JPH06177533A - Joining method of composite printed board - Google Patents
Joining method of composite printed boardInfo
- Publication number
- JPH06177533A JPH06177533A JP43A JP33014792A JPH06177533A JP H06177533 A JPH06177533 A JP H06177533A JP 43 A JP43 A JP 43A JP 33014792 A JP33014792 A JP 33014792A JP H06177533 A JPH06177533 A JP H06177533A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flexible substrate
- lead electrodes
- lead
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、２枚のプリント基板の
各リード電極を半田付けによって電気的接続するプリン
ト基板の接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board joining method for electrically connecting lead electrodes of two printed circuit boards by soldering.
【０００２】[0002]
【従来の技術】最近、電子機器の軽量化、薄型化および
短小化の要求から、それに使用されるプリント配線基板
は高密度化、多層化および立体化されている。特に限ら
れた空間を立体的に利用するために可撓性基板と硬質基
板との配線接続をより高信頼性を目的とした技術が提案
されている。2. Description of the Related Art Recently, printed wiring boards used for electronic devices have been highly densified, multi-layered and three-dimensionalized due to demands for weight reduction, thickness reduction and miniaturization of electronic devices. In particular, there has been proposed a technique aiming at higher reliability in wiring connection between a flexible substrate and a hard substrate in order to three-dimensionally use a limited space.
【０００３】例えば図６、図７に示すように、可撓性基
板１に形成されたスルーホール２の表面に露出するよう
に半田レジスト膜３が設けられている。硬質基板４にも
同様にスルーホール５と半田レジスト膜６が設けられて
いる。そして可撓性基板１と硬質基板４は接着層７によ
り接合硬化されている。For example, as shown in FIGS. 6 and 7, a solder resist film 3 is provided so as to be exposed on the surface of a through hole 2 formed in a flexible substrate 1. A through hole 5 and a solder resist film 6 are similarly provided on the hard substrate 4. The flexible substrate 1 and the hard substrate 4 are bonded and cured by the adhesive layer 7.
【０００４】可撓性基板１上に印刷された半田ペースト
８は加熱溶解し、硬質基板２のスルーホール５へ落し込
むことができる。溶融固化後の半田９が形成され、可撓
性基板１と硬質基板２との配線接続が行なわれる。The solder paste 8 printed on the flexible substrate 1 can be melted by heating and dropped into the through holes 5 of the hard substrate 2. The solder 9 after melting and solidification is formed, and wiring connection between the flexible substrate 1 and the hard substrate 2 is performed.
【０００５】また他の実施例としては、図８のような、
リード電極１１ａが複数形成された可撓性基板１１と、
リード電極１２ａが複数形成された硬質基板１２とを対
向させて予め接着層１３を熱により仮接着し固定する。
その後可撓性基板１１と硬質基板１２との間に位置する
予備半田１４を加熱によって溶融させることにより両リ
ード電極１１ａ，１２ａ同志を接合する。なお、加熱方
法は、リフロー方式、ヒートプレス方式のいづれの方法
においても接合される。As another embodiment, as shown in FIG.
A flexible substrate 11 having a plurality of lead electrodes 11a formed thereon;
The hard substrate 12 on which a plurality of lead electrodes 12a are formed is made to face, and the adhesive layer 13 is preliminarily heat-bonded and fixed in advance.
After that, the preliminary solder 14 located between the flexible substrate 11 and the hard substrate 12 is melted by heating to join the lead electrodes 11a and 12a together. The heating method may be a reflow method or a heat press method.
【０００６】[0006]
【発明が解決しようとする課題】上記従来技術における
前者の接合方法では、半田ペースト８の印刷時の空気
が、スルーホール２，５内に入り、熱溶融時に気泡発生
となったり、硬化した接着層７からのガス発生による気
泡が可撓性基板１と硬質基板４の対向電極部界面に存在
すると両者の配線接続部の導通不良となるなどの問題が
あった。In the former joining method in the above-mentioned prior art, air during printing of the solder paste 8 enters the through holes 2 and 5, and bubbles are generated during heat melting, or a cured adhesive is applied. When air bubbles generated by the gas generated from the layer 7 exist at the interface between the opposing electrodes of the flexible substrate 1 and the hard substrate 4, there is a problem that the wiring connection between the two becomes poor.
【０００７】また、後者の接合方法では、リード電極１
１ａと１２ａの対向面積が狭い場合には、接合部の半田
付けが不十分となり導通不良が起り易い欠点を有してい
た。本発明は、このような欠点を解決するためになされ
たもので高密度に配線された可撓性基板と硬質基板との
電気接続を信頼性の高くすることのできる複合プリント
基板の接合方法を提供することを目的とするものであ
る。In the latter joining method, the lead electrode 1
When the facing area between 1a and 12a is small, there is a drawback that soldering of the joint portion is insufficient and conduction failure easily occurs. The present invention has been made in order to solve such a drawback, and provides a method for joining a composite printed circuit board capable of highly reliable electrical connection between a flexible board and a hard board which are densely wired. It is intended to be provided.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
の一つの手段としては、 （１）片面または両面に配線回路を有し、複数のくし歯
状電極部を有した可撓性基板と両面または多層に配線回
路を有する硬質基板とを配線接続する複合プリント基板
の接合方法において、前記可撓性基板の複数のくし歯状
電極部のリード電極に複数のスリット部を設け、該可撓
性基板と予備半田された複数のリード電極を有する硬質
基板とを各リード電極を相互に対向するように接合し、
前記予備半田を加熱溶融させ配線接続させるようにした
ことを特徴とする複合プリント基板の接合方法を提供す
るものである。As one means for achieving the above object, (1) a flexible substrate having a wiring circuit on one side or both sides and having a plurality of comb-teeth-shaped electrode portions In a method for joining a composite printed circuit board, which is connected to a hard substrate having a wiring circuit on both sides or in multiple layers, a plurality of slits are provided in the lead electrodes of a plurality of the comb-shaped electrode portions of the flexible substrate, A flexible substrate and a hard substrate having a plurality of pre-soldered lead electrodes so that the lead electrodes face each other,
It is intended to provide a method for joining a composite printed circuit board, characterized in that the preliminary solder is heated and melted to be connected to wiring.
【０００９】今一つの手段としては、 （２）前記複数のくし歯状リード電極に複数のスルーホ
ール側壁面を形成する。As another means, (2) a plurality of through hole side wall surfaces are formed in the plurality of comb tooth-shaped lead electrodes.
【００１０】今一つの手段としては、 （３）前記可撓性基板のリード電極全面に半田メッキを
施すものとする。As another means, (3) solder plating is applied to the entire surface of the lead electrodes of the flexible substrate.
【００１１】[0011]
【作用】両基板のリード電極を半田付けしたとき、加熱
溶融した半田は、各リード電極周囲に流れ出すととも
に、スリット部にも流入し、半田接触面積が増し、半田
強度が増す。When the lead electrodes of both substrates are soldered, the heated and melted solder flows out to the periphery of each lead electrode and also flows into the slit portion, so that the solder contact area increases and the solder strength increases.
【００１２】また、スルーホール側壁面部を設けた場合
も、スルーホール側壁面部にも溶融半田が流入し、半田
接触面積が増大し、より半田強度が増す。Also, when the side wall surface portion of the through hole is provided, the molten solder also flows into the side wall surface portion of the through hole, the solder contact area increases, and the solder strength further increases.
【００１３】さらに、リード電極全面を半田メッキする
ことにより、溶融半田は、各リード電極の周囲全体に流
れ込むことにより、リード電極の側面全体にフイレット
部が形成され、各リード電極の半田強度がさらに増大す
る。Furthermore, by plating the entire surface of the lead electrodes with molten solder, the molten solder flows into the entire periphery of each of the lead electrodes to form a fillet portion on the entire side surface of each of the lead electrodes, further increasing the solder strength of each of the lead electrodes. Increase.
【００１４】[0014]
【実施例】以下本発明を図面に基づいて詳細に説明す
る。図１は本発明の第一実施例を示す可撓性基板のリー
ド電極の要部平面図、図２は同じく可撓性基板と硬質基
板とを接着層を介して接合した状態の要部平面図であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view of a main part of a lead electrode of a flexible substrate showing a first embodiment of the present invention, and FIG. 2 is a plan view of a main part in which a flexible substrate and a hard substrate are joined together via an adhesive layer. It is a figure.
【００１５】可撓性基板２１に設けられた複数のリード
電極２１ａは、くし歯状に形成され、該リード電極２１
ａには、複数のスリット２１ｂが設けられている。具体
的に記すと、可撓性基板２１の接合側端部はリード電極
２１ａの領域以外のフィルムベース２２が切欠きされ、
該リード電極２１ａの領域だけがくし歯状の突出部２３
となるように形成されている。The plurality of lead electrodes 21a provided on the flexible substrate 21 are formed in a comb-teeth shape.
A plurality of slits 21b are provided in a. Specifically, the film base 22 other than the region of the lead electrode 21a is cut out at the bonding side end of the flexible substrate 21,
Only the region of the lead electrode 21a has a comb-like protrusion 23
It is formed so that.
【００１６】一方硬質基板２４には複数のリード電極２
４ａが形成され、それぞれのリード電極２４ａ上には予
備半田２５が被着されている。On the other hand, a plurality of lead electrodes 2 are provided on the hard substrate 24.
4a is formed, and the preliminary solder 25 is adhered on each lead electrode 24a.
【００１７】次に上記両基板２１，２４の接合方法につ
いて説明する。まず、両基板２１，２４の各リード電極
２１ａ，２４ａを対向させて、可撓性基板２１のリード
電極２１ａを硬質基板２４の予備半田２５と接するよう
に合わせる。そして予め接着層２６を熱により仮接着
し、可撓性基板２１と硬質基板２４とを固定する。その
後、予備半田２５を図示しない半田ゴテで加熱すること
によって再溶融させることにより、リード電極２１ａと
２４ａを接合させる。Next, a method of joining the above two substrates 21 and 24 will be described. First, the lead electrodes 21 a and 24 a of the two substrates 21 and 24 are opposed to each other, and the lead electrodes 21 a of the flexible substrate 21 are brought into contact with the preliminary solder 25 of the hard substrate 24. Then, the adhesive layer 26 is preliminarily adhered by heat to fix the flexible substrate 21 and the hard substrate 24. Then, the lead electrodes 21a and 24a are joined by re-melting the preliminary solder 25 by heating it with a soldering iron (not shown).
【００１８】なお、各リード電極２１ａ，２４ａの位置
ずれに基づく隣合う電極とのブリッジ接続を防ぐため
に、リード電極２１ａの方をリード電極２４ａに比べて
巾を狭く設定してある。The width of the lead electrode 21a is set to be narrower than that of the lead electrode 24a in order to prevent bridge connection between adjacent lead electrodes due to the positional deviation of the lead electrodes 21a and 24a.
【００１９】なお、加熱方法はリフロー方式、ヒートプ
レス方式のいずれの方法においても良好な接合が得られ
る。Good joining can be obtained by either the reflow method or the heat press method as the heating method.
【００２０】上記のようにして両基板のリード電極２１
ａ，２４ａを半田付けすると、溶融した半田が各リード
電極２１ａ周囲に流れるとともに、リード電極２１ａに
設けられたスリット２１ｂにも流入することになり、半
田の接触面積が増大する。As described above, the lead electrodes 21 on both substrates
When a and 24a are soldered, the molten solder flows around each lead electrode 21a and also flows into the slit 21b provided in the lead electrode 21a, so that the contact area of the solder increases.
【００２１】図３は、本発明の第二実施例を示す可撓性
基板と硬質基板とを配線接続した状態の要部平面図、図
４は、図３の要部断面図で、（ａ）は図３の矢印Ａ−Ａ
断面図、（ｂ）は図３の矢印Ｂ−Ｂ断面図、（Ｃ）は図
３の矢印Ｃ−Ｃ断面図である。FIG. 3 is a plan view of a main part of a second embodiment of the present invention in which a flexible substrate and a hard substrate are connected by wiring, and FIG. 4 is a cross-sectional view of the main part of FIG. ) Is an arrow A-A in FIG.
Sectional drawing, (b) is arrow BB sectional drawing of FIG. 3, (C) is arrow CC sectional drawing of FIG.
【００２２】可撓性基板３１は、フイルムベース３２の
両面に導体パターン３３を形成し、該導体パターン３３
を複数のスルーホール側壁面３３ａ、３３ａ、で接続し
た複数のリード電極３４、３４、を有して構成されてい
る。The flexible substrate 31 has conductor patterns 33 formed on both surfaces of a film base 32, and the conductor patterns 33 are formed on the conductor patterns 33.
Is connected by a plurality of through hole side wall surfaces 33a, 33a, and has a plurality of lead electrodes 34, 34.
【００２３】一方、硬質基板３５は、予め予備半田３６
された複数のリード電極３７、３７、を有して構成され
ている。On the other hand, the hard substrate 35 is preliminarily soldered 36 beforehand.
It is configured to have a plurality of formed lead electrodes 37, 37.
【００２４】上記両基板３１、３５を配線接続するとき
は、両基板３１、３５の各リード電極３４、３７を対抗
させて、可撓性基板３１のリード電極３４を硬質基板３
５の予備半田３６を有したリード電極３７とを合わせ
る。そして予め接着層３８を熱により仮接着し、両基板
３１と３５を固定する。その後、予備半田３６を図示し
ない半田ゴテで加熱することによって再溶融させること
により各リード電極３４と３７とを接合させる。When wiring the both substrates 31 and 35, the lead electrodes 34 and 37 of the two substrates 31 and 35 are opposed to each other so that the lead electrodes 34 of the flexible substrate 31 are connected to the hard substrate 3.
5 and the lead electrode 37 having the preliminary solder 36. Then, the adhesive layer 38 is preliminarily adhered by heat to fix the two substrates 31 and 35 together. Then, the lead electrodes 34 and 37 are joined by heating the preliminary solder 36 with a soldering iron (not shown) to re-melt it.
【００２５】この場合、溶融半田は、スルーホール側壁
面３３ａ、３３ａ、内へも流入し、側壁部にフイレット
部３９が形成され、各リード電極３４と３７の半田強度
が増すことになる。In this case, the molten solder also flows into the through hole side wall surfaces 33a, 33a, the fillet portion 39 is formed on the side wall portion, and the solder strength of the lead electrodes 34 and 37 is increased.
【００２６】図５は、本発明の第三実施例を示す可撓性
基板と硬質基板とを配線接続した状態の要部断面図であ
る。なお、要部平面図は第二実施例で示した図３と同様
であるので省略する。図５（ａ）は図３の矢印Ａ−Ａに
相当する断面図、図５（ｂ）は図３の矢印Ｂ−Ｂに相当
する断面図である。FIG. 5 is a cross-sectional view of the essential parts of a third embodiment of the present invention in which a flexible substrate and a hard substrate are connected by wiring. The plan view of the main part is the same as that shown in FIG. 5A is a sectional view corresponding to the arrow AA in FIG. 3, and FIG. 5B is a sectional view corresponding to the arrow BB in FIG.
【００２７】可撓性基板４１は、フイルムベース４２の
全面に導体パターン４３を形成し、該導体パターン４３
の全面に半田メッキ層４４を形成した複数のリード電極
４５、４５、を有して構成されている。なお、前記リー
ド電極４５は前記したスリット２１ｂまたはスルーホー
ル側壁面３３ａを有していてもよい。The flexible substrate 41 has a conductor pattern 43 formed on the entire surface of the film base 42, and the conductor pattern 43 is formed.
Is provided with a plurality of lead electrodes 45, 45 having a solder plating layer 44 formed on the entire surface thereof. The lead electrode 45 may have the slit 21b or the through hole side wall surface 33a.
【００２８】一方、硬質基板４６は、予め予備半田４７
された複数のリード電極４８、４８、を有して構成され
ている。On the other hand, the hard board 46 is preliminarily soldered 47 beforehand.
The plurality of lead electrodes 48, 48 are formed.
【００２９】上記両基板４１、４６を配線接続するとき
は、両基板４１、４６の各リード電極４５、４８を対向
させて、可撓性基板４１のリード電極４５を硬質基板４
６の予備半田４７を有したリード電極４８とを合わせ
る。そして予め設けられた接着層（図示せず）を熱によ
り仮接着し、両基板４１と４６を固定する。その後、予
備半田４７を図示しない半田ゴテで加熱することによっ
て再溶融させることにより、各リード電極４５と４８と
を接合させる。When wiring the two substrates 41, 46, the lead electrodes 45, 48 of the two substrates 41, 46 are opposed to each other, and the lead electrode 45 of the flexible substrate 41 is connected to the hard substrate 4.
6 and the lead electrode 48 having the preliminary solder 47. Then, an adhesive layer (not shown) provided in advance is temporarily adhered by heat to fix both substrates 41 and 46. After that, the preliminary solder 47 is heated by a soldering iron (not shown) to be remelted, so that the lead electrodes 45 and 48 are joined.
【００３０】この場合、各リード電極側面部４５ａにも
溶融半田が流入し側面部４５ａにフイレット部４９が形
成され、各リード電極４５と４８の半田強度が増すこと
になる。In this case, the molten solder also flows into the side surface portions 45a of the lead electrodes and the fillet portions 49 are formed on the side surface portions 45a, so that the solder strength of the lead electrodes 45 and 48 is increased.
【００３１】[0031]
【発明の効果】本発明は、以上説明したような構成にな
っているので下記のような効果を奏する。硬質基板の接
合リード電極の予備半田が溶融して両基板のリード電極
を半田付けするが、可撓性基板の各リード電極にスリッ
トを設けているため、溶融半田はスリット部へも流入す
ることになり、そのため、半田接触面積が増大してより
強固で確実な接合が得られる。Since the present invention has the above-described structure, it has the following effects. Bonding of hard substrates The preliminary solder of the lead electrodes is melted and the lead electrodes of both substrates are soldered, but since the lead electrodes of the flexible substrate are provided with slits, the molten solder must flow into the slits as well. Therefore, the solder contact area is increased, and stronger and more reliable joining can be obtained.
【００３２】また、リード電極にスルーホール側壁面を
形成することによって、スルーホール側壁面に半田が流
入し、フイレット部が形成され、半田強度がより増大す
ることになる。Further, by forming the side wall surface of the through hole in the lead electrode, the solder flows into the side wall surface of the through hole, the fillet portion is formed, and the solder strength is further increased.
【００３３】さらに、リード電極全面に半田メッキ層を
形成することによりリード電極側壁面全域に半田が流入
し、フイレット部が形成され、さらに半田強度が増大す
ることになる。Further, by forming the solder plating layer on the entire surface of the lead electrode, the solder flows into the entire side surface of the lead electrode, the fillet portion is formed, and the solder strength is further increased.
【図１】本発明の可撓性基板のリード電極の要部平面図
である。FIG. 1 is a plan view of a main part of a lead electrode of a flexible substrate of the present invention.
【図２】本発明の第一実施例の可撓性基板と硬質基板と
の接合を示す要部平面図である。FIG. 2 is a plan view of relevant parts showing the joining of the flexible substrate and the hard substrate according to the first embodiment of the present invention.
【図３】本発明の第二実施例の可撓性基板と硬質基板と
の接合を示す要部平面図である。FIG. 3 is a plan view of relevant parts showing the joining of a flexible substrate and a hard substrate according to a second embodiment of the present invention.
【図４】同じく図３の要部断面図で、（ａ）は矢印Ａ−
Ａ断面図、（ｂ）は矢印Ｂ−Ｂ断面図、（ｃ）は矢印Ｃ
−Ｃ断面図である。FIG. 4 is a sectional view of the principal part of FIG. 3, in which (a) is an arrow A-.
A sectional view, (b) is an arrow BB sectional view, (c) is an arrow C
FIG.
【図５】本発明の第三実施例の可撓性基板と硬質基板と
の接合を示す要部図で、（ａ）は図３の矢印Ａ−Ａに相
当する断面図、（ｂ）は図３の矢印Ｂ−Ｂに相当する断
面図である。5A and 5B are principal part views showing joining of a flexible substrate and a hard substrate according to a third embodiment of the present invention, FIG. 5A is a sectional view corresponding to arrow AA in FIG. 3, and FIG. FIG. 4 is a sectional view corresponding to arrow BB in FIG. 3.
【図６】従来技術の可撓性基板と硬質基板との接合を示
し、半田ペースト印刷工程後のスルーホールの断面図で
ある。FIG. 6 is a cross-sectional view of a through hole after a solder paste printing process, showing the joining of a conventional flexible substrate and a hard substrate.
【図７】同じく半田ペーストを加熱溶融工程により配線
接続されたスルーホールの断面図である。FIG. 7 is a sectional view of a through hole in which a solder paste is also wire-connected by a heating and melting step.
【図８】従来技術の他の実施例の可撓性基板と硬質基板
との接合を示す要部平面図である。FIG. 8 is a plan view of a principal portion showing joining of a flexible substrate and a hard substrate according to another embodiment of the prior art.
２１，３１，４１ 可撓性基板 ２１ａ，２４ａ，３４，３７，４５，４８ リード電
極 ２１ｂ スリット ２４，３５，４６ 硬質基板 ３３ａ スルーホール側壁面 ３９，４９ フイレット部 ４４ 半田メッキ層21, 31, 41 Flexible substrate 21a, 24a, 34, 37, 45, 48 Lead electrode 21b Slit 24, 35, 46 Hard substrate 33a Through hole side wall surface 39, 49 Fillet portion 44 Solder plating layer
Claims (3)
のくし歯状リード電極部を有した可撓性基板と両面また
は多層に配線回路を有する硬質基板とを配線接続する複
合プリント基板の接合方法において、前記可撓性基板の
複数のくし歯状電極部のリード電極に複数のスリット部
を設け、該可撓性基板と予備半田された複数のリード電
極を有する硬質基板とを各リード電極を相互に対向する
ように接合し、前記予備半田を加熱溶融させ配線接続さ
せるようにしたことを特徴とする複合プリント基板の接
合方法。1. A composite printed circuit board having a wiring circuit on one or both sides thereof, wherein a flexible substrate having a plurality of comb-teeth-shaped lead electrode portions and a hard substrate having wiring circuits on both sides or a multilayer are connected by wiring. In the joining method, a plurality of slit portions are provided on the lead electrodes of the plurality of comb-teeth-shaped electrode portions of the flexible substrate, and the flexible substrate and a hard substrate having a plurality of pre-soldered lead electrodes are provided for each lead. A method for joining a composite printed circuit board, characterized in that the electrodes are joined so as to face each other, and the preliminary solder is heated and melted to connect the wiring.
スルーホール側壁面を形成したことを特徴とする請求項
１記載の複合プリント基板の接合方法。2. The method for joining a composite printed circuit board according to claim 1, wherein a plurality of through hole side wall surfaces are formed on the plurality of comb tooth-shaped lead electrodes.
メッキを施したことを特徴とする請求項１または２記載
の複合プリント基板の接合方法。3. The method for joining composite printed circuit boards according to claim 1, wherein the lead electrodes on the entire surface of the flexible substrate are plated with solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4330147A JP2821070B2 (en) | 1992-12-10 | 1992-12-10 | Composite printed circuit board joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4330147A JP2821070B2 (en) | 1992-12-10 | 1992-12-10 | Composite printed circuit board joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06177533A true JPH06177533A (en) | 1994-06-24 |
| JP2821070B2 JP2821070B2 (en) | 1998-11-05 |
Family
ID=18229344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4330147A Expired - Fee Related JP2821070B2 (en) | 1992-12-10 | 1992-12-10 | Composite printed circuit board joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2821070B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4418085C2 (en) * | 1993-05-21 | 1999-09-09 | Toyota Motor Co Ltd | Safety device for a vehicle |
| JP2015177004A (en) * | 2014-03-14 | 2015-10-05 | ミネベア株式会社 | flexible printed circuit board |
| WO2017199861A1 (en) * | 2016-05-20 | 2017-11-23 | オリンパス株式会社 | Ultrasonic transducer module, ultrasonic endoscope, and method for manufacturing ultrasonic transducer module |
-
1992
- 1992-12-10 JP JP4330147A patent/JP2821070B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4418085C2 (en) * | 1993-05-21 | 1999-09-09 | Toyota Motor Co Ltd | Safety device for a vehicle |
| JP2015177004A (en) * | 2014-03-14 | 2015-10-05 | ミネベア株式会社 | flexible printed circuit board |
| WO2017199861A1 (en) * | 2016-05-20 | 2017-11-23 | オリンパス株式会社 | Ultrasonic transducer module, ultrasonic endoscope, and method for manufacturing ultrasonic transducer module |
| US11160530B2 (en) | 2016-05-20 | 2021-11-02 | Olympus Corporation | Ultrasonic transducer module, ultrasonic endoscope and processing method of ultrasonic transducer module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2821070B2 (en) | 1998-11-05 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |