JPH06312837A - Conveyer - Google Patents
ConveyerInfo
- Publication number
- JPH06312837A JPH06312837A JP12844193A JP12844193A JPH06312837A JP H06312837 A JPH06312837 A JP H06312837A JP 12844193 A JP12844193 A JP 12844193A JP 12844193 A JP12844193 A JP 12844193A JP H06312837 A JPH06312837 A JP H06312837A
- Authority
- JP
- Japan
- Prior art keywords
- endless belt
- circuit board
- polymer compound
- adhesive polymer
- compound layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- De-Stacking Of Articles (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、主として回路基板等
の板状物を搬送する搬送装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a transfer device for transferring a plate-like object such as a circuit board.
【０００２】[0002]
【従来の技術】従来、積み重ねられた回路基板を、ベル
トコンベア等に載せるための搬送装置としては、吸引装
置を用いて、回路基板を一枚づつ吸引して持ち上げ、コ
ンベア上に載せていた。この場合、回路基板には、一般
に、端子挿通孔やスルーホールや位置決め用の透孔が形
成されており、これらの透孔を避けて吸引装置の吸盤を
配置していた。2. Description of the Related Art Conventionally, a suction device has been used as a transfer device for mounting the stacked circuit boards on a belt conveyor or the like, and the circuit boards are suctioned and lifted one by one and placed on the conveyor. In this case, the circuit board is generally formed with a terminal insertion hole, a through hole, and a through hole for positioning, and the suction cup of the suction device is arranged avoiding these through holes.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の技術の場
合、回路基板の種類が替わると、透孔の位置も替わり、
従って、吸引装置の吸盤の位置も変更しなければなら
ず、基板変更に際しての作業が面倒であった。さらに、
吸引装置が必要であり、そのための機械を設置しなけれ
ばならず、搬送装置全体として大型になり、構造も複雑
なものとなるという欠点があった。In the above conventional technique, when the type of the circuit board changes, the position of the through hole also changes,
Therefore, the position of the suction cup of the suction device has to be changed, and the work for changing the substrate is troublesome. further,
A suction device is required, and a machine for that purpose must be installed, and the transport device as a whole becomes large in size and its structure is complicated.
【０００４】この発明は上記従来の技術の問題点に鑑み
てなされたもので、簡単な構造で、被搬送物の変更に対
しても何ら変更を加えることなく使用可能な搬送装置を
提供することを目的とする。The present invention has been made in view of the above-mentioned problems of the prior art, and provides a transporting device which has a simple structure and can be used even if the transported object is changed without any change. With the goal.
【０００５】[0005]
【課題を解決するための手段】この発明は、少なくとも
一対のローラ間に、粘着性を有したゲル状ゴム等の粘着
性高分子化合物層が表面に露出した無端ベルトを掛け渡
し、この無端ベルトの表面を、被搬送物の表面に圧接さ
せる押圧手段を設け、上記無端ベルト表面に付着させら
れた被搬送物を搬送方向先端のローラ位置まで搬送する
搬送装置である。SUMMARY OF THE INVENTION According to the present invention, an endless belt having an adhesive polymer compound layer such as gel rubber having an adhesive property exposed on the surface is laid between at least a pair of rollers. Is a conveying device which is provided with a pressing means for pressing the surface of the object to the surface of the object to be conveyed, and conveys the object adhered to the surface of the endless belt to the roller position at the leading end in the conveying direction.
【０００６】[0006]
【作用】この発明の搬送装置は、無端ベルトの表面に粘
着性高分子化合物層を設け、この粘着性高分子化合物に
被搬送物を付着させて搬送するので、被搬送物の表面形
状や透孔等に関係なく確実に保持して搬送することがで
きる。さらに、粘着性高分子化合物層は、糊のようにそ
の一部が剥離して被搬送物表面に付着することがなく、
逆に表面のゴミを除去するものであり、被搬送物表面に
悪影響を与えることはない。In the transporting apparatus of the present invention, since the adhesive polymer compound layer is provided on the surface of the endless belt and the object to be transported is adhered to the adhesive polymer compound and transported, the surface shape and the transparency of the object to be transported are transmitted. It can be reliably held and transported regardless of the holes or the like. Furthermore, the adhesive polymer compound layer does not adhere to the surface of the object to be transported due to part of the adhesive film peeling off like glue.
On the contrary, it removes dust on the surface and does not adversely affect the surface of the transported object.
【０００７】[0007]
【実施例】以下この発明の実施例について図面に基づい
て説明する。この実施例の搬送装置は回路基板をベルト
コンベア上に載せるためのもので、制御盤１０と、この
制御盤１０により制御される駆動装置１２とが設けら
れ、駆動装置１２に駆動ローラ１４が接続しているとと
もに、従動ローラ１６及びテンションローラ１８が設け
られている。各ローラ１４，１６，１８には、無端ベル
ト２０が掛けられている。この無端ベルト２０は、ベル
ト基材２１と、その外側に設けられた粘着性高分子化合
物層２２とからなっている。粘着性高分子化合物層２２
は、ポリエチレン系ゲル状ゴム、ポリウレタン樹脂、塩
化ビニル樹脂、シリコンゴム等であり、各種の高分子化
合物を、適宜の弾性及び硬度になるように添加剤等を調
整して製造されるものである。そして、この粘着性は、
主に硬度と弾性の双方に依存し、その各々に対して負の
相関関係がある。Embodiments of the present invention will be described below with reference to the drawings. The carrier device of this embodiment is for mounting a circuit board on a belt conveyor, and is provided with a control board 10 and a drive device 12 controlled by the control board 10, and a drive roller 14 is connected to the drive device 12. In addition, the driven roller 16 and the tension roller 18 are provided. An endless belt 20 is hung on each of the rollers 14, 16 and 18. The endless belt 20 includes a belt base material 21 and an adhesive polymer compound layer 22 provided on the outside thereof. Adhesive polymer compound layer 22
Are polyethylene gel rubbers, polyurethane resins, vinyl chloride resins, silicone rubbers, etc., which are produced by adjusting various additives such as various polymer compounds so as to have appropriate elasticity and hardness. . And this stickiness is
It depends mainly on both hardness and elasticity, with a negative correlation to each.
【０００８】この無端ベルト２０は、図２に示すよう
に、各ローラ１４，１６，１８に４本掛け渡され各々同
期して回動する。また、上方の従動ローラ１６とテンシ
ョンローラ１８との間には、クリーニング手段である洗
浄槽２４が設けられ、無端ベルト２０がその中に一旦入
れられて出て行くように設けられている。洗浄槽２４の
出口部分には、乾燥ブロア２６が設けられ、洗浄された
無端ベルト２０の表面を乾燥させるものである。As shown in FIG. 2, the endless belt 20 is wound around four rollers 14, 16 and 18 and rotated in synchronization with each other. Further, a cleaning tank 24 as a cleaning means is provided between the driven roller 16 and the tension roller 18 on the upper side, and the endless belt 20 is provided so that the endless belt 20 is once put therein and goes out. A drying blower 26 is provided at the outlet of the cleaning tank 24 to dry the surface of the washed endless belt 20.
【０００９】この搬送装置の下方には、被搬送物である
回路基板３０が積み重ねられ、最上部の回路基板３０を
所定の高さに設定する基板上下装置３２が設けられてい
る。一方、駆動ローラ１４付近の下方には、無端ベルト
２０と等しい周速度で回転した支持ローラ３４が複数取
りつけられ、さらに、この駆動ローラ１４の下方に、回
路基板３０を所定位置に搬送するベルトコンベア３６の
基端部が位置している。A circuit board 30 which is an object to be transferred is stacked below the transfer device, and a board elevating device 32 is provided for setting the uppermost circuit board 30 to a predetermined height. On the other hand, below the vicinity of the drive roller 14, a plurality of support rollers 34 that are rotated at the same peripheral speed as the endless belt 20 are mounted, and below the drive roller 14, a belt conveyor that conveys the circuit board 30 to a predetermined position. The proximal end of 36 is located.
【００１０】また、基板上下装置３２上に積み重ねられ
た回路基板３０の上方であって、無端ベルト２０をはさ
んで回路基板３０と対面する位置には、各無端ベルト２
０を下方に押しやり回路基板３０の表面に粘着性高分子
化合物層２２を押し付ける押圧手段である押し付け装置
３８が設けられている。In addition, above the circuit boards 30 stacked on the board raising / lowering device 32 and at a position facing the circuit board 30 with the endless belt 20 interposed therebetween, each endless belt 2 is provided.
A pressing device 38, which is a pressing unit that presses 0 downward and presses the adhesive polymer compound layer 22 on the surface of the circuit board 30, is provided.
【００１１】この実施例の搬送装置に動作は、回路基板
を４列にして基板上下装置３２にセットする。そして、
駆動装置１２が駆動され、無端ベルト２０を回動させ、
制御盤１０により所定のタイミングに制御された押し付
け装置３８が、回路基板３０の表面に無端ベルト２０の
粘着性高分子化合物層２２を、所定時間間隔で押し付け
る。すると、回路基板３０は、粘着性高分子化合物層２
２に付着し、無端ベルト２０の移動に伴って、積み重ね
られた回路基板３０の最上部の基板が４列同時に搬送さ
れる。この時、回路基板３０には多数の透孔４０が形成
されているが、透孔４０の位置に関係なく、無端ベルト
２０が回路基板３０を保持して終端部へ搬送する。In the operation of the carrier device of this embodiment, the circuit boards are set in four rows and set in the board up-down device 32. And
The driving device 12 is driven to rotate the endless belt 20,
The pressing device 38 controlled by the control board 10 at a predetermined timing presses the adhesive polymer compound layer 22 of the endless belt 20 on the surface of the circuit board 30 at predetermined time intervals. Then, the circuit board 30 has the adhesive polymer compound layer 2
2, the uppermost circuit boards of the stacked circuit boards 30 are simultaneously conveyed in four rows as the endless belt 20 moves. At this time, although a large number of through holes 40 are formed in the circuit board 30, the endless belt 20 holds the circuit board 30 and conveys the circuit board 30 to the terminal end regardless of the positions of the through holes 40.
【００１２】そして、駆動ローラ１４が位置した終端部
では、無端ベルト２０が回路基板３０から連続的にはが
れ、回路基板３０が無端ベルト２０に付着したまま上方
に搬送されることはない。また、無端ベルト２０の下方
には、支持ローラ３４が設けられ、回路基板３０が万一
粘着性高分子化合物層２２からはがれても、下方には落
下せずに無端ベルト２０と支持ローラ３４とにより挟ま
れて搬送され、確実にベルトコンベア３６の基端部へ送
られる。At the terminal end where the drive roller 14 is located, the endless belt 20 is continuously peeled off from the circuit board 30, and the circuit board 30 is not conveyed upward while being attached to the endless belt 20. Further, a support roller 34 is provided below the endless belt 20, and even if the circuit board 30 is peeled off from the adhesive polymer layer 22, the endless belt 20 and the support roller 34 do not drop downward. It is sandwiched by and conveyed, and is reliably sent to the base end portion of the belt conveyor 36.
【００１３】無端ベルト２０は、回路基板３０の搬送に
より表面にゴミ等が付着するが、洗浄槽２４内の洗浄液
でゴミ等が除去され、乾燥ブロア２６により粘着性高分
子化合物層２２の表面が確実に乾燥され、良好な粘着力
を維持して回路基板３０の搬送が行われる。Dust and the like adhere to the surface of the endless belt 20 when the circuit board 30 is conveyed, but the dust and the like are removed by the cleaning liquid in the cleaning tank 24, and the surface of the adhesive polymer compound layer 22 is removed by the dry blower 26. The circuit board 30 is transported while being surely dried and maintaining a good adhesive force.
【００１４】この実施例の搬送装置によれば、回路基板
３０を粘着性高分子化合物層２２に粘着させて保持し搬
送するので、回路基板３０の透孔４０の位置や形状に関
係なく確実に搬送することができる。しかも、被搬送物
である基板の変更に際しても、吸引装置のように設定変
更の必要がなく、そのまま利用することができるもので
あり、自由度の大きい搬送措置である。また、無端ベル
ト２０の下方には、支持ローラ３４を設け、基板３０が
落下しないように支持し、確実な搬送を確保している。
さらに、粘着性高分子化合物層２２は、回路基板３０の
表面に粘着かすが付着することがなく、しかもゴミ等を
容易に除去することができ、耐久性も高いものである。According to the carrier of this embodiment, the circuit board 30 is adhered to and held by the adhesive polymer compound layer 22 and carried, so that the circuit board 30 can be reliably carried out regardless of the position or shape of the through hole 40. Can be transported. Moreover, even when the substrate to be transported is changed, there is no need to change the setting unlike the suction device, and the substrate can be used as it is, which is a transportation measure with a high degree of freedom. A support roller 34 is provided below the endless belt 20 to support the substrate 30 so that the substrate 30 does not drop and ensure reliable transport.
Further, the adhesive polymer compound layer 22 has a high durability because the adhesive residue does not adhere to the surface of the circuit board 30, dust can be easily removed.
【００１５】なお、この発明の搬送装置は、上記実施例
に限定されず、帯状の粘着性高分子化合物層を有した無
端ベルトが、ローラ間に掛け渡され、この粘着性高分子
化合物層に被搬送物を付着させて、搬送するものであれ
ば良く、粘着性高分子化合物の種類や、ベルトの駆動方
法は問わない。粘着性高分子化合物は、被搬送物に合わ
せて、適宜の粘着力及び弾性等を設定可能なものであ
り、公知の粘着性高分子化合物を適宜選択して使用可能
なものである。The transporting device of the present invention is not limited to the above embodiment, and an endless belt having a band-shaped adhesive polymer compound layer is stretched between rollers to form an adhesive polymer compound layer. Any material may be used as long as the material to be conveyed is attached and conveyed, and the kind of the adhesive polymer compound and the belt driving method are not limited. The adhesive polymer compound can have an appropriate adhesive force, elasticity, etc. set according to the object to be conveyed, and a known adhesive polymer compound can be appropriately selected and used.
【００１６】[0016]
【発明の効果】この発明の搬送装置は、粘着性を有した
粘着性高分子化合物層に、被搬送物を付着させて、所定
位置に運ぶようにしたので、被搬送物の表面性状や、形
状にかかわらず確実に被搬送物を保持して運ぶことがで
きる。さらに、押圧手段により、被搬送物の表面に粘着
性高分子化合物層を押し付けて付着させているので、任
意の間隔で確実に搬送することができる。また、装置自
体も、簡単な構成となり、機構や大きさの自由度も高い
ものである。さらに、粘着性高分子化合物層によって、
被搬送物表面のほこり等が除去されるという効果もあ
る。EFFECT OF THE INVENTION In the transporting device of the present invention, the object to be transported is adhered to the adhesive polymer compound layer having adhesiveness and carried to a predetermined position. The transported object can be reliably held and carried regardless of the shape. Further, since the adhesive polymer compound layer is pressed and attached to the surface of the object to be conveyed by the pressing means, the object can be reliably conveyed at an arbitrary interval. Further, the apparatus itself has a simple structure and has a high degree of freedom in mechanism and size. Furthermore, by the adhesive polymer compound layer,
There is also an effect that dust or the like on the surface of the transported object is removed.
【図１】この発明の搬送装置の一実施例の部分拡大斜視
図である。FIG. 1 is a partially enlarged perspective view of an embodiment of a carrying device of the present invention.
【図２】この実施例の搬送装置の平面図である。FIG. 2 is a plan view of the transfer device according to this embodiment.
【図３】この実施例の搬送装置の正面図である。FIG. 3 is a front view of the transport device according to this embodiment.
１２ 駆動装置 １４ 駆動ローラ １６ 従動ローラ ２０ 無端ベルト ２２ 粘着性高分子化合物層 ２４ 洗浄槽 ３０ 回路基板 ３８ 押し付け装置 ４０ 透孔 12 Drive Device 14 Drive Roller 16 Driven Roller 20 Endless Belt 22 Adhesive Polymer Compound Layer 24 Cleaning Tank 30 Circuit Board 38 Pressing Device 40 Through Hole
Claims (2)
を有し、このローラ間に、粘着性高分子化合物層が表面
に露出した無端ベルトを掛け渡し、この無端ベルトの表
面を、被搬送物の表面に圧接させる押圧手段を設け、上
記無端ベルト表面に付着させられた被搬送物を搬送方向
先端のローラ位置まで搬送することを特徴とする搬送装
置。1. An endless belt having a driving device and at least a pair of rollers, the surface of which an adhesive polymer compound layer is exposed is hung between the rollers, and the surface of the endless belt is used to convey the object. And a pressing means for pressing the surface of the endless belt to convey the object to be conveyed attached to the surface of the endless belt to the roller position at the front end in the conveying direction.
クリーニング手段を設けたことを特徴とする請求項１記
載の搬送装置。2. The conveying device according to claim 1, further comprising a cleaning unit for removing deposits on the surface of the endless belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12844193A JPH06312837A (en) | 1993-04-30 | 1993-04-30 | Conveyer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12844193A JPH06312837A (en) | 1993-04-30 | 1993-04-30 | Conveyer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06312837A true JPH06312837A (en) | 1994-11-08 |
Family
ID=14984813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12844193A Pending JPH06312837A (en) | 1993-04-30 | 1993-04-30 | Conveyer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06312837A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4864975A (en) * | 1987-07-03 | 1989-09-12 | Honda Giken Kogyo Kabushiki Kaisha | Compression ratio-changing device for internal combustion engines |
| WO2016017807A1 (en) * | 2014-08-01 | 2016-02-04 | 日東電工株式会社 | Method for handling display cell having flexible thin film structure |
| WO2016017806A1 (en) * | 2014-08-01 | 2016-02-04 | 日東電工株式会社 | Method for cementing optical functional film to display cell of flexible thin film structure |
-
1993
- 1993-04-30 JP JP12844193A patent/JPH06312837A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4864975A (en) * | 1987-07-03 | 1989-09-12 | Honda Giken Kogyo Kabushiki Kaisha | Compression ratio-changing device for internal combustion engines |
| WO2016017807A1 (en) * | 2014-08-01 | 2016-02-04 | 日東電工株式会社 | Method for handling display cell having flexible thin film structure |
| WO2016017806A1 (en) * | 2014-08-01 | 2016-02-04 | 日東電工株式会社 | Method for cementing optical functional film to display cell of flexible thin film structure |
| CN105321862A (en) * | 2014-08-01 | 2016-02-10 | 日东电工株式会社 | Method for handling display cell having flexible thin film structure |
| KR20160016591A (en) * | 2014-08-01 | 2016-02-15 | 닛토덴코 가부시키가이샤 | Method for laminating an Optically Functional Film to a Display Cell of a Flexible Thin Film Structure |
| JP2016035507A (en) * | 2014-08-01 | 2016-03-17 | 日東電工株式会社 | Method for handling display cell with flexible thin film structure |
| JP2016035508A (en) * | 2014-08-01 | 2016-03-17 | 日東電工株式会社 | Method for attaching optical functional film to display cell with flexible thin film structure |
| TWI632099B (en) * | 2014-08-01 | 2018-08-11 | 日商日東電工股份有限公司 | Method for handling a display cell and a optical display cell and a cell motherboard of a thin film structure |
| TWI636866B (en) * | 2014-08-01 | 2018-10-01 | 日商日東電工股份有限公司 | Method for laminating an optically functional film to a display cell of a flexible thin film structure |
| CN105321862B (en) * | 2014-08-01 | 2018-12-18 | 日东电工株式会社 | The method for handling the display element of flexible film structure |
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