JPH0356169U - - Google Patents
Info
- Publication number
- JPH0356169U JPH0356169U JP5037689U JP5037689U JPH0356169U JP H0356169 U JPH0356169 U JP H0356169U JP 5037689 U JP5037689 U JP 5037689U JP 5037689 U JP5037689 U JP 5037689U JP H0356169 U JPH0356169 U JP H0356169U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil layer
- metal coating
- layer core
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す表面図、第２
はその裏面図、第３図は第１，２図のプリント配
線板の縦断面図である。
１……銅箔層によるコア、２……積層板、３…
…孔、４，９……金属被膜、５……樹脂層、６…
…パターン、７……スルーホール、８−１……裏
面座刳り部、８−２……表面座刳り部。
Figure 1 is a surface view showing one embodiment of the present invention;
3 is a rear view thereof, and FIG. 3 is a longitudinal sectional view of the printed wiring board shown in FIGS. 1 and 2. 1...Core made of copper foil layer, 2...Laminated board, 3...
...hole, 4,9...metal coating, 5...resin layer, 6...
...Pattern, 7...Through hole, 8-1...Back surface recess, 8-2...Front surface recess.
補正 平２．１１．２０
図面の簡単な説明を次のように補正する。
明細書第６頁第１行「第２」を「第２図」と補
正する。Amendment 11/20/1999 The brief description of the drawing is amended as follows. "2nd" in the first line of page 6 of the specification is amended to read "Fig. 2."
Claims (1)
、内面に金属被膜を施した孔が複数個、これ等銅
箔層コアに亘つて延び、該金属被膜により前記複
数層の銅箔層コアが接続され、最下側の銅箔層コ
アの下面が露出する裏面座刳り部に当該最下側銅
箔層コアに接続する金属被膜が施されているプリ
ント配線板。 孔がブラインド型である請求項記載のプリ
ント配線板。[Claims for Utility Model Registration] A plurality of cores made of copper foil layers are provided inside, a plurality of holes each having a metal coating on the inner surface extend across the copper foil layer core, and the metal coating allows the above-mentioned A printed wiring board to which multiple copper foil layer cores are connected, and a metal coating connected to the lowermost copper foil layer core is applied to the back recess where the bottom surface of the lowermost copper foil layer core is exposed. . The printed wiring board according to claim 1, wherein the holes are of a blind type.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5037689U JPH0638439Y2 (en) | 1989-04-28 | 1989-04-28 | Printed wiring board |
| US07/509,833 US5045642A (en) | 1989-04-20 | 1990-04-17 | Printed wiring boards with superposed copper foils cores |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5037689U JPH0638439Y2 (en) | 1989-04-28 | 1989-04-28 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0356169U true JPH0356169U (en) | 1991-05-30 |
| JPH0638439Y2 JPH0638439Y2 (en) | 1994-10-05 |
Family
ID=31568869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5037689U Expired - Lifetime JPH0638439Y2 (en) | 1989-04-20 | 1989-04-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638439Y2 (en) |
-
1989
- 1989-04-28 JP JP5037689U patent/JPH0638439Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638439Y2 (en) | 1994-10-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |