JPH0640554B2 - Mounting method for gold wire for die bonding - Google Patents

Mounting method for gold wire for die bonding

Info

Publication number
JPH0640554B2
JPH0640554B2 JP60223984A JP22398485A JPH0640554B2 JP H0640554 B2 JPH0640554 B2 JP H0640554B2 JP 60223984 A JP60223984 A JP 60223984A JP 22398485 A JP22398485 A JP 22398485A JP H0640554 B2 JPH0640554 B2 JP H0640554B2
Authority
JP
Japan
Prior art keywords
gold wire
tool
clamper
bent portion
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60223984A
Other languages
Japanese (ja)
Other versions
JPS6284526A (en
Inventor
公司 柴田
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP60223984A priority Critical patent/JPH0640554B2/en
Publication of JPS6284526A publication Critical patent/JPS6284526A/en
Publication of JPH0640554B2 publication Critical patent/JPH0640554B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） この発明はダイボンディング用金線のマウント方法に関
する。The present invention relates to a method for mounting a gold wire for die bonding.

（従来の技術） 第４図に示すように半導体のペレットＰをフレームＦな
どの表面にダイボンディングするのに、そのフレームＦ
の表面に金をメッキしておき、これを加熱した状態で表
面にペレットをのせて付着するのが普通であるが、この
メッキによる金に代えてフレームＦの表面に金線Ａをボ
ンディングなどによってマウントし、これを加熱して溶
融状態としてから、その表面にペレットＰをのせること
によってダイボンディングすることが行われている。(Prior Art) As shown in FIG. 4, when a semiconductor pellet P is die-bonded to the surface of a frame F or the like, the frame F
It is common to deposit gold on the surface of the plate and attach the pellet by placing the pellet on the surface in a heated state. Instead of the plated gold, the gold wire A is bonded to the surface of the frame F by bonding or the like. It is carried out by mounting and mounting the pellets P on the surface of the mounted body after heating and melting it.

第２図は従来の金線のマウント方法を説明するためのも
ので、リールなどから繰り出されてくる金線Ａは、クラ
ンパＣ内を通り、ボンディング用のツールＴを貫通して
引き出されている。第２図Ａに示すようにツールＴから
出ている金線Ａの先端は既にＬ状に屈曲されて屈曲部Ｂ
が形成されてあるものとし、またクランパＣはオープン
されているものとする。FIG. 2 is for explaining a conventional method for mounting a gold wire. The gold wire A fed from a reel or the like passes through the clamper C and is drawn out through the bonding tool T. . As shown in FIG. 2A, the tip of the gold wire A protruding from the tool T has already been bent into an L shape, and the bent portion B has been bent.
Is formed, and the clamper C is opened.

まず金線Ａが繰り出されてその先端の屈曲部Ｂをフレー
ムＦの表面に第２図Ｂに示すようにのせる。ついでツー
ルＴを下降させて屈曲部Ｂの一端をフレームＦに押し付
けて融着（ボンディング）し、これによって屈曲部Ｂを
フレームＦにマウントする。次にツールＴを第２図Ｃに
示すように距離Ｌだけ上昇させる。この上昇によって次
の屈曲部Ｂを形成するための金線が、ツールＴからあた
かも繰り出されるようになる。First, the gold wire A is paid out, and the bent portion B at its tip is placed on the surface of the frame F as shown in FIG. 2B. Then, the tool T is lowered and one end of the bent portion B is pressed against the frame F to be fused (bonded), whereby the bent portion B is mounted on the frame F. Next, the tool T is raised by the distance L as shown in FIG. 2C. Due to this rise, the gold wire for forming the next bent portion B comes to be extended from the tool T.

一方これまでの間にクランパＣは若干降下され、その降
下のあとクローズされて金線Ａをクランプする。そして
ここでクローズされたクランパＣを当初の位置まで引き
上げると、この引き上げによって金線Ａは屈曲部Ｂから
引きちぎられるようにしてカットされる。この状態を示
したのが第２図Ｄである。On the other hand, the clamper C is slightly lowered so far, and after that, it is closed to clamp the gold wire A. Then, when the clamper C closed here is pulled up to the initial position, the gold wire A is cut so as to be torn from the bent portion B by this pulling up. This state is shown in FIG. 2D.

このあとベンディング用のアームＭが矢印方向により駆
動されてきて、ツールＴの先端から出ている金線を屈曲
する（第２図Ｅ参照。）。この屈曲のあとクランパＣは
オープンされ、当初の状態に戻る。After that, the bending arm M is driven in the direction of the arrow to bend the gold wire protruding from the tip of the tool T (see FIG. 2E). After this bending, the clamper C is opened and returns to the initial state.

以上の説明からも理解されるように、第２図ＣからＤの
状態に移るとき、ツールＴを上昇させたときこれにつら
れて金線が繰り入れられるのを防ぐためにクランパＣが
用意され、このときクランパＣをクローズすることによ
って金線Ａをグリップして、その繰り入れを防止してい
る。As can be understood from the above description, the clamper C is provided in order to prevent the gold wire from being drawn in when the tool T is moved up when the state is changed from C to D in FIG. At this time, the clamper C is closed to grip the gold wire A and prevent it from being fed in.

一方第２図Ａの状態においては、金線を繰り出す必要が
あるとことから、クランパＣはオープンされていなれれ
ばならないので、第２図Ｅ以降においてクランパＣはオ
ープンされる。On the other hand, in the state of FIG. 2A, since the gold wire needs to be paid out, the clamper C has to be open, so the clamper C is opened after FIG. 2E.

ところがこのときのクランパＣのオープンによって金線
のグリップを解除すると、それ以前の金線のカール状態
あるいはベンディング状態に基づく復元力によってトー
ションが作用し、そのため金線が移動したり、よじれる
ように回転したりすることがある。However, when the grip of the gold wire is released by opening the clamper C at this time, torsion acts due to the restoring force based on the curl state or bending state of the gold wire before that, and therefore the gold wire moves or twists and rotates. There is something to do.

そのため第３図に示すようにフレーム上のペレットＰの
ダイボンディング領域Ｑが鎖線で示す範囲であったとす
ると、本来ならば屈曲部Ｂは領域Ｑのセンターにマウン
トされなければならないのに、点線で示すようにセンタ
ーから外れてマウントされてしまうようになる。このよ
うな位置にマウントされるようなことがあると、ペレッ
トＰのフレームに対するダイボンディングが極めて不安
定となる。Therefore, assuming that the die bonding area Q of the pellet P on the frame is within the range shown by the chain line as shown in FIG. 3, the bent portion B should be mounted at the center of the area Q, but is shown by the dotted line. As shown, it will be mounted off the center. If it is mounted at such a position, die bonding of the pellet P to the frame becomes extremely unstable.

（発明が解決しようとする問題点） この発明はトーションが作用することがあっても、ダイ
ボンディング用の金線のマウント位置の安定化を図るこ
とを目的とする。(Problems to be Solved by the Invention) An object of the present invention is to stabilize the mount position of a gold wire for die bonding even if a torsion acts.

（問題点を解決するための手段） この発明は金線をクランパによってグリップしたまま
で、屈曲部形成のためのベンディングから、その屈曲部
のフレームへのボンディングを実施するとともに、ボン
ディング後からツールの、このツールからの金線の繰り
出しのための引き上げまでの間にクランパを上昇させる
ようにし、この上昇の際のみクランパをオープンとして
そのグリップを解除するようにしたことを特徴とする。(Means for Solving the Problems) The present invention carries out bonding from the bending for forming the bent portion to the frame of the bent portion while gripping the gold wire by the clamper, and after the bonding, The feature is that the clamper is raised before the pulling up of the gold wire from the tool, and the gripper is opened and the grip is released only when the clamper is raised.

（実施例） この発明の実施例を第１図によって説明すると、金線Ａ
は、クランパＣ内を通り、ボンディング用のツールＴを
貫通して引き出されている。第１図Ａに示すようにツー
ルＴから出ている金線Ａの先端は既にＬ状に屈曲されて
屈曲部Ｂが形成されてあるものする。これらの状態は従
来と同様である。しかしクランパＣは既にクローズされ
ているものとする。(Embodiment) The embodiment of the present invention will be described with reference to FIG.
Passes through the clamper C, penetrates the bonding tool T, and is drawn out. As shown in FIG. 1A, it is assumed that the tip of the gold wire A extending from the tool T is already bent in an L shape to form a bent portion B. These states are the same as the conventional ones. However, it is assumed that the clamper C is already closed.

まず金線ＡはクランパＣによってグリップされた状態で
クランパＣが下降し、屈曲部ＢをフレームＦの表面に第
１図Ｂに示すようにのせる。この時クランパＣと一体的
にツールＴも下降させる。そしてツールＴによって屈曲
部Ｂの一端をフレームＦに押し付けて融着（ボンディン
グ）し、これによって屈曲部ＢをフレームＦにマウント
する。First, the clamper C descends while the gold wire A is gripped by the clamper C, and the bent portion B is placed on the surface of the frame F as shown in FIG. 1B. At this time, the tool T is also lowered integrally with the clamper C. Then, one end of the bent portion B is pressed against the frame F by the tool T to be fused (bonded), whereby the bent portion B is mounted on the frame F.

次にツールＴをそのボンディング状態としたままで、ク
ランパＣをオープンにして金線のグリップを解除した状
態で、第１図Ｃに示すように若干上昇させ、そのあと再
びクローズする。この上昇によって次の屈曲部Ｂ分のた
めのツールＴの引き上げ行程が確保されるようになる。
またこのクランプＣはその上昇の際オープンにされ、金
線のグリップを解除しているので、クランパＣは金線の
引き上げを伴わずに上昇するようになる。Next, with the tool T kept in the bonding state, the clamper C is opened and the grip of the gold wire is released, and the tool T is slightly raised as shown in FIG. 1C, and then closed again. By this rise, the pulling stroke of the tool T for the next bent portion B is secured.
Further, since the clamp C is opened at the time of its ascent to release the grip of the gold wire, the clamper C comes to ascend without pulling up the gold wire.

このあと第１図Ｄに示すよういツールＴを距離Ｌだけ引
き上げる。引き上げによって金線が、ツールＴからあた
かも繰り出されるようになる。ついで金線をグリップし
た状態にあるクランパＣをツールＴとともに当初の位置
まで引き上げると、この引き上げによって金線Ａは屈曲
部Ｂから引きちぎられるようにしてカットされる。この
状態を示したのが第１図Ｅである。Thereafter, the tool T as shown in FIG. 1D is pulled up by the distance L. By pulling up, the gold wire comes to be extended from the tool T. Then, when the clamper C holding the gold wire is pulled up to the initial position together with the tool T, the gold wire A is cut off from the bent portion B by this pulling up. This state is shown in FIG. 1E.

ここで従来と同様にベンディング用のアームＭが矢印方
向より駆動されてきて、ツールＴの先端から出ている金
線を屈曲する（第１図Ｅ参照。）。この屈曲によって当
初の状態に戻る。Here, similarly to the conventional case, the bending arm M is driven in the direction of the arrow to bend the gold wire extending from the tip of the tool T (see FIG. 1E). This bending restores the original condition.

以上の行程において、金線Ａはクランパによってグリッ
プされたままで、金線のベンディングからボンディング
まで実施するようにしたので、屈曲部のベンディング時
において、金線が回転するようなことは確実に回避され
る。In the above process, since the gold wire A is gripped by the clamper and the bending of the gold wire to the bonding are performed, the gold wire is surely prevented from rotating during bending of the bent portion. It

（発明の効果） 以上詳述したようにこの発明によれば、ダイボンディン
グ用の金線のマウント位置を、金線にトーションがかか
っていても簡単にしかも確実に安定化し得るといった効
果を奏する。(Effect of the Invention) As described in detail above, according to the present invention, there is an effect that the mount position of the gold wire for die bonding can be easily and reliably stabilized even if the gold wire is under torsion.

【図面の簡単な説明】 第１図はこの発明の実施例行程を示す正面図、第２図は
従来工程を示す正面図、第３図は金線のマウント状態を
示す平面図、第４図はペレットのボンディング状態を示
す断面図である。 Ｆ……フレーム、Ａ……金線、Ｂ……屈曲部、Ｃ……ク
ランパ、Ｔ……ツール、Ｐ……ペレット、BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing an embodiment process of the present invention, FIG. 2 is a front view showing a conventional process, FIG. 3 is a plan view showing a mounted state of a gold wire, and FIG. FIG. 4 is a cross-sectional view showing a bonding state of pellets. F ... Frame, A ... Gold wire, B ... Bend, C ... Clamper, T ... Tool, P ... Pellet,

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】金線をクランパによってグリップしたまま
で、ツールから繰り出された前記金線の先端を、屈曲部
形成のためにベンディングし、および前記ツール、グリ
ップを下降させて、前記屈曲部を前記ツールにより被ボ
ンディング位置にボンディングする工程、 前記ツールによるボディングのあと、前記ツールをボン
ディング状態としたままで、前記クランパをオープンと
して前記金線のグリップを解除して上昇させ、その上昇
後において前記クランパをクローズして前記金線を再び
グリップする工程、 前記クランパが再び前記金線をグリップしたあと、前記
金線の繰り出しのために前記ツールを引き上げる工程、 および前記ツールを引き上げたあと、前記金線をグリッ
プしている前記クランパを前記ツールとともに引き上げ
て、前記屈曲部から前記金線をカットする工程とからな
る ダイボンディング用金線のマウント方法。1. The gold wire is gripped by a clamper, and the tip of the gold wire fed from the tool is bent to form a bent portion, and the tool and the grip are lowered to move the bent portion. Bonding to a bonded position by the tool, after boding by the tool, the clamper is opened and the grip of the gold wire is released and raised while the tool is in the bonding state, and after that, Closing the clamper and gripping the gold wire again, the gripper gripping the gold wire again, and then pulling up the tool for feeding the gold wire; and pulling up the tool, the gold wire Pull up the clamper gripping the wire together with the tool, Die bonding mold line of the mount method of the curved portions and a step for cutting the gold wire.
JP60223984A 1985-10-08 1985-10-08 Mounting method for gold wire for die bonding Expired - Lifetime JPH0640554B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60223984A JPH0640554B2 (en) 1985-10-08 1985-10-08 Mounting method for gold wire for die bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60223984A JPH0640554B2 (en) 1985-10-08 1985-10-08 Mounting method for gold wire for die bonding

Publications (2)

Publication Number Publication Date
JPS6284526A JPS6284526A (en) 1987-04-18
JPH0640554B2 true JPH0640554B2 (en) 1994-05-25

Family

ID=16806754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60223984A Expired - Lifetime JPH0640554B2 (en) 1985-10-08 1985-10-08 Mounting method for gold wire for die bonding

Country Status (1)

Country Link
JP (1) JPH0640554B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2531046B2 (en) * 1991-08-31 1996-09-04 株式会社ニレコ Optical line mark detector

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125842A (en) * 1982-01-22 1983-07-27 Toshiba Corp Wire bonding device

Also Published As

Publication number Publication date
JPS6284526A (en) 1987-04-18

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