JPH06260387A - Stepper - Google Patents
StepperInfo
- Publication number
- JPH06260387A JPH06260387A JP5075287A JP7528793A JPH06260387A JP H06260387 A JPH06260387 A JP H06260387A JP 5075287 A JP5075287 A JP 5075287A JP 7528793 A JP7528793 A JP 7528793A JP H06260387 A JPH06260387 A JP H06260387A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- refrigerant
- temperature
- pipe
- reduction projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置の製造時に
おいてウェーハにＬＳＩ等のパターンを転写する縮小投
影露光装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reduction projection exposure apparatus for transferring a pattern such as an LSI on a wafer when manufacturing a semiconductor device.
【０００２】[0002]
【従来の技術】従来の縮小投影露光装置には、レチクル
の表面に異物が付着するのを防止するためのペリクル膜
を固定するペリクルフレームを備えたものがあった。こ
のペリクルフレームには、ペリクルフレームが熱膨張し
てペリクル膜が傾斜するのを防止する冷却機能付きペリ
クルを具備したものがある。2. Description of the Related Art A conventional reduction projection exposure apparatus has a pellicle frame for fixing a pellicle film for preventing foreign matter from adhering to the surface of a reticle. Some pellicle frames include a pellicle with a cooling function that prevents the pellicle frame from tilting due to thermal expansion of the pellicle frame.
【０００３】冷却機能付きペリクルを具備する縮小投影
露光装置については、特開平２−３０２７５７号公報に
記載されているが、この縮小投影露光装置の冷却機能部
について図３を用いて説明する。図３（ａ）は冷却機能
付きペリクルの縦断面図、図３（ｂ）は図３（ａ）のｂ
−ｂ線断面図である。A reduction projection exposure apparatus having a pellicle with a cooling function is described in Japanese Patent Application Laid-Open No. 2-302757, and the cooling function section of this reduction projection exposure apparatus will be described with reference to FIG. 3A is a vertical cross-sectional view of the pellicle with a cooling function, and FIG. 3B is b of FIG. 3A.
It is a -b line sectional view.
【０００４】図３（ａ）に示すように、このペリクル３
１は、ペリクルフレーム３１ｂに接着剤によりペリクル
膜３１ａを貼り付けたものであり、ペリクルフレーム３
１ｂのペリクル膜３１ａを貼り付けた面の反対側に塗布
された接着剤３１ｃによって不図示のレチクルに固定さ
れるものである。As shown in FIG. 3A, this pellicle 3
Reference numeral 1 denotes a pellicle frame 31b having a pellicle film 31a attached thereto by an adhesive.
1b is fixed to a reticle (not shown) by an adhesive 31c applied to the side opposite to the surface on which the pellicle film 31a is attached.
【０００５】図３（ａ）及び（ｂ）に示すように、ペリ
クルフレーム３１ｂの内部には、冷却水流路３２が設け
られており、その両端はそれぞれ図示のように冷却水供
給口３２ａ及び冷却水排出口３２ｂに接続されている。As shown in FIGS. 3 (a) and 3 (b), a pellicle frame 31b is provided with a cooling water flow path 32, and both ends thereof are provided with a cooling water supply port 32a and a cooling water, respectively, as shown in the drawing. It is connected to the water outlet 32b.
【０００６】ペリクル３１を縮小投影露光装置に装着し
て長時間にわたって使用すると、ペリクル３１が加熱さ
れるが、ペリクルフレーム３１ｂの内部の冷却水流路３
２には常に冷却水が流れており、ペリクルフレーム３１
ｂの温度の上昇が防止され、ペリクル膜３１ａに加えら
れていた引っ張り力が維持できるため、ペリクル膜３１
ａの傾斜が防止される。これにより、露光精度の低下を
防止することが可能となる。When the pellicle 31 is mounted on the reduction projection exposure apparatus and used for a long time, the pellicle 31 is heated, but the cooling water passage 3 inside the pellicle frame 31b is heated.
2, the cooling water always flows, and the pellicle frame 31
Since the temperature rise of b is prevented and the tensile force applied to the pellicle film 31a can be maintained, the pellicle film 31a can be maintained.
The inclination of a is prevented. This makes it possible to prevent the exposure accuracy from decreasing.
【０００７】[0007]
【発明が解決しようとする課題】しかし、上述のような
冷却機能付きペリクルを具備する縮小投影露光装置で
は、ペリクル膜の傾斜は防止されるが、ウェーハ露光中
に、露光光がレチクルに繰り返し照射され、レチクルの
特にクロムパターン部が発熱し、レチクルの温度が上昇
し、レチクルが膨張するという問題は解決されない。However, in the reduction projection exposure apparatus having the pellicle with a cooling function as described above, the tilt of the pellicle film is prevented, but the exposure light is repeatedly applied to the reticle during wafer exposure. However, the problem that the chrome pattern part of the reticle generates heat, the temperature of the reticle rises, and the reticle expands is not solved.
【０００８】レチクルが膨張すると、各レイヤーの総合
重ね合わせ精度が低下するので、このレチクルの温度を
一定に保つことは重要である。When the reticle expands, the overall overlay accuracy of each layer decreases, so it is important to keep the temperature of this reticle constant.
【０００９】そこで、本発明の目的は、ウェーハ露光中
にレチクルの温度上昇を抑えることが可能な縮小投影露
光装置を提供することにある。Therefore, an object of the present invention is to provide a reduction projection exposure apparatus capable of suppressing the temperature rise of a reticle during wafer exposure.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に、本発明の縮小投影露光装置においては、レチクルを
保持するレチクルステージの内部に配管を設け、この配
管に冷媒を流す冷却手段を設けたものである。In order to solve the above problems, in the reduction projection exposure apparatus of the present invention, a pipe is provided inside a reticle stage that holds a reticle, and a cooling means for flowing a refrigerant is provided in this pipe. It is a thing.
【００１１】なお、前記レチクルに接触するように設置
された温度センサと、この温度センサの検出値に基づい
て前記レチクルステージ内配管を流れる冷媒の温度また
は量を制御する制御手段とを設けるとよい。A temperature sensor installed so as to contact the reticle, and control means for controlling the temperature or amount of the refrigerant flowing through the pipe inside the reticle stage based on the detection value of the temperature sensor may be provided. .
【００１２】[0012]
【作用】本発明によれば、レチクルステージ内配管を流
れる冷媒によってレチクルが冷却されるので、レチクル
の温度上昇を抑えることが可能になり、レチクルの温度
上昇によるレチクルの膨張を防ぐことができる。According to the present invention, since the reticle is cooled by the refrigerant flowing through the pipe inside the reticle stage, the temperature rise of the reticle can be suppressed and the reticle expansion due to the temperature rise of the reticle can be prevented.
【００１３】なお、温度センサによりレチクルの温度を
検出し、この検出値に基づいて制御手段により冷媒の温
度または量を制御すると、レチクルの温度を一定に保つ
ことができる。If the temperature of the reticle is detected by the temperature sensor and the temperature or amount of the refrigerant is controlled by the control means based on the detected value, the temperature of the reticle can be kept constant.
【００１４】[0014]
【実施例】以下、本発明を実施例に基づき図１及び図２
を参照して説明する。図１は実施例における縮小投影露
光装置のレチクルステージの要部を示す図２のａ−ａ線
拡大断面図、図２は実施例における縮小投影露光装置の
概略構成図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to FIGS.
Will be described with reference to. FIG. 1 is an enlarged cross-sectional view taken along the line aa of FIG. 2 showing a main part of a reticle stage of the reduction projection exposure apparatus in the embodiment, and FIG. 2 is a schematic configuration diagram of the reduction projection exposure apparatus in the embodiment.
【００１５】図２において、露光光源１からでた露光光
２がレチクルステージ４上のレチクル３を通過し、レチ
クル３上のパターンが、縮小投影レンズ５を通してウェ
ーハ６上に転写される。In FIG. 2, the exposure light 2 emitted from the exposure light source 1 passes through the reticle 3 on the reticle stage 4, and the pattern on the reticle 3 is transferred onto the wafer 6 through the reduction projection lens 5.
【００１６】図１に示すように、レチクルステージ４の
内部に冷却配管７が設けられており、この冷却配管７の
中に空気または水等の冷媒８が循環器９によって循環さ
れて流されている。また、冷却配管７の中に熱交換器１
０が設けられ、この熱交換器１０に通じる冷却配管１１
の中にフロン等の冷媒１２が循環器１３によって流され
ている。As shown in FIG. 1, a cooling pipe 7 is provided inside the reticle stage 4, and a refrigerant 8 such as air or water is circulated and circulated in the cooling pipe 7 by a circulator 9. There is. In addition, the heat exchanger 1 is provided in the cooling pipe 7.
0 is provided and the cooling pipe 11 leading to this heat exchanger 10
A refrigerant 12 such as chlorofluorocarbon is circulated by a circulator 13.
【００１７】さらに、レチクルステージ４の角部には、
レチクル３と接触するように温度センサ１４が取付けら
れており、レチクル３の温度をモニタしている。この温
度センサ１４の検出信号は制御部１５に入力され、その
検出値に基づいて制御部１５は循環器９及び１３を制御
する。Further, at the corner of the reticle stage 4,
A temperature sensor 14 is attached so as to come into contact with the reticle 3, and the temperature of the reticle 3 is monitored. The detection signal of the temperature sensor 14 is input to the controller 15, and the controller 15 controls the circulators 9 and 13 based on the detected value.
【００１８】上記のように構成された本実施例によれ
ば、レチクルステージ４内の冷却配管７を流れる冷媒８
によってレチクル３が冷却され、レチクル３の温度上昇
が抑えられる。これにより、レチクル３の膨張が防止さ
れる。According to the present embodiment configured as described above, the refrigerant 8 flowing through the cooling pipe 7 in the reticle stage 4
As a result, the reticle 3 is cooled, and the temperature rise of the reticle 3 is suppressed. This prevents the reticle 3 from expanding.
【００１９】この際、本実施例においては、温度センサ
１４にて測定されたレチクル３の温度をフィードバック
して、冷媒８及び冷媒１２の流量または温度或いはこれ
ら両方を制御する。例えば、レチクル３の温度が上昇す
ると、温度センサ１４によって測定された温度パラメー
タに従って、熱交換器１０を流れる冷媒１２の流量、冷
却配管７を流れる冷媒８の流量を多くして、レチクルス
テージ４を冷却し、これによってレチクル３が冷却さ
れ、レチクル３の温度が一定に保たれる。At this time, in this embodiment, the temperature of the reticle 3 measured by the temperature sensor 14 is fed back to control the flow rates or temperatures of the refrigerant 8 and the refrigerant 12 or both of them. For example, when the temperature of the reticle 3 rises, the flow rate of the refrigerant 12 flowing through the heat exchanger 10 and the flow rate of the refrigerant 8 flowing through the cooling pipe 7 are increased in accordance with the temperature parameter measured by the temperature sensor 14, and the reticle stage 4 is moved. By cooling, the reticle 3 is cooled by this, and the temperature of the reticle 3 is kept constant.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
レチクルの温度上昇を抑えることが可能になり、レチク
ルの温度上昇によるレチクルの膨張を防ぐことができる
ので、各レイヤーの総合重ね合わせ精度の低下を防ぐこ
とが可能になる。As described above, according to the present invention,
Since it is possible to suppress the temperature increase of the reticle and prevent the reticle from expanding due to the temperature increase of the reticle, it is possible to prevent the deterioration of the overall overlay accuracy of each layer.
【図１】本発明の実施例における縮小投影露光装置のレ
チクルステージの要部を示す図２のａ−ａ線拡大断面図
である。FIG. 1 is an enlarged cross-sectional view taken along line aa of FIG. 2 showing a main part of a reticle stage of a reduction projection exposure apparatus according to an exemplary embodiment of the present invention.
【図２】本発明の実施例における縮小投影露光装置の概
略構成図である。FIG. 2 is a schematic configuration diagram of a reduction projection exposure apparatus according to an embodiment of the present invention.
【図３】従来の縮小投影露光装置における冷却機能付き
ペリクルの断面図である。FIG. 3 is a sectional view of a pellicle with a cooling function in a conventional reduction projection exposure apparatus.
１ 露光光源 ２ 露光光 ３ レチクル ４ レチクルステージ ５ 縮小投影レンズ ６ ウェーハ ７ 冷却配管 ８ 冷媒 ９ 循環器 １０ 熱交換器 １１ 冷却配管 １２ 冷媒 １３ 循環器 １４ 温度センサ １５ 制御部 1 Exposure Light Source 2 Exposure Light 3 Reticle 4 Reticle Stage 5 Reduction Projection Lens 6 Wafer 7 Cooling Pipe 8 Refrigerant 9 Circulator 10 Heat Exchanger 11 Cooling Pipe 12 Refrigerant 13 Circulator 14 Temperature Sensor 15 Controller
フロントページの続き (72)発明者 江口 公平 相模原市淵野辺５−10−１ 新日本製鐵株 式会社エレクトロニクス研究所内Continued Front Page (72) Inventor Kohei Eguchi 5-10-1, Fuchinobe, Sagamihara-shi Nippon Steel Co., Ltd. Inside Electronics Research Laboratory
Claims (2)
内部に配管を設け、この配管に冷媒を流す冷却手段を設
けたことを特徴とする縮小投影露光装置。1. A reduction projection exposure apparatus characterized in that a pipe is provided inside a reticle stage for holding a reticle, and a cooling means for flowing a refrigerant is provided in the pipe.
て、前記レチクルに接触するように設置された温度セン
サと、この温度センサの検出値に基づいて前記レチクル
ステージ内配管を流れる冷媒の温度または量を制御する
制御手段とを設けたことを特徴とする縮小投影露光装
置。2. The reduction projection exposure apparatus according to claim 1, wherein a temperature sensor installed so as to come into contact with the reticle, and a temperature of a refrigerant flowing through the pipe in the reticle stage based on a detection value of the temperature sensor or A reduction projection exposure apparatus, which is provided with control means for controlling the amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5075287A JPH06260387A (en) | 1993-03-09 | 1993-03-09 | Stepper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5075287A JPH06260387A (en) | 1993-03-09 | 1993-03-09 | Stepper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06260387A true JPH06260387A (en) | 1994-09-16 |
Family
ID=13571872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5075287A Withdrawn JPH06260387A (en) | 1993-03-09 | 1993-03-09 | Stepper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06260387A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7812929B2 (en) | 2005-09-26 | 2010-10-12 | Samsung Electronics Co., Ltd. | Electrostatic chuck with temperature sensing unit, exposure equipment having the same, and method of detecting temperature from photomask |
| US20200103767A1 (en) * | 2016-03-24 | 2020-04-02 | Asml Netherlands B.V. | Patterning device cooling system and method of thermally conditioning a patterning device |
-
1993
- 1993-03-09 JP JP5075287A patent/JPH06260387A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7812929B2 (en) | 2005-09-26 | 2010-10-12 | Samsung Electronics Co., Ltd. | Electrostatic chuck with temperature sensing unit, exposure equipment having the same, and method of detecting temperature from photomask |
| US20200103767A1 (en) * | 2016-03-24 | 2020-04-02 | Asml Netherlands B.V. | Patterning device cooling system and method of thermally conditioning a patterning device |
| US11036148B2 (en) * | 2016-03-24 | 2021-06-15 | Asml Netherlands B.V. | Patterning device cooling system and method of thermally conditioning a patterning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000509 |