JPH06349534A - Terminal to be attached to wiring board and method of attaching the terminal to the wiring board - Google Patents

Terminal to be attached to wiring board and method of attaching the terminal to the wiring board

Info

Publication number
JPH06349534A
JPH06349534A JP5137185A JP13718593A JPH06349534A JP H06349534 A JPH06349534 A JP H06349534A JP 5137185 A JP5137185 A JP 5137185A JP 13718593 A JP13718593 A JP 13718593A JP H06349534 A JPH06349534 A JP H06349534A
Authority
JP
Japan
Prior art keywords
terminal
wiring board
terminals
end surfaces
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5137185A
Other languages
Japanese (ja)
Inventor
Osamu Tamakoshi
修 玉越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP5137185A priority Critical patent/JPH06349534A/en
Publication of JPH06349534A publication Critical patent/JPH06349534A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To attach terminals at any positions of a wiring board and at the same time to make an automatic apparatus for exclusive use for terminals unnecessary, to make no need of insertion holes in the wiring board, and to provide sufficient terminal strength even in the case the size is made compact. CONSTITUTION:Terminals to be attached to a wiring board is composed of a pair of terminal faces 2a, 2b on the opposite to each other, an outer circumferential face 2c to connect the terminal faces, a terminal main body 2 provided with a conductor part in electrically connected state with at least both terminal faces 2a, 2b, and an insulator 3 which covers the outer circumferential face 2c of the terminal main body 2. The insulator 3 part is sucked by a suction nozzle of an automatic building-in apparatus to attach the terminals to a wiring board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、配線基板に取付ける端
子及びその端子の配線基板への取付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal to be attached to a wiring board and a method for attaching the terminal to the wiring board.

【０００２】[0002]

【従来の技術】従来、配線基板に取付ける端子として、
図５や図６に示す形状のものがある。2. Description of the Related Art Conventionally, as a terminal to be attached to a wiring board,
There is a shape shown in FIGS. 5 and 6.

【０００３】図５に示す端子１１は、一端に配線基板１
２の端縁部分を挟持する挟持部１１ａを備えたもので、
挟持部１１ａで配線基板１２を挟み込んだ後にそこに形
成された電極ランド１３に半田付けされる。The terminal 11 shown in FIG. 5 has a wiring board 1 at one end.
With a holding portion 11a for holding the edge portion of 2,
After the wiring board 12 is sandwiched by the sandwiching portions 11a, it is soldered to the electrode lands 13 formed therein.

【０００４】図６に示す端子１４は、一端に、配線基板
１２に形成された貫通孔１５に対するストッパーとして
の頭部１４ａを備えたもので、この端子１４を貫通孔１
５に挿通した後にそこに形成された電極ランド１３に半
田付けされる。The terminal 14 shown in FIG. 6 is provided with a head portion 14a as a stopper for the through hole 15 formed in the wiring board 12 at one end.
After being inserted in 5, the electrode land 13 formed there is soldered.

【０００５】[0005]

【発明が解決しようとする課題】ところが、図５に示す
端子１１においては、絶縁基板１２の端縁部分にしか取
付けできないという問題がある。また、フープ材に連続
して形成しておくことにより、自動機を用いて絶縁基板
１２に取付けることができるが、そのための専用の自動
機が必要になるという問題がある。さらに、端子強度を
保つ上で、小型化には適していないという問題もある。However, the terminal 11 shown in FIG. 5 has a problem that it can be attached only to the edge portion of the insulating substrate 12. Further, by forming the hoop material continuously, the hoop material can be attached to the insulating substrate 12 by using an automatic machine, but there is a problem that a dedicated automatic machine for that purpose is required. Further, there is a problem that it is not suitable for downsizing in maintaining the terminal strength.

【０００６】また、図６に示す端子１４においては、配
線基板１２に貫通孔１５を形成しなければならないとい
う問題がある。また、端子強度の面では図５のものより
も小型化には適しているといえるが、配線基板１２への
取付けのための自動化が困難であり、仮に自動化できて
も図５のものと同様に専用の自動機が必要になるという
問題がある。Further, the terminal 14 shown in FIG. 6 has a problem that the through hole 15 must be formed in the wiring board 12. Further, in terms of terminal strength, it can be said that it is more suitable for downsizing than that of FIG. 5, but automation for mounting on the wiring board 12 is difficult, and even if automation is possible, it is similar to that of FIG. There is a problem that a dedicated automatic machine is required.

【０００７】したがって、本発明においては、配線基板
面のどの位置にも取付けることができるとともに、端子
のための専用の自動機を用いなくても配線基板への取付
けの自動化が可能となり、配線基板面に貫通孔を形成す
る必要もなく、小型化しても端子強度の面で問題のな
い、配線基板に取付ける端子およびその端子の配線基板
への取付け方法を提供することを目的としている。Therefore, in the present invention, the wiring board can be mounted at any position on the surface of the wiring board, and the mounting on the wiring board can be automated without using a dedicated automatic machine for terminals. It is an object of the present invention to provide a terminal to be mounted on a wiring board and a method for mounting the terminal to the wiring board, which does not need to form a through hole in its surface and has no problem in terms of terminal strength even if it is downsized.

【０００８】[0008]

【課題を解決するための手段】このような目的を達成す
るために、本発明の請求項１に係る配線基板に取付ける
端子においては、対向する一対の端面とそれを結ぶ外周
面とを有し、かつ少なくともその両端面に互いに導通し
た状態の導体部を備えた端子本体と、その端子本体の外
周面を覆っている絶縁体とからなり、その絶縁体部分が
自動実装機の吸着ノズルの吸着面とされたことを特徴と
している。In order to achieve such an object, a terminal to be mounted on a wiring board according to claim 1 of the present invention has a pair of opposing end surfaces and an outer peripheral surface connecting the end surfaces. , And at least both end surfaces of the terminal main body having a conductive portion in a conductive state, and an insulator covering the outer peripheral surface of the terminal main body, the insulating portion is suction of the suction nozzle of the automatic mounting machine It is characterized by being a face.

【０００９】また、本発明の請求項２に係る端子の配線
基板への取付け方法においては、請求項１記載の端子の
配線基板への取付け方法であって、まず絶縁体部分を自
動実装機の吸着ノズルで吸着して端子本体の両端面を結
ぶ軸線が配線基板面に対して平行となるような状態で端
子を保持し、次いでその端子を一方の端面側のみが半田
ペーストの付与された電極ランドに接触するようにして
配線基板上に載置し、その後に加熱して半田ペーストを
溶融し、その溶融した半田の表面張力により前記端子を
電極ランド上で起立させて前記軸線が配線基板面に対し
て垂直になるようにしたことを特徴としている。According to a second aspect of the present invention, in the method for attaching a terminal to a wiring board, the terminal is attached to the wiring board according to the first aspect. An electrode that is held by the suction nozzle so that the axis connecting both end faces of the terminal body is parallel to the surface of the wiring board, and then that terminal has solder paste applied to only one end face side. It is placed on the wiring board so as to be in contact with the land and then heated to melt the solder paste, and the terminals are erected on the electrode land by the surface tension of the melted solder so that the axis line is on the wiring board surface. The feature is that it is perpendicular to.

【００１０】[0010]

【作用】請求項１の配線基板に取付ける端子は、その一
方の端面を配線基板の電極ランドに半田付けすることに
より、その電極ランドを端子の他方の端面を介して外部
回路へ接続することができる。According to the present invention, the terminal mounted on the wiring board can be connected to an external circuit through the other end surface of the terminal by soldering one end surface of the terminal to the electrode land of the wiring board. it can.

【００１１】請求項２の端子の配線基板への取付け方法
は、端子本体の外周面を覆っている絶縁体部分を自動実
装機の吸着ノズルで吸着して配線基板へ載置するもので
あるため、配線基板面のどの位置へも取付けることがで
き、しかも他のチップ状電子部品の自動実装機を用いる
ことができるため、専用の実装機を必要としない。According to a second aspect of the present invention, in the method of mounting a terminal on a wiring board, the insulator portion covering the outer peripheral surface of the terminal body is sucked by a suction nozzle of an automatic mounting machine and placed on the wiring board. Since it can be mounted at any position on the surface of the wiring board and an automatic mounter for other chip-shaped electronic components can be used, a dedicated mounter is not required.

【００１２】また、いわゆるチップ状電子部品で問題と
されるツームストーン現象を利用して端子を電極ランド
に半田付けするものであるため、端面の面積の微小な端
子であっても配線基板への取付けが可能となる。Further, since the terminals are soldered to the electrode lands by utilizing the tombstone phenomenon, which is a problem in so-called chip-shaped electronic parts, even if the terminals have a very small end surface area, they can be connected to the wiring board. It can be installed.

【００１３】[0013]

【実施例】以下、本発明の一実施例を図面を参照して詳
細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

【００１４】図１において、配線基板へ取付ける端子１
は、端子本体２と絶縁体３とからなっている。端子本体
２は、金属材料からなり、対向する一対の端面２ａ、２
ｂとこれらの端面２ａ、２ｂを結ぶ外周面２ｃとを有す
る微小（例えば、端面２ａ、２ｂの大きさは２ｍｍ×１
ｍｍ、両端面２ａ、２ｂ間の長さは３ｍｍ）な角柱状に
形成されている。In FIG. 1, a terminal 1 attached to a wiring board
Is composed of a terminal body 2 and an insulator 3. The terminal body 2 is made of a metal material, and has a pair of opposing end faces 2a, 2
b and an outer peripheral surface 2c connecting the end surfaces 2a and 2b (for example, the size of the end surfaces 2a and 2b is 2 mm × 1).
mm, and the length between both end surfaces 2a and 2b is 3 mm).

【００１５】絶縁体３は、樹脂材料からなり、端子本体
２の両端面２ａ、２ｂに隣接する個所を僅かに残して端
子本体２の外周面２ｃの各面を覆うように塗布等の手段
で形成されている。The insulator 3 is made of a resin material, and is applied by means of coating or the like so as to cover each surface of the outer peripheral surface 2c of the terminal body 2 while leaving a small portion adjacent to both end surfaces 2a, 2b of the terminal body 2. Has been formed.

【００１６】このように構成された端子１は、次のよう
にして配線基板に取付けられる。すなわち、図２に示す
ように、まず端子１の絶縁体３部分を自動実装機の吸着
ノズル４で吸着して端子本体２の両端面２ａ、２ｂを結
ぶ軸線が配線基板５面に対して平行となるような状態で
保持する。次いで、図３に示すように、端子１を一方の
端面２ａ側のみが半田ペースト６の付与された電極ラン
ド７に接触するようにして配線基板５上に載置する。The terminal 1 thus constructed is attached to the wiring board as follows. That is, as shown in FIG. 2, first, the insulator 3 portion of the terminal 1 is sucked by the suction nozzle 4 of the automatic mounting machine and the axis connecting the both end surfaces 2a and 2b of the terminal body 2 is parallel to the surface of the wiring board 5. Hold in such a state that Next, as shown in FIG. 3, the terminal 1 is placed on the wiring board 5 so that only one end face 2a side is in contact with the electrode land 7 provided with the solder paste 6.

【００１７】その後、配線基板５を加熱して半田ペース
ト６を溶融すると、図４に示すように、端子１はその溶
融した半田の表面張力により端面２ａ側を支点にして電
極ランド７上で起立し、前記軸線が配線基板５面に対し
て垂直の状態となる。この状態で溶融した半田を固化す
ることにより端子１はその端面２ａ側が電極ランド７に
接続された状態で配線基板５に取付けられる。After that, when the wiring board 5 is heated to melt the solder paste 6, the terminal 1 is erected on the electrode land 7 with the end face 2a side as a fulcrum due to the surface tension of the melted solder, as shown in FIG. Then, the axis is in a state of being perpendicular to the surface of the wiring board 5. By solidifying the molten solder in this state, the terminal 1 is attached to the wiring board 5 with the end face 2a side thereof being connected to the electrode land 7.

【００１８】上記のように、端子１が溶融した半田の表
面張力により起立する現象は、いわゆるチップ状電子部
品におけるツームストーン現象と呼ばれるものであり、
チップ状電子部品においてはこのツームストーン現象が
生じないように種々の配慮がなされるが、本発明は逆に
このツームストーン現象を積極的に利用することによ
り、端子１を配線基板５に取付けるようにしたものであ
る。端子１にこのようなツームストーン現象を生じさせ
るには、配線基板５面の電極ランド７に関しては、端子
１の両端面２ａ、２ｂ間の長さ寸法よりも小さくて、一
方の端面２ａ又は２ｂ側のみしか接触し得ないような大
きさ（望ましくは端面２ａ、２ｂに近似した大きさ）に
形成されていることが望ましい。また、端子１に関して
は、その外周面２ｃがその端面２ａ、２ｂに隣接する部
分をあまり露出させないように絶縁体３で覆われている
ことが望ましい。As described above, the phenomenon in which the terminal 1 rises due to the surface tension of the molten solder is what is called the tombstone phenomenon in so-called chip-shaped electronic parts.
In the chip-shaped electronic component, various consideration is given so that this tombstone phenomenon does not occur, but the present invention conversely attaches the terminal 1 to the wiring board 5 by positively utilizing this tombstone phenomenon. It is the one. In order to cause such a tombstone phenomenon in the terminal 1, the electrode land 7 on the surface of the wiring board 5 is smaller than the length dimension between both end surfaces 2a and 2b of the terminal 1 and one end surface 2a or 2b. It is desirable that it is formed in a size (preferably a size similar to the end faces 2a, 2b) so that only the sides can come into contact with each other. Further, it is desirable that the outer peripheral surface 2c of the terminal 1 be covered with an insulator 3 so as not to expose portions adjacent to the end surfaces 2a and 2b so much.

【００１９】なお、端子１は、上記実施例のような角柱
状である必要はなく、円柱状等の他の形状であってもよ
いし、その大きさについてもツームストーン現象が生じ
得るものであれば、いかなるものでもよい。また、端子
本体２についても上記実施例のように全体が金属材料で
形成されている必要はなく、セラミックや樹脂等の絶縁
材料の表面にメッキ等の手段で金属膜が形成されたもの
であってもよい。要は、端子本体２の少なくとも両端面
２ａ、２ｂに導体部を備えており、その両端面の導体部
が互いに導通された状態となっておればよい。The terminal 1 does not have to have a prismatic shape as in the above embodiment, but may have another shape such as a cylindrical shape, and its size may cause the tombstone phenomenon. Anything will do as long as it is available. Also, the terminal main body 2 does not have to be entirely formed of a metal material as in the above embodiment, but a metal film is formed on the surface of an insulating material such as ceramic or resin by plating or the like. May be. In short, it is sufficient that at least both end surfaces 2a and 2b of the terminal body 2 are provided with conductor portions, and the conductor portions on both end surfaces are electrically connected to each other.

【００２０】[0020]

【発明の効果】以上説明したことから明らかなように本
発明の請求項１および２の配線基板に取付ける端子およ
びその端子の配線基板への取付け方法によれば、他のチ
ップ状電子部品と同様に端子を自動実装機の吸着ノズル
で吸着して配線基板へ取付けるものであるため、配線基
板面のどの位置にも取付けることができ、端子のための
専用の自動機を用いなくても配線基板への取付けの自動
化が可能となる。また、端子は配線基板面に取付けられ
るため、配線基板面に貫通孔を形成する必要はなく、し
かも端子本体は柱状をなしているため、小型化しても端
子強度の面で問題となることはない。As is apparent from the above description, according to the terminals to be mounted on the wiring board and the method of mounting the terminals to the wiring board according to claims 1 and 2 of the present invention, it is the same as other chip-shaped electronic components. Since the terminal is attached to the wiring board by sucking it with the suction nozzle of the automatic mounting machine, it can be attached to any position on the surface of the wiring board, and the wiring board can be installed without using a dedicated automatic machine for terminals. Can be automated. Further, since the terminals are attached to the wiring board surface, there is no need to form through holes in the wiring board surface, and since the terminal body has a columnar shape, there is no problem in terms of terminal strength even if the size is reduced. Absent.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の配線基板に取付ける端子の
斜視図である。FIG. 1 is a perspective view of a terminal attached to a wiring board according to an embodiment of the present invention.

【図２】図１の端子の配線基板への取付け方法を説明す
るための配線基板の斜視図である。FIG. 2 is a perspective view of a wiring board for explaining a method of attaching the terminal of FIG. 1 to the wiring board.

【図３】図１の端子の配線基板への取付け方法を説明す
るための配線基板の斜視図である。FIG. 3 is a perspective view of a wiring board for explaining a method of attaching the terminal of FIG. 1 to the wiring board.

【図４】図１の端子の配線基板への取付け方法を説明す
るための配線基板の斜視図である。FIG. 4 is a perspective view of a wiring board for explaining a method of attaching the terminal of FIG. 1 to the wiring board.

【図５】従来例の配線基板に取付ける端子の側面図であ
る。FIG. 5 is a side view of a terminal attached to a conventional wiring board.

【図６】従来例の配線基板に取付ける端子の側面図であ
る。FIG. 6 is a side view of a terminal attached to a conventional wiring board.

【符号の説明】[Explanation of symbols]

１ 端子 ２ 端子本体 ２ａ、２ｂ 端面 ２ｃ 外周面 ３ 絶縁体 ４ 吸着ノズル ５ 配線基板 ６ 半田ペースト ７ 電極ランド 1 terminal 2 terminal body 2a, 2b end surface 2c outer peripheral surface 3 insulator 4 suction nozzle 5 wiring board 6 solder paste 7 electrode land

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 対向する一対の端面とそれを結ぶ外周面
とを有し、かつ少なくともその両端面に互いに導通した
状態の導体部を備えた端子本体と、その端子本体の外周
面を覆っている絶縁体とからなり、その絶縁体部分が自
動実装機の吸着ノズルの吸着面とされたことを特徴とす
る、配線基板に取付ける端子。1. A terminal main body having a pair of end surfaces facing each other and an outer peripheral surface connecting the end surfaces, and at least both end surfaces of the terminal main body having conductor portions in a conductive state, and a terminal main body covering the outer peripheral surface. A terminal to be mounted on a wiring board, characterized in that the insulating portion is the suction surface of the suction nozzle of the automatic mounting machine. 【請求項２】 請求項１記載の端子の配線基板への取付
け方法であって、まず絶縁体部分を自動実装機の吸着ノ
ズルで吸着して端子本体の両端面を結ぶ軸線が配線基板
面に対して平行となるような状態で端子を保持し、次い
でその端子を一方の端面側のみが半田ペーストの付与さ
れた電極ランドに接触するようにして配線基板上に載置
し、その後に加熱して半田ペーストを溶融し、その溶融
した半田の表面張力により前記端子を電極ランド上で起
立させて前記軸線が配線基板面に対して垂直になるよう
にしたことを特徴とする端子の配線基板への取付け方
法。2. The method of mounting a terminal on a wiring board according to claim 1, wherein the insulating portion is first sucked by a suction nozzle of an automatic mounting machine, and an axis line connecting both end surfaces of the terminal body to the wiring board surface. Hold the terminals in parallel to each other, then place the terminals on the wiring board so that only one end surface side contacts the electrode land with solder paste, and then heat. To the wiring board of the terminal characterized in that the solder paste is melted and the surface tension of the melted solder causes the terminal to stand up on the electrode land so that the axis line is perpendicular to the wiring board surface. How to install.
JP5137185A 1993-06-08 1993-06-08 Terminal to be attached to wiring board and method of attaching the terminal to the wiring board Pending JPH06349534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5137185A JPH06349534A (en) 1993-06-08 1993-06-08 Terminal to be attached to wiring board and method of attaching the terminal to the wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5137185A JPH06349534A (en) 1993-06-08 1993-06-08 Terminal to be attached to wiring board and method of attaching the terminal to the wiring board

Publications (1)

Publication Number Publication Date
JPH06349534A true JPH06349534A (en) 1994-12-22

Family

ID=15192793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5137185A Pending JPH06349534A (en) 1993-06-08 1993-06-08 Terminal to be attached to wiring board and method of attaching the terminal to the wiring board

Country Status (1)

Country Link
JP (1) JPH06349534A (en)

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