JPH06263479A - Glass for seal bonding and circuit device using the same - Google Patents
Glass for seal bonding and circuit device using the sameInfo
- Publication number
- JPH06263479A JPH06263479A JP7620993A JP7620993A JPH06263479A JP H06263479 A JPH06263479 A JP H06263479A JP 7620993 A JP7620993 A JP 7620993A JP 7620993 A JP7620993 A JP 7620993A JP H06263479 A JPH06263479 A JP H06263479A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- glass
- weight
- sealing
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、封着用ガラス及びそれ
を使用した回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass for sealing and a circuit device using the glass.
【０００２】[0002]
【従来の技術】従来、封着用ガラスとしては亜鉛・ホウ
ケイ酸ガラス、鉛・亜鉛・ホウケイ酸ガラス、鉛・ホウ
ケイ酸ガラスなどが用いられている。さらには、金属と
の密着性を向上させるため、遷移金属、特にチタンを添
加した鉛・チタンガラス、鉛・チタンガラスセラミック
スなどが用いられている。2. Description of the Related Art Conventionally, zinc / borosilicate glass, lead / zinc / borosilicate glass, lead / borosilicate glass and the like have been used as glass for sealing. Furthermore, in order to improve the adhesion with metals, transition metals, particularly lead / titanium glass, and lead / titanium glass ceramics to which titanium is added are used.
【０００３】しかし、これらの封着用ガラスの抗折強度
は、たかだか３００〜１０００ｋｇ／ｃｍ2 であり応用
範囲を狭める原因となっていた。また、回路装置の金属
製リード端子を封着した場合、封着用ガラスの抗折強度
が低いため、リード端子の曲げ加工などリード端子の周
辺に応力が加わるような加工時には、ガラスにクラック
などの欠陥が生じて気密性が低下するという課題があっ
た。However, the bending strength of these sealing glasses is at most 300 to 1000 kg / cm 2, which is a cause of narrowing the range of application. In addition, when the metal lead terminals of the circuit device are sealed, the bending strength of the sealing glass is low, so cracking or other damage to the glass may occur during processing such as bending the lead terminals when stress is applied to the periphery of the lead terminals. There has been a problem that defects are generated and the airtightness is lowered.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、従来技術の
上記課題を解消しようとするもので、抗折強度が大き
く、回路装置の金属製リード端子を封着した場合、リー
ド端子の曲げ加工などリード端子の周辺に応力が加わる
ような加工時にも、ガラスにクラックなどの欠陥が生じ
て気密性が低下することのない封着用ガラス、及び、そ
れを使用した回路装置の提供を目的とする。DISCLOSURE OF THE INVENTION The present invention is intended to solve the above-mentioned problems of the prior art and has a large bending strength, and when a metal lead terminal of a circuit device is sealed, the lead terminal is bent. An object of the present invention is to provide a sealing glass that does not deteriorate the airtightness due to defects such as cracks in the glass even when processing is applied to the periphery of the lead terminal, etc., and a circuit device using the sealing glass. .
【０００５】[0005]
【課題を解決するための手段】本発明は、重量％表示で
実質的に シリカ２０〜８０％ アルミナ５〜４０％ 酸化ほう素５〜４０％ 酸化鉛１〜２０％ 酸化バリウム１〜５％ アルカリ金属酸化物０．１〜１％ 鉄の酸化物０〜１％ マンガンの酸化物０〜１％ ニッケルの酸化物０〜１％ 鉄の酸化物＋マンガンの酸化物＋ニッケルの酸化物０．
１〜１％ からなる封着用ガラス、及び、この封着用ガラスにより
リード端子を封着してなる回路装置である。The present invention is substantially in terms of weight% silica 20 to 80% alumina 5 to 40% boron oxide 5 to 40% lead oxide 1 to 20% barium oxide 1 to 5% alkali Metal oxide 0.1-1% Iron oxide 0-1% Manganese oxide 0-1% Nickel oxide 0-1% Iron oxide + manganese oxide + nickel oxide
A sealing glass comprising 1 to 1%, and a circuit device obtained by sealing a lead terminal with the sealing glass.
【０００６】本発明の封着用ガラスの組成限定理由を以
下に述べる。シリカ（ＳｉＯ2 ）は、ガラスを構成する
基本成分であり、２０重量％未満では誘電率が大きくな
り、８０重量％超では抗折強度が低下する。望ましくは
３０〜６０重量％であり、特に望ましくは４０〜５５重
量％である。アルミナ（Ａｌ2 Ｏ3 ）は、ガラスを構成
する基本成分であり、５重量％未満では抗折強度が低下
し、４０重量％では誘電率が大きくなるのみならず溶融
しにくくなる。望ましくは１０〜３０重量％であり、特
に望ましくは１５〜２５重量％である。The reasons for limiting the composition of the glass for sealing of the present invention will be described below. Silica (SiO 2 ) is a basic component constituting glass, and if it is less than 20% by weight, the dielectric constant becomes large, and if it exceeds 80% by weight, the bending strength is lowered. It is preferably 30 to 60% by weight, and particularly preferably 40 to 55% by weight. Alumina (Al 2 O 3 ) is a basic component constituting glass, and if it is less than 5% by weight, the flexural strength is lowered, and if it is 40% by weight, not only the dielectric constant becomes large but also it becomes difficult to melt. It is preferably 10 to 30% by weight, particularly preferably 15 to 25% by weight.
【０００７】酸化ほう素（Ｂ2 Ｏ3 ）は、フラックス成
分であり、５重量％未満では溶融しにくくなり、かつ焼
結性が低下するため抗折強度が低下し、４０重量％超で
は耐水性が低下する。望ましくは１０〜３０重量％であ
り、特に望ましくは１５〜２５重量％である。酸化鉛
（ＰｂＯ）は、改質成分であり、１重量％未満では溶融
しにくくなり、かつ焼結性が低下するため抗折強度が低
下し、２０重量％超では誘電率が増大する。望ましくは
３〜１２重量％であり、特に望ましくは５〜８重量％で
ある。Boron oxide (B 2 O 3 ) is a flux component, and if it is less than 5% by weight, it becomes difficult to melt, and the sinterability is lowered, so that the flexural strength is lowered, and if it exceeds 40% by weight, it is water resistant. Sex decreases. It is preferably 10 to 30% by weight, particularly preferably 15 to 25% by weight. Lead oxide (PbO) is a modifying component, and if it is less than 1% by weight, it becomes difficult to melt and the sinterability is lowered, so that the flexural strength is lowered, and if it exceeds 20% by weight, the dielectric constant is increased. It is preferably 3 to 12% by weight, and particularly preferably 5 to 8% by weight.
【０００８】酸化バリウム（ＢａＯ）は、改質成分であ
り、１重量％未満では溶融しにくくなり焼結性が低下す
るため抗折強度が低下し、５重量％超では誘電率が増大
する。望ましくは１．５〜４重量％であり、特に望まし
くは２〜３重量％である。アルカリ金属酸化物は、フラ
ックス成分であり、０．１重量％未満では溶融しにくく
なり焼結性が低下するため抗折強度が低下し、１重量％
超では耐水性が低下する。望ましくは０．３〜０．８重
量％であり、特に望ましくは０．５〜０．７重量％であ
る。アルカリ金属酸化物としては、Ｌｉ2 Ｏ、Ｎａ2
Ｏ、Ｋ2 Ｏの１種又は２種以上が使用される。[0008] Barium oxide (BaO) is a modifying component, and if it is less than 1% by weight, it is difficult to melt and the sinterability is lowered, so the flexural strength is lowered, and if it exceeds 5% by weight, the dielectric constant is increased. It is preferably 1.5 to 4% by weight, particularly preferably 2 to 3% by weight. Alkali metal oxide is a flux component, and if it is less than 0.1% by weight, it is difficult to melt and the sinterability is reduced, so that the flexural strength is reduced, and 1% by weight is obtained.
If it exceeds the limit, the water resistance will decrease. It is preferably 0.3 to 0.8% by weight, and particularly preferably 0.5 to 0.7% by weight. Examples of alkali metal oxides include Li 2 O and Na 2
One or more of O and K 2 O are used.
【０００９】鉄の酸化物、マンガンの酸化物及びニッケ
ルの酸化物は、金属端子との接着性を向上させる成分で
あり１種又は２種以上が使用される。これら３種の酸化
物の総量が０．１重量％未満では接着強度が低下し、１
重量％超では誘電率が増大する。望ましくは０．３〜
０．８重量％であり。特に望ましくは０．５〜０．７重
量％である。The iron oxide, manganese oxide, and nickel oxide are components that improve the adhesiveness to the metal terminal, and one or more of them are used. If the total amount of these three kinds of oxides is less than 0.1% by weight, the adhesive strength will decrease, and
If the content exceeds 50% by weight, the dielectric constant increases. Desirably 0.3-
0.8% by weight. It is particularly preferably 0.5 to 0.7% by weight.
【００１０】なお、この封着用ガラスの一部は、結晶
質、非結晶質又はガラス質のいずれか１種又は２種以上
の相が、共存している場合でも本発明の効果にかわりは
ない。また、本発明の封着用ガラスに着色剤を添加して
も限定されるものではない。It should be noted that a part of the glass for sealing does not change the effect of the present invention even if one or more phases of crystalline, amorphous or glassy coexist. . Further, the addition of a coloring agent to the glass for sealing of the present invention is not limited.
【００１１】図１は、本発明による封着用ガラスを使用
した回路装置の断面図である。図のように、コバール合
金製基板１とコバール合金製シーリング２との間にコバ
ール合金製リードフレーム３を挟持し、上記封着用ガラ
ス４により、コバール合金製リードフレーム３を封着し
てある。コバール合金製リードフレーム３にはＮｉーＡ
ｕメッキが行われており、ＩＣチップ５は、基板１の上
にダイボンドされている。また、コバール合金製リード
フレーム３とＩＣチップ５とは、金線８により接続され
ている。コバール合金製上蓋６は、ＡｕーＳｎ合金７に
よりコバール合金製シーリング２に接着されている。FIG. 1 is a sectional view of a circuit device using the glass for sealing according to the present invention. As shown in the figure, a Kovar alloy lead frame 3 is sandwiched between a Kovar alloy substrate 1 and a Kovar alloy ceiling 2, and the Kovar alloy lead frame 3 is sealed by the sealing glass 4. Ni-A on the lead frame 3 made of Kovar alloy
u-plating is performed, and the IC chip 5 is die-bonded on the substrate 1. The Kovar alloy lead frame 3 and the IC chip 5 are connected by a gold wire 8. The Kovar alloy upper lid 6 is bonded to the Kovar alloy sealing 2 with an Au—Sn alloy 7.
【００１２】[0012]
【作用】本発明の作用メカニズムは必ずしも明確ではな
いが、本発明のガラス中でＰｂＯ系ガラスとＢａＯ系ガ
ラスがミクロ的に共存し、圧縮応力が発生しガラスが強
化されるものと推定される。Although the mechanism of action of the present invention is not always clear, it is presumed that PbO-based glass and BaO-based glass coexist microscopically in the glass of the present invention to generate compressive stress and strengthen the glass. .
【００１３】[0013]
【実施例】原料を調合し、白金坩堝に入れ、１４００〜
１５００℃で２〜４加熱撹拌溶融した。次いで、これを
水砕し、さらに粉砕装置にて平均粒径５μｍに粉砕し、
表１、表２に記載した組成（単位：重量％）のガラス粉
末を得た。Example: Raw materials are mixed and put in a platinum crucible, and 1400 to
The mixture was heated and stirred at 1500 ° C. for 2 to 4 to melt. Next, this is pulverized with water, and further pulverized with a pulverizer into an average particle size of 5 μm,
Glass powders having compositions (unit:% by weight) shown in Tables 1 and 2 were obtained.
【００１４】このガラス粉末にバインダーとしてエチル
セルロース、溶剤としてブチルカルビトールアセテート
を加え、アルミナ乳鉢中で混練しペースト状に調整し
た。これを厚さ０．８ｍｍ、巾５ｍｍ、長さ３０ｍｍに
成形し、８５０℃で２時間焼成した。このガラス焼成品
の抗折強度、誘電率、耐水性（水和重量増加率）を測定
した。さらに、このガラスペーストを用いて、図１に示
した、外形１０ｍｍ角、高さ２ｍｍ、端子数２０の回路
装置を作製し、米国ＭＩＬ．ＳＴＤ ８８３Ｃー２００
４に従って、端子の３回曲げ試験を３回繰り返して行い
ガラス封着部のリークテスト（単位：１０-9ｓｔｄｃｃ
／秒）を行った。これらの結果も表１、表２に記載し
た。また、比較例として、別の封着用ガラスを用い同様
の測定を行った。その結果を表３に示した。Ethyl cellulose as a binder and butyl carbitol acetate as a solvent were added to this glass powder and kneaded in an alumina mortar to prepare a paste. This was molded into a thickness of 0.8 mm, a width of 5 mm and a length of 30 mm, and baked at 850 ° C. for 2 hours. The bending strength, dielectric constant, and water resistance (hydration weight increase rate) of this glass fired product were measured. Further, using this glass paste, a circuit device having an outer shape of 10 mm square, a height of 2 mm and 20 terminals shown in FIG. STD 883C-200
In accordance with No. 4, the bending test of the terminal was repeated three times and the leak test of the glass-sealed part (unit: 10 -9 stdcc
/ Sec). These results are also shown in Tables 1 and 2. As a comparative example, the same measurement was performed using another sealing glass. The results are shown in Table 3.
【００１５】（特性評価方法） １）抗折強度：東洋ボールドイン製強度試験機により測
定した。試験用サンプルを２０ｍｍの２支点上に置き、
支点間中央に、０．５ｍｍ／分の速度で荷重を加え破損
時の荷重を測定した。 ２）誘電率：安藤電気製交流ブリッジにより１００ｋＨ
ｚの特性を測定した。その際の雰囲気は、温度２５±１
℃、湿度４５±１％であった。 ３）耐水性（水和重量増加率）：サンプルを、温度９０
℃±１℃、相対湿度９５±１％の環境に２４時間放置
し、重量増加率を測定した。 ４）リークテスト：米国ＭＩＬ．ＳＴＤ ８８３Ｃー１
０１４に従ってＨｅリークテストを行った。(Characteristic Evaluation Method) 1) Bending Strength: Measured by a strength tester manufactured by Toyo Bold-in. Place the test sample on two fulcrums of 20 mm,
A load was applied to the center between the fulcrums at a speed of 0.5 mm / min and the load at break was measured. 2) Dielectric constant: 100kH by Ando Denki AC bridge
The characteristics of z were measured. At that time, the atmosphere is 25 ± 1
C., humidity 45 ± 1%. 3) Water resistance (rate of increase in hydrated weight): the sample was tested at a temperature of 90
The sample was left for 24 hours in an environment of ° C ± 1 ° C and relative humidity of 95 ± 1%, and the weight increase rate was measured. 4) Leak test: US MIL. STD 883C-1
A He leak test was conducted according to 014.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 [Table 2]
【００１８】[0018]
【表３】 [Table 3]
【００１９】[0019]
【発明の効果】これらの結果より明かな如く、本発明の
封着用ガラスは、抗折強度１６００ｋｇ／ｃｍ2 以上、
誘電率７以下、耐水性（水和重量増加率）０．３％以下
と従来の封着用ガラスでは得られなかった優れた特性を
示す。さらに、本発明の封着用ガラスを用いて作製した
回路装置は曲げ試験後のリーク不良はなく、優れた信頼
性を示す。よってその工業的な価値は多大である。As is clear from these results, the sealing glass of the present invention has a bending strength of 1600 kg / cm 2 or more,
Dielectric constant of 7 or less and water resistance (rate of increase in hydrated weight) of 0.3% or less exhibit excellent properties not obtained by conventional sealing glass. Furthermore, the circuit device produced using the glass for sealing of the present invention has no leakage failure after the bending test and exhibits excellent reliability. Therefore, its industrial value is enormous.
【図１】本発明のガラス組成物を用いて作製した回路装
置の断面図FIG. 1 is a cross-sectional view of a circuit device produced by using the glass composition of the present invention.
１：コバール合金製基板 ２：コバール合金製シールリング ３：コバール合金製リードフレーム ４：封着用ガラス 1: Kovar alloy substrate 2: Kovar alloy seal ring 3: Kovar alloy lead frame 4: Sealing glass
Claims (2)
１〜１％ からなる封着用ガラス。1. Wt% substantially silica 20-80% Alumina 5-40% Boron oxide 5-40% Lead oxide 1-20% Barium oxide 1-5% Alkali metal oxide 0.1-1 % Iron oxide 0-1% Manganese oxide 0-1% Nickel oxide 0-1% Iron oxide + manganese oxide + nickel oxide 0.
Glass for sealing consisting of 1 to 1%.
端子を封着してなる回路装置。2. A circuit device in which lead terminals are sealed with the sealing glass according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7620993A JPH06263479A (en) | 1993-03-10 | 1993-03-10 | Glass for seal bonding and circuit device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7620993A JPH06263479A (en) | 1993-03-10 | 1993-03-10 | Glass for seal bonding and circuit device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06263479A true JPH06263479A (en) | 1994-09-20 |
Family
ID=13598786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7620993A Pending JPH06263479A (en) | 1993-03-10 | 1993-03-10 | Glass for seal bonding and circuit device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06263479A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003324166A (en) * | 2002-04-26 | 2003-11-14 | Matsushita Electric Ind Co Ltd | Glass terminal and manufacturing method thereof and air-tight terminal employing glass terminal |
| WO2021024620A1 (en) * | 2019-08-08 | 2021-02-11 | 日本電気硝子株式会社 | Glass powder, dielectric material, sintered body, and high frequency circuit member |
| JP2023051778A (en) * | 2021-09-30 | 2023-04-11 | 富喬工業股▲分▼有限公司 | Glass composition, glass, glass fiber and product containing the glass fiber |
-
1993
- 1993-03-10 JP JP7620993A patent/JPH06263479A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003324166A (en) * | 2002-04-26 | 2003-11-14 | Matsushita Electric Ind Co Ltd | Glass terminal and manufacturing method thereof and air-tight terminal employing glass terminal |
| WO2021024620A1 (en) * | 2019-08-08 | 2021-02-11 | 日本電気硝子株式会社 | Glass powder, dielectric material, sintered body, and high frequency circuit member |
| CN114206794A (en) * | 2019-08-08 | 2022-03-18 | 日本电气硝子株式会社 | Glass powder, dielectric material, sintered body, and high-frequency circuit member |
| CN114206794B (en) * | 2019-08-08 | 2023-07-21 | 日本电气硝子株式会社 | Glass powder, dielectric material, sintered body, and circuit component for high frequency |
| US11939258B2 (en) | 2019-08-08 | 2024-03-26 | Nippon Electric Glass Co., Ltd. | Glass powder, dielectric material, sintered body, and high frequency circuit member |
| JP2023051778A (en) * | 2021-09-30 | 2023-04-11 | 富喬工業股▲分▼有限公司 | Glass composition, glass, glass fiber and product containing the glass fiber |
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