JPH06196625A - Power module - Google Patents
Power moduleInfo
- Publication number
- JPH06196625A JPH06196625A JP35767192A JP35767192A JPH06196625A JP H06196625 A JPH06196625 A JP H06196625A JP 35767192 A JP35767192 A JP 35767192A JP 35767192 A JP35767192 A JP 35767192A JP H06196625 A JPH06196625 A JP H06196625A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- power chip
- power
- power module
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、パワーモジュールに関
し、特にパワーIC、或いはパワートランジスタ等(以
下、パワーチップという)を搭載し、高い放熱効率を維
持しつつ筐体または放熱体に容易に取付可能なパワーモ
ジュールに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power module, and more particularly to a power IC, a power transistor or the like (hereinafter referred to as a power chip) mounted thereon, which can be easily mounted on a housing or a radiator while maintaining high heat radiation efficiency. Regarding possible power modules.
【0002】[0002]
【従来の技術】電力用として使用されるパワーチップ
は、温度上昇を防ぐため、一般的に放熱体(ヒートシン
ク)、或いは熱容量の大きい基台、筐体等に取り付けら
れる。図3は従来のパワーモジュールを示す斜視図であ
る。図3のパワーモジュールは、図示しないパワーチッ
プをその上部面に搭載した矩形体状の台座部1と、該台
座部1の下面に形成された雄ネジ部3を有する。雄ネジ
部3は放熱体5に形成された雌ネジ部7に螺合するよう
になっている。従って、放熱体5の雌ネジ部7に雄ネジ
部3を螺合すると、台座部1は、放熱体5上に載置され
た状態で固定されることとなる。このように構成された
パワーモジュールにおいては、パワーチップが発熱する
と、熱が台座1に伝導し、台座1に伝導した熱は雄ネジ
部3、雌ネジ部7を介して放熱体5に伝導して放熱体5
から放熱され、パワーチップの温度上昇が防止されるこ
ととなる。2. Description of the Related Art A power chip used for electric power is generally attached to a radiator (heat sink), a base having a large heat capacity, a casing or the like in order to prevent a temperature rise. FIG. 3 is a perspective view showing a conventional power module. The power module shown in FIG. 3 has a pedestal portion 1 having a rectangular shape on which an unillustrated power chip is mounted on its upper surface, and a male screw portion 3 formed on the lower surface of the pedestal portion 1. The male screw part 3 is adapted to be screwed into a female screw part 7 formed on the radiator 5. Therefore, when the male screw portion 3 is screwed into the female screw portion 7 of the heat radiator 5, the pedestal portion 1 is fixed while being placed on the heat radiator 5. In the power module thus configured, when the power chip generates heat, the heat is conducted to the pedestal 1, and the heat conducted to the pedestal 1 is conducted to the radiator 5 via the male screw portion 3 and the female screw portion 7. Radiating body 5
The heat is radiated from the device and the temperature rise of the power chip is prevented.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来のパワーモジュールにおいては、台座部1が、
下面の一部から突出した雄ネジ部3を介して放熱体5に
固定されていたため、放熱体5との間で十分な接触面積
を確保することができなかった。そのため、パワーチッ
プは、熱を雄ネジ部3からのみの小さな接触面積でしか
放熱体5へ伝熱することができず、台座部1に熱が滞留
することとなり、放熱効率を十分に高められないという
問題があった。本発明は上記状況に鑑みてなされたもの
で、台座部と放熱体との接触面積を大きくすることがで
きるパワーモジュールを提供し、もって、パワーチップ
の放熱効率の向上を図ることを目的とする。However, in such a conventional power module, the pedestal portion 1 is
Since it was fixed to the radiator 5 via the male screw portion 3 protruding from a part of the lower surface, it was not possible to secure a sufficient contact area with the radiator 5. Therefore, the power chip can transfer the heat to the radiator 5 only with a small contact area only from the male screw part 3, and the heat stays in the pedestal part 1, so that the heat dissipation efficiency can be sufficiently enhanced. There was a problem of not having. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a power module capable of increasing a contact area between a pedestal portion and a heat radiator, thereby improving heat radiation efficiency of a power chip. .
【0004】[0004]
【課題を解決するための手段】上記目的を達成するた
め、本発明によれば、パワーチップを搭載し、該パワー
チップを熱的かつ機械的に放熱体に結合可能なパワーモ
ジュールが提供され、該パワーモジュールにおいては、
略円柱形状の熱伝導性部材で構成され、外周面に雄ネジ
部を備えた基体と、該基体の端面に取付けられたパワー
チップとを設け、前記基体の雄ネジ部を放熱体に形成さ
れた雌ネジ部に螺合することによって前記パワーチップ
の放熱を行なう。In order to achieve the above object, according to the present invention, there is provided a power module having a power chip mounted thereon and capable of thermally and mechanically coupling the power chip to a radiator. In the power module,
A base formed of a substantially columnar heat conductive member and having a male screw portion on the outer peripheral surface thereof and a power chip attached to an end face of the base body are provided, and the male screw portion of the base body is formed on a radiator. The power chip is radiated by being screwed into the female screw portion.
【0005】[0005]
【作用】上記構成に係るパワーモジュールにおいては、
基体の両端面を除く大部分または全ての外表面を雄ネジ
部とすることができ、この雄ネジ部の全体が放熱体の雌
ネジ部に螺合される。従って、パワーチップを搭載した
基体と放熱体との接触面積が大きくなり、パワーチップ
の熱伝導経路が十分に確保され、効率的に放熱が行なわ
れる。In the power module having the above structure,
Most or all of the outer surface of the base body excluding both end surfaces can be male screw parts, and the entire male screw parts are screwed into the female screw parts of the radiator. Therefore, the contact area between the base on which the power chip is mounted and the radiator is large, the heat conduction path of the power chip is sufficiently secured, and heat is efficiently radiated.
【0006】[0006]
【実施例】以下、本発明に係るパワーモジュールの好適
な実施例を図面を参照して詳細に説明する。図1は本発
明の1実施例に係るパワーモジュールの斜視図、図2は
同パワーモジュールの縦断面図である。円柱状の基体1
1の端面には凹部13が形成され、凹部13は底面13
aが平坦面となっている。底面13aには絶縁皮膜(窒
化アルミAN等)15(図2参照)が形成され、絶縁皮
膜15上には回路(回路パターン)17が形成されてい
る。つまり、底面13aは、それ自体が回路基板となっ
ているのである。回路パターン17上にはパワーチップ
19が取り付けられ、パワーチップ19は底面13aに
熱を伝えるため底面が平らな金属面で形成されている。
回路パターン17上のパワーチップ19上の各電極は、
回路パターン17の所定の電極パッドにワイヤーボンデ
ィングされる。なお、回路パターン17は、上述のよう
に、底面13aに直接形成する他、別体の回路基板を底
面13aに取り付けるものであってもよい。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the power module according to the present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view of a power module according to an embodiment of the present invention, and FIG. 2 is a vertical sectional view of the power module. Cylindrical base 1
A recess 13 is formed on the end face of the recess 1.
a is a flat surface. An insulating film (such as aluminum nitride AN) 15 (see FIG. 2) is formed on the bottom surface 13a, and a circuit (circuit pattern) 17 is formed on the insulating film 15. That is, the bottom surface 13a is itself a circuit board. A power chip 19 is mounted on the circuit pattern 17, and the power chip 19 has a flat bottom surface for conducting heat to the bottom surface 13a.
Each electrode on the power chip 19 on the circuit pattern 17 is
Wire bonding is performed on a predetermined electrode pad of the circuit pattern 17. The circuit pattern 17 may be directly formed on the bottom surface 13a as described above, or may be a circuit board that is a separate body attached to the bottom surface 13a.
【0007】また、基体11の外周には基体11の中心
軸方向に雄ネジ部21が形成され、基体11の外周面は
大部分または全面がネジ面となっている。また、基体1
1の下面には凹溝23(図2参照)が形成され、この凹
溝23はドライバ、治具等と嵌合するようになってい
る。一方、放熱体25には雄ネジ部21が螺合する雌ネ
ジ部27が形成され、雌ネジ部27は基体11の少なく
とも大部分を収納する深さを有している。つまり、雄ネ
ジ部21を雌ネジ部27に螺合させることで、基体11
は雌ネジ27内に挿着されるようになっている。そし
て、基体11は、放熱体25に挿着された後、外部回路
とワイヤーボンディングされる。以上のように、基体1
1、パワーチップ19、雄ネジ部21を主な部材とし
て、パワーモジュール29が構成されている。A male screw portion 21 is formed on the outer periphery of the base 11 in the direction of the central axis of the base 11, and the outer peripheral surface of the base 11 is mostly or entirely a screw surface. Also, the base 1
A concave groove 23 (see FIG. 2) is formed on the lower surface of 1 and the concave groove 23 is adapted to be fitted with a driver, a jig, or the like. On the other hand, the radiator 25 is formed with a female screw portion 27 with which the male screw portion 21 is screwed, and the female screw portion 27 has a depth for accommodating at least most of the base 11. That is, by screwing the male screw portion 21 into the female screw portion 27, the base 11
Is inserted into the female screw 27. Then, the base body 11 is inserted into the radiator 25 and then wire-bonded to an external circuit. As described above, the base 1
The power module 29 is configured with the power chip 19, the power chip 19, and the male screw portion 21 as main members.
【0008】このように構成されたパワーモジュール2
9においては、基体11が雌ネジ部27に螺合される
と、基体11の全外周面が放熱体25の内周面に接触す
ることとなり、基体11は大きな面積で放熱体25と接
触し、熱の伝導経路が十分に確保されることとなる。こ
のため、パワーチップ19からの熱は、速やかに放熱体
25へ伝導することとなり、基体11での熱の滞留がな
くなる。なお、雌ネジ27の所定深さに段部等を形成す
れば、基体11を雌ネジ27に螺合させた際、所定位置
で基体11を位置決めすることも可能となる。[0008] The power module 2 configured in this way
In No. 9, when the base 11 is screwed into the female screw portion 27, the entire outer peripheral surface of the base 11 contacts the inner peripheral surface of the radiator 25, and the base 11 contacts the radiator 25 in a large area. Therefore, the heat conduction path is sufficiently secured. Therefore, the heat from the power chip 19 is quickly conducted to the radiator 25, and the heat is not accumulated in the base 11. If a step portion or the like is formed at a predetermined depth of the female screw 27, when the base 11 is screwed into the female screw 27, the base 11 can be positioned at a predetermined position.
【0009】[0009]
【発明の効果】以上詳細に説明したように、本発明に係
るパワーモジュールでは、パワーチップを基体端面に設
け、放熱体の雌ネジ部に螺合する雄ネジ部を基体の外周
面に形成したので、基体と放熱体との接触面積が大きく
なり、パワーチップの熱伝導経路を十分に確保すること
ができるようになる。この結果、パワーチップの放熱効
率を著しく向上させることが可能になる。As described above in detail, in the power module according to the present invention, the power chip is provided on the end face of the base body, and the male screw portion to be screwed into the female screw portion of the radiator is formed on the outer peripheral surface of the base body. Therefore, the contact area between the base and the radiator becomes large, and the heat conduction path of the power chip can be sufficiently secured. As a result, it becomes possible to significantly improve the heat dissipation efficiency of the power chip.
【図1】本発明の1実施例に係るパワーモジュールの外
観を示す斜視図である。FIG. 1 is a perspective view showing an appearance of a power module according to an embodiment of the present invention.
【図2】図1のパワーモジュールの詳細な構成を示す縦
断面図である。FIG. 2 is a vertical sectional view showing a detailed configuration of the power module in FIG.
【図3】従来のパワーモジュールの外観構造を示す斜視
図である。FIG. 3 is a perspective view showing an external structure of a conventional power module.
11 基体 13 凹部 13a 底面 15 絶縁皮膜 17 回路パターン 19 パワーチップ 21 雄ネジ部 23 凹溝 25 放熱体 27 雌ネジ部 29 パワーモジュール 11 Base 13 Recess 13a Bottom 15 Insulating Film 17 Circuit Pattern 19 Power Chip 21 Male Screw Part 23 Recessed Groove 25 Heat Dissipator 27 Female Screw Part 29 Power Module
Claims (1)
を熱的かつ機械的に放熱体に結合可能なパワーモジュー
ルであって、 略円柱形状の熱伝導性部材で構成され外周面に雄ネジ部
を備えた基体と、該基体の端面に取付けられたパワーチ
ップとを具備し、前記基体の雄ネジ部を放熱体に形成さ
れた雌ネジ部に螺合することによって前記パワーチップ
の放熱を行なうことを特徴とするパワーモジュール。1. A power module having a power chip mounted thereon, the power chip being capable of being thermally and mechanically coupled to a heat radiator, the power module being composed of a substantially columnar heat conductive member and having a male screw portion on an outer peripheral surface thereof. And a power chip attached to an end surface of the base, and the male chip portion of the base is screwed into a female screw portion formed on the radiator to radiate heat from the power chip. A power module characterized in that.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35767192A JPH06196625A (en) | 1992-12-24 | 1992-12-24 | Power module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35767192A JPH06196625A (en) | 1992-12-24 | 1992-12-24 | Power module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06196625A true JPH06196625A (en) | 1994-07-15 |
Family
ID=18455317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP35767192A Pending JPH06196625A (en) | 1992-12-24 | 1992-12-24 | Power module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06196625A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015025447A1 (en) * | 2013-08-23 | 2015-02-26 | 富士電機株式会社 | Semiconductor devices |
-
1992
- 1992-12-24 JP JP35767192A patent/JPH06196625A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015025447A1 (en) * | 2013-08-23 | 2015-02-26 | 富士電機株式会社 | Semiconductor devices |
JPWO2015025447A1 (en) * | 2013-08-23 | 2017-03-02 | 富士電機株式会社 | Semiconductor device |
US9842786B2 (en) | 2013-08-23 | 2017-12-12 | Fuji Electric Co., Ltd. | Semiconductor device |
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