JPH06164085A - Composite flexible board - Google Patents

Composite flexible board

Info

Publication number
JPH06164085A
JPH06164085A JP31880592A JP31880592A JPH06164085A JP H06164085 A JPH06164085 A JP H06164085A JP 31880592 A JP31880592 A JP 31880592A JP 31880592 A JP31880592 A JP 31880592A JP H06164085 A JPH06164085 A JP H06164085A
Authority
JP
Japan
Prior art keywords
polyimide film
base material
layer
elastic modulus
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31880592A
Other languages
Japanese (ja)
Inventor
Atsushi Ueda
淳 上田
Seiichi Watanabe
誠一 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP31880592A priority Critical patent/JPH06164085A/en
Publication of JPH06164085A publication Critical patent/JPH06164085A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To provide a composite flexible board which causes no insulation failure, has excellent handleability and an increased mechanical strength such as tearing strength. CONSTITUTION:A conductor circuit pattern 4 is integrally formed on the base material surface of a base material of polyimide resin, a cover lay is provided while the conductor circuit pattern 4 is applied, a polyimide film 6 is laminated on at least one of the cover lay and the base material surface, the initial modulus in tension of the polyimide film 6 is set smaller than of the base material, and the initial modulus in tension of the polyimide film 6 itself is set within the range of 200 to 400Kg/mm<2>.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、高信頼性を有する複
合フレキシブル基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a highly reliable composite flexible substrate.

【０００２】[0002]

【従来の技術】従来、フレキシブル回路基板（ＦＰＣ）
はポリイミドフィルムやポリエチレンテレフタレートフ
ィルム間にパターニングされた導体をエポキシ系やアク
リル系の接着剤でサンドイッチした構造になっており、
折り曲げが可能であるため折り曲げを必要とするケーブ
ル代替や回路基板として使用されている。2. Description of the Related Art Conventionally, a flexible circuit board (FPC)
Has a structure in which a conductor patterned between a polyimide film and a polyethylene terephthalate film is sandwiched with an epoxy or acrylic adhesive,
Since it can be bent, it is used as a cable substitute or circuit board that requires bending.

【０００３】上記のようなＦＰＣとしては、現在３層基
板が使用されている。この３層基板は、基材フィルム、
接着剤層および導体の３種類の材料から成り立ってお
り、これにより３層基板と呼ばれているものであるが、
基材フィルムと導体といった全く異種な物質を接着剤層
により接着していること、および、全体として可撓性が
必要であることから、上記接着剤層を構成する接着剤に
大きな制限がある。ところが、市場には数種の接着剤が
あるのみであり、しかも、これら数種の接着剤はアクリ
ル樹脂を主としたものや、エポキシ樹脂にゴムやポリア
ミド樹脂のエラストマーを添加したものでつくられてお
り、耐熱信頼性に劣るという問題があった。しかも、水
分の存在下において導体パターン間の電位差により導体
が接着剤層の表面あるいは接着剤層中を移動して短絡を
引き起こすマイグレーションの問題があった。As the above FPC, a three-layer substrate is currently used. This three-layer substrate is a base film,
It is made up of three types of materials, an adhesive layer and a conductor, which makes it called a three-layer board.
Since the completely different substances such as the base film and the conductor are adhered by the adhesive layer and the flexibility as a whole is required, the adhesive constituting the adhesive layer is greatly limited. However, there are only several types of adhesives on the market, and these several types of adhesives are made mainly of acrylic resin or epoxy resin with rubber or polyamide resin elastomer added. Therefore, there is a problem that the heat resistance is poor. In addition, there is a problem of migration in which the conductor moves on the surface of the adhesive layer or in the adhesive layer due to the potential difference between the conductor patterns in the presence of water to cause a short circuit.

【０００４】そこで、耐熱性向上のため接着剤と基材フ
ィルムとを一体化した２層基板が検討されている。この
２層基板は、導体に直接耐熱性を有するポリイミド樹脂
等を流延塗布し、基材と接着剤との機能を持たせるもの
である。このため、２層基板には、３層基板のような耐
熱性に劣る接着剤層が存在しなくなり、基板の耐熱性が
向上するとともに、耐マイグレーション性も向上するよ
うになった。Therefore, in order to improve heat resistance, a two-layer substrate in which an adhesive and a base film are integrated has been studied. In this two-layer substrate, a conductor is directly cast and coated with a heat-resistant polyimide resin or the like to have a function as a base material and an adhesive. Therefore, the two-layer substrate does not have an adhesive layer having poor heat resistance unlike the three-layer substrate, and the heat resistance of the substrate is improved and the migration resistance is also improved.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、上記２
層基板は、製造において、その導体側に樹脂をスクリー
ン印刷等で塗布することによりカバーレイを設置するた
め、上記カバーレイにピンホールが発生しやすく、絶縁
不良を引き起こすという問題点があった。しかも、部品
実装においても、平滑性に劣るためハンドリング性が悪
く、さらに、引き裂き強度が低いため連続化にも支障を
きたすという問題点があった。[Problems to be Solved by the Invention] However, the above 2
In the layered substrate, since the coverlay is installed by applying a resin to the conductor side by screen printing or the like in manufacturing, there is a problem that pinholes are easily generated in the coverlay and insulation failure occurs. Moreover, in mounting components, there is a problem that the smoothness is poor and the handling property is poor, and further, the tear strength is low, which hinders continuity.

【０００６】この発明は、このような事情に鑑みなされ
たもので、絶縁不良を起こすことがなく、ハンドリング
性に優れ、しかも、引き裂き強度等の機械的強度を向上
させることのできる複合フレキシブル基板の提供をその
目的とする。The present invention has been made in view of the above circumstances, and provides a composite flexible substrate which does not cause insulation failure, is excellent in handleability, and can improve mechanical strength such as tear strength. The purpose is to provide.

【０００７】[0007]

【課題を解決するための手段】上記の目的を達成するた
め、この発明の複合フレキシブル基板は、ポリイミド系
樹脂からなる基材の基材面に導体パターンが一体形成さ
れ、上記導体パターンを被覆した状態でカバーレイが設
けられ、上記カバーレイおよび上記基材面の少なくとも
一方にポリイミドフィルムが貼着され、上記ポリイミド
フィルムの初期引っ張り弾性率が上記基材の初期引っ張
り弾性率より小さく設定され、かつポリイミドフィルム
自体の初期引っ張り弾性率が２００〜４００ｋｇ／ｍｍ
2 の範囲内に設定されているという構成をとる。In order to achieve the above object, in the composite flexible substrate of the present invention, a conductor pattern is integrally formed on the base material surface of a base material made of a polyimide resin, and the conductor pattern is covered. A cover lay is provided in a state, a polyimide film is attached to at least one of the cover lay and the base material surface, and the initial tensile elastic modulus of the polyimide film is set smaller than the initial tensile elastic modulus of the base material, and Initial tensile elastic modulus of the polyimide film itself is 200-400kg / mm
The configuration is set within the range of 2 .

【０００８】[0008]

【作用】すなわち、この発明の複合フレキシブル基板
は、ポリイミド系樹脂からなる基材の基材面に導体パタ
ーンが一体形成され、上記導体パターンを被覆した状態
でカバーレイが設けられたフレキシブル基板の上記カバ
ーレイおよび上記基材面の少なくとも一方にポリイミド
フィルムが貼着されているため、それ自身の厚みが厚く
なるとともに、機械的強度も向上する。このため、２層
基板が有する優れた耐熱性および耐マイグレーション性
を維持しながらも、ハンドリング性に優れ、かつ、引き
裂き強度が向上して連続化が実現しやすくなる。しか
も、上記ポリイミドフィルムの初期引っ張り弾性率が上
記基材の初期引っ張り弾性率より小さく設定され、か
つ、ポリイミドフィルム自体の初期引っ張り弾性率が２
００〜４００ｋｇ／ｍｍ2 の範囲内に設定されているた
め、さらにハンドリング性に優れるうえ、屈曲性にも優
れたものになる。That is, the composite flexible substrate of the present invention is a flexible substrate in which a conductor pattern is integrally formed on a substrate surface of a substrate made of a polyimide resin, and a cover lay is provided in a state of covering the conductor pattern. Since the polyimide film is attached to at least one of the cover lay and the surface of the base material, the thickness of the film itself is increased and the mechanical strength is also improved. For this reason, while maintaining the excellent heat resistance and migration resistance of the two-layer substrate, the handling property is excellent, the tear strength is improved, and continuity is easily realized. Moreover, the initial tensile elastic modulus of the polyimide film is set smaller than the initial tensile elastic modulus of the substrate, and the initial tensile elastic modulus of the polyimide film itself is 2
Since it is set within the range of 00 to 400 kg / mm 2, the handling property is further excellent and the bending property is also excellent.

【０００９】なお、この発明において、初期引っ張り弾
性率とはＡＳＴＭ Ｄ８８２により測定されたものであ
り、２０℃での測定値である。In the present invention, the initial tensile elastic modulus is measured by ASTM D882 and is a measured value at 20 ° C.

【００１０】つぎに、この発明を詳しく説明する。Next, the present invention will be described in detail.

【００１１】図１はこの発明の複合フレキシブル基板を
示す斜視図であり、図２はその断面図である。これらの
図において、１は２層ＦＰＣであり、点線で示した導体
回路パターン４を埋設している。５はカバーレイ３側の
開口部であり、この開口部５に導体回路パターン４が露
呈している。６はポリイミドフィルムであり、接着剤層
７を介して上記２層ＦＰＣ１のカバーレイ３側に貼り合
わされている。FIG. 1 is a perspective view showing a composite flexible substrate of the present invention, and FIG. 2 is a sectional view thereof. In these figures, 1 is a two-layer FPC, in which the conductor circuit pattern 4 shown by the dotted line is embedded. Reference numeral 5 denotes an opening on the coverlay 3 side, and the conductor circuit pattern 4 is exposed in the opening 5. Reference numeral 6 denotes a polyimide film, which is attached to the cover lay 3 side of the two-layer FPC 1 via the adhesive layer 7.

【００１２】なお、図１に示した例では、２層ＦＰＣ１
のカバーレイ３側にポリイミドフィルム６を貼り合わせ
ているが、これに限定するものではなく、２層ＦＰＣ１
の基材２側にポリイミドフィルム６を貼り合わせてもよ
い。ただし、厚みのバランスの点を考慮すると、上記ポ
リイミドフィルム６をカバーレイ３側に設置するほうが
好ましい。また、図１に示した例では２層ＦＰＣ１は片
面銅基板であるが、両面銅基板でもよい。In the example shown in FIG. 1, the two-layer FPC1
The polyimide film 6 is attached to the cover lay 3 side of the above, but the present invention is not limited to this, and the two-layer FPC 1
The polyimide film 6 may be attached to the base material 2 side of the. However, considering the thickness balance, it is preferable to install the polyimide film 6 on the coverlay 3 side. Further, in the example shown in FIG. 1, the two-layer FPC 1 is a single-sided copper substrate, but it may be a double-sided copper substrate.

【００１３】上記２層ＦＰＣ１を構成する基材２および
カバーレイ３は、ともにポリイミド系樹脂よりなり、熱
硬化性あるいは熱可塑性どちらでもよい。また、上記基
材２およびカバーレ３の耐熱温度は米国ＵＬ規格におけ
る材料の耐熱温度１５５℃以上が好ましく、２６０℃，
３０秒程度の短期的耐熱に対して溶融等しないものが好
ましい。Both the base material 2 and the coverlay 3 which compose the two-layer FPC 1 are made of a polyimide resin and may be either thermosetting or thermoplastic. Further, the heat resistant temperature of the base material 2 and the cover sheet 3 is preferably a heat resistant temperature of 155 ° C. or higher of the material in the US UL standard, 260 ° C.
It is preferable that the material does not melt against a short-term heat resistance of about 30 seconds.

【００１４】上記導体回路パターン４を構成する導体と
しては、特に規定しないが、銅，アルミニウム，金，ス
テンレス，および銅化合物等があげられ、半田，ニッケ
ル，金めっき等を施してもよく、パターニングもエッチ
ングおよびメッキのいずれの方法により作製してもよ
い。The conductor forming the conductor circuit pattern 4 is not particularly specified, but examples thereof include copper, aluminum, gold, stainless steel, copper compounds, and the like, which may be plated with solder, nickel, gold, or the like, and patterned. May be produced by either etching or plating.

【００１５】上記ポリイミドフィルム６としては、特に
規定しないが、通常３層ＦＰＣの基材フィルムに使用さ
れるフィルムで、例えば、東レデュポン社製のカプトン
フィルム，鐘淵化学社製のアピカルフィルム，宇部興産
社製のユーピレックスフィルム等があげられ、その厚み
はハンドリング性ならびに曲げ性を必要とするため、好
適には１０μｍ〜１２５μｍの範囲内に設定される。ま
た、上記ポリイミドフィルム６の初期引っ張り弾性率は
２００〜４００ｋｇ／ｍｍ2 の範囲内に設定する必要が
あり、かつ上記２層ＦＰＣ１の基材２のそれより小さな
値に設定されなければならない。上記ポリイミドフィル
ム６の初期引っ張り弾性率が２００ｋｇ／ｍｍ2 未満で
は、熱に対する歪みが大きくなり、平滑性が失われるこ
とになり、４００ｋｇ／ｍｍ2 を越えると、ＦＰＣ基板
の特徴である可撓性が失われることになるからである。
また、ポリイミドフィルム６の初期引っ張り弾性率を上
記２層ＦＰＣ１の基材２のそれよりも小さい値に設定す
ることで、より適した曲げ強度、高い引き裂き強度を有
することになる。The polyimide film 6 is not particularly specified, but it is a film usually used as a base film of a three-layer FPC, such as Kapton film manufactured by Toray DuPont Co., Apical film manufactured by Kanegafuchi Chemical Co., and Ube. Examples of the film include UPILEX film manufactured by Kosan Co., Ltd. The thickness thereof is required to be handleable and bendable, so that it is preferably set within the range of 10 μm to 125 μm. The initial tensile elastic modulus of the polyimide film 6 must be set within the range of 200 to 400 kg / mm 2 , and must be set to a value smaller than that of the base material 2 of the two-layer FPC 1. When the initial tensile elastic modulus of the polyimide film 6 is less than 200 kg / mm 2 , the strain to heat becomes large and the smoothness is lost, and when it exceeds 400 kg / mm 2 , the flexibility characteristic of the FPC board is obtained. Will be lost.
Further, by setting the initial tensile elastic modulus of the polyimide film 6 to a value smaller than that of the base material 2 of the two-layer FPC 1, more suitable bending strength and high tear strength can be obtained.

【００１６】上記接着剤層７は、２層ＦＰＣ１の基材２
またはカバーレイ３とポリイミドフィルム６とを接着さ
せることができればよく、この接着剤層７を構成する接
着剤としては、３層ＦＰＣに使用されるエポキシ系接着
剤，アクリル系接着剤，ポリアミド系接着剤，ポリイミ
ド系接着剤等ならびにそれらを併用したものが用いら
れ、その厚みは好適には数μｍ〜１００μｍの範囲内に
設定される。また、上記接着剤は耐熱性の優れたものが
よく、例えば、上記ＵＬ規格における材料の耐熱温度１
００℃以上が好ましいが、特に規定しない。The adhesive layer 7 is the base material 2 of the two-layer FPC 1.
Alternatively, it is sufficient that the cover lay 3 and the polyimide film 6 can be adhered to each other, and the adhesive constituting the adhesive layer 7 is an epoxy adhesive, an acrylic adhesive, a polyamide adhesive used in a three-layer FPC. An agent, a polyimide-based adhesive, or the like and a combination thereof are used, and the thickness thereof is preferably set within a range of several μm to 100 μm. Also, the above-mentioned adhesive preferably has excellent heat resistance, and for example, the heat-resistant temperature of the material in the UL standard 1
The temperature is preferably 00 ° C or higher, but not particularly specified.

【００１７】つぎに、この発明を実施例にもとづいて説
明する。Next, the present invention will be described based on embodiments.

【００１８】[0018]

【実施例１】図１および図２に示す複合フレキシブル基
板を作製した。この実施例１では、２層ＦＰＣ１とし
て、厚み２５μｍのベースフィルム２と厚み３５μｍの
銅箔４とからなる２層基板が用いられ、この２層ＦＰＣ
１に厚み約５μｍのカバーレイ３が設置され、このカバ
ーレイ３側にエポキシ接着剤７を介して厚み２５μｍの
ポリイミドフィルム６が接着されている。Example 1 A composite flexible substrate shown in FIGS. 1 and 2 was produced. In Example 1, a two-layer FPC 1 including a base film 2 having a thickness of 25 μm and a copper foil 4 having a thickness of 35 μm is used as the two-layer FPC 1.
1, a cover lay 3 having a thickness of about 5 μm is installed, and a polyimide film 6 having a thickness of 25 μm is adhered to the cover lay 3 side with an epoxy adhesive 7.

【００１９】このような複合フレキシブル基板は、例え
ば、つぎのようにして製造することができる。すなわ
ち、上記２層ＦＰＣ（エスパネックス，新日鉄化学社
製）１の銅箔４を化学的エッチングによりパターニング
し、ついで、ポリイミド系カバーコートインク（ＳＰＩ
−２００Ｎ，新日鉄化学社製）をスクリーン印刷にて、
開口部５を設けた状態で印刷し、つぎに、熱オーブン中
で溶剤を除去後、２７０℃で３分間キュアーしてカバー
レイ３を設置し、これにより、図３に示す２層ＦＰＣを
作製した。そののち、この２層ＦＰＣ１のカバーレイ３
側に２層フレキシブル用エポキシ接着剤（日東電工社
製）７をＢステージ状（半硬化状）で塗布することによ
りポリイミドフィルム（アピカルＡＨ，鐘淵化学社製）
６を接着し、このポリイミドフィルム６を接着したシー
トを、ホットプレスで貼り合わせて接着剤７を硬化さ
せ、そののち、外形を金型で打ち抜き、目的とするフレ
キシブル基板を作製した。Such a composite flexible substrate can be manufactured, for example, as follows. That is, the copper foil 4 of the two-layer FPC (Espanex, Nippon Steel Chemical Co., Ltd.) 1 is patterned by chemical etching, and then the polyimide-based cover coat ink (SPI) is used.
-200N, made by Nippon Steel Chemical Co., Ltd. by screen printing
Printing is performed with the opening 5 provided, and then the solvent is removed in a hot oven, followed by curing at 270 ° C. for 3 minutes to set the cover lay 3 and thereby the two-layer FPC shown in FIG. 3 is produced. did. After that, this 2 layer FPC1 coverlay 3
A polyimide film (Apical AH, manufactured by Kanegafuchi Chemical Co., Ltd.) by applying a two-layer flexible epoxy adhesive (made by Nitto Denko) 7 on the side in a B-stage shape (semi-cured)
6 was adhered, and the sheet to which the polyimide film 6 was adhered was stuck by a hot press to cure the adhesive 7, and then the outer shape was punched out with a mold to produce a target flexible substrate.

【００２０】[0020]

【実施例２】上記実施例１において、２層ＦＰＣとして
２層ＦＰＣ（チッソフレキシブルＳＧ２５Ｅ１８，チッ
ソ社製）を用い、ポリイミドフィルムとしてポリイミド
フィルム（カプトン１００Ｈ，東レジュポン社製）を用
い、上記実施例１と同様にして、複合フレキシブル基板
を作製した。Example 2 In Example 1, the two-layer FPC (Cisso Flexible SG25E18, manufactured by Chisso Corp.) is used as the two-layer FPC, and the polyimide film (Kapton 100H, manufactured by Toray Jupon) is used as the polyimide film. A composite flexible substrate was produced in the same manner as in 1.

【００２１】[0021]

【実施例３】上記実施例１において、ポリイミドフィル
ムとしてポリイミドフィルム（ニトミッドＶ−フィルム
Ｔ，日東電工社製）を用い、上記実施例１と同様にし
て、複合フレキシブル基板を作製した。Example 3 A composite flexible substrate was prepared in the same manner as in Example 1 except that a polyimide film (Nitomid V-Film T, manufactured by Nitto Denko Corporation) was used as the polyimide film.

【００２２】[0022]

【実施例４】上記実施例１において、ポリイミドフィル
ムとしてポリイミドフィルム（ユーピレックス−Ｒ，宇
部興産社製）を用い、上記実施例１と同様にして、複合
フレキシブル基板を作製した。Example 4 A composite flexible substrate was prepared in the same manner as in Example 1 except that a polyimide film (Upilex-R, manufactured by Ube Industries, Ltd.) was used as the polyimide film.

【００２３】[0023]

【比較例１】上記実施例１において、ポリイミドフィル
ムとしてポリイミドフィルム（ジアミノジフェニルエー
テル，含シリコンジアミンとピロメリット酸無水物より
作製したシリコン含有ポリイミド，日東電工社による試
作品）を用い、上記実施例１と同様にして、複合フレキ
シブル基板を作製した。Comparative Example 1 In the above Example 1, a polyimide film (diaminodiphenyl ether, silicon-containing polyimide prepared from silicon-containing diamine and pyromellitic dianhydride, prototype by Nitto Denko) was used as the polyimide film in Example 1 above. A composite flexible substrate was prepared in the same manner as in.

【００２４】[0024]

【比較例２】上記実施例１において、ポリイミドフィル
ムとしてポリイミドフィルム（アピカルＮＰＩ，鐘淵化
学社製）を用い、上記実施例１と同様にして、複合フレ
キシブル基板を作製した。Comparative Example 2 A composite flexible substrate was prepared in the same manner as in Example 1 except that a polyimide film (Apical NPI, manufactured by Kanegafuchi Chemical Co., Ltd.) was used as the polyimide film in Example 1.

【００２５】[0025]

【比較例３】上記実施例２において、ポリイミドフィル
ムとしてポリイミドフィルム（ユーピレックス−Ｓ，宇
部興産社製）を用い、上記実施例２と同様にして、複合
フレキシブル基板を作製した。Comparative Example 3 A composite flexible substrate was prepared in the same manner as in Example 2 except that a polyimide film (Upilex-S, manufactured by Ube Industries, Ltd.) was used as the polyimide film in Example 2.

【００２６】[0026]

【比較例４】基材（カプトン１００Ｈ，東レジュポン社
製）１０にエポキシ系接着剤（日東電工社製）１１を介
して厚み３５μｍの電解銅箔（三井金属社製）１２を貼
り合わせることにより３層ＦＰＣを作製し、ついで、上
記実施例１と同様にしてパターニングを行い、つぎに、
接着剤１４を介してカバーレイ（カプトン１００Ｈ，東
レジュポン社製）１３を熱プレスで貼り合わせたのち外
形を打ち抜き、図４に示す３層ＦＰＣを作製した。[Comparative Example 4] A base material (Kapton 100H, manufactured by Toray-Jupon Co., Ltd.) 10 is pasted with an electrolytic copper foil (made by Mitsui Metals Co., Ltd.) 12 having a thickness of 35 μm via an epoxy adhesive (made by Nitto Denko Corporation) 11. A three-layer FPC was produced, and then patterned in the same manner as in Example 1 above.
A coverlay (Kapton 100H, manufactured by Toray-Jupon Corporation) 13 was attached by a heat press via an adhesive agent 14, and then the outer shape was punched out to produce a three-layer FPC shown in FIG.

【００２７】[0027]

【比較例５】実施例１で作製した２層ＦＰＣに対して外
形を打ち抜き、図２に示す２層ＦＰＣを作製した。Comparative Example 5 A two-layer FPC shown in FIG. 2 was manufactured by punching out the outer shape of the two-layer FPC manufactured in Example 1.

【００２８】上記実施例１，２および比較例１〜５の各
フレキシブル基板について、引っ張り弾性率，耐マイグ
レーション，絶縁破壊特性，屈曲特性，ハンドリング特
性，引き裂き強度および耐半田特性の各項目を測定し、
その結果を表１および表２に示した。なお、上記引っ張
り弾性率は、ＡＳＴＭ Ｄ８８２に準じて、測定した。For each of the flexible substrates of Examples 1 and 2 and Comparative Examples 1 to 5, the tensile modulus, migration resistance, dielectric breakdown characteristics, bending characteristics, handling characteristics, tear strength and solder resistance characteristics were measured. ,
The results are shown in Tables 1 and 2. The tensile elastic modulus was measured according to ASTM D882.

【００２９】上記耐マイグレーションは、つぎのように
して測定した。すなわち、２００μｍピッチのクシ状パ
ターンに１００Ｖを印加し、８５℃×８５％ＲＨの恒温
恒湿機中に放置し、電流をモニターした。The migration resistance was measured as follows. That is, 100 V was applied to a comb-like pattern having a pitch of 200 μm, and the pattern was left in a thermo-hygrostat at 85 ° C. × 85% RH to monitor the current.

【００３０】上記絶縁破壊特性は、つぎのようにして判
定した。すなわち、ＡＳＴＭ Ｄ８８２に準じて、回路
パターンをアースとし、この回路パターン上面より電圧
（２０℃，３ｋＶ）を印加し、異常の有無を判定した。The dielectric breakdown characteristics were determined as follows. That is, according to ASTM D882, the circuit pattern was grounded, and a voltage (20 ° C., 3 kV) was applied from the upper surface of this circuit pattern to determine the presence or absence of abnormality.

【００３１】上記屈曲特性は、つぎのようにして測定し
た。すなわち、可撓部に対しＩＰＣ−ＦＣ−２４０Ｃの
測定に準じて、直径１０ｍｍ，ストローク２４．５ｍｍ
で行った。The bending characteristics were measured as follows. That is, according to the measurement of IPC-FC-240C for the flexible portion, the diameter is 10 mm and the stroke is 24.5 mm.
I went there.

【００３２】上記ハンドリング特性は、つぎのようにし
て判定した。すなわち、基板の装着に要する時間を参考
にし、判定した。The above handling characteristics were determined as follows. That is, the determination was made with reference to the time required for mounting the substrate.

【００３３】上記引き裂き強度は、つぎのようにして測
定した。すなわち、ＡＳＴＭ Ｄ１００４の引裂抵抗測
定に準じて、測定した。The above tear strength was measured as follows. That is, it was measured according to the tear resistance measurement of ASTM D1004.

【００３４】また、上記耐半田特性は、つぎのようにし
て測定した。すなわち、２６０℃の半田浴に２０秒間浸
漬した後、パターン開口部における銅箔上への半田もぐ
り込み量を顕微鏡で測定した。The solder resistance was measured as follows. That is, after being immersed in a solder bath at 260 ° C. for 20 seconds, the amount of the solder penetrating onto the copper foil at the pattern opening was measured with a microscope.

【００３５】そして、上記各測定結果を総合的に判断し
て、総評価をした。なお、上記表２において、◎は非常
に優れていることを、○は優れていることを、△は劣っ
ていることを、×は非常に劣っていることを、それぞれ
示している。Then, the above-mentioned respective measurement results were comprehensively judged and a total evaluation was carried out. In Table 2, ⊚ indicates that it is very excellent, ∘ indicates that it is excellent, Δ indicates that it is inferior, and x indicates that it is extremely inferior.

【００３６】[0036]

【表１】 [Table 1]

【００３７】[0037]

【表２】 [Table 2]

【００３８】上記表１および表２から明らかなように、
比較例１品ではハンドリング特性が劣り、比較例２，３
品では屈曲特性に劣っている。また、比較例４品では、
絶縁破壊特性および屈曲特性以外の全ての点で劣り、比
較例５品では、絶縁破壊特性，ハンドリング特性および
引き裂き強度の点で劣っている。これに対し、実施例１
および２品は、すべての点で優れている。As is clear from Tables 1 and 2 above,
The product of Comparative Example 1 was inferior in handling characteristics, and Comparative Examples 2 and 3
The product is inferior in bending property. Further, in the product of Comparative Example 4,
Inferior in all respects other than the dielectric breakdown property and bending property, and in Comparative Example 5 product, inferior in dielectric breakdown property, handling property and tear strength. On the other hand, Example 1
And the two products are excellent in all respects.

【００３９】[0039]

【発明の効果】以上のように、この発明のフレキシブル
基板によれば、従来の２層基板と比べ、厚みが厚くなる
とともに、機械的強度が向上するため、２層基板が有す
る優れた耐熱性および耐マイグレーション性を維持しな
がらも、ハンドリング性に優れ、かつ、引き裂き強度が
向上して連続化が実現しやすくなる。しかも、ポリイミ
ドフィルムの初期引っ張り弾性率が上記基材の初期引っ
張り弾性率より小さく設定され、かつ、ポリイミドフィ
ルム自体の初期引っ張り弾性率が２００〜４００ｋｇ／
ｍｍ2 の範囲内に設定されているため、さらにハンドリ
ング性に優れるうえ、屈曲性に優れたものになる。これ
により、高温高湿で振動等苛酷な条件とされる自動車用
途等高い信頼性を必要とする回路基板として使用するこ
とができる。As described above, according to the flexible substrate of the present invention, the thickness becomes thicker and the mechanical strength is improved as compared with the conventional two-layer substrate, so that the two-layer substrate has excellent heat resistance. Also, while maintaining the migration resistance, the handling property is excellent, the tear strength is improved, and continuity is easily realized. Moreover, the initial tensile elastic modulus of the polyimide film is set to be smaller than the initial tensile elastic modulus of the substrate, and the initial tensile elastic modulus of the polyimide film itself is 200 to 400 kg /
Since it is set within the range of mm 2, the handling property is further excellent, and the bending property is also excellent. As a result, it can be used as a circuit board requiring high reliability such as an automobile application which is subjected to severe conditions such as high temperature and high humidity and vibration.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明のフレキシブル基板の一実施例を示す
斜視図である。FIG. 1 is a perspective view showing an embodiment of a flexible substrate of the present invention.

【図２】上記フレキシブル基板を示す断面図である。FIG. 2 is a cross-sectional view showing the flexible substrate.

【図３】従来の２層ＦＰＣを示す断面図である。FIG. 3 is a cross-sectional view showing a conventional two-layer FPC.

【図４】従来の３層ＦＰＣを示す断面図である。FIG. 4 is a cross-sectional view showing a conventional three-layer FPC.

【符号の説明】[Explanation of symbols]

１ ２層ＦＰＣ ２ 基材 ３ カバーレイ ４ 導体回路パターン ５ 開口部 ６ ポリイミドフィルム ７ 接着剤層 1 2 Layer FPC 2 Base Material 3 Coverlay 4 Conductor Circuit Pattern 5 Opening 6 Polyimide Film 7 Adhesive Layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ポリイミド系樹脂からなる基材の基材面
に導体パターンが一体形成され、上記導体パターンを被
覆した状態でカバーレイが設けられ、上記カバーレイお
よび上記基材面の少なくとも一方にポリイミドフィルム
が貼着され、上記ポリイミドフィルムの初期引っ張り弾
性率が上記基材の初期引っ張り弾性率より小さく設定さ
れ、かつポリイミドフィルム自体の初期引っ張り弾性率
が２００〜４００ｋｇ／ｍｍ2 の範囲内に設定されてい
ることを特徴とする複合フレキシブル基板。1. A conductor pattern is integrally formed on a base material surface of a base material made of a polyimide resin, and a cover lay is provided in a state of covering the conductor pattern, and at least one of the cover lay and the base material surface. A polyimide film is attached, the initial tensile elastic modulus of the polyimide film is set smaller than the initial tensile elastic modulus of the base material, and the initial tensile elastic modulus of the polyimide film itself is set within the range of 200 to 400 kg / mm 2. Composite flexible substrate characterized by being characterized.
JP31880592A 1992-11-27 1992-11-27 Composite flexible board Pending JPH06164085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31880592A JPH06164085A (en) 1992-11-27 1992-11-27 Composite flexible board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31880592A JPH06164085A (en) 1992-11-27 1992-11-27 Composite flexible board

Publications (1)

Publication Number Publication Date
JPH06164085A true JPH06164085A (en) 1994-06-10

Family

ID=18103141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31880592A Pending JPH06164085A (en) 1992-11-27 1992-11-27 Composite flexible board

Country Status (1)

Country Link
JP (1) JPH06164085A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140906A (en) * 1997-07-23 1999-02-12 Olympus Optical Co Ltd Electric circuit board
US6333466B1 (en) 1998-11-18 2001-12-25 Nitto Denko Corporation Flexible wiring board
JP2002344122A (en) * 2001-05-17 2002-11-29 Denso Corp Printed circuit board and manufacturing method
JP2006269949A (en) * 2005-03-25 2006-10-05 Teikoku Tsushin Kogyo Co Ltd Method of manufacturing flexible circuit board with insulating plate
US7166869B2 (en) 1995-11-06 2007-01-23 Nichia Corporation Nitride semiconductor with active layer of quantum well structure with indium-containing nitride semiconductor
JP2007208087A (en) * 2006-02-03 2007-08-16 Kaneka Corp High turnable flexible printed wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166869B2 (en) 1995-11-06 2007-01-23 Nichia Corporation Nitride semiconductor with active layer of quantum well structure with indium-containing nitride semiconductor
US7166874B2 (en) 1995-11-06 2007-01-23 Nichia Corporation Nitride semiconductor with active layer of quantum well structure with indium-containing nitride semiconductor
US8304790B2 (en) 1995-11-06 2012-11-06 Nichia Corporation Nitride semiconductor with active layer of quantum well structure with indium-containing nitride semiconductor
JPH1140906A (en) * 1997-07-23 1999-02-12 Olympus Optical Co Ltd Electric circuit board
US6333466B1 (en) 1998-11-18 2001-12-25 Nitto Denko Corporation Flexible wiring board
JP2002344122A (en) * 2001-05-17 2002-11-29 Denso Corp Printed circuit board and manufacturing method
JP2006269949A (en) * 2005-03-25 2006-10-05 Teikoku Tsushin Kogyo Co Ltd Method of manufacturing flexible circuit board with insulating plate
JP2007208087A (en) * 2006-02-03 2007-08-16 Kaneka Corp High turnable flexible printed wiring board

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