JPH0228338A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPH0228338A
JPH0228338A JP63178418A JP17841888A JPH0228338A JP H0228338 A JPH0228338 A JP H0228338A JP 63178418 A JP63178418 A JP 63178418A JP 17841888 A JP17841888 A JP 17841888A JP H0228338 A JPH0228338 A JP H0228338A
Authority
JP
Japan
Prior art keywords
wire
tool
bonding
tip
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63178418A
Other languages
Japanese (ja)
Inventor
Koichi Togashi
富樫　孝市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63178418A priority Critical patent/JPH0228338A/en
Publication of JPH0228338A publication Critical patent/JPH0228338A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a bonded part from peeling off and suppress dispersion of tail lengths by cutting a wire by moving a tool backward with a clamp closed after bonding at a second bonding point. CONSTITUTION:After a wire 5 is bonded at a second bonding point, a tool 3 is moved backward with a clamp 4 closed to cut the wire 5. Therefore, force upward will not act on the wire 5 to prevent the bonded part of the wire 5 from peeling off. After the tool 3 is raised and the wire 5 is sent out of the tip of the tool 3, the sent-out part of the wire 5 is shaped by bending by moving the tool 3 diagonally to the lower behind to always obtain tails of a constant length equal to the length of the sent-out part. This prevents the bonded part from peeling off and suppresses dispersion of the lengths of the tail at the tip of the tool.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明はワイヤフィード角を９ｏ°とするＵＳ（超音波
ワイヤボンディング）又はＵＳＣ（超音波併用熱圧着ワ
イヤボンディング）等のワイヤボンディング方法に関し
、特に、ワイヤ切断及びワイヤ成形工程を改良したワイ
ヤボンディング方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wire bonding method such as US (ultrasonic wire bonding) or USC (ultrasonic thermocompression wire bonding) in which the wire feed angle is 9o°. In particular, the present invention relates to a wire bonding method with improved wire cutting and wire forming steps.

［従来の技術］ 第２図（ａ）乃至（Ｃ）は従来のこの種のワイヤボンデ
ィング方法を工程順に示す模式図である。[Prior Art] FIGS. 2(a) to 2(C) are schematic diagrams showing a conventional wire bonding method of this type in order of steps.

ワイヤ５をペレット１上の端子における第１ボンド点に
ボンディングした後、第２図（ａ）に示すように、ワイ
ヤ５を外部リード２上の第２ボンド点にボンディングす
る。なお、図中６はボンディングヘッド（図示せず）に
取付けられた超音波発振ホーンであり、この超音波発振
ホーン６はワイヤ５及びツール３を超音波振動させる。After bonding the wire 5 to the first bond point on the terminal on the pellet 1, the wire 5 is bonded to the second bond point on the external lead 2, as shown in FIG. 2(a). Note that 6 in the figure is an ultrasonic oscillation horn attached to a bonding head (not shown), and this ultrasonic oscillation horn 6 causes the wire 5 and tool 3 to ultrasonically vibrate.

次いで、クランプ４を開いた状態でツール３を若干上昇
させ、その後、第２図（ｂ）に示すようにクランプ４を
閉じてツール３を後方（第１ボンド点から遠ざかる方向
）の斜め下方に移動させる。そして、第２図（Ｃ）に示
すようにツール３が被ボンデイング材の外部リード２に
接触する直前にツール３を後方の水平方向に移動させて
ワイヤ５を切断する。Next, the tool 3 is raised slightly with the clamp 4 open, and then, as shown in FIG. move it. Then, as shown in FIG. 2C, just before the tool 3 comes into contact with the external lead 2 of the material to be bonded, the tool 3 is moved backward in the horizontal direction to cut the wire 5.

［発明が解決しようとする課題］ しかしながら、上述した従来のワイヤボンディング方法
においては、ワイヤ５を第２ボンド点にボンディングし
た後、クランプ４を開いてツール３を上昇させることに
より、ツール３の先端からワイヤ５を若干進出させ、そ
の後、クランプ４を閉じてツール３によりワイヤ５を引
っ張って切断するため、ワイヤ５が切断される前にボン
ディング部が剥離しやすいという欠点がある。また、ワ
イヤネック部の強度の相違により、ワイヤ切断位置が異
なるため、ツール３の先端から下方に突出するワイヤ５
のテールの長さがばらつくという欠点がある。[Problems to be Solved by the Invention] However, in the conventional wire bonding method described above, after bonding the wire 5 to the second bonding point, the tip of the tool 3 is removed by opening the clamp 4 and raising the tool 3. Since the wire 5 is advanced slightly from the wire 5 and then the clamp 4 is closed and the wire 5 is pulled and cut by the tool 3, there is a drawback that the bonding part is likely to peel off before the wire 5 is cut. In addition, since the wire cutting position differs due to the difference in the strength of the wire neck portion, the wire 5 protrudes downward from the tip of the tool 3.
The disadvantage is that the length of the tail varies.

本発明はかかる問題点に鑑みてなされたものであって、
ホンディング部の剥離が抑制されると共に、ツール先端
のテール長のバラツキが抑制されたワイヤボンディング
方法を提供することを目的とする。The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a wire bonding method in which peeling of a bonding part is suppressed and variation in tail length of a tool tip is suppressed.

［課題を解決するための手段］ 本発明に係るワイヤボンディング方法は、ワイヤを第１
ボンド点にボンディングした後、第２ボンド点にボンデ
ィングする工程と、クランプを閉じた状態でツールを第
１ボンド点から遠ざかる後方に移動させてワイヤを切断
する工程と、ツールを上昇させると共にツールの先端が
らワイヤを送り出す工程と、前記ツールを後方の斜め下
方に移動させて前記ツールの先端から出ている部分のワ
イヤを曲げ成形する工程と、を有することを特徴とする
。[Means for Solving the Problems] A wire bonding method according to the present invention includes a wire bonding method in which a wire is
After bonding to the bond point, bonding to a second bond point; moving the tool backward away from the first bond point with the clamp closed to cut the wire; and raising the tool and cutting the wire. The method is characterized by comprising the steps of sending out the wire from the tip, and moving the tool backward and diagonally downward to bend and shape the portion of the wire protruding from the tip of the tool.

［作用］ 本発明においては、ワイヤを第２ボンド点にボンディン
グした後、クランプを閉じた状態でそのまま、ツールを
後方に移動させてワイヤを切断する。従って、ワイヤに
は上方への力は作用しないから、ワイヤのボンディング
部が剥離することが抑制される。次いで、ツールを上昇
させると共に、ツールの先端からワイヤを送り出した後
、ツールを後方の斜め下方に移動させてこの送り出した
部分を曲げ成形するから、常にこの送り出した部分に相
当する長さの一定長のテール部分が得られる。[Operation] In the present invention, after bonding the wire to the second bond point, the tool is moved rearward with the clamp closed to cut the wire. Therefore, since no upward force is applied to the wire, peeling of the bonding portion of the wire is suppressed. Next, as the tool is raised, the wire is sent out from the tip of the tool, and then the tool is moved backward and diagonally downward to bend and form this sent out part, so the wire is always of a constant length corresponding to this sent out part. A long tail is obtained.

［実施例］ 次に、本発明の実施例について添付の図面を参照して具
体的に説明する。[Example] Next, an example of the present invention will be specifically described with reference to the accompanying drawings.

第１図（ａ）乃至（ｃ）は本発明の実施例方法を工程順
に示す模式図である。先ず、第１図（ａ）に示すように
、ペレット１の所定の端子の第１７にンド点にワイヤ５
をボンディングした後、ワイヤ５が挿通されたツール３
に超音波発振ホーン６により超音波振動を印加しつつ外
部リード２上の第２ボンド点にワイヤ５をボンディング
する。FIGS. 1(a) to 1(c) are schematic diagrams showing an example method of the present invention in order of steps. First, as shown in FIG.
After bonding, the tool 3 into which the wire 5 is inserted
Then, the wire 5 is bonded to the second bonding point on the external lead 2 while applying ultrasonic vibration using the ultrasonic oscillation horn 6.

次いで、クランプ４を閉じた状態でツール３を後方に、
つまり、第１のボンド点から遠ざかる方向に、水平移動
させ、ワイヤ５をツール３のネック部分で切断する。Next, with the clamp 4 closed, move the tool 3 backwards.
That is, the wire 5 is cut by the neck portion of the tool 3 by horizontal movement in a direction away from the first bond point.

その後、第１図（ｂ）に示すように、ツール３を上昇さ
せると共に、ワイヤ５をツール３の先端から送り出し、
これにより、ツール３の先端から所定長のワイヤ５を進
出させる。Thereafter, as shown in FIG. 1(b), the tool 3 is raised and the wire 5 is sent out from the tip of the tool 3.
As a result, a predetermined length of wire 5 is advanced from the tip of the tool 3.

次いで、図中矢印にて示すようにツール３を後方の斜め
下方に向けて移動させる。そうすると、ツール３の先端
から突出しているワイヤ５の部分が外部リード２に接触
し、ツール３が更に斜め下方に移動すると、このツール
３の先端のワイヤ５部分が折り曲げられてテール部分が
形成される。Next, the tool 3 is moved backward and diagonally downward as shown by the arrow in the figure. Then, the part of the wire 5 protruding from the tip of the tool 3 comes into contact with the external lead 2, and when the tool 3 moves further diagonally downward, the part of the wire 5 at the tip of the tool 3 is bent to form a tail part. Ru.

ツール３は外部リード２との間でワイヤ５のテール部分
を挾み込む位置まで下降する。これにより、ワイヤ５の
先端にテール部分を成形する。The tool 3 is lowered to a position where the tail portion of the wire 5 is sandwiched between the tool 3 and the external lead 2. As a result, a tail portion is formed at the tip of the wire 5.

次いで、第１図（ｃ）に示すように、ツール３を上昇さ
せ、次順のワイヤボンディング工程において、上述の動
作を繰返す。Next, as shown in FIG. 1(c), the tool 3 is raised and the above-described operation is repeated in the next wire bonding process.

本実施例方法においては、ワイヤ５を第２ボンド点にて
ボンディングした後、ツール３を後方に且つ水平方向に
移動させてワイヤ５を切断するから、この切断工程にお
いては、ワイヤ５のボンディング部において上方に向う
力は作用しない。従って、ボンディング部の剥離が防止
される。In the method of this embodiment, after the wire 5 is bonded at the second bond point, the tool 3 is moved backward and horizontally to cut the wire 5. No upward force acts on . Therefore, peeling of the bonding portion is prevented.

そして、ワイヤ５のテール部分は、切断後にワイヤ５を
ツール３の先端から所定長送り出すことにより設定し、
この送出部分をツール３を斜め下方に移動させることに
よりツール３と外部リード２との間で曲げ成形してテー
ル部をつくる。従って、このテール部の長さは切断位置
に無関係であるから、常に所定の一定長に調節すること
ができる。Then, the tail portion of the wire 5 is set by feeding the wire 5 a predetermined length from the tip of the tool 3 after cutting,
By moving the tool 3 obliquely downward, this delivery portion is bent and formed between the tool 3 and the external lead 2 to form a tail portion. Therefore, since the length of this tail portion is independent of the cutting position, it can always be adjusted to a predetermined constant length.

［発明の効果］ 以上説明したように本発明によれば、第２ボンド点にボ
ンディングした後クランプを閉じたままツールを後方に
移動させてワイヤを切断するから、ボンディング部の剥
離が防止され、テール長のバラツキが抑制される。[Effects of the Invention] As explained above, according to the present invention, after bonding to the second bond point, the tool is moved backward with the clamp closed to cut the wire, so peeling of the bonded part is prevented. Variations in tail length are suppressed.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）乃至（ｃ）は本発明の実施例に係るワイヤ
ボンディング方法を工程順に示す模式図、第２図（ａ）
乃至（Ｃ）は従来方法を示す模式図である。 １；ベレット、２；外部リード、３；ツール、４；クラ
ンプ、５；ワイヤ、６：超音波発振ホーンFIGS. 1(a) to (c) are schematic diagrams showing the wire bonding method according to the embodiment of the present invention in the order of steps, and FIG. 2(a)
7(C) are schematic diagrams showing the conventional method. 1; Bellet, 2; External lead, 3; Tool, 4; Clamp, 5; Wire, 6: Ultrasonic oscillation horn

Claims (1)

【特許請求の範囲】[Claims] （１）ワイヤを第１ボンド点にボンディングした後、第
２ボンド点にボンディングする工程と、クランプを閉じ
た状態でツールを第１ボンド点から遠ざかる後方に移動
させてワイヤを切断する工程と、ツールを上昇させると
共にツールの先端からワイヤを送り出す工程と、前記ツ
ールを後方の斜め下方に移動させて前記ツールの先端か
ら出ている部分のワイヤを曲げ成形する工程と、を有す
ることを特徴とするワイヤボンディング方法。(1) bonding the wire to the first bond point and then bonding it to the second bond point; and cutting the wire by moving the tool backward away from the first bond point with the clamp closed; It is characterized by comprising the steps of raising the tool and sending out the wire from the tip of the tool, and moving the tool backward and diagonally downward to bend and shape the portion of the wire protruding from the tip of the tool. wire bonding method.
JP63178418A 1988-07-18 1988-07-18 Wire bonding method Pending JPH0228338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63178418A JPH0228338A (en) 1988-07-18 1988-07-18 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63178418A JPH0228338A (en) 1988-07-18 1988-07-18 Wire bonding method

Publications (1)

Publication Number Publication Date
JPH0228338A true JPH0228338A (en) 1990-01-30

Family

ID=16048151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63178418A Pending JPH0228338A (en) 1988-07-18 1988-07-18 Wire bonding method

Country Status (1)

Country Link
JP (1) JPH0228338A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160115990A (en) * 2014-02-10 2016-10-06 가부시키가이샤 신가와 Method for producing semiconductor device and wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160115990A (en) * 2014-02-10 2016-10-06 가부시키가이샤 신가와 Method for producing semiconductor device and wire bonding device
US20160351535A1 (en) * 2014-02-10 2016-12-01 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US9978713B2 (en) * 2014-02-10 2018-05-22 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus

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