JPH0637229A - Soldering method and jig for soldering - Google Patents
Soldering method and jig for solderingInfo
- Publication number
- JPH0637229A JPH0637229A JP18976792A JP18976792A JPH0637229A JP H0637229 A JPH0637229 A JP H0637229A JP 18976792 A JP18976792 A JP 18976792A JP 18976792 A JP18976792 A JP 18976792A JP H0637229 A JPH0637229 A JP H0637229A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- package
- molten solder
- solder
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明ははんだ付け方法及びはん
だ付け用治具に係り,さらに詳しくは,フラットタイプ
ICパッケージの外リードの予備はんだ付け方法及び予
備はんだ付け用治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method and a soldering jig, and more particularly, to a method for presoldering outer leads of a flat type IC package and a jig for presoldering.
【0002】近年,ICパッケージの基板実装性及び基
板実装後の実装強度に関し,より一層の信頼性の向上が
要求されている。このような要求に対し,実装する前に
予備はんだ付け処理で対応することが行われている。予
備はんだ付け処理とは,溶融はんだ槽へのリードの浸漬
により外リード表面に薄いはんだ層を形成する処理を指
している。[0002] In recent years, further improvement in reliability has been demanded regarding the board mountability of the IC package and the mounting strength after the board is mounted. To meet such demands, pre-soldering processing is performed before mounting. The pre-soldering process refers to the process of forming a thin solder layer on the outer lead surface by dipping the lead in a molten solder bath.
【0003】金めっきされた外リードを有するICパッ
ケージを基板実装した場合,実装接合部に機械的に脆い
金すずの金属間化合物が生じ,実装強度の低下を招く。
この場合,外リードの金めっきの上に予め予備はんだ付
け処理を施しておけば,金の一部またはほとんど全部
を,はんだで置換することができ,実装後の金すずの金
属間化合物の生成を防ぎ,実装強度の低下を抑えること
ができる。When an IC package having gold-plated outer leads is mounted on a substrate, a mechanically brittle intermetallic compound of gold tin is generated at the mounting joint portion, resulting in a reduction in mounting strength.
In this case, if pre-soldering is performed on the gold plating of the outer leads in advance, some or almost all of the gold can be replaced with solder, and the intermetallic compound of gold tin after mounting can be generated. It is possible to prevent the deterioration of mounting strength.
【0004】[0004]
【従来の技術】図4は予備はんだ付け処理の従来例を示
す断面図で,(a) は浸漬時, (b) は引上げ時を示し,1
はICパッケージ,2は外リード,3は溶融はんだ,7
はヒートシンクを表す。最近のフラットタイプICパッ
ケージでは,隣接する外リード間の間隙が非常に狭い高
密度実装のもので,素子からの発熱を外部に導くヒート
シンクの形成されたものがある。2. Description of the Related Art FIG. 4 is a cross-sectional view showing a conventional example of a pre-soldering process, in which (a) shows dipping and (b) shows pulling up.
Is an IC package, 2 is an outer lead, 3 is molten solder, 7
Represents a heat sink. In recent flat type IC packages, there are high density packaging packages in which the gap between adjacent outer leads is very narrow, and a heat sink for guiding the heat generated from the device to the outside is formed.
【0005】従来の予備はんだ付け方法は,外リード2
を溶融はんだ3に浸漬し,一定時間後引き上げるという
作業により行われていた。しかし,外リードピッチが小
さくなり,隣接する外リード2間の間隙が例えば 0.3mm
より小さくなってくると,溶融はんだ槽からの外リード
2引上げ時に,隣接する外リード間の溶融はんだが完全
に切れず過剰はんだが残り,そのままの状態で固化して
はんだのブリッジを生じ,外リード2間で短絡が発生し
てしまうといった問題が生じている。The conventional pre-soldering method uses the outer lead 2
Was immersed in the molten solder 3 and pulled up after a certain period of time. However, the outer lead pitch becomes smaller, and the gap between adjacent outer leads 2 is, for example, 0.3 mm.
When it becomes smaller, when the outer lead 2 is pulled up from the molten solder tank, the molten solder between the adjacent outer leads is not completely cut off and excess solder remains, solidifying in that state and forming a solder bridge, There is a problem that a short circuit occurs between the leads 2.
【0006】これに対して,溶融はんだ3への外リード
2の浸漬深さを厳密に設定することも行われるが,それ
でも外リード2によってはんだ這い上がり高さにばらつ
きが生じ,ICパッケージのろう付けパッド部まで這い
上がった溶融はんだがパッド間でブリッジを起こしてし
まうことがある。On the other hand, the immersion depth of the outer lead 2 into the molten solder 3 may be set strictly, but the outer lead 2 still causes variations in the solder creep-up height, and the soldering of the IC package may occur. The molten solder that has climbed up to the attachment pad part may cause a bridge between the pads.
【0007】溶融はんだの温度を上げて表面張力を低下
させたり,引き上げ速度を下げたりする等の対応も行っ
てきたが,この対策は予備はんだ処理能力の低下に伴う
コストアップ,半導体装置に加わる熱的ストレスの増加
による信頼性の低下,といった問題の発生が避けられ
ず,さらに,はんだの切れを完全にしてはんだブリッジ
の形成を避けるための根本的解決策とはならなかった。
従って,新たな対応が求められている。Although measures such as increasing the temperature of the molten solder to lower the surface tension and lowering the pulling rate have been taken, this measure is added to the cost due to the reduction of the preliminary soldering capacity and adds to the semiconductor device. Problems such as reduced reliability due to increased thermal stress were unavoidable, and it was not a fundamental solution to complete solder breakage and avoid the formation of solder bridges.
Therefore, new measures are required.
【0008】[0008]
【発明が解決しようとする課題】本発明は上記の問題に
鑑み,処理能力を低下することなしに,熱的ストレスを
増加することなしに予備はんだ付けを行い,しかも,狭
リードピッチのICパッケージで外リード2間にはんだ
ブリッジの生じないはんだ付け方法及びはんだ付け用治
具を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention performs pre-soldering without lowering processing capacity and without increasing thermal stress, and has an IC package with a narrow lead pitch. It is an object of the present invention to provide a soldering method and a soldering jig in which a solder bridge is not generated between the outer leads 2.
【0009】[0009]
【課題を解決するための手段】図1は第1の実施例を示
す断面図,図2は第2の実施例を示す断面図,図3は第
3の実施例を示す断面図である。FIG. 1 is a sectional view showing a first embodiment, FIG. 2 is a sectional view showing a second embodiment, and FIG. 3 is a sectional view showing a third embodiment.
【0010】上記課題は,ICパッケージ1の外リード
2に予備はんだ付けを行うに際し,溶融はんだ槽3aの溶
融はんだ3表面に該溶融はんだ3に不溶の板4を設置
し,該ICパッケージ1の外リード2を該溶融はんだ3
に浸漬した後,該外リード2を該板4の端に接して該溶
融はんだ3をしごきながら該ICパッケージ1を引き上
げるはんだ付け方法によって解決される。The above problem is that when pre-soldering the outer leads 2 of the IC package 1, a plate 4 insoluble in the molten solder 3 is placed on the surface of the molten solder 3 in the molten solder tank 3a. The outer lead 2 is connected to the molten solder 3
It is solved by a soldering method in which the outer lead 2 is brought into contact with the end of the plate 4 and the molten solder 3 is squeezed to pull up the IC package 1 after the immersion.
【0011】また,ICパッケージ1を保持して予備は
んだ付けを行うはんだ付け用治具であって, 該ICパッ
ケージ1の外リード2を外側から押さえ,溶融はんだ3
に不溶の爪板5を有するはんだ付け用治具によって解決
される。A soldering jig for holding the IC package 1 and performing pre-soldering. The outer lead 2 of the IC package 1 is pressed from the outside and the molten solder 3 is held.
This is solved by a soldering jig having an insoluble nail plate 5.
【0012】また,ICパッケージ1の予備はんだ付け
を行うはんだ付け用治具であって,該ICパッケージ1
を保持し該ICパッケージ1の外リード2を外側から押
さえ,溶融はんだ3に不溶の爪板5と,該外リード2の
内側に接して装着され,該溶融はんだ3に不溶の内板6
とを有するはんだ付け用治具によって解決される。A soldering jig for pre-soldering the IC package 1, said IC package 1
Holding the outer leads 2 of the IC package 1 from the outside, and mounting the nail plate 5 insoluble in the molten solder 3 and the inner plate 6 in contact with the inside of the outer leads 2 and insoluble in the molten solder 3.
It is solved by a soldering jig having and.
【0013】[0013]
【作用】本発明では,溶融はんだ3からの外リード2引
上げ時に,外リード2を板4の端に接して溶融はんだ3
をしごきながらICパッケージ1を引き上げるから,外
リード2上に過剰はんだ残りの生じることがなく,その
結果,隣接する外リード2間で,はんだブリッジの発生
を防ぐことができる。In the present invention, when the outer lead 2 is pulled up from the molten solder 3, the outer lead 2 is brought into contact with the end of the plate 4 and the molten solder 3
Since the IC package 1 is pulled up while squeezing, excess solder residue does not occur on the outer leads 2, and as a result, it is possible to prevent the formation of solder bridges between the adjacent outer leads 2.
【0014】また,ICパッケージ1の外リード2を外
側から押さえる爪板で,溶融はんだ3に不溶の爪板5を
有するはんだ付け用治具を用いれば,溶融はんだ3は爪
板5によって制限されるから,ICパッケージ1を引き
上げる時,外リード2上に残るはんだの量は制限され,
その結果,隣接する外リード2間で,はんだブリッジの
発生が制限される。If a soldering jig having a nail plate for pressing the outer lead 2 of the IC package 1 from the outside and having an insoluble nail plate 5 in the molten solder 3, the molten solder 3 is restricted by the nail plate 5. Therefore, when the IC package 1 is pulled up, the amount of solder remaining on the outer leads 2 is limited,
As a result, the occurrence of solder bridges between adjacent outer leads 2 is limited.
【0015】また,爪板5に加えて,さらに外リード2
の内側に接して溶融はんだ3に不溶の内板6を装着する
ようにすれば,溶融はんだ3は外リード2の下部に制限
され外リード2の上部に回り込むことはないから,IC
パッケージ1を引き上げた後,隣接する外リード2間
で,はんだブリッジの発生はほとんどなくなる。In addition to the claw plate 5, the outer lead 2
If the inner plate 6 that is insoluble in the molten solder 3 is attached to the inside of the IC, the molten solder 3 is limited to the lower part of the outer lead 2 and does not wrap around to the upper part of the outer lead 2.
After pulling up the package 1, almost no solder bridge is generated between the adjacent outer leads 2.
【0016】[0016]
【実施例】図1は第1の実施例を示す断面図であり,1
はICパッケージ,2は外リード,3は溶融はんだ,3a
は溶融はんだ槽,4はセラミック板,7はヒートシンク
を表す。ICパッケージ1は例えば金めっきの施された
外リードを4辺に有するフラットタイプICパッケージ
で,隣接する外リード2間の間隙は例えば0.28mmで,各
辺に例えば41箇の外リードが配置されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view showing a first embodiment.
Is an IC package, 2 is an outer lead, 3 is molten solder, 3a
Is a molten solder bath, 4 is a ceramic plate, and 7 is a heat sink. The IC package 1 is, for example, a flat type IC package having gold-plated outer leads on four sides, the gap between adjacent outer leads 2 is, for example, 0.28 mm, and, for example, 41 outer leads are arranged on each side. ing.
【0017】溶融はんだ3の表面に接して,一端が溶融
はんだ3上に露出するセラミック板4を溶融はんだ槽3a
に取り付ける。セラミック板4は溶融はんだ3に不溶
で,一辺に並ぶ外リード2全部に接触する。The ceramic plate 4 which is in contact with the surface of the molten solder 3 and has one end exposed on the molten solder 3 is placed in the molten solder bath 3a.
Attach to. The ceramic plate 4 is insoluble in the molten solder 3 and contacts all the outer leads 2 arranged side by side.
【0018】ICパッケージ1の主面を溶融はんだ3の
面に傾斜させて外リード2を溶融はんだ3に浸漬する。
浸漬深さは少なくとも外リード2のプリント基板への取
付け部を全部含むようにする。溶融はんだ3の温度は例
えば 250〜300 ℃で,5〜7秒間浸漬した後,外リード
2を板4の端に接触させて溶融はんだ3をしごきながら
斜め方向に引き上げる。この作業は人手で行ってもよい
が,ロボット機構により,ICパッケージ1の主面の傾
斜角度を例えば45°,引き上方向も45°として信頼
性よく行うこともできる。The main surface of the IC package 1 is inclined to the surface of the molten solder 3 and the outer leads 2 are immersed in the molten solder 3.
The immersion depth should include at least the mounting portion of the outer lead 2 on the printed circuit board. The temperature of the molten solder 3 is, for example, 250 to 300 ° C., and after dipping for 5 to 7 seconds, the outer leads 2 are brought into contact with the ends of the plate 4 and the molten solder 3 is squeezed and pulled up in an oblique direction. Although this work may be performed manually, it can be performed with reliability by setting the inclination angle of the main surface of the IC package 1 to be 45 ° and the pull-up direction to be 45 ° by the robot mechanism.
【0019】このようにして,外リード2上に過剰はん
だ残りを生じさせることなく引き上げることができた。
その結果,隣接する外リード2間でのはんだブリッジの
発生が,板4を設置しない従来例に比べて激減した。In this way, it was possible to pull up the outer lead 2 without causing excess solder residue.
As a result, the occurrence of solder bridges between the adjacent outer leads 2 was drastically reduced compared to the conventional example in which the plate 4 was not installed.
【0020】図2は第2の実施例を示す断面図で,符号
は図1と共通であり,さらに5ははんだ浸漬用治具,5a
は爪板, 8はフラックスを表す。はんだ浸漬用治具5は
ICパッケージ1を保持して外リード2を溶融はんだ3
に浸漬するものであり,先端に外リード2を外側から押
さえる爪板5aを有している。爪板5aは溶融はんだ3に不
純物の材料からなり,例えばチタン製である。FIG. 2 is a sectional view showing a second embodiment, the reference numerals are the same as those in FIG. 1, and 5 is a solder dipping jig and 5a.
Is a nail plate and 8 is a flux. The solder dipping jig 5 holds the IC package 1 and holds the outer lead 2 with the molten solder 3
It has a claw plate 5a that presses the outer lead 2 from the outside at the tip. The claw plate 5a is made of a material having impurities in the molten solder 3 and is made of, for example, titanium.
【0021】ICパッケージ1をはんだ浸漬用治具5に
取付け,爪板5aを外リード2の外側に接触させる。その
後,外リード2及び爪板5aが十分に浸るように,例えば
溶融した松やにのフラックス8に浸し,次いで,ICパ
ッケージ1の主面を溶融はんだ3の面に対して傾斜さ
せ,外リード2を溶融はんだ3に浸漬する。フラックス
8は流れて爪板5aの部分に溜まる。フラックス8は溶融
はんだ3中で分解し,はんだ濡れをよくする有効成分が
徐々に消失していくから,フラックス8が爪板5aの部分
に溜まる量の多い方がはんだの流れをよくし,はんだブ
リッジ発生の抑制に対して有利となる。The IC package 1 is attached to the solder dipping jig 5, and the claw plate 5a is brought into contact with the outside of the outer lead 2. After that, the outer lead 2 and the claw plate 5a are soaked in a flux 8 of molten pine or the like so that the outer lead 2 and the claw plate 5a are sufficiently dipped, and then the main surface of the IC package 1 is inclined with respect to the surface of the molten solder 3 to fix the outer lead 2 Immerse in the molten solder 3. The flux 8 flows and collects on the claw plate 5a. Since the flux 8 decomposes in the molten solder 3 and the active ingredient that improves the solder wettability gradually disappears, the larger the amount of the flux 8 that accumulates on the nail plate 5a, the better the flow of the solder. This is advantageous for suppressing the occurrence of bridges.
【0022】溶融はんだ3の温度は例えば 250〜300 ℃
で,5〜7秒間浸漬した後,外リード2を引き上げる。
引き上げる方向は必ずしも斜め方向でなくてもよい。こ
のようにして,外リード2上に過剰はんだ残りの生じる
ことがなく引き上げることができた。その結果,隣接す
る外リード2間でのはんだブリッジはほとんど発生しな
かった。The temperature of the molten solder 3 is, for example, 250 to 300 ° C.
Then, after soaking for 5 to 7 seconds, the outer lead 2 is pulled up.
The direction of pulling up is not necessarily diagonal. In this way, the outer lead 2 could be pulled up without excessive solder residue. As a result, almost no solder bridge was formed between the adjacent outer leads 2.
【0023】図3は第3の実施例を示す断面図で,符号
は図2と共通であり,さらに6はセラミック板,9はマ
グネットを表す。この例は第2の実施例に加えて,外リ
ード2の内側に接するセラミック板6を配置している。
セラミック板6の固定はマグネット9により,ICパッ
ケージ1の中にある磁性板との吸引力を利用して行うよ
うにする。FIG. 3 is a cross-sectional view showing a third embodiment. Reference numerals are the same as those in FIG. 2, 6 is a ceramic plate, and 9 is a magnet. In this example, in addition to the second embodiment, a ceramic plate 6 contacting the inside of the outer lead 2 is arranged.
The ceramic plate 6 is fixed by the magnet 9 by using the attraction force with the magnetic plate in the IC package 1.
【0024】第3の実施例では,溶融はんだ3が外リー
ド2の内側に回り込むことが完全に押さえられ,溶融は
んだ3の這い上がりがなく,隣接する外リード2間での
はんだブリッジの発生は全く見られなかった。In the third embodiment, the molten solder 3 is completely prevented from wrapping around the inner side of the outer lead 2, the molten solder 3 does not creep up, and a solder bridge is not generated between the adjacent outer leads 2. I couldn't see it at all.
【0025】[0025]
【発明の効果】以上説明したように,本発明によれば,
狭リードピッチのICパッケージの予備はんだ付けにお
いて,はんだブリッジの発生が抑制できるという効果を
奏し,はんだの外リード2の這い上がり高さにばらつき
とか,溶融はんだの昇温によるICパッケージの熱的ス
トレスの増加といった従来の問題も解決される。As described above, according to the present invention,
In the pre-soldering of an IC package with a narrow lead pitch, the effect of suppressing the generation of solder bridges is exerted, and the creeping height of the outer lead 2 of the solder varies, and the thermal stress of the IC package due to the temperature rise of the molten solder. Conventional problems such as increase of
【図1】第1の実施例を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment.
【図2】第2の実施例を示す断面図である。FIG. 2 is a sectional view showing a second embodiment.
【図3】第3の実施例を示す断面図である。FIG. 3 is a sectional view showing a third embodiment.
【図4】従来例を示す断面図で,(a) は浸漬時, (b) は
引上げ時を示す。FIG. 4 is a cross-sectional view showing a conventional example, in which (a) shows the time of immersion and (b) shows the time of pulling.
1はICパッケージ 2は外リード 3は溶融はんだ 3aは溶融はんだ槽 4は板であってセラミック板 5ははんだ浸漬用治具 5aは爪板 6は板であってセラミック板 7はヒートシンク 8はフラックス 9はマグネット 1 is an IC package 2 is an outer lead 3 is molten solder 3a is molten solder bath 4 is a plate, ceramic plate 5 is a solder dipping jig 5a is a claw plate 6 is a plate, ceramic plate 7 is a heat sink 8 is a flux 9 is a magnet
Claims (3)
備はんだ付けを行うに際し, 溶融はんだ槽(3a)の溶融は
んだ(3) 表面に該溶融はんだ(3) に不溶の板(4) を設置
し, 該ICパッケージ(1) の外リード(2) を該溶融はんだ
(3) に浸漬した後,該外リード(2) を該板(4) の端に接
して該溶融はんだ(3) をしごきながら該ICパッケージ
(1) を引き上げることを特徴とするはんだ付け方法。1. When pre-soldering the outer leads (2) of the IC package (1), a plate (4) which is insoluble in the molten solder (3) is formed on the surface of the molten solder (3) in the molten solder bath (3a). ) Is installed, and the outer leads (2) of the IC package (1) are connected to the molten solder.
After immersing in the (3), the outer leads (2) are brought into contact with the edges of the plate (4) and the molten solder (3) is squeezed, and the IC package is
(1) A soldering method characterized by pulling up.
だ付けを行うはんだ付け用治具であって, 該ICパッケ
ージ(1) の外リード(2) を外側から押さえ,溶融はんだ
(3) に不溶の爪板(5) を有することを特徴とするはんだ
付け用治具。2. A soldering jig for holding an IC package (1) and performing pre-soldering, wherein an outer lead (2) of the IC package (1) is pressed from the outside to melt the solder.
(3) A soldering jig having an insoluble claw plate (5).
行うはんだ付け用治具であって, 該ICパッケージ(1)
を保持し該ICパッケージ(1) の外リード(2) を外側か
ら押さえ,溶融はんだ(3) に不溶の爪板(5) と,該外リ
ード(2) の内側に接して装着され,該溶融はんだ(3) に
不溶の内板(6) とを有することを特徴とするはんだ付け
用治具。3. A soldering jig for pre-soldering an IC package (1), the IC package (1)
Holding the outer leads (2) of the IC package (1) from the outside, and mounting the nail plate (5) insoluble in the molten solder (3) and the inside of the outer leads (2), A soldering jig comprising a molten solder (3) and an insoluble inner plate (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18976792A JPH0637229A (en) | 1992-07-17 | 1992-07-17 | Soldering method and jig for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18976792A JPH0637229A (en) | 1992-07-17 | 1992-07-17 | Soldering method and jig for soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0637229A true JPH0637229A (en) | 1994-02-10 |
Family
ID=16246850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18976792A Withdrawn JPH0637229A (en) | 1992-07-17 | 1992-07-17 | Soldering method and jig for soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0637229A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009141325A (en) * | 2007-11-14 | 2009-06-25 | Panasonic Corp | Inductance component and method for manufacturing the same |
-
1992
- 1992-07-17 JP JP18976792A patent/JPH0637229A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009141325A (en) * | 2007-11-14 | 2009-06-25 | Panasonic Corp | Inductance component and method for manufacturing the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991005 |