JPH06387B2 - Glass / ceramic substrate - Google Patents
Glass / ceramic substrateInfo
- Publication number
- JPH06387B2 JPH06387B2 JP61122271A JP12227186A JPH06387B2 JP H06387 B2 JPH06387 B2 JP H06387B2 JP 61122271 A JP61122271 A JP 61122271A JP 12227186 A JP12227186 A JP 12227186A JP H06387 B2 JPH06387 B2 JP H06387B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- ceramic substrate
- nitrogen
- strength
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔概 要〕 ガラス・セラミックスのガラスに強度が大きい窒素含有
ガラスを用いて基板強度を上げる。[Detailed Description of the Invention] [Outline] The substrate strength is increased by using a nitrogen-containing glass having high strength as the glass / ceramic glass.
本発明はガラス・セラミック基板に係り、特にガラスと
して強度が大きい窒素含有ガラスを用いて基板強度を上
げたガラス・セラミック基板に関するものである。The present invention relates to a glass / ceramic substrate, and more particularly to a glass / ceramic substrate in which the strength of the substrate is increased by using nitrogen-containing glass having high strength as the glass.
アルミナ系ガラス・セラミック基板はアルミナとガラス
の複合材料であり、ガラスを含有しているために低温で
焼成できるが、ガラスを含有しているために基板の強度
はガラスの強度に支配されて、従来のアルミナ基板に比
して弱くなる。また、ガラス含有の影響のため熱伝導率
が低い。Alumina-based glass / ceramic substrate is a composite material of alumina and glass.Because it contains glass, it can be fired at low temperature, but because it contains glass, the strength of the substrate is governed by the strength of glass. Weaker than conventional alumina substrates. Further, the thermal conductivity is low due to the influence of the glass content.
本発明は低温焼成可能な高強度のガラス・セラミツク基
板を提供することを目的とする。An object of the present invention is to provide a high-strength glass / ceramic substrate that can be fired at a low temperature.
また本発明は低温焼成可能で高熱伝導性ガラス・セラミ
ック基板を提供することを目的とする。Another object of the present invention is to provide a glass / ceramic substrate which can be fired at a low temperature and has high thermal conductivity.
上記問題点は本発明によればガラスとセラミックスから
なるガラス・セラミック基板において；前記ガラスの少
なくとも一部を窒素含有ガラスとしたことを特徴とする
ガラス・セラミックス基板によって解決される。According to the present invention, the above problems are solved in a glass-ceramic substrate made of glass and ceramics; a glass-ceramic substrate characterized in that at least a part of the glass is nitrogen-containing glass.
本発明ではガラスが全て窒素含有ガラスであり、セラミ
ックスが窒化アルミニウムであることが好ましい。In the present invention, it is preferable that the glass is all nitrogen-containing glass and the ceramic is aluminum nitride.
本発明ではガラスの量を減らしていないので焼成条件を
通常の低温で行なえ、しかも強度の大きな窒素含有ガラ
スを用いているのでガラス・セラミックスの強度を大き
くすることができる。In the present invention, since the amount of glass is not reduced, the firing condition can be performed at a normal low temperature, and since the nitrogen-containing glass having high strength is used, the strength of the glass / ceramic can be increased.
また本発明ではガラス・セミックスのガラスとして全て
窒素含有ガラスを用い、しかもセラミックスとして高熱
伝導性の窒化アルミニウム（ＡｌＮ）を用いた場合は熱
伝導性が良く低温で焼成できる。Further, in the present invention, when nitrogen-containing glass is used as the glass of the ceramics and ceramics, and aluminum nitride (AlN) having high thermal conductivity is used as the ceramics, the thermal conductivity is good and it can be fired at a low temperature.
以下本発明の実施例を説明する。 Examples of the present invention will be described below.
粒径４μｍのアルミナ粉末とほうけい酸ガラスと窒素含
有ガラス（例えばSiON-Al2O3-CaO）とをそれぞれ体積比
で１：１：１、そしてＰＭＭＡ，ＰＢＶのような有機バ
インダ、メチルエチルケトン(MEK)のような溶剤及び可
塑剤をボールミングで混合し、スラリーを形成した。こ
のスラリーをドクターブレード法により0.3mmの厚さの
グリーンシートに成形した。これを150×150mmの大きさ
に打ち抜いた後、130℃30分の積層条件で１０層に積層
した。この積層体を大気雰囲気1050℃で４ｈ焼成した。Alumina powder having a particle size of 4 μm, borosilicate glass, and nitrogen-containing glass (for example, SiON-Al 2 O 3 -CaO) in a volume ratio of 1: 1: 1 respectively, and an organic binder such as PMMA or PBV , methyl ethyl ketone ( Solvents such as MEK) and a plasticizer were mixed by ballming to form a slurry. This slurry was formed into a green sheet having a thickness of 0.3 mm by the doctor blade method. After punching this into a size of 150 × 150 mm, it was laminated in 10 layers under the lamination condition of 130 ° C. for 30 minutes. This laminate was fired at 1050 ° C. in the air for 4 hours.
得られたガラスセラミック基板を30×10mmに切断し、曲
げ試験用試験片を作った。この試験片をインストロン試
験機を用いて、三点曲げ試験を行い、その結果を第１表
に示す。The obtained glass ceramic substrate was cut into 30 × 10 mm to prepare a test piece for bending test. A three-point bending test was performed on this test piece using an Instron tester, and the results are shown in Table 1.
第１表に示すように本実施例は従来例に比し著しく曲げ
強度が大であった。なお従来例はAl2O3のセラミックとS
iO2-B2O3のガラスを用いたガラス・セラミック基板であ
る。 As shown in Table 1, the flexural strength of this example was significantly higher than that of the conventional example. The conventional example is Al 2 O 3 ceramic and S
This is a glass-ceramic substrate using iO 2 -B 2 O 3 glass.
第２の実施例として窒化アルミニウム（ＡｌＮ）３５体
積％、例えばCa-Al-Si-O-N系又はY-Al-Si-O-N系の窒素
含有ガラスと上記実施例で用いた、有機バインダ、溶
剤、可塑剤をボールミリングで混合しスラリーを形成し
た。このスラリーをドクターブレード法により300μｍ
の厚さのグリーンシートに成形した。これを150×150mm
の大きさに打ち抜いた後、銅ペーストをスクリーン印刷
によって配線し、これを１０層に積層し、次に窒素雰囲
気中1050℃で５時間焼成した。As a second embodiment, 35% by volume of aluminum nitride (AlN), for example, a Ca-Al-Si-ON-based or Y-Al-Si-ON-based nitrogen-containing glass and the organic binder, solvent, and The plasticizer was mixed by ball milling to form a slurry. 300 μm of this slurry by the doctor blade method
Was formed into a green sheet having a thickness of. This is 150 x 150 mm
After punching to a size of 1, the copper paste was wired by screen printing, laminated in 10 layers, and then fired in a nitrogen atmosphere at 1050 ° C. for 5 hours.
このようにして得られたガラス・セラミック基板の試験
結果を第２表に示す。The test results of the glass-ceramic substrate thus obtained are shown in Table 2.
従来例は第１の実施例で用いた基板と同じものである。 The conventional example is the same as the substrate used in the first embodiment.
第２表から明らかなように本実施例は曲げ強さ及び熱伝
導率が従来例より優れていることがわかる。本実施例に
おける窒素含有ガラスとＡｌＮの組み合せでは窒素含有
ガラスはＡｌＮとの濡れ性が良好という利点もある。As is apparent from Table 2, this example is superior in bending strength and thermal conductivity to the conventional example. The combination of the nitrogen-containing glass and AlN in this example also has an advantage that the nitrogen-containing glass has good wettability with AlN.
以上説明したように本発明によれば従来のガラス・セラ
ミック基板より強度が大であり、しかもセラミックスと
してＡｌＮを用いれば熱伝導性が向上する。更に本発明
では従来のガラス・セラミック基板の焼成温度である10
00〜1050℃の低温焼成が可能で高速コンピユーター用銅
導体多層セラミック基板として使用できる。As described above, according to the present invention, the strength is higher than that of the conventional glass / ceramic substrate, and the thermal conductivity is improved by using AlN as the ceramic. Furthermore, in the present invention, the firing temperature of the conventional glass-ceramic substrate is 10
It can be fired at a low temperature of 0 to 1050 ° C and can be used as a copper conductor multilayer ceramic substrate for high-speed computers.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 横山 博三 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭60−177635（ＪＰ，Ａ) 特開 昭57−162393（ＪＰ，Ａ) 特開 昭60−24095（ＪＰ，Ａ) 特開 昭61−12091（ＪＰ，Ａ) 特公 昭58−11390（ＪＰ，Ｂ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirozo Yokoyama 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (56) Reference JP-A-60-177635 (JP, A) JP-A-57- 162393 (JP, A) JP 60-24095 (JP, A) JP 61-12091 (JP, A) JP 58-11390 (JP, B2)
Claims (2)
ラミック基板において； 前記ガラスの少なくとも一部を窒素含有ガラスとしたこ
とを特徴とするガラス・セラミック基板。1. A glass / ceramic substrate comprising glass and ceramics; at least a part of the glass being nitrogen-containing glass.
前記セラミックスが窒化アルミニウムであることを特徴
とする特許請求の範囲第１項記載のガラス・セラミック
基板。2. The glass is all nitrogen-containing glass,
The glass-ceramic substrate according to claim 1, wherein the ceramic is aluminum nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61122271A JPH06387B2 (en) | 1986-05-29 | 1986-05-29 | Glass / ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61122271A JPH06387B2 (en) | 1986-05-29 | 1986-05-29 | Glass / ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62279938A JPS62279938A (en) | 1987-12-04 |
| JPH06387B2 true JPH06387B2 (en) | 1994-01-05 |
Family
ID=14831829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61122271A Expired - Lifetime JPH06387B2 (en) | 1986-05-29 | 1986-05-29 | Glass / ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06387B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07149539A (en) * | 1993-11-25 | 1995-06-13 | Sumitomo Electric Ind Ltd | Glass-ceramic composite and its production |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811390B2 (en) * | 1977-02-18 | 1983-03-02 | 株式会社東芝 | Method of manufacturing thermally conductive substrate |
| JPS57162393A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Ltd | Multilayer circuit board |
| JPS6024095A (en) * | 1983-07-20 | 1985-02-06 | 株式会社日立製作所 | Method of producing glass ceramic multilayer circuit board |
| JPH0810710B2 (en) * | 1984-02-24 | 1996-01-31 | 株式会社東芝 | Method for manufacturing good thermal conductive substrate |
| JPS6112091A (en) * | 1984-06-27 | 1986-01-20 | 株式会社日立製作所 | Multilayer circuit board and method of producing same |
-
1986
- 1986-05-29 JP JP61122271A patent/JPH06387B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62279938A (en) | 1987-12-04 |
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