JPH0645713A - Heat resistant flexible printed wiring board and manufacture thereof - Google Patents
Heat resistant flexible printed wiring board and manufacture thereofInfo
- Publication number
- JPH0645713A JPH0645713A JP3654891A JP3654891A JPH0645713A JP H0645713 A JPH0645713 A JP H0645713A JP 3654891 A JP3654891 A JP 3654891A JP 3654891 A JP3654891 A JP 3654891A JP H0645713 A JPH0645713 A JP H0645713A
- Authority
- JP
- Japan
- Prior art keywords
- aromatic polyamide
- wiring board
- printed wiring
- heat
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はベースフィルムが芳香族
ポリアミド（アラミド）からなり、簡便な工程で経済的
に製造できる耐熱性フレキシブル印刷配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant flexible printed wiring board whose base film is made of aromatic polyamide (aramid) and which can be economically produced by a simple process.
【０００２】[0002]
【従来の技術】従来の印刷配線板の製造方法は、サブト
ラクティブ法とアディティブ法が主な方法であり、その
うち主流をなしているのはサブトラクティブ法である。
該方法は高密度、高信頼性の印刷配線板（プリント配線
板）の製造技術として完成度の極めて高い技術となって
いる。これに対し主流ではないが、より安価に印刷配線
板を製造する方法として合成樹脂絶縁板上に導体パタ―
ンを印刷ペ―スト法や蒸着法等で形成する方法も知られ
ていた。2. Description of the Related Art A conventional method for manufacturing a printed wiring board is mainly a subtractive method and an additive method, and the mainstream method is the subtractive method.
This method is an extremely high-quality technique as a technique for producing a high-density and highly reliable printed wiring board (printed wiring board). On the other hand, it is not the mainstream, but as a cheaper method of manufacturing printed wiring boards, conductor patterns are placed on synthetic resin insulation boards.
A method of forming a film by a printing paste method or a vapor deposition method has been known.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら前者のサ
ブトラクティブ法にも工程が長く、作業が繁雑であるこ
と、廃液処理などで公害が発生しないように対処する必
要があること、銅等の資源の有効活用を図る必要がある
こと、及びより一層のコストダウンが望ましいといった
点では改善が望まれているのである。本発明はこのよう
な要望に応え、後者のいわゆる印刷による方法を抜本的
に改善することにより低コストで、工程も短く容易であ
り、且つ無公害、省資源的な耐熱性フレキシブル印刷配
線板を提供することを課題とするものである。However, the former subtractive method also has a long process and is complicated in work, it is necessary to take measures so as not to cause pollution in waste liquid treatment, and resources such as copper are required. Improvements are desired in terms of the need for effective utilization and the desire for further cost reduction. The present invention responds to such a demand, and by radically improving the latter so-called printing method, a heat-resistant flexible printed wiring board which is low in cost, has a short process, is easy, and is pollution-free and resource-saving is provided. The challenge is to provide.
【０００４】[0004]
【課題を解決するための手段】そこで本発明者は方法と
しては簡便であるが高密度化、ファイン化の点では制約
があり、且つ他の性能面においても種々の問題点があっ
て、主流とはなり得なかった導電性ペ―スト印刷法をさ
らに研究した結果、芳香族ポリアミドの基板を用い、こ
れに印刷したものを加熱・加圧することによって上記課
題を一挙に解決できることを見出し本発明を完成した。
すなわち本発明は、導体パタ―ンが印刷された芳香族ポ
リアミド基材を加熱及び加圧して得た耐熱性フレキシブ
ル印刷配線板を提供するものである。Therefore, the present inventor has a simple method, but is limited in terms of high density and fineness, and has various problems in other performances. As a result of further research on a conductive paste printing method that could not be achieved, it was found that the above problems can be solved all at once by using an aromatic polyamide substrate and heating and pressurizing the printed product. Was completed.
That is, the present invention provides a heat resistant flexible printed wiring board obtained by heating and pressurizing an aromatic polyamide substrate on which a conductor pattern is printed.
【０００５】以下本発明を詳細に説明する。本発明で用
いる基材は芳香族ポリアミド基材である。即ち、主鎖中
に芳香族環構造を持つ芳香族ポリアミド（アラミドとも
いう）であって、なかでも特にポリーＰーフエニレンテ
レフタルアミドが好ましい。この芳香族ポリアミドは電
気特性がよく高強度、高弾性率、耐熱性であって、印刷
回路基板として優れた性質を有している。The present invention will be described in detail below. The base material used in the present invention is an aromatic polyamide base material. That is, it is an aromatic polyamide (also called aramid) having an aromatic ring structure in the main chain, and poly-P-phenylene terephthalamide is particularly preferable. This aromatic polyamide has good electrical characteristics, high strength, high elastic modulus, and heat resistance, and has excellent properties as a printed circuit board.
【０００６】本発明に於ては上記基材の上に導体パタ―
ンを形成するが、その際用いられる導電性ペ―ストもし
くは導電性インクとしては公知の導体、特に金属導体が
用いられるが、なかでも銀もしくは銀パラジウムのペ―
ストもしくはインクが好ましい。又その中に含まれるビ
ヒクル剤もしくはバインダ―としては熱可塑性樹脂、例
えばポリアクリル系、ポリ塩化ビニル系及びポリビニル
アセタ―ル系等の樹脂が用いられる。その他加熱加圧し
た時流動化し熱硬化する熱硬化樹脂も用いることができ
る。In the present invention, a conductor pattern is formed on the above base material.
A known conductor, particularly a metal conductor, is used as the conductive paste or conductive ink used at that time. Among them, a silver or silver-palladium paste is used.
Strokes or inks are preferred. As the vehicle agent or binder contained therein, thermoplastic resins such as polyacrylic resins, polyvinyl chloride resins and polyvinyl acetal resins are used. In addition, a thermosetting resin that fluidizes and is thermoset when heated and pressed can also be used.
【０００７】導体パタ―ンを形成するにはパタ―ン印刷
法、例えばスクリ―ン印刷法、パッド印刷法、グラビヤ
印刷法、フレキソ印刷法等が用いられる。これらの中で
スクリ―ン印刷法が特に好ましい。しかし本発明におい
ては導電性ペ―スト、例えば銀ペ―ストを用いてスクリ
―ン印刷した段階では、まだ該パタ―ン回路の電導性は
不充分な状態にある。しかし、れを加熱・加圧すること
によって、飛躍的に電導性が向上（表面抵抗値が約１／
５に低下）する。To form the conductor pattern, a pattern printing method such as a screen printing method, a pad printing method, a gravure printing method, or a flexo printing method is used. Of these, the screen printing method is particularly preferable. However, in the present invention, at the stage of screen printing using a conductive paste such as a silver paste, the electrical conductivity of the pattern circuit is still insufficient. However, by heating and pressurizing the leakage, the electrical conductivity is dramatically improved (surface resistance value is about 1 /
5).
【０００８】加熱・加圧の方法としては熱プレス法もし
くは熱ロ―ル法を用いる。加熱条件としては１６０℃以
上が好ましい。しかし、実際には導電性ペ―ストのビヒ
クル流動開始温度、基材の耐熱性等を勘案して、前もっ
て予備テストで最適加熱温度を決めておくことが望まし
い。加圧条件としては５〜１００kg／cm2 がよいが、こ
れも加熱条件と同様、予備テストで最適条件を設定して
から行うのが望ましい。As the heating / pressurizing method, a hot press method or a heat roll method is used. The heating condition is preferably 160 ° C. or higher. However, in practice, it is desirable to determine the optimum heating temperature in advance by a preliminary test in consideration of the vehicle flow starting temperature of the conductive paste and the heat resistance of the base material. The pressurizing condition is preferably 5 to 100 kg / cm 2, but like the heating condition, it is desirable to set the optimum condition in the preliminary test.
【０００９】なお、熱プレスもしくは熱ロ―ルに用いる
機械は従来からこれらに用いられている加熱プレス機、
カレンダ―加工等に用いる加熱ロ―ル機を用いることが
できる。又、熱プレス法では従来から用いられている保
護板、つや付板、クッション材、融着防止用シ―ト等を
適宜利用することもできる。これらの従来技術の利用は
熱ロ―ルの場合も同様である。The machine used for the hot press or the heat roll is a heating press machine conventionally used for these,
A heating roll machine used for calendar processing or the like can be used. Further, in the hot pressing method, conventionally used protective plates, glossy plates, cushion materials, fusion preventing sheets and the like can be appropriately used. The utilization of these prior arts is similar in the case of heat rolls.
【００１０】[0010]
【作用効果】プラスチックフィルム等を基材としてその
上に導電性ペ―ストを用いて導体パタ―ンを印刷した回
路は通常、電導性が不充分で、信号等のような極めて微
弱な電流の回路にしか利用できなかった。加熱・加圧前
の本発明の芳香族ポリアミドベースフィルム上に形成さ
れた導体パタ―ンも同様に電導性が不足しており、やは
り特殊な用途にしか使用できない。それが加熱・加圧の
工程を経た後は、表面抵抗値が約１／５に低下したた
め、電導性が飛躍的に向上したため、一挙に多用途に有
効な印刷配線板になった。[Effects] Circuits in which a conductor pattern is printed on a plastic film or the like as a base material by using a conductive paste usually have insufficient electric conductivity, and an extremely weak current such as a signal is generated. Only available for circuits. Similarly, the conductor pattern formed on the aromatic polyamide base film of the present invention before heating / pressurizing also lacks the electrical conductivity, and thus can be used only for special purposes. After passing through the heating / pressurizing process, the surface resistance value was reduced to about 1/5, and the electrical conductivity was dramatically improved.
【００１１】すなわち、銀ペ―ストでパターン印刷した
ものの表面抵抗値は大体３６ｍΩ／□であるが、これを
本発明の加熱加圧処理することにより約７ｍΩ／□に低
下することが確認されている。これに対して、従来通り
の銀ペースト印刷だけで業界で要求されている２５ｍΩ
／□以下の表面抵抗値を得ることができず、無理して達
成しようとする場合には大幅に膜圧を増すか、線巾を広
げる必要があり、もう一方の要求項目であるファインパ
ターン化が犠牲になる。That is, the surface resistance value of the pattern-printed silver paste was about 36 mΩ / □, but it was confirmed that the surface resistance value was reduced to about 7 mΩ / □ by the heat and pressure treatment of the present invention. There is. On the other hand, 25mΩ which is required in the industry only by printing silver paste as usual
If you cannot achieve a surface resistance value less than □ / □ and try to achieve it by force, it is necessary to increase the film pressure or widen the line width. Fine patterning, which is the other requirement, is required. Will be sacrificed.
【００１２】また、本発明の加熱加圧によってパターン
が形成されている層の表面が平滑、均一になり絶縁層を
オーバーコートする際の信頼性が向上した。さらに本発
明で用いる芳香族ポリアミドベースフィルムは熱収縮率
及び線膨脹係数が従来のポリエチレンテレフタレートベ
ースフィルム、ポリイミドベースフィルム等に比べ優れ
ているので、加熱加圧してもパターンの乱れがなく、寸
法精度が良好という特長も有している。Further, the surface of the layer on which the pattern is formed is smooth and uniform by the heat and pressure of the present invention, and the reliability in overcoating the insulating layer is improved. Further, since the aromatic polyamide base film used in the present invention is superior in thermal shrinkage and linear expansion coefficient to conventional polyethylene terephthalate base film, polyimide base film, etc., there is no pattern disorder even when heated and pressed, and dimensional accuracy is improved. It also has the feature of being good.
【００１３】[0013]
【実施例】以下実施例で本発明を説明する 実施例１ 厚さ５０μｍのアラミドフィルム〔旭化成工業（株）
製、アラミカ（登録商標）〕の上にポリエステル系銀ペ
ースト〔藤倉化成（株）製、トーダイト（登録商標）Ｘ
Ａ３８０Ａ〕を用いて厚さ７μｍの導体パタ―ンをスク
リ―ン印刷し、１５０℃で２分間乾燥した。このものの
抵抗値は表１に示すとおりである。次にこれを１７０℃
で４０kg／cm2 で６０分間、名機製作所（株）のホット
プレスＭＨＰＣ−３８５−７５０を用いて熱プレスし
た。次にこれにレジスト層をスクリーン印刷で形成せし
め、１５０℃で２分間乾燥してフレキシブル印刷配線板
を得た。このものの抵抗値を表１に示す。表１に示すと
おり加熱加圧前約３６ｍΩ／□前後であった表面抵抗値
が約７ｍΩ／□程度に低下しており、導電性向上が確認
された。EXAMPLES The present invention will be described below with reference to Examples. Example 1 An aramid film having a thickness of 50 μm [Asahi Kasei Co., Ltd.]
Manufactured by Aramica (registered trademark)] and polyester-based silver paste (manufactured by Fujikura Kasei Co., Ltd., Todite (registered trademark) X)
A380A] was used to screen-print a conductor pattern having a thickness of 7 μm and dried at 150 ° C. for 2 minutes. The resistance value of this product is as shown in Table 1. Then this is 170 ℃
At 40 kg / cm 2 for 60 minutes using a hot press MHPC-385-750 manufactured by Meiki Seisakusho Co., Ltd. Next, a resist layer was formed thereon by screen printing and dried at 150 ° C. for 2 minutes to obtain a flexible printed wiring board. The resistance value of this product is shown in Table 1. As shown in Table 1, the surface resistance value, which was about 36 mΩ / □ before heating and pressurization, decreased to about 7 mΩ / □, confirming improvement in conductivity.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【発明の効果】本発明により、極めて低コストで、銅箔
等のエッチングによる除去等にともなう公害対策を必要
としない、省資源的で、簡便、経済的な印刷配線板の製
造方法が実現した。又、本発明方法によって製造された
印刷配線板はフレキシブルであって、且つ安価であるか
ら、従来印刷配線板が使用しにくかったような分野での
新たな用途が期待できる。Industrial Applicability According to the present invention, a resource-saving, simple and economical method for producing a printed wiring board is realized which is extremely low in cost and does not require pollution measures associated with removal of copper foil by etching. . Further, since the printed wiring board manufactured by the method of the present invention is flexible and inexpensive, it can be expected to have new applications in fields where it has been difficult to use conventional printed wiring boards.
フロントページの続き (72)発明者 菊地 剛志 東京都台東区駒形２丁目１番５号 株式会 社緑マーク内Front Page Continuation (72) Inventor Takeshi Kikuchi 2-5 Komagata, Taito-ku, Tokyo Inside the green mark of the stock company
Claims (4)
ミド基材を加熱及び加圧して得た耐熱性フレキシブル印
刷配線板。1. A heat-resistant flexible printed wiring board obtained by heating and pressurizing an aromatic polyamide substrate on which a conductor pattern is printed.
テレフタルアミドである請求項１記載の印刷配線板。2. The printed wiring board according to claim 1, wherein the aromatic polyamide is polyparaphenylene terephthalamide.
行われる請求項１記載の印刷配線板。3. The printed wiring board according to claim 1, wherein the heating and pressing are performed by a hot press or a heat roll.
体パターンを印刷した後、乾燥しこれを熱プレス又は熱
ロールで加熱加圧し、ついでオーバーコート層を印刷し
乾燥することを特徴とする耐熱性フレキシブル印刷配線
板の製造方法。4. A heat-resistant flexible material, characterized in that after a conductor pattern is printed on an aromatic polyamide base film, it is dried, and this is heated and pressed by a hot press or a hot roll, and then an overcoat layer is printed and dried. Manufacturing method of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3654891A JPH0645713A (en) | 1991-02-07 | 1991-02-07 | Heat resistant flexible printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3654891A JPH0645713A (en) | 1991-02-07 | 1991-02-07 | Heat resistant flexible printed wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0645713A true JPH0645713A (en) | 1994-02-18 |
Family
ID=12472823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3654891A Pending JPH0645713A (en) | 1991-02-07 | 1991-02-07 | Heat resistant flexible printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645713A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652276A (en) * | 1994-11-15 | 1997-07-29 | Kanegafuchi Chemical Industry Co., Ltd. | Foaming resin composition, plastic foam formed from the composition, and method for forming the plastic foam |
| KR20160102166A (en) * | 2013-11-01 | 2016-08-29 | 피피지 인더스트리즈 오하이오 인코포레이티드 | Methods of transferring electrically conductive materials |
-
1991
- 1991-02-07 JP JP3654891A patent/JPH0645713A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652276A (en) * | 1994-11-15 | 1997-07-29 | Kanegafuchi Chemical Industry Co., Ltd. | Foaming resin composition, plastic foam formed from the composition, and method for forming the plastic foam |
| KR20160102166A (en) * | 2013-11-01 | 2016-08-29 | 피피지 인더스트리즈 오하이오 인코포레이티드 | Methods of transferring electrically conductive materials |
| JP2016536810A (en) * | 2013-11-01 | 2016-11-24 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドＰＰＧ Ｉｎｄｕｓｔｒｉｅｓ Ｏｈｉｏ，Ｉｎｃ． | Method for transferring conductive material |
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