近傍のグリーンシート面と段差を生じて
いるので、強い力で加圧しないとスルーホール内導体が
下層のグリーンシートに接触しない。The conductor pattern other than the through holes is uniformly pressed onto the ceramic green sheet by pressure bonding, but the green sheet is lacking in the through holes.
Since a cavity is formed and a step is formed with the surface of the green sheet in the vicinity, the conductor in the through hole does not come into contact with the green sheet in the lower layer unless pressure is applied with a strong force.
【００１０】すなわち、同図（ｄ）及び（ｅ）に見られ
るように、スルーホール部分は他の導体部分よりも小さ
い圧力を受けるようになり、スルーホール部分の密着性
が得られず、剥離フィルム６を剥離する時に、スルーホ
ール導体部分が剥離フィルムに付いたまま剥離され、一
方他の導体部分はグリーンシートと密着しているので、
導体パターンが切れるという課題があった。That is, as shown in FIGS. 3D and 3E, the through-hole portion receives a smaller pressure than the other conductor portions, and the adhesion of the through-hole portion cannot be obtained, resulting in peeling. When the film 6 is peeled off, the through-hole conductor portion is peeled off while being attached to the peeling film, while the other conductor portions are in close contact with the green sheet.
There was a problem that the conductor pattern was cut.
【００１１】そこで本発明の目的はスルーホール付グリ
ーンシートの積層と、剥離フィルムからの導体パターン
の転写により積層セラミック電子部品の製造工程におい
て積層体を形成する際、スルーホール部での導体接続が
確実で断線を生じない積層セラミック電子部品の製造方
法を提供することにある。Therefore, an object of the present invention is to form a laminated body in the manufacturing process of a laminated ceramic electronic component by laminating green sheets with through holes and transferring a conductor pattern from a release film, so that conductor connection at through holes can be made. It is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component that is reliable and does not cause disconnection.
【００１２】[0012]
【課題を解決するための手段】本発明者は、上記目的を
達成すべく研究の結果、スルーホール部分は他の導体部
分よりも圧力を受けにくく、密着強度が得られないこと
に鑑み、圧力がかかりにくいスルーホール部にも均一な
圧力を作用させるために、導体パターン転写の際に、剥
離フィルム上に弾性シートを設けて、圧力の均一性を計
り、該スルーホール部分にも同様な圧力を与えるように
すれば、上記課題が解決されることを見出し本発明に到
達した。As a result of research to achieve the above object, the present inventor has found that through-hole portions are less likely to receive pressure than other conductor portions, and adhesion strength cannot be obtained. In order to apply a uniform pressure to the through-hole that is difficult to apply, an elastic sheet is provided on the release film during transfer of the conductor pattern to measure the pressure uniformity, and the same pressure is applied to the through-hole. The inventors have found that the above-mentioned problems can be solved if the above is given, and have reached the present invention.
【００１３】そこで本発明は、透明な剥離フィルムに印
刷された導体パターンを、スルーホールを儲けたセラミ
ックグリーンシートに転写した後、該フィルムを剥離す
ることを繰り返して、積層されたセラミック磁性体中に
所定のコイル導体パターンが内設される積層体を形成す
る工程を含む積層セラミック電子部品の製造方法におい
て、金属性の対向する上下一対の平板により、上記セラ
ミックグリーンシートと導体パターンが印刷された剥離
フィルムを挟み、プレス圧着して導体パターンの転写を
行う際、上記剥離フィルム上に弾性シートを載置して行
うか、あるいは平板のうち上部平板の主面に該弾性シー
トを張りつけて行うことを特徴とする積層セラミック電
子部品の製造方法を提供するものである。Therefore, according to the present invention, the conductor pattern printed on a transparent release film is transferred to a ceramic green sheet having a through hole and then the film is peeled off repeatedly to obtain a laminated ceramic magnetic material. In a method of manufacturing a laminated ceramic electronic component including a step of forming a laminated body in which a predetermined coil conductor pattern is internally provided, the ceramic green sheet and the conductor pattern are printed by a pair of upper and lower metallic flat plates facing each other. When a conductor pattern is transferred by sandwiching a release film and press-pressing, an elastic sheet is placed on the release film, or the elastic sheet is attached to the main surface of the upper flat plate of the flat plates. The present invention provides a method for manufacturing a monolithic ceramic electronic component.
【００１４】[0014]
【作用】本発明の方法では、剥離フィルムと上部平板あ
るいは上面金型との間にラバーのような弾性シートを置
くので、弾性シートが凹凸を吸収し、セラミックグリー
ンシートとスルーホール部分とに均一な圧力が作用し、
圧力のかかりにくいスルーホールも弾性シートが加圧
し、他のセラミックグリーンシートの部分と同様に押圧
を受けるようになる。In the method of the present invention, since the elastic sheet such as rubber is placed between the peeling film and the upper flat plate or the upper mold, the elastic sheet absorbs the unevenness, and the ceramic green sheet and the through hole portion are evenly arranged. Pressure acts,
The elastic sheet also pressurizes the through-holes, which are hard to apply pressure, and receives the same pressure as other ceramic green sheets.
【００１５】[0015]
【実施例】図１は本実施例において、セラミックグリー
ンシートを積層して積層体を得る際、スルーホール部に
おける上下導体パターンの接続を確実にするために用い
られた弾性シートを示す断面図であり、前記図４ととも
に参照して以下説明する。 （１）Ｎｉ−Ｚｎフェライト粉体にポリビニルブチラー
ルを主成分とするバインダーを加え、ドクターブレード
法によりセラミックグリーンシートを作成する。 （２）セラミックグリーンシートの一部には、所定のピ
ッチでスルーホールが形成される。一方、導体となるＡ
ｇ粉にエチルセルロースを主成分とするバインダーおよ
びブチルカルビトールアセテートを加え、混練してペー
ストを作成する。このペーストを剥離剤をコーティング
した透明な剥離フィルムに、所定のパターンで導体パタ
ーンをスクリーン印刷する。 （３）これらスルーホールが設けられたグリーンシート
及び導体パターン付フィルムを斜視図で示される図４
（ａ）〜（ｊ）のように積層・転写を交互に繰り返して
フェライト磁性体内部にコイル導体のスパイラルパター
ンが内設された積層チップインダクタ用の積層体を得
る。 （４）上記転写の際、上下導体パターン間はスルーホー
ルで接続されるのであるが、剛体である金型だけでは確
実に接続されないので、図１の断面図に示すように、剥
離フィルム６の上に弾性シート９を乗せた後、上面金型
７（下面金型は図示せず）、側面金型８を用いて上下か
らプレスした。EXAMPLE FIG. 1 is a cross-sectional view showing an elastic sheet used for ensuring the connection of upper and lower conductor patterns in a through hole portion when a ceramic green sheet is laminated to obtain a laminated body in this example. Yes, and will be described below with reference to FIG. (1) A binder containing polyvinyl butyral as a main component is added to Ni-Zn ferrite powder, and a ceramic green sheet is prepared by a doctor blade method. (2) Through holes are formed at a predetermined pitch on a part of the ceramic green sheet. On the other hand, the conductor A
A binder having ethyl cellulose as a main component and butyl carbitol acetate are added to g powder and kneaded to prepare a paste. This paste is screen-printed with a conductor pattern in a predetermined pattern on a transparent release film coated with a release agent. (3) FIG. 4 which is a perspective view showing the green sheet provided with these through holes and the film with a conductor pattern.
As in (a) to (j), stacking and transferring are alternately repeated to obtain a stacked body for a multilayer chip inductor in which a spiral pattern of a coil conductor is provided inside a ferrite magnetic body. (4) At the time of the above-mentioned transfer, the upper and lower conductor patterns are connected by through holes. However, since it is not surely connected only by the mold which is a rigid body, as shown in the sectional view of FIG. After the elastic sheet 9 was placed on the top, the upper surface mold 7 (the lower surface mold is not shown) and the side surface mold 8 were used to press from above and below.
【００１６】該弾性シート９はスルーホール部にも変形
して入り込み、上下の導体パターンを確実に接続させる
ことができる。 （５）こうして得られた積層体（実際には多数の素子パ
ターンが形成された集合体である）を所定のチップ寸法
に裁断後、各素子を大気中で９００℃で焼成し、その両
端面に導電ペーストを塗布、大気中６００℃で焼き付け
て外部電極を付与して積層チップインダクタを得た。The elastic sheet 9 also deforms and enters the through holes, so that the upper and lower conductor patterns can be reliably connected. (5) After cutting the laminated body (actually, an assembly in which a large number of element patterns are formed) into a predetermined chip size, each element is fired at 900 ° C. in the atmosphere, and both end faces thereof are cut. A conductive paste was applied to the above, and baked at 600 ° C. in the atmosphere to provide external electrodes to obtain a multilayer chip inductor.
【００１７】なお、上記のように、剥離フィルムと上面
金型とで該弾性シートを挟む方法を採用したが、上面金
型あるいは平板の主面に弾性シートを張りつけてプレス
してもよく、後者の場合はいちいち弾性シートを重ねる
手間が省けて好都合である。Although the method of sandwiching the elastic sheet between the release film and the upper mold is adopted as described above, the elastic sheet may be stuck to the main surface of the upper mold or a flat plate and pressed, the latter. In the case of, it is convenient because it is not necessary to stack elastic sheets one by one.
【００１８】[0018]
【発明の効果】以上説明したように、本発明の製造方法
によれば、スルーホール付グリーンシートの積層と剥離
フィルムからの導体パターンの転写により積層体を形成
する際、剥離フィルム上に弾性シートを置いて上下一対
の平板又は金型でプレス圧着するので、弾性シートが凹
凸を吸収し、グリーンシートとスルーホール部分とに均
等に圧力を作用させる。As described above, according to the manufacturing method of the present invention, when a laminated body is formed by laminating a green sheet with through holes and transferring a conductor pattern from the peeling film, an elastic sheet is formed on the peeling film. Then, the elastic sheet absorbs the unevenness, and pressure is evenly applied to the green sheet and the through-hole portion because the sheet is placed and pressed by a pair of upper and lower flat plates or dies.
【００１９】したがって、転写法によるスルーホールの
接続が確実になる。Therefore, the connection of the through holes by the transfer method becomes reliable.
【図１】本発明の一実施例において、セラミックグリー
ンシートを積層して積層体を得る際、スルーホールにお
ける上下導体パターンの接続を確実にするために用いら
れた弾性シートを示す断面図である。FIG. 1 is a cross-sectional view showing an elastic sheet used for ensuring connection of upper and lower conductor patterns in a through hole when a ceramic green sheet is laminated to obtain a laminated body in one embodiment of the present invention. .
【図２】導体パターンの転写による積層セラミック電子
部品の製造工程において、従来のスルーホール接続にお
ける上下導体パターンの接続不良を説明するための断面
図である。FIG. 2 is a cross-sectional view for explaining a connection failure between upper and lower conductor patterns in a conventional through-hole connection in a manufacturing process of a multilayer ceramic electronic component by transferring a conductor pattern.
【図３】同図（ａ）〜（ｃ）は、従来の積層チップイン
ダクタの製造工程において、導体パターンの転写方法を
説明するための斜視図である。3A to 3C are perspective views for explaining a method of transferring a conductor pattern in a manufacturing process of a conventional multilayer chip inductor.
【図４】同図（ａ）〜（ｊ）は、従来の積層チップイン
ダクタの製造工程において、転写法によるコイル導体パ
ターンの積層順序を示す斜視図である。4A to 4J are perspective views showing a stacking order of coil conductor patterns by a transfer method in a manufacturing process of a conventional multilayer chip inductor.
１ セラミックグリーンシート ２ カバーシート ３ スルーホール ４ 導体パターン ５ スルーホール付グリーンシート ６ 剥離フィルム ７ 上面の平板または金型 ８ 側面の金型 ９ 弾性シート 1 Ceramic Green Sheet 2 Cover Sheet 3 Through Hole 4 Conductor Pattern 5 Green Sheet with Through Hole 6 Release Film 7 Flat Plate or Mold on Top 8 Side Mold 9 Elastic Sheet
Claims (1)
ターンを、スルーホールを設けたセラミックグリーンシ
ートに転写した後、該フィルムを剥離することを繰り返
して、積層されたセラミック磁性体中に所定のコイル導
体パターンが内設される積層体を形成する工程を含む積
層セラミック電子部品の製造方法において、金属性の対
向する上下一対の平板により、上記セラミックグリーン
シートと導体パターンが印刷された剥離フィルムを挟
み、プレス圧着して導体パターンの転写を行う際、上記
剥離フィルム上に弾性シートを載置して行うか、あるい
は平板のうち上部平板の主面に該弾性シートを張り付け
て行うことを特徴とする積層セラミック電子部品の製造
方法。1. A method of transferring a conductor pattern printed on a transparent release film onto a ceramic green sheet having through holes and then peeling off the film to repeat a predetermined process in a laminated ceramic magnetic material. In a method for manufacturing a laminated ceramic electronic component including a step of forming a laminated body in which a coil conductor pattern is provided, a release film printed with the ceramic green sheet and a conductor pattern is formed by a pair of upper and lower metallic flat plates facing each other. When the conductor pattern is transferred by sandwiching and press-bonding, the elastic sheet is placed on the release film, or the elastic sheet is attached to the main surface of the upper flat plate among the flat plates. Method for manufacturing laminated ceramic electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25062992A JPH0677075A (en) | 1992-08-26 | 1992-08-26 | Manufacture of monolithic ceramic electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25062992A JPH0677075A (en) | 1992-08-26 | 1992-08-26 | Manufacture of monolithic ceramic electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0677075A true JPH0677075A (en) | 1994-03-18 |
Family
ID=17210701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25062992A Withdrawn JPH0677075A (en) | 1992-08-26 | 1992-08-26 | Manufacture of monolithic ceramic electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0677075A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013183107A1 (en) * | 2012-06-04 | 2013-12-12 | アイトリックス株式会社 | Compressed powder molded inductor member production device, production method for compressed powder molded inductor member, and compressed powder molded inductor member |
-
1992
- 1992-08-26 JP JP25062992A patent/JPH0677075A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013183107A1 (en) * | 2012-06-04 | 2013-12-12 | アイトリックス株式会社 | Compressed powder molded inductor member production device, production method for compressed powder molded inductor member, and compressed powder molded inductor member |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991102 |