JPH025533Y2 - - Google Patents

Info

Publication number
JPH025533Y2
JPH025533Y2 JP1984074879U JP7487984U JPH025533Y2 JP H025533 Y2 JPH025533 Y2 JP H025533Y2 JP 1984074879 U JP1984074879 U JP 1984074879U JP 7487984 U JP7487984 U JP 7487984U JP H025533 Y2 JPH025533 Y2 JP H025533Y2
Authority
JP
Japan
Prior art keywords
wire
capillary
clamper
spark
torch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984074879U
Other languages
Japanese (ja)
Other versions
JPS60187537U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984074879U priority Critical patent/JPS60187537U/en
Publication of JPS60187537U publication Critical patent/JPS60187537U/en
Application granted granted Critical
Publication of JPH025533Y2 publication Critical patent/JPH025533Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【考案の詳細な説明】 〔考案の利用分野〕 本考案は、半導体製品の製造工程において、半
導体部品とリード側とを電気的に接続するための
ワイヤの接続に使用される自動ワイヤボンダに関
する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an automatic wire bonder used for connecting wires for electrically connecting semiconductor components and leads in the manufacturing process of semiconductor products.

〔考案の背景〕[Background of the idea]

半導体製品の製造に用いられる自動ワイヤボン
ダは、電気トーチとキヤピラリーの下端に突出し
たワイヤの先端との間にスパークを発生させ、ワ
イヤを溶かしてボール状にし、このワイヤのボー
ルをパターン認識装置が検知した半導体製品であ
るチツプ上の所定位置にキヤピラリーをもつて押
圧固着し、その後ワイヤを引き出しつつキヤピラ
リーをチツプ側に移動し、ワイヤをチツプ側に固
着する。その後、キヤピラリーをある程度引き上
げた段階においてクランパによりワイヤを把持
し、さらにキヤピラリーを引き上げてワイヤを切
断するようになつている。この自動ワイヤボンダ
は、トーチによるスパークの発生がない場合、ワ
イヤ切れとして装置が停止するようになつてい
る。そして、従来ワイヤ切れが発生して装置が停
止すると、作業者がピンセツトによりワイヤを挟
んで繰り出し、リード側に捨てボンドを行つた
後、ボールを作るようにしている。 Automatic wire bonders used in the manufacture of semiconductor products generate a spark between an electric torch and the tip of a wire protruding from the bottom end of a capillary, melting the wire into a ball that is detected by a pattern recognition device. A capillary is pressed and fixed to a predetermined position on a chip, which is a semiconductor product, and then the capillary is moved to the chip side while pulling out the wire, and the wire is fixed to the chip side. Thereafter, when the capillary has been pulled up to a certain extent, the clamper grips the wire, and the capillary is further pulled up to cut the wire. This automatic wire bonder is designed so that if no spark is generated by the torch, the wire breaks and the device stops. Conventionally, when a wire breakage occurs and the device stops, an operator would pinch the wire with tweezers and feed it out, make a discard bond on the lead side, and then make a ball.

ところが、ワイヤ切れにより装置が停止するも
のの中には、単にスプールにおけるワイヤの絡み
等によつてワイヤが切断し、キヤピラリーから抜
けてしまうものの他に、ワイヤがキヤピラリーの
下方に出ている場合やキヤピラリーの中に留まつ
ている場合も多い。即ち、ワイヤが適切に切断さ
れたにもかかわらず電気トーチのスパーク不良、
ワイヤクランパの作動不良によりワイヤが切断さ
れない場合、ワイヤを接続したチツプが剥がれて
しまう場合、ボンド不良によりワイヤが固着され
なかつた場合等の場合においてもアークの発生が
なく、ワイヤ切れと判断されて装置が停止してし
まう。このような場合においても、装置の停止に
伴い作業者が前記した捨てボンド作業を行わなけ
ればならない。このため、作業者による捨てボン
ド作業の回数が増加すると、装置の稼動率が低下
する。また、ワイヤのボンド工程は、ヒータブロ
ツク部において行われるため、ヒータブロツク部
における滞留時間が増加すると、共晶合金の成分
が変化する等の品質面においても悪影響を及ぼ
す。 However, some of the cases where the equipment stops due to wire breakage include cases where the wire is simply cut due to entanglement in the spool and comes out of the capillary, as well as cases where the wire protrudes below the capillary or It often remains inside. i.e. failure to spark the electric torch even though the wire was properly cut;
Even in cases such as when the wire is not cut due to a malfunction of the wire clamper, when the chip to which the wire is connected is peeled off, or when the wire is not fixed due to a bond failure, no arc occurs and the wire is determined to be broken. The device stops. Even in such a case, the operator must perform the above-mentioned disposal bond operation when the apparatus is stopped. Therefore, as the number of times the worker performs the discard bond work increases, the operating rate of the device decreases. Furthermore, since the wire bonding process is performed in the heater block, an increase in the residence time in the heater block will have an adverse effect on quality, such as a change in the composition of the eutectic alloy.

〔考案の目的〕[Purpose of invention]

本考案は、スパークの発生がなくワイヤ切れと
判断された場合において、作業者による捨てボン
ド作業の回数を減少することができる自動ワイヤ
ボンダを提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic wire bonder that can reduce the number of times an operator performs discard bonding operations when it is determined that the wire is broken without the generation of sparks.

〔考案の概要〕[Summary of the idea]

本考案は、トーチによるスパークの発生がなく
ワイヤ切れと判断された場合に、ワイヤがキヤピ
ラリーから抜けてしまつたか否かに関係なく自動
的に捨てボンドするようにし、ワイヤがキヤピラ
リー内に残つている場合における作業者の捨てボ
ンド作業をなくし、上記目的を達成できるように
構成したものである。 The present invention automatically discards the wire when it is determined that the wire is broken because no spark is generated by the torch, regardless of whether the wire has come out of the capillary or not. This is designed to eliminate the need for waste bond work by workers when there is a need for a worker, and to achieve the above objective.

〔考案の実施例〕[Example of idea]

本考案に係る自動ワイヤボンダの好ましい実施
例を、添付図面に従つて詳説する。 A preferred embodiment of the automatic wire bonder according to the present invention will be described in detail with reference to the accompanying drawings.

第１図は、本考案に係る自動ワイヤボンダの主
要部を示す正面図である。第１図において、ベー
ス１０上に設けた本体部１２には、アームスライ
ドユニツト１４が取り付けてある。このアームス
ライドユニツト１４は、矢印１６に示すごとく本
体部１２の側面を上下動することができ、側面下
部にボンテイングアーム１８が設けてある。この
ボンデイングアーム１８は、基部から先端に向け
漸次細くなつており、先端部にキヤピラリー２０
が設けてある。このキヤピラリー２０の近くに
は、電気トーチの電極２２が配置してある。そし
て、ボンデイングアーム１８の上方には、クラン
パアーム２４が配設してある。このクランパアー
ム２４は、クランパスライドユニツト２６を介し
てアームスライドユニツト１４に取る付けられ、
矢印２８に示すごとくアームスライドユニツト１
４に対し相対的に上下動できるようになつてい
る。また、クランパアーム２４の先端部には、ク
ランパ３０とガイド３２とが設けてある。クラン
パアーム２４の上方には、本体部１２の上部に固
定したアーム３４が配置してある。そして、金線
であるワイヤ３６は、アーム３４に設けたワイヤ
掛３８を介してガイド３２、クランパ３０を経由
した後、キヤピラリー２０に挿通され、先端部が
いわゆるテール４０としてキヤピラリー２０の下
方に突出している。 FIG. 1 is a front view showing the main parts of an automatic wire bonder according to the present invention. In FIG. 1, an arm slide unit 14 is attached to a main body 12 provided on a base 10. As shown in FIG. This arm slide unit 14 can move up and down the side surface of the main body 12 as shown by an arrow 16, and a bonding arm 18 is provided at the lower part of the side surface. This bonding arm 18 gradually becomes thinner from the base to the tip, and has a capillary 20 at the tip.
is provided. An electrode 22 of an electric torch is arranged near this capillary 20. A clamper arm 24 is disposed above the bonding arm 18. This clamper arm 24 is attached to the arm slide unit 14 via a clamper slide unit 26,
As shown by arrow 28, arm slide unit 1
It is designed to be able to move up and down relative to 4. Furthermore, a clamper 30 and a guide 32 are provided at the tip of the clamper arm 24. An arm 34 fixed to the upper part of the main body 12 is arranged above the clamper arm 24. The wire 36, which is a gold wire, passes through the guide 32 and the clamper 30 via a wire hook 38 provided on the arm 34, and then is inserted into the capillary 20, with the tip end protruding below the capillary 20 as a so-called tail 40. ing.

クランパ３０は、第２図に示すごとく固定側把
持部４２と可動側把持部４４とからなつている。
可動側把持部４４は、Ｌ字状をなす可動アーム４
６の先端部に設けられている。この可動アーム４
６の後端部は、クランパアーム２４にピン５０を
介して枢支してあるブラケツト５２の一端部に固
定してある。ブラケツト５２は、他端側５３にば
ね５４が取り付けられ、可動アーム４６を介して
可動側把持部４４を固定側把持部４２に押圧する
ように付勢している。 As shown in FIG. 2, the clamper 30 is made up of a fixed side grip part 42 and a movable side grip part 44.
The movable side grip part 44 is an L-shaped movable arm 4.
It is provided at the tip of 6. This movable arm 4
The rear end of the bracket 6 is fixed to one end of a bracket 52 which is pivotally supported on the clamper arm 24 via a pin 50. A spring 54 is attached to the other end 53 of the bracket 52 and biases the movable grip 44 against the fixed grip 42 via the movable arm 46.

電気トーチの電極２２はＬ字状をなし、第３図
に示すごとくブラケツト５８に枢支してある。こ
のブラケツト５８は、駆動部６０の先端部に取り
付けられ、軸６２が矢印６４のごとく回転するの
に伴い、電極２２が矢印６６のごとく回動する。 The electrode 22 of the electric torch is L-shaped and is pivotally supported on a bracket 58 as shown in FIG. This bracket 58 is attached to the tip of the drive section 60, and as the shaft 62 rotates as shown by arrow 64, the electrode 22 rotates as shown by arrow 66.

上記のごとく構成してある実施例の作用は、次
のとおりである。 The operation of the embodiment configured as described above is as follows.

まず、ワイヤ３６は、ワイヤ掛３８、ガイド３
２を介してテール４０を有するようにキヤピラリ
ー２０に挿通される。そして、図示しない制御装
置によりクランパ３０を作動させてワイヤ３６を
把持するとともに、電気トーチ２２の電極２２と
テール４０との間にスパークを発生させ、テール
４０を溶融していわゆるボールを作る。その後、
キヤピラリー２０をチツプの上方に移動させ、ア
ームスライドユニツト１６を駆動してキヤピラリ
ー２０をダイス上に降ろし、クランパ３０を開い
てボールをチツプに押圧して圧着する。なお、ク
ランパ３０の操作は、図示しない操作棒によりブ
ラケツト５２の他端側５３を第２図の左方向に押
し、ばね５４の付勢力に抗してブラケツト５２を
反時計方向に回動させ、可動側把持部４４を可動
アーム４６を介して開く。 First, the wire 36 is connected to the wire hook 38 and the guide 3.
2 and is inserted into the capillary 20 so as to have a tail 40. Then, a control device (not shown) operates the clamper 30 to grip the wire 36, and generates a spark between the electrode 22 of the electric torch 22 and the tail 40, melting the tail 40 to form a so-called ball. after that,
The capillary 20 is moved above the chip, the arm slide unit 16 is driven to lower the capillary 20 onto the die, the clamper 30 is opened, and the ball is pressed against the chip and crimped. The clamper 30 is operated by pushing the other end 53 of the bracket 52 to the left in FIG. 2 using an operating rod (not shown), rotating the bracket 52 counterclockwise against the biasing force of the spring 54, and The movable grip portion 44 is opened via the movable arm 46.

次に、チツプへのワイヤ３６の圧着が終了する
と、アームスライドユニツト１６によりキヤピラ
リー２０が所定の高さまで上昇し、リード側の接
続位置の上方まで移動する。そして、制御装置
は、第４図のステツプ１００に示すごとくキヤピ
ラリー２０を、リード側の接続位置（第２ボンド
位置）に下降させ、ステツプ１０２を飛び越して
ステツプ１０４に移り、第５図Ａに示すごとくワ
イヤ３６をリード側６８に押圧して圧着し、ダイ
ス７０とリード側６８とを電気的に結合する。そ
の後、キヤピラリー２０は、ステツプ１０６にお
いて第５図Ｂに示すごとくテール量分だけ上昇
し、停止する。そして、制御装置は、ステツプ１
０８においてクランパ３０を作動させてワイヤ３
６を把持した後、ステツプ１１０において第５図
Ｃに示すごとくキヤピラリー２０をトーチのスパ
ーク位置まで上昇させる。次に、制御装置は、ス
テツプ１１２において電気トーチを駆動し、第５
図Ｄに示すごとく電極２２をキヤピラリーの下方
に移動させる。即ち、第３図に示すごとく軸６２
を回転させることにより電気トーチの電極２２を
ピン５６を中心として回動させ、キヤピラリー２
０の下方に移動させる。そして、制御装置は、電
気トーチを作動してステツプ１１４において電極
２２とテール４０との間にスパークを発生させ
る。スパークの発生があるときは、ステツプ１１
６においてワイヤが正常のテール量をもつてボー
ルが完成されたものと判断され、ステツプ１１８
に示すごとく次のワイヤボンドへと移行する。 Next, when the wire 36 is crimped onto the chip, the arm slide unit 16 raises the capillary 20 to a predetermined height and moves it above the connection position on the lead side. Then, the control device lowers the capillary 20 to the lead side connection position (second bond position) as shown in step 100 of FIG. 4, skips step 102 and moves to step 104, as shown in FIG. 5A. The wire 36 is pressed and crimped onto the lead side 68, thereby electrically coupling the die 70 and the lead side 68. Thereafter, in step 106, the capillary 20 rises by the amount of the tail, as shown in FIG. 5B, and then stops. Then, the control device performs step 1
At 08, the clamper 30 is operated to remove the wire 3.
6, the capillary 20 is raised to the torch spark position in step 110 as shown in FIG. 5C. Next, the controller drives the electric torch in step 112, and the fifth
The electrode 22 is moved below the capillary as shown in Figure D. That is, as shown in FIG.
By rotating the electrode 22 of the electric torch around the pin 56, the capillary 2
Move it below 0. The controller then activates the electric torch to generate a spark between the electrode 22 and the tail 40 in step 114. If sparks occur, step 11
At step 6, it is determined that the wire has a normal tail amount and the ball is completed, and step 118
Move on to the next wire bond as shown in .

ステツプ１１４においてスパークの発生がない
ときは、スパーク１１６においてワイヤ切れと判
断され、ステツプ１２０に進み、トーチ電極の駆
動源がOFFされる。その後、制御装置はステツ
プ１１６においてしたワイヤ切れの判断が第１回
目の判断であるか否かを判断する。ワイヤ切れが
第１回目のものであるときには、ステツプ１２４
において第５図Ｅに示すごとくキヤピラリーを通
常のテール量の半分だけ下降させ、ステツプ１２
６において第５図Ｆに示すごとく電気トーチを駆
動して電極２２によりテール４０を曲げる。次
に、制御装置はステツプ１２８に進みキヤピラリ
ー２０を予め記憶しているリード側の決められた
捨てボンド位置へ移動し、ステツプ１００に戻つ
て第５図Ｇに示すごとくキヤピラリー２０をテー
ル側６８の捨てボンド位置に下降させる。キヤピ
ラリー２０がテール側６８の上面に達すると、制
御装置はステツプ１０２においてクランパ３０を
開き、次のステツプ１０４において捨てボンドを
した後、第５図Ｈに示すごとくキヤピラリー２０
をテール量分だけ引き上げ、以下前記したステツ
プ１０８〜１１６の動作を行う。上記の捨てボン
ド操作によりステツプ１１６において正常と判断
されたときは、通常の第２ボンドが行われ、ステ
ツプ１１８に進み次のワイヤボンドが行われる。
ステツプ１１６において再びワイヤ切れと判断さ
れたときは、ステツプ１２０に進み、電気トーチ
２２の電源がOFFされ、ステツプ１２２に進む。
そして、ステツプ１２２において制御装置が第２
回目のワイヤ切れであると判断したときは、ステ
ツプ１３０に進み、ワイヤボンダ装置を停止する
とともに、ランプの点灯やブザー等により警報を
発する。この警報が発せられると、作業者は手動
操作により前記した従来と同様のいわゆる通常の
捨てボンド操作を行う。 If no spark is generated in step 114, it is determined that the wire is broken in the spark 116, and the process proceeds to step 120, where the drive source for the torch electrode is turned off. Thereafter, the control device determines whether the wire breakage determination made in step 116 is the first determination. If this is the first wire breakage, step 124
Then, lower the capillary by half the normal tail amount as shown in FIG. 5E, and proceed to step 12.
At 6, the electric torch is activated to bend the tail 40 by the electrode 22 as shown in FIG. 5F. Next, the controller proceeds to step 128 to move the capillary 20 to a pre-stored predetermined discard bond position on the lead side, and returns to step 100 to move the capillary 20 to the tail side 68 as shown in FIG. 5G. Lower it to the discard bond position. When the capillary 20 reaches the upper surface of the tail side 68, the controller opens the clamper 30 in step 102, and after making a sacrificial bond in the next step 104, the capillary 20 is closed as shown in FIG. 5H.
is pulled up by the tail amount, and the operations of steps 108 to 116 described above are performed. If the above-mentioned disposable bond operation is determined to be normal in step 116, a normal second bond is performed, and the process advances to step 118 to perform the next wire bond.
If it is determined in step 116 that the wire is broken again, the process proceeds to step 120, where the power to the electric torch 22 is turned off, and the process proceeds to step 122.
Then, in step 122, the control device
When it is determined that the wire has broken for the second time, the process proceeds to step 130, where the wire bonder device is stopped and a warning is issued by lighting a lamp, buzzer, or the like. When this alarm is issued, the operator manually performs the so-called normal disposable bond operation similar to the conventional method described above.

このようにワイヤ切れと判断されたときに、自
動的に捨てボンド動作を行わせることにより、チ
ツプ剥れやクランパの不良等により、第２ボンド
後におけるワイヤの適正な切断動作が行われなか
つた場合やテール量が短い場合等の作業者による
捨てボンド作業をなくすことができ、ワイヤボン
ダ装置の稼動率を上昇させることができる。ま
た、ヒータ部における半導体製品の滞留時間を短
くすることができ、品質の低下を防止することが
できる。 In this way, by automatically performing a discard bonding operation when it is determined that the wire is broken, it is possible to prevent the wire from being cut properly after the second bonding due to chip peeling or a defective clamper. This eliminates the need for workers to discard bonding work when the tail amount is short or when the tail amount is short, and the operating rate of the wire bonder apparatus can be increased. Furthermore, the residence time of the semiconductor product in the heater section can be shortened, and deterioration in quality can be prevented.

なお、捨てボンド操作を第６図Ａに示すような
ワイヤの先端が、キヤピラリー２０内にあるよう
なワイヤ切れに対しても対処できるようにするた
めには、ステツプ１２２とステツプ１２４との間
に次のような操作を行わせるとよい。即ち、ステ
ツプ１１６においてワイヤ切れと判断され、しか
もステツプ１２０を経てステツプ１２２において
第１回目のワイヤ切れであると判断されたとき
は、第１図に示したクランパスライドユニツト２
６を駆動し、ワイヤ３６を把持した状態において
第６図Ｂに示すごとくクランパ３０を下降させワ
イヤ３６の先端部がテール４０としてキヤピラリ
ー２０の下方に突出するようにする。その後、前
記したと同様にステツプ１２４においてキヤピラ
リー２０を通常のテール量の半分だけ降下させ、
第６図Ｃに示すごとく電気トーチを駆動してテー
ル４０を曲げる。そして、前記したと同様に第６
図Ｄに示すごとくキヤピラリー２０を捨てボンド
位置に降下させ、クランパ３０を開いて通常の位
置に戻すとともに、捨てボンドを行う。 In addition, in order to make the sacrificial bonding operation possible even in the case where the tip of the wire is broken in the capillary 20 as shown in FIG. You may want to perform the following operations: That is, when it is determined in step 116 that the wire is broken, and furthermore, that it is the first wire breakage in step 122 after passing through step 120, the clamper slide unit 2 shown in FIG.
6, and while holding the wire 36, the clamper 30 is lowered as shown in FIG. 6B so that the tip of the wire 36 protrudes below the capillary 20 as a tail 40. Thereafter, in step 124, the capillary 20 is lowered by half the normal tail amount, as described above.
The electric torch is driven to bend the tail 40 as shown in FIG. 6C. Then, in the same way as above, the sixth
As shown in Figure D, the capillary 20 is lowered to the sacrificial bonding position, the clamper 30 is opened and returned to the normal position, and the sacrificial bonding is performed.

このようにすることにより、従来作業者がピン
セツトを用いてワイヤ３６をキヤピラリー２０の
下方に突き出るように押し込んでいた作業をなく
すことができ、装置の稼動率をより高めることが
できる。 By doing so, it is possible to eliminate the conventional work of pushing the wire 36 into the capillary 20 using tweezers so that the wire 36 protrudes below the capillary 20, thereby further increasing the operating rate of the apparatus.

〔考案の効果〕[Effect of idea]

以上説明したように、本考案によれば、ワイヤ
ボンド装置に自動的に捨てボンド操作を行わせる
ことにより、作業者よる捨てボンド作業が減少
し、装置の稼動率を高めることができる。 As described above, according to the present invention, by having the wire bonding machine automatically perform the discard bonding operation, the discard bonding work by the operator can be reduced, and the operating rate of the apparatus can be increased.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る自動ワイヤボンダの主要
部を示す正面図、第２図はクランパの詳細構造
図、第３図は電気トーチの詳細図、第４図は捨て
ボンド操作の流れ図、第５図は捨てボンド操作の
工程図、第６図は他の実施例の捨てボンド操作の
工程図である。 １４……アームスライドユニツト、２０……キ
ヤピラリー、２２……電気トーチ、２６……クラ
ンパスライドユニツト、３０……クランパ、３６
……ワイヤ。 Fig. 1 is a front view showing the main parts of the automatic wire bonder according to the present invention, Fig. 2 is a detailed structural diagram of the clamper, Fig. 3 is a detailed diagram of the electric torch, Fig. 4 is a flowchart of the disposable bond operation, and Fig. 5 The figure is a process diagram of the disposable bond operation, and FIG. 6 is a process diagram of the disposable bond operation of another embodiment. 14... Arm slide unit, 20... Capillary, 22... Electric torch, 26... Clamper slide unit, 30... Clamper, 36
...Wire.

Claims (1)

【実用新案登録請求の範囲】 (1) ワイヤの先端部が下方に突出して挿通される
キヤピラリーと、このキヤピラリーの上方に位
置して前記ワイヤを把持し、キヤピラリーとと
もに下降してワイヤを繰り出すクランパと、前
記ワイヤの先端部との間にスパークを発生させ
るトーチと、前記キヤピラリーとクランパとを
作動させる駆動装置と、接続位置を検知すると
ともに、前記駆動装置を介して前記キヤピラリ
ーを作動させて前記ワイヤを接続位置に固着す
る制御装置とを有する自動ワイヤボンダにおい
て、前記トーチによるスパークの発生の有無を
検出するスパーク検出装置と、このスパーク検
出装置の出力を受けて前記スパークの発生がな
い場合に、少なくとも１回前記キヤピラリーを
下降させて前記ワイヤの固着操作を行う捨てボ
ンド機構とを有することを特徴とする自動ワイ
ヤボンダ。 (2) 前記捨てボンド機構は、前記スパークの発生
がない場合に前記クランパを作動させ、前記ワ
イヤを把持して繰り出すクランパ駆動装置が設
けられていることを特徴とする実用新案登録請
求の範囲第１項記載の自動ワイヤボンダ。[Claims for Utility Model Registration] (1) A capillary into which a wire is inserted with its tip protruding downward, and a clamper located above the capillary to grip the wire and descend together with the capillary to feed out the wire. , a torch that generates a spark between the tip of the wire, a drive device that operates the capillary and the clamper, and a drive device that detects the connection position and operates the capillary via the drive device to remove the wire. an automatic wire bonder having a control device for fixing the torch in a connecting position, a spark detection device for detecting whether or not a spark is generated by the torch, and at least An automatic wire bonder comprising: a disposable bonding mechanism that lowers the capillary once to fix the wire. (2) The disposable bond mechanism is provided with a clamper drive device that operates the clamper to grasp and feed out the wire when the spark is not generated. The automatic wire bonder according to item 1.
JP1984074879U 1984-05-22 1984-05-22 automatic wire bonder Granted JPS60187537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984074879U JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984074879U JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Publications (2)

Publication Number Publication Date
JPS60187537U JPS60187537U (en) 1985-12-12
JPH025533Y2 true JPH025533Y2 (en) 1990-02-09

Family

ID=30615579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984074879U Granted JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Country Status (1)

Country Link
JP (1) JPS60187537U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627968B2 (en) * 1990-05-02 1997-07-09 株式会社カイジョー Semiconductor assembly equipment

Also Published As

Publication number Publication date
JPS60187537U (en) 1985-12-12

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