JPH06265924A - Electro-optic device and its production - Google Patents
Electro-optic device and its productionInfo
- Publication number
- JPH06265924A JPH06265924A JP7890193A JP7890193A JPH06265924A JP H06265924 A JPH06265924 A JP H06265924A JP 7890193 A JP7890193 A JP 7890193A JP 7890193 A JP7890193 A JP 7890193A JP H06265924 A JPH06265924 A JP H06265924A
- Authority
- JP
- Japan
- Prior art keywords
- electro
- resin
- electrode
- circuit member
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属厚膜を有する回路
部材との導電接続に特徴を有する液晶表示装置のような
電気光学装置及びその製造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device such as a liquid crystal display device characterized by conductive connection with a circuit member having a thick metal film, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】液晶表示素子等のガラス基板上に形成さ
れた端子部分に対し、外部回路との接続のために銅箔付
きのフレキシブルプリント基板のような金属厚膜を有す
る回路部材を導電接続する方法としては、種々の方法が
知られている。2. Description of the Related Art A circuit member having a thick metal film, such as a flexible printed circuit board with a copper foil, is electrically connected to a terminal portion formed on a glass substrate such as a liquid crystal display element for connection with an external circuit. Various methods are known as methods for doing this.
【０００３】具体的には、端子部分のIn2O3-SnO2（ＩＴ
Ｏ）やSnO2等の透明電極に無電解ニッケルメッキ等を施
し、ハンダ付けする方法、異方性導電膜を用いる方法、
導電ゴムコネクタを用いる方法等が行われている。Specifically, In 2 O 3 -SnO 2 (IT
O) or SnO 2 or the like, a method of applying electroless nickel plating or the like to a transparent electrode and soldering, a method of using an anisotropic conductive film,
A method using a conductive rubber connector and the like have been performed.
【０００４】ハンダ付けする方法は最も付着力が強く信
頼性は高くなるが、メッキ工程が必要であり、端子間の
ハンダのブリッジによる短絡の問題やハンダ付け時に高
温にさらされるという問題があった。また、導電ゴムコ
ネクタは端子のピッチが狭くなると信頼性が低下し、ゴ
ムの弾性力で接続を保っているため長期間における信頼
性に問題があった。また、異方性導電膜も異方性の導電
接続を保つのに製造条件や微細なピッチへの対応にいろ
いろの制限があった。Although the soldering method has the strongest adhesion and the highest reliability, it requires a plating process, and has a problem of a short circuit due to a solder bridge between terminals and a problem of being exposed to a high temperature during soldering. . Further, the conductive rubber connector has reduced reliability when the pitch of the terminals is narrowed, and since the connection is maintained by the elastic force of the rubber, there is a problem in reliability for a long period of time. Further, the anisotropic conductive film also has various restrictions in terms of manufacturing conditions and correspondence to a fine pitch in order to maintain anisotropic conductive connection.
【０００５】[0005]
【発明が解決しようとする課題】このため、信頼性が高
く、かつ、製造が容易な電気光学素子と金属厚膜を有す
る回路部材との導電接続が望まれていた。Therefore, there has been a demand for conductive connection between the electro-optical element having high reliability and easy to manufacture and the circuit member having the thick metal film.
【０００６】[0006]
【課題を解決するための手段】本発明は、前述の問題点
を解決すべくなされたものであり、一対の電極付基板を
電極面が相対向するように配置し、周辺をシールして内
部に電気光学媒体を挟持し、少なくとも一方の電極付基
板は他の電極付基板が対向していない端子部分を有する
電気光学素子の端子部分で、金属厚膜を有する回路部材
と導電接続を行う電気光学装置において、金属厚膜表面
に微細な凹凸が形成されている回路部材と、電気光学素
子の端子部分との間に硬化前に比べて硬化後に収縮した
状態となる樹脂を配置して両者を接着したことを特徴と
する電気光学装置、及び、その金属厚膜表面に設けられ
た微細な凹凸の凹部と凸部の高さの差が 5〜30μｍとさ
れることを特徴とする電気光学装置を提供するものであ
る。The present invention has been made to solve the above-mentioned problems, and a pair of substrates with electrodes are arranged so that their electrode surfaces face each other, and the peripheries are sealed to form an internal structure. The electro-optic medium is sandwiched between the electrodes, and at least one electrode-equipped substrate is a terminal portion of an electro-optical element having a terminal portion that does not face the other electrode-equipped substrate, and an electrical connection for conductive connection with a circuit member having a thick metal film is provided. In an optical device, a resin that is in a contracted state after curing as compared with that before curing is arranged between a circuit member having fine irregularities formed on the surface of a metal thick film and a terminal portion of an electro-optical element. An electro-optical device characterized by being bonded, and an electro-optical device characterized in that the height difference between the concave and convex portions of fine irregularities provided on the surface of the metal thick film is 5 to 30 μm. Is provided.
【０００７】また、一対の電極付基板を電極面が相対向
するように配置し、周辺をシールして内部に電気光学媒
体を挟持し、少なくとも一方の電極付基板は他の電極付
基板が対向していない端子部分を有する電気光学素子の
端子部分に、金属厚膜を有する回路部材を導電接続する
電気光学装置の製造法において、回路部材の金属厚膜表
面に微細な凹凸を形成し、電気光学素子の端子部分との
間に硬化後に収縮する樹脂を配置し、両者を接着したこ
とを特徴とする電気光学装置の製造法を提供するもので
ある。Further, a pair of substrates with electrodes are arranged so that the electrode surfaces face each other, and the periphery is sealed to sandwich the electro-optical medium inside. At least one substrate with electrodes faces another substrate with electrodes. In a method of manufacturing an electro-optical device in which a circuit member having a metal thick film is conductively connected to a terminal part of an electro-optical element having a terminal part which is not formed, fine unevenness is formed on the metal thick film surface of the circuit member, A method of manufacturing an electro-optical device, characterized in that a resin that shrinks after curing is arranged between the terminal portion of the optical element and the resin, and the both are adhered.
【０００８】本発明の電気光学装置で用いる電気光学素
子は、一対の電極付基板を電極面が相対向するように配
置し、周辺をシールして内部に電気光学媒体を挟持し、
少なくとも一方の電極付基板は他の電極付基板が対向し
ていない端子部分を有するものである。具体的な例とし
ては、ＩＴＯやSnO2等の透明電極をガラス、プラスチッ
ク等の基板上に形成した電極付基板間に、液晶を挟持し
た液晶光学素子がある。もちろん、これ以外のエレクト
ロクロミック素子や他の光学素子でも使用できる。In the electro-optical element used in the electro-optical device of the present invention, a pair of substrates with electrodes are arranged such that the electrode surfaces face each other, and the periphery is sealed to sandwich the electro-optical medium inside.
At least one substrate with electrodes has a terminal portion where the other substrate with electrodes does not face each other. As a specific example, there is a liquid crystal optical element in which a liquid crystal is sandwiched between substrates with electrodes in which transparent electrodes such as ITO and SnO 2 are formed on a substrate such as glass or plastic. Of course, other electrochromic devices or other optical devices can be used.
【０００９】また、この基板上には、必要に応じてカラ
ーフィルター、遮光膜、位相差板、偏光板、ＴＦＴ、Ｍ
ＩＭ、金属配線、反射層、各種絶縁層等が形成されても
よい。また、基板自体が必要に応じてカラーフィルタ
ー、位相差板、偏光板、反射板、半導体基板等であって
もよい。If necessary, a color filter, a light-shielding film, a retardation film, a polarizing plate, a TFT, an M film are formed on the substrate.
IM, metal wiring, a reflective layer, various insulating layers, etc. may be formed. Further, the substrate itself may be a color filter, a retardation plate, a polarizing plate, a reflection plate, a semiconductor substrate or the like, if necessary.
【００１０】本発明の電気光学素子は、２枚の電極基板
が相対向してシールされているシール外に、端子部分を
有する、即ち、少なくとも一方の電極付基板は他の電極
付基板が対向していない端子部分を有する。この端子部
分の電極を通じて金属厚膜を有する回路部材と導電接続
をとる構造であればよい。The electro-optical element of the present invention has a terminal portion outside the seal in which two electrode substrates are sealed so as to face each other, that is, at least one electrode substrate is opposed to another electrode substrate. Not having a terminal portion. Any structure may be used as long as it has a conductive connection with a circuit member having a thick metal film through the electrode of the terminal portion.
【００１１】本発明の金属厚膜を有する回路部材とは、
それ自体が数十μｍ程度の金属厚膜による導電膜を有す
る回路部材であり、具体的にはフレキシブル回路基板に
銅箔によるパターンを設けたものや、ＴＡＢ等がある。
なお、本発明では、金属厚膜による導電膜に微細な凹凸
のパターンが形成される。この凹凸の詳細については、
後で詳述する。The circuit member having a thick metal film of the present invention is
The circuit member itself has a conductive film of a metal thick film of about several tens of μm, and specifically, there are a flexible circuit board provided with a pattern of copper foil, TAB, and the like.
In the present invention, a fine uneven pattern is formed on the conductive film made of a thick metal film. For more information about this unevenness,
More on this later.
【００１２】本発明の電気光学装置の導電接続した状態
の断面図を図１に示す。図１において、1A、1Bはガラ
ス、プラスチック等の基板、2A、2BはＩＴＯやSnO2等の
電極、 3は両基板を接着するシール、 4はフレキシブル
回路基板等の回路部材、 5は回路部材上の金属厚膜、 6
はその金属厚膜に設けられた凹凸、 7は硬化後に収縮す
る樹脂を示している。L は端子の電極2Aと回路部材上の
金属厚膜5とが対向している長さを示している。FIG. 1 shows a sectional view of the electro-optical device of the present invention in a conductively connected state. In FIG. 1, 1A and 1B are substrates such as glass and plastic, 2A and 2B are electrodes such as ITO and SnO 2 , 3 is a seal for adhering both substrates, 4 is a circuit member such as a flexible circuit board, and 5 is a circuit member Metal thick film on, 6
Indicates the unevenness provided on the thick metal film, and 7 indicates the resin that contracts after curing. L indicates the length at which the electrode 2A of the terminal and the thick metal film 5 on the circuit member face each other.
【００１３】この図からも明らかなように、電気光学素
子の電極2Aは回路部材4 の金属厚膜5 とその表面に設け
られた凹凸6 の凸部で接触しており、その接触が硬化後
に収縮する樹脂7 で保持されている。この樹脂が硬化し
た際に、収縮して電極2Aと金属厚膜5 との接触を強く保
持している。このため、温度の変化にさらされても、導
電接続不良を生じにくい。As is clear from this figure, the electrode 2A of the electro-optical element is in contact with the metal thick film 5 of the circuit member 4 at the projections of the unevenness 6 provided on the surface thereof, and the contact is after curing. It is held by a shrinking resin 7. When this resin is hardened, it contracts and strongly holds the contact between the electrode 2A and the thick metal film 5. Therefore, even when exposed to a change in temperature, a conductive connection failure is unlikely to occur.
【００１４】この樹脂は、図１に示すように電気光学素
子のシールの側面まで延長して設けられていることが、
接続の信頼性が向上すると共に電気光学素子のシールの
信頼性も向上させるため、好ましい。また、下側も、基
板1Aの側面まで延長されて設けられていることが、回路
部材の剥離を抑制するため、好ましい。This resin is provided so as to extend to the side surface of the seal of the electro-optical element as shown in FIG.
This is preferable because the reliability of the connection is improved and the reliability of the seal of the electro-optical element is improved. Further, it is preferable that the lower side is also provided so as to extend to the side surface of the substrate 1A in order to prevent peeling of the circuit member.
【００１５】図２は、図１の例を紙面に垂直な面で切断
した状態を示す断面図である。図２においては、この端
子の接続のみを示しているが、通常は横に多数の端子が
並んで配置されている。図での符号は、図１と同じもの
には同じ符号を付けた。W1は端子の電極の頂部の幅、W2
は回路部材の金属厚膜の頂部の幅、W3は端子の電極の頂
部と隣接する電極の頂部の幅を示している。FIG. 2 is a sectional view showing a state in which the example of FIG. 1 is cut along a plane perpendicular to the plane of the drawing. In FIG. 2, only the connection of these terminals is shown, but usually, a large number of terminals are arranged side by side. The same reference numerals as those in FIG. 1 are attached to the same reference numerals in the drawings. W 1 is the width of the top of the terminal electrode, W 2
Is the width of the top of the metal thick film of the circuit member, and W 3 is the width of the top of the electrode adjacent to the terminal and the top of the electrode adjacent thereto.
【００１６】この断面の例では、凸部が 5個、凹部が 4
個とされているが、これは端子の電極と回路部材の金属
厚膜の対向部分の大きさと凹凸のピッチ等によって異な
る。例えば、ＴＡＢ接続のように 100μｍ以下のピッチ
での接続の場合、この断面のみでは凸部が 1個とか凹部
が 1個とかしか見えないことがある。その場合において
も、図２の奥行き方向（図１の横方向でL の長さがあ
る）で見れば、必ず複数の凹凸が設けられるようにされ
る。In this example of the cross section, there are 5 convex portions and 4 concave portions.
However, this depends on the size of the facing portion of the electrode of the terminal and the thick metal film of the circuit member, the pitch of the unevenness, and the like. For example, in the case of connection with a pitch of 100 μm or less such as TAB connection, only one convex portion or one concave portion may be visible only in this cross section. Even in that case, when viewed in the depth direction of FIG. 2 (the length of which is L in the lateral direction of FIG. 1), a plurality of irregularities are always provided.
【００１７】即ち、この凹凸のパターンは凸部または凹
部が１つしかないというようなものでは信頼性が不充分
になるので、必ず複数の凹凸を設けるようにする。これ
は、図２の電極と金属厚膜が対向している部分以外の部
分（端子間）での接着のみでは、剥離に対して信頼性が
充分でないためである。即ち、電極と金属厚膜とが対向
している部分の中にアンカーのように樹脂が配置されて
いることが重要なためである。That is, since the reliability of the uneven pattern having only one convex portion or concave portion is insufficient, a plurality of concave and convex portions should be provided. This is because reliability is not sufficient for peeling only by adhesion in a portion (between terminals) other than the portion where the electrode and the thick metal film in FIG. 2 face each other. That is, it is important that the resin is disposed like an anchor in the portion where the electrode and the thick metal film face each other.
【００１８】実用的には、電気光学素子の個々の端子部
分と対向する部分で、回路部材の金属厚膜の凸部の数
（または凹部の数）を 5以上とする。好ましくは、10以
上とする。この凹凸は、ランダムな凹凸の他、ストライ
プ状、同心円状、放射状、格子状の溝や凸部としてもよ
い。また、上記の凹凸の個数は点状の凸部や凹部とした
場合であり、例えばＳ字状、Ｗ字状等の溝や凸部が形成
される場合には、凸部や凹部が連続していて夫々 1個ず
つしかないという形態もある。Practically, the number of convex portions (or the number of concave portions) of the thick metal film of the circuit member is 5 or more at the portion facing the individual terminal portions of the electro-optical element. It is preferably 10 or more. The irregularities may be stripes, concentric circles, radials, or lattice-shaped grooves or protrusions in addition to random irregularities. The above-mentioned number of irregularities is the case where dot-shaped convex portions or concave portions are used. For example, when S-shaped or W-shaped grooves or convex portions are formed, the convex portions and concave portions are continuous. There is also a form in which there is only one each.
【００１９】この凹凸は、プレスにより形成することが
容易であるが、エッチング法や固い材料で擦る傷つけ法
等で形成してもよい。凹凸の深さは、概ね10〜50μｍ程
度とされるが、金属厚膜の厚みと接続部の面積等によっ
て適宜設定すればよい。なお、これはあまり小さくする
と、凹部に充填される樹脂の働きが弱くなるので、平均
10μｍ以上にする。また、この凹凸のピッチは、点状や
ストライプ状のような場合には、10〜 100μｍ程度とす
ればよい。これも金属厚膜の厚みと接続部の面積等によ
って適宜設定すればよい。Although the irregularities can be easily formed by pressing, they may be formed by an etching method or a scratching method by rubbing with a hard material. The depth of the irregularities is generally about 10 to 50 μm, but may be appropriately set depending on the thickness of the thick metal film, the area of the connection portion, and the like. If this is made too small, the resin filling the recesses will weaken, so the average
Make it 10 μm or more. The pitch of the unevenness may be about 10 to 100 μm in the case of a dot shape or a stripe shape. This may also be appropriately set depending on the thickness of the metal thick film, the area of the connection portion, and the like.
【００２０】本発明の接着に用いる樹脂は、硬化後に収
縮する樹脂が用いられる。この収縮は後で電気光学素子
を加熱して膨張した際においても、導電接続が充分に保
たれる程度に収縮するものであればよい。具体的には、
エポキシ樹脂等の熱硬化型樹脂やアクリル樹脂等の光硬
化型樹脂が使用できる。特に、本発明では、加熱せずに
短時間で硬化が可能で収縮率が大きい光硬化型樹脂の使
用が好ましい。The resin used for the adhesion of the present invention is a resin that shrinks after curing. The contraction may be such that it contracts so that the conductive connection is sufficiently maintained even when the electro-optical element is heated and expanded later. In particular,
A thermosetting resin such as an epoxy resin or a photocuring resin such as an acrylic resin can be used. Particularly, in the present invention, it is preferable to use a photocurable resin that can be cured in a short time without heating and has a large shrinkage rate.
【００２１】本発明では、この接着用の樹脂が、電気光
学素子の基板と回路部材の金属厚膜の対向している部分
のみでなく、図１に示すように電気光学素子のシール側
面まで、特に好ましくは反対側の基板側面まで延長され
て充填されることが好ましい。これにより、回路部材の
基板に対する付着力を強くし、かつ、電気光学素子のシ
ールの信頼性向上させるという利点を生じる。In the present invention, the adhesive resin is applied not only to the portion where the substrate of the electro-optical element and the thick metal film of the circuit member face each other, but also to the sealing side surface of the electro-optical element as shown in FIG. It is particularly preferable to extend and fill the side surface of the substrate on the opposite side. As a result, there are advantages that the adhesion of the circuit member to the substrate is increased and the reliability of the seal of the electro-optical element is improved.
【００２２】さらに、基板のシール外部の電極の露出し
ている部分の電極の露出による腐食の抑制にも役立つ。
また、この樹脂には、導電性粒子が混入されていないの
で、導電性粒子の凝集による隣接端子間の短絡や、導電
性粒子不足による接続抵抗の部分的増加というような問
題点を生じにくい。Further, it is also useful for suppressing corrosion of the exposed portion of the electrode outside the seal of the substrate due to the exposure of the electrode.
In addition, since the conductive particles are not mixed in this resin, problems such as short circuit between adjacent terminals due to aggregation of the conductive particles and partial increase in connection resistance due to lack of conductive particles are unlikely to occur.
【００２３】本発明の電気光学装置を製造するには種々
の方法が考えられるが、特に、以下のように製造するこ
とにより容易に製造できる。回路部材の金属厚膜にプレ
ス法等により微細な凹凸を付ける。次いで、硬化後に収
縮する樹脂を電気光学素子の基板または回路部材にディ
スペンサーや印刷等により付与する。次いで、両者を重
ね合わせ、圧着して樹脂を硬化させる。光硬化型樹脂の
場合には、光を照射し、熱硬化型樹脂の場合には、加熱
する。Various methods are conceivable for manufacturing the electro-optical device of the present invention, and in particular, the following manufacturing method facilitates manufacturing. Fine irregularities are formed on the metal thick film of the circuit member by a pressing method or the like. Next, a resin that contracts after curing is applied to the substrate or circuit member of the electro-optical element by a dispenser, printing, or the like. Then, the two are superposed and pressure-bonded to cure the resin. In the case of a photocurable resin, it is irradiated with light, and in the case of a thermosetting resin, it is heated.
【００２４】この加圧は、充分に電気光学素子の基板の
電極と、回路部材の金属厚膜の凸部とが接触するように
する。具体的には、 5〜50kg/cm2程度とすればよいが、
実験的に決定すればよい。This pressurization ensures that the electrode of the substrate of the electro-optical element and the convex portion of the thick metal film of the circuit member come into contact with each other. Specifically, it may be about 5 to 50 kg / cm 2 ,
It may be determined experimentally.
【００２５】本発明では接着用の樹脂として、光硬化型
樹脂を使用することが好ましい。この光硬化型樹脂は、
光照射により硬化せしめられ、光としては可視光、紫外
線等が使用できるが、保存時、塗布工程時には硬化が進
行しにくい方が有利であるので、紫外線で硬化させられ
るものとすることが好ましい。具体的には、高圧水銀ラ
ンプ、超高圧水銀ランプ等を用いて硬化させられるもの
が好ましい。In the present invention, it is preferable to use a photocurable resin as the adhesive resin. This photocurable resin is
It is cured by irradiation with light, and visible light, ultraviolet rays, or the like can be used as light. However, it is advantageous that curing does not easily proceed during storage and during the coating step, and therefore it is preferable that the resin be cured by ultraviolet rays. Specifically, those that can be cured using a high pressure mercury lamp, an ultra high pressure mercury lamp, or the like are preferable.
【００２６】この光硬化型樹脂は、具体的には、アクリ
ル樹脂、ポリイミド樹脂、ポリアミド樹脂、シリコーン
樹脂等の樹脂で光硬化型樹脂が代表的なものとして挙げ
られる。この光硬化型樹脂は、充分な絶縁性や付着力を
有し、硬化時に収縮して電気光学素子の電極と回路部材
の金属厚膜とを強固に接着することができるものであれ
ば使用できる。The photo-curable resin is specifically a resin such as an acrylic resin, a polyimide resin, a polyamide resin, or a silicone resin, and the photo-curable resin is a typical one. This photocurable resin can be used as long as it has sufficient insulation and adhesiveness and can shrink during curing to firmly bond the electrode of the electro-optical element and the thick metal film of the circuit member. .
【００２７】本発明の回路部材は前記したように銅箔等
の金属箔を導体として設けたフレキシブル回路基板、金
属箔の端子を有するＴＡＢ等がある。しかし、通常の厚
手の回路基板や薄いフィルム状の基板であっても使用可
能である。The circuit member of the present invention includes a flexible circuit board provided with a metal foil such as a copper foil as a conductor as described above, and a TAB having terminals of the metal foil. However, even a normal thick circuit board or a thin film board can be used.
【００２８】[0028]
【作用】本発明では、電気光学素子の基板の電極と回路
部材の金属厚膜とが、硬化後に収縮する樹脂で接着され
ており、金属厚膜に凹凸が設けられているため、電極と
金属厚膜とが対向している部分の中にアンカーのように
樹脂が配置されていることになる。これにより、接着の
信頼性が高く、温度が上昇して樹脂が膨張しても導電接
続の信頼性が低下しない。In the present invention, since the electrode of the substrate of the electro-optical element and the thick metal film of the circuit member are adhered by the resin that shrinks after curing and the thick metal film has irregularities, the electrode and the metal The resin is arranged like an anchor in the portion facing the thick film. As a result, the reliability of the adhesion is high, and the reliability of the conductive connection does not decrease even if the temperature rises and the resin expands.
【００２９】[0029]
実施例１ ソーダガラス基板上にＩＴＯからなる透明電極を 330μ
ｍピッチで電極幅W1＝300μｍ、電極間隙W3＝30μｍの
ストライプ状にパターニングしたものを用いて、内部に
ネマチック液晶を封入して液晶表示素子を作成した。回
路部材として、W2＝ 200μｍ、厚み35μｍの銅箔を設け
たフレキシブル回路基板を準備し、この銅箔面を凹凸が
250個／mm2 の金型を用いて15kg/cm2の圧力でプレスし
て深さが平均約20μｍの点状の凸部を形成した。Example 1 A 330 μm transparent electrode made of ITO was formed on a soda glass substrate.
A nematic liquid crystal was sealed inside to form a liquid crystal display element using a pattern having a stripe pattern with an electrode width W 1 = 300 μm and an electrode gap W 3 = 30 μm at m pitch. As a circuit member, prepare a flexible circuit board provided with a copper foil with W 2 = 200 μm and a thickness of 35 μm.
It was pressed at a pressure of 15 kg / cm 2 using a mold of 250 pieces / mm 2 to form dot-shaped convex portions having an average depth of about 20 μm.
【００３０】この電気光学素子の端子部で電極と回路部
材の金属厚膜とを長さが2mm で対向するようにして、そ
の間に光硬化型アクリル樹脂（ロックタイト社製）を4m
g/cm2 塗布して、7kg/cm2 の圧力で加圧しながら紫外線
を500mJ/cm2 照射して硬化させた。この加圧時に、図１
に示すように樹脂がシール側面及び端子部分の形成され
た基板1Aに対向している基板1Bの端面に達するととも
に、基板1Aの右端からはみ出して基板1Aの右側端面の一
部にかかるようにした。At the terminal portion of this electro-optical element, the electrode and the metal thick film of the circuit member are made to face each other with a length of 2 mm, and a photocurable acrylic resin (manufactured by Loctite Co., Ltd.) 4 m is placed between them.
It was applied at g / cm 2 and irradiated with ultraviolet rays at 500 mJ / cm 2 while being pressed at a pressure of 7 kg / cm 2 to be cured. During this pressurization,
The resin reaches the end surface of the board 1B facing the board 1A on which the seal side surface and the terminal portion are formed as shown in, and extends from the right end of the board 1A to be applied to a part of the right end surface of the board 1A. .
【００３１】比較例１として、フレキシブル回路基板の
銅箔面に凹凸を形成しない他は同様にして導電接続を形
成したものを作成した。この２つの接続抵抗の初期値は
ほとんど同じであった。この２つを−40℃と85℃のヒー
トサイクル試験に投入した結果、比較例１のものは接続
抵抗が初期値の2倍以上に上昇し、一部オープン（断
線）が生じた。しかし、実施例１のものは接続抵抗が初
期値の約 2倍にしか上昇しなく、かつオープン（断線）
は全く生じなかった。As Comparative Example 1, a flexible circuit board was prepared in which conductive connections were formed in the same manner except that no unevenness was formed on the copper foil surface. The initial values of these two connection resistances were almost the same. As a result of putting these two into a heat cycle test of −40 ° C. and 85 ° C., in Comparative Example 1, the connection resistance increased to more than twice the initial value, and some open (breakage) occurred. However, in the case of Example 1, the connection resistance rises only about twice as much as the initial value, and is open (broken wire).
Did not occur at all.
【００３２】実施例２ フレキシブル回路基板の銅箔面の凹凸を長手方向に直交
する方向にストライプ状に形成（図１のように見える）
したものを作成し、実施例１と同様にして製造した。こ
れも、ヒートサイクル試験をした結果、実施例１と同等
の性能を示した。Example 2 Concavities and convexities on the copper foil surface of a flexible circuit board are formed in stripes in a direction orthogonal to the longitudinal direction (see FIG. 1).
The above was prepared and manufactured in the same manner as in Example 1. As a result of a heat cycle test, this also showed the same performance as that of Example 1.
【００３３】実施例３ ソーダガラス基板上にカラーフィルター、遮光膜、その
上に樹脂による絶縁層、さらにその上にＩＴＯからなる
透明電極を 110μｍピッチで電極幅W1＝90μｍ、電極間
隙W3＝20μｍのストライプ状にパターニングしたものを
用いて、内部にネマチック液晶を封入して液晶表示素子
を作成した。回路部材として、W3＝20μｍ、厚み35μｍ
の銅箔を設けたＴＡＢを準備し、この銅箔面を凹凸が 2
50個／mm2 の金型を用いて15kg/cm2の圧力でプレスして
深さが平均約20μｍの点状の凸部を形成した。Example 3 On a soda glass substrate, a color filter, a light-shielding film, an insulating layer made of a resin thereon, and a transparent electrode made of ITO thereon were formed with a pitch of 110 μm, an electrode width W 1 = 90 μm, and an electrode gap W 3 = A nematic liquid crystal was encapsulated inside the one patterned into a stripe pattern of 20 μm to prepare a liquid crystal display element. As a circuit member, W 3 = 20μm, thickness 35μm
Prepare the TAB with the copper foil on it, and
It was pressed at a pressure of 15 kg / cm 2 using a die of 50 pieces / mm 2 to form a dot-shaped convex portion having an average depth of about 20 μm.
【００３４】これを実施例１と同様にして光硬化型アク
リル樹脂で両者を接着した。これも、ヒートサイクル試
験をした結果、実施例１と同様に、接続抵抗の増加に伴
う表示のむらはほとんど見られなかった。In the same manner as in Example 1, both were adhered with a photocurable acrylic resin. Also, as a result of the heat cycle test, as in Example 1, almost no display unevenness due to an increase in connection resistance was observed.
【００３５】[0035]
【発明の効果】本発明では、電気光学素子の基板の電極
と回路部材の金属厚膜とが、硬化後に収縮する樹脂で接
着されており、その金属厚膜に凹凸が設けられている。
本発明では、この電極と金属厚膜とが対向している部分
の中に（金属厚膜の凹部に）アンカーのように樹脂が配
置されている。これにより、接着の信頼性が高く、温度
が上昇して樹脂が膨張しても導電接続の信頼性が低下し
ない。According to the present invention, the electrode of the substrate of the electro-optical element and the thick metal film of the circuit member are adhered to each other with a resin that shrinks after curing, and the thick metal film is provided with irregularities.
In the present invention, the resin is arranged like an anchor in the portion where the electrode and the thick metal film face each other (in the concave portion of the thick metal film). As a result, the reliability of the adhesion is high, and the reliability of the conductive connection does not decrease even if the temperature rises and the resin expands.
【００３６】また、この樹脂を電気光学素子のシールの
側面まで延長して設けることによりさらに接続の信頼性
が向上すると共に電気光学素子のシールの信頼性も向上
させる。さらに、端子部分での電極の露出も防げるの
で、電極の腐食も抑制される。また、下側も端子部の基
板の側面まで延長されて設けることにより、回路部材の
剥離を抑制する効果も生じる。Further, by extending this resin to the side surface of the seal of the electro-optical element, the reliability of the connection is further improved and the reliability of the seal of the electro-optical element is also improved. Furthermore, since it is possible to prevent the electrodes from being exposed at the terminals, corrosion of the electrodes is suppressed. Further, since the lower side is also extended to the side surface of the substrate of the terminal portion, the effect of suppressing peeling of the circuit member is also produced.
【００３７】また、本発明では、使用する樹脂に、導電
性粒子が混入されていなくてよいので、導電性粒子の不
均一の問題を生じない。即ち、導電性粒子の凝集による
隣接端子間の短絡や、導電性粒子不足による接続抵抗の
部分的増加というような問題点を生じにくい。Further, in the present invention, since the conductive particles do not have to be mixed in the resin used, the problem of non-uniformity of the conductive particles does not occur. That is, problems such as a short circuit between adjacent terminals due to aggregation of conductive particles and a partial increase in connection resistance due to lack of conductive particles are unlikely to occur.
【００３８】本発明はこの他本発明の効果を損しない範
囲内で種々の応用が可能である。In addition to the above, the present invention can be applied in various ways within a range that does not impair the effects of the present invention.
【図１】本発明の電気光学装置の基本的構造を示す断面
図。FIG. 1 is a sectional view showing a basic structure of an electro-optical device according to the present invention.
【図２】図１の例の紙面に垂直な面で切断した断面を示
す断面図。FIG. 2 is a cross-sectional view showing a cross section taken along a plane perpendicular to the paper surface of the example of FIG.
【符号の説明】 基板 ：1A、 1B 電極 ：2A、 2B シール ： 3 回路部材 ： 4 金属厚膜 ： 5 凹凸 ： 6 樹脂 ： 7[Explanation of symbols] Substrate: 1A, 1B Electrode: 2A, 2B Seal: 3 Circuit member: 4 Metal thick film: 5 Concavo-convex: 6 Resin: 7
Claims (3)
うに配置し、周辺をシールして内部に電気光学媒体を挟
持し、少なくとも一方の電極付基板は他の電極付基板が
対向していない端子部分を有する電気光学素子の端子部
分で、金属厚膜を有する回路部材と導電接続を行う電気
光学装置において、金属厚膜表面に微細な凹凸が形成さ
れている回路部材と、電気光学素子の端子部分との間に
硬化前に比べて硬化後に収縮した状態となる樹脂を配置
して両者を接着したことを特徴とする電気光学装置。1. A pair of substrates with electrodes are arranged such that their electrode surfaces face each other, and the electro-optical medium is sandwiched by sealing the peripheries, and at least one substrate with electrodes faces another substrate with electrodes. In the terminal portion of the electro-optical element having a terminal portion which is not formed, in the electro-optical device for conducting conductive connection with the circuit member having the thick metal film, the circuit member having fine irregularities formed on the thick metal film surface, An electro-optical device characterized in that a resin that is in a contracted state after curing is arranged between the terminal portion of the optical element and the terminal portion of the optical element, and the two are bonded together.
膜表面に設けられた微細な凹凸の凹部と凸部の高さの差
が 5〜30μｍとされることを特徴とする電気光学装置。2. The electro-optical device according to claim 1, wherein the height difference between the concave and convex portions of the fine irregularities provided on the surface of the thick metal film is 5 to 30 μm. .
うに配置し、周辺をシールして内部に電気光学媒体を挟
持し、少なくとも一方の電極付基板は他の電極付基板が
対向していない端子部分を有する電気光学素子の端子部
分に、金属厚膜を有する回路部材を導電接続する電気光
学装置の製造法において、回路部材の金属厚膜表面に微
細な凹凸を形成し、電気光学素子の端子部分との間に硬
化後に収縮する樹脂を配置し、両者を接着したことを特
徴とする電気光学装置の製造法。3. A pair of electrode-equipped substrates are arranged such that their electrode surfaces face each other, and the electro-optical medium is sandwiched by sealing the peripheries, and at least one electrode-equipped substrate faces another electrode-equipped substrate. In a method of manufacturing an electro-optical device in which a circuit member having a metal thick film is conductively connected to a terminal part of an electro-optical element having a terminal part which is not formed, fine unevenness is formed on the metal thick film surface of the circuit member, A method for manufacturing an electro-optical device, characterized in that a resin that shrinks after curing is arranged between the terminal portion of the optical element and the resin and the resin is adhered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7890193A JPH06265924A (en) | 1993-03-12 | 1993-03-12 | Electro-optic device and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7890193A JPH06265924A (en) | 1993-03-12 | 1993-03-12 | Electro-optic device and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06265924A true JPH06265924A (en) | 1994-09-22 |
Family
ID=13674735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7890193A Pending JPH06265924A (en) | 1993-03-12 | 1993-03-12 | Electro-optic device and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06265924A (en) |
Cited By (5)
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|---|---|---|---|---|
| JP2002304130A (en) * | 2001-04-04 | 2002-10-18 | Smk Corp | Connector |
| JP2003069216A (en) * | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Method for connecting conductive connectors to each other |
| WO2008139994A1 (en) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| US9660131B2 (en) | 2007-05-09 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
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-
1993
- 1993-03-12 JP JP7890193A patent/JPH06265924A/en active Pending
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|---|---|---|---|---|
| JP2002304130A (en) * | 2001-04-04 | 2002-10-18 | Smk Corp | Connector |
| JP2003069216A (en) * | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Method for connecting conductive connectors to each other |
| KR101157771B1 (en) * | 2007-05-09 | 2012-06-25 | 히다치 가세고교 가부시끼가이샤 | Conductor connection member, connection structure, and solar cell module |
| CN102723381A (en) * | 2007-05-09 | 2012-10-10 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| JPWO2008139994A1 (en) * | 2007-05-09 | 2010-08-05 | 日立化成工業株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN102270669A (en) * | 2007-05-09 | 2011-12-07 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| KR101101464B1 (en) * | 2007-05-09 | 2012-01-03 | 히다치 가세고교 가부시끼가이샤 | Conductor connection member, connection structure, and solar cell module |
| CN102332478A (en) * | 2007-05-09 | 2012-01-25 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| WO2008139994A1 (en) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| EP2146355A1 (en) | 2007-05-09 | 2010-01-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| JP5115553B2 (en) * | 2007-05-09 | 2013-01-09 | 日立化成工業株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN103545402A (en) * | 2007-05-09 | 2014-01-29 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN102723381B (en) * | 2007-05-09 | 2015-08-19 | 日立化成株式会社 | Conductor connection member |
| US9660131B2 (en) | 2007-05-09 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
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