JPH06158381A - Precision electroformed mold - Google Patents
Precision electroformed moldInfo
- Publication number
- JPH06158381A JPH06158381A JP33553992A JP33553992A JPH06158381A JP H06158381 A JPH06158381 A JP H06158381A JP 33553992 A JP33553992 A JP 33553992A JP 33553992 A JP33553992 A JP 33553992A JP H06158381 A JPH06158381 A JP H06158381A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mold
- alloy
- electroformed
- precision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プラスチック成形・ガ
ラス成形等の成形を行うための転写精度の高い精密電鋳
金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a precision electroforming mold having a high transfer accuracy for performing molding such as plastic molding and glass molding.
【０００２】[0002]
【従来の技術】従来、この種の精密転写金型としては、
Ｎｉ電鋳層を母型表面に直接施して裏打部材を取付けて
脱型した表面がＮｉ電鋳層の金型が知られている。又、
Ｎｉ電鋳層に代えてＮｉ合金電鋳層を母型表面に直接施
して裏打ちした金型も知られている。2. Description of the Related Art Conventionally, as this type of precision transfer mold,
There is known a mold in which a Ni electroformed layer is directly applied to the surface of a mother die, a backing member is attached to the die, and the surface is demolded. or,
There is also known a die in which a Ni alloy electroformed layer is directly applied to the surface of the mother die in place of the Ni electroformed layer and backed.
【０００３】[0003]
【発明が解決しようとする課題】従来のＮｉ電鋳層の金
型では、硬さが室温においてＨＶ＝２００程で軟らかく
２００〜６００℃のプラスチック成形・ガラス成形を圧
入すればＮｉ電鋳層が変形したり摩耗が進行してミクロ
ンの単位の精度が確保できなかった。又、Ｎｉ合金電鋳
層の金型では、硬さが室温においてＨＶ＝４００〜５０
０で高温硬度も大で摩耗と変形は少ないが電着応力が大
であるため、電着中に０．１〜０．２ｍｍで母型表面か
ら剥離することが多くなり、不良品として使用出来ない
という問題点がある。In the conventional mold of Ni electroformed layer, the hardness is soft at room temperature at HV = 200 and the Ni electroformed layer is softened by press-fitting plastic molding / glass molding at 200 to 600 ° C. Deformation and wear progressed, and accuracy in the unit of micron could not be secured. Further, in the mold of the Ni alloy electroformed layer, the hardness is HV = 400 to 50 at room temperature.
At 0, high temperature hardness is high, wear and deformation are small, but electrodeposition stress is large, so it often peels off from the surface of the master mold within 0.1 to 0.2 mm during electrodeposition, and can be used as a defective product There is a problem that it does not exist.
【０００４】更に、Ｎｉ合金無電解メッキ層のみでは、
ＨＶ＝４００〜６００で室温や高温硬度に優れている
が、数１０μｍの厚みしか形成できず、且つ電着応力が
大きく剥離も大きいという問題点があるため型の形成が
できなかった。Further, with only the Ni alloy electroless plating layer,
Although HV = 400 to 600 and excellent in room temperature and high temperature hardness, a mold could not be formed due to the problems that only a thickness of several tens of μm can be formed, and the electrodeposition stress is large and peeling is large.
【０００５】本発明が解決しようとする課題は、従来の
これらの金型の問題点を解消し、転写精度が高いととも
に高温硬度が高く、耐熱性・耐摩耗性と保形性に優れた
精密電鋳金型を提供することにある。The problem to be solved by the present invention is to eliminate the problems of these conventional molds, and to obtain a high precision with high transfer accuracy, high temperature hardness, and excellent heat resistance, wear resistance and shape retention. It is to provide an electroformed mold.
【０００６】[0006]
【課題を解決するための手段】かかる課題を解決した本
発明の要旨は、 １） 母型表面にＮｉ又はＣｏの電気メッキを施し、そ
の上にＮｉ合金電鋳層を厚く形成させた後、母型を脱型
させ、その後表面のＮｉ又はＣｏの電気メッキ層を除去
して製造したことを特徴とする精密電鋳金型 ２） 母型表面にＮｉ又はＣｏの電気メッキを施し、そ
の上にＮｉ合金系無電解メッキ層を形成し、更にその表
面にＮｉ合金電鋳層を厚く形成させた後、母型を脱型さ
せ、その後表面のＮｉ又はＣｏの電気メッキ層を除去し
て製造したことを特徴とする精密電鋳金型 ３） Ｎｉ合金電鋳層の表面に裏打部材を取付けた１又
は２記載の精密電鋳金型 にある。Means for Solving the Problems The gist of the present invention which has solved the above problems is as follows: 1) After electroplating Ni or Co on the surface of a mother die and forming a thick Ni alloy electroformed layer thereon, Precision electroforming mold characterized by being manufactured by removing the master mold and then removing the Ni or Co electroplating layer on the surface. 2) Ni or Co electroplating on the master mold surface, and then A Ni alloy-based electroless plating layer was formed, a Ni alloy electroformed layer was thickly formed on the surface of the Ni alloy-based electroless plating layer, the master mold was released from the mold, and then the Ni or Co electroplating layer on the surface was removed. 3) The precision electroformed mold according to 1 or 2, wherein a backing member is attached to the surface of the Ni alloy electroformed layer.
【０００７】以下、本発明について更に説明する。本発
明の精密電鋳金型を製造するに際しては、先ず母型表面
に密着性が優れたＮｉ又はＣｏの電気メッキを施す。次
に、このＮｉ，Ｃｏの電気メッキ層の上に耐熱性があっ
て硬度に優れたＮｉ合金電鋳層を形成する。この時、Ｎ
ｉ又はＣｏの電気メッキ層とＮｉ合金電鋳層との接合力
は強いのでＮｉ合金電鋳層は厚く形成できる。しかも、
Ｎｉ合金電鋳層は硬度・強度があり保形性があってプラ
スチック注入圧・ガラス注入圧に対して変形しないよう
にしている。このように、Ｎｉ合金電鋳層を所定厚みに
形成した後で、表面のＮｉ又はＣｏの電気メッキ層を除
去し、硬度と強度があり耐摩耗性のあるＮｉ合金電鋳層
のみとする。The present invention will be further described below. When manufacturing the precision electroforming mold of the present invention, first, Ni or Co having excellent adhesion is electroplated on the surface of the master mold. Next, a Ni alloy electroformed layer having heat resistance and excellent hardness is formed on the Ni and Co electroplated layers. At this time, N
Since the bonding force between the i or Co electroplated layer and the Ni alloy electroformed layer is strong, the Ni alloy electroformed layer can be formed thick. Moreover,
The Ni alloy electroformed layer has hardness and strength and has shape retention so that it is not deformed by plastic injection pressure or glass injection pressure. In this way, after the Ni alloy electroformed layer is formed to a predetermined thickness, the Ni or Co electroplated layer on the surface is removed to leave only the Ni alloy electroformed layer having hardness and strength and abrasion resistance.
【０００８】又、Ｎｉ又はＣｏの電気メッキ層の上にＮ
ｉ合金無電解メッキを施し、更にＮｉ合金電鋳層を形成
させた後にＮｉ又はＣｏの電気メッキ層を除去するもの
もＮｉ合金無電解メッキ層が高温硬度に優れて、より強
度が高く耐圧・耐熱性に優れた金型となる。In addition, N is formed on the Ni or Co electroplating layer.
In the case where the i alloy electroless plating is performed, and then the Ni alloy electroformed layer is formed and then the Ni or Co electroplated layer is removed, the Ni alloy electroless plated layer has excellent high temperature hardness, higher strength and pressure resistance. A mold with excellent heat resistance.
【０００９】本発明において、前記の様に最終段階で最
表面のＮｉ又はＣｏの電気メッキ層を除去する方法とし
ては、酸液で化学的に除去するのが望ましく、最も望ま
しくは２０％（重量）以上の硝酸水溶液に型全体を浸漬
するか、あるいは除去対象のメッキ層部分だけを浸漬
し、均一な溶解除去ができる様に溶液の攪拌を十分に行
う。又、浸漬時間はＮｉ又はＣｏの電気メッキ層の厚み
によって調整するが、一般的には６０分以内が好まし
く、溶液から引き出した後にすばやく湯洗や水洗を行
い、直ちに表面を乾燥させる。In the present invention, as a method for removing the Ni or Co electroplating layer on the outermost surface in the final stage as described above, it is desirable to chemically remove with an acid solution, and most desirably 20% (weight). ) The whole mold is dipped in the above nitric acid aqueous solution, or only the plating layer portion to be removed is dipped, and the solution is sufficiently stirred so that it can be uniformly dissolved and removed. The dipping time is adjusted depending on the thickness of the Ni or Co electroplating layer, but it is generally preferably within 60 minutes, and after the solution is taken out of the solution, it is quickly washed with hot water or water and the surface is immediately dried.
【００１０】尚、本発明の精密金型は必要によっては裏
打部材を取付けて補強する。The precision mold of the present invention may have a backing member attached to reinforce it if necessary.
【００１１】[0011]
【作用】本発明では、製造段階において、最初に母型表
面にＮｉ又はＣｏの電気メッキ層を施すので、母型との
付着性・密着性に優れており、電着中にメッキ層の剥離
が無いので高い転写精度を確保できる。一方、Ｎｉ又は
Ｃｏの電気メッキ層は、耐摩耗性の点でやや劣るため成
形時に部分的な摩耗が進行すると成形品の品質に悪影響
を及ぼすので、最終段階で予め除去することにより成形
時の前記の問題点は解決できる。In the present invention, the Ni or Co electroplating layer is first applied to the surface of the die in the manufacturing stage, so that the adhesion and adhesion to the die are excellent, and the plating layer peels during electrodeposition. High transfer accuracy can be secured because there is no gap. On the other hand, the electroplating layer of Ni or Co is slightly inferior in terms of wear resistance, and if partial abrasion progresses during molding, it adversely affects the quality of the molded product. The above problems can be solved.
【００１２】[0012]
【実施例】以下、実施例を図面に基いて説明する。図１
は請求項１記載の精密電鋳金型の実施例の説明図であ
り、図２は請求項２記載の精密電鋳金型の実施例の説明
図である。Embodiments will be described below with reference to the drawings. Figure 1
Is an explanatory view of an embodiment of the precision electroformed mold according to claim 1, and FIG. 2 is an explanatory view of an embodiment of the precision electroformed mold according to claim 2.
【００１３】図１に示す実施例は、前処理された木製の
母型１の表面にＮｉ電気メッキ層２を２μｍ施し、この
上にＦｅを８〜１０％含有するＮｉ合金の電鋳を行い、
３ｍｍのＮｉ合金電鋳層３を形成し、その上にエポキシ
系樹脂の裏打部材５を取付ける。その後、母型１を脱型
させて中間精密電鋳金型を製造する。この中間精密電鋳
金型６は、Ｎｉ電気メッキ層２が母型１に正確に密着し
てサブミクロン単位の精密の転写表面をもち、しかも電
気メッキ層２がＮｉ合金電鋳層３と結合してＮｉ合金電
鋳層３を厚く形成できる。その後、Ｎｉ電気メッキ層除
去処理７によりＮｉ電気メッキ層２を除去した。この場
合の電気メッキ層の除去方法としては、中間精密金型６
の全体を３０重量％の硝酸水溶液（２５℃）中に１０分
間浸漬して最表面のＮｉ電気メッキ層を溶解除去し、液
中から引上げて８０℃の温水で水洗後熱風中で乾燥し
た。このように製造された精密電鋳金型８は、Ｎｉ合金
電鋳層３が厚く形成され、充分な硬度と強度を有し、精
密な形状転写を得るとともに耐熱性・耐久性・耐摩耗性
に富んだものにできた。In the embodiment shown in FIG. 1, a Ni electroplating layer 2 having a thickness of 2 μm is formed on the surface of a pretreated wooden mother die 1, and a Ni alloy containing 8 to 10% Fe is electroformed on the Ni electroplating layer 2. ,
A Ni alloy electroformed layer 3 of 3 mm is formed, and an epoxy resin backing member 5 is attached thereon. Then, the mother die 1 is released from the mold to manufacture an intermediate precision electroforming mold. In this intermediate precision electroforming mold 6, the Ni electroplating layer 2 has a precise transfer surface of a submicron level by precisely adhering to the mother die 1, and the electroplating layer 2 is bonded to the Ni alloy electroforming layer 3. As a result, the Ni alloy electroformed layer 3 can be formed thick. Then, the Ni electroplated layer 2 was removed by the Ni electroplated layer removal treatment 7. In this case, the method of removing the electroplating layer is as follows:
The whole was immersed in a 30 wt% nitric acid aqueous solution (25 ° C.) for 10 minutes to dissolve and remove the Ni electroplating layer on the outermost surface, pulled out of the solution, washed with warm water at 80 ° C., and dried in hot air. The precision electroformed mold 8 thus manufactured has a thick Ni alloy electroformed layer 3 and has sufficient hardness and strength to obtain precise shape transfer as well as heat resistance, durability and wear resistance. It was made rich.
【００１４】図２に示す実施例の精密電鋳金型の製造法
は、Ｎｉ電気メッキ層２とＮｉ合金電鋳層３との間にＢ
を０．５〜１．０％含有するＮｉ合金無電解メッキ層４
を０．０３ｍｍの厚み形成させ、裏打部材５を取付けた
中間精密電鋳金型９を中間的に製造し、その後前記実施
例と同一のＮｉ電気メッキ層除去処理７によってＮｉ電
気メッキ層２を除去して精密電鋳金型１０を得る。これ
も図１同様に高い耐熱性・耐摩耗性を有している。In the method for manufacturing the precision electroformed mold of the embodiment shown in FIG. 2, B is provided between the Ni electroplated layer 2 and the Ni alloy electroformed layer 3.
Alloy electroless plating layer 4 containing 0.5 to 1.0% of
Was formed to a thickness of 0.03 mm, and an intermediate precision electroforming mold 9 having the backing member 5 attached was intermediately manufactured, and then the Ni electroplating layer 2 was removed by the same Ni electroplating layer removing process 7 as in the above-mentioned embodiment. Then, the precision electroforming mold 10 is obtained. This also has high heat resistance and wear resistance as in FIG.
【００１５】[0015]
【発明の効果】以上の様に、本発明によれば、母型との
密着性が良好で０．１〜０．２μｍ単位の高精度の転写
が得ることができ、しかも高温硬度・強度が得られて耐
摩耗性が優れて且つ高温における変形が少なく耐久性の
ある精密金型にできた。As described above, according to the present invention, the adhesiveness to the mother die is good, and the highly accurate transfer of 0.1 to 0.2 μm unit can be obtained, and the high temperature hardness and strength are high. As a result, a precision mold having excellent wear resistance, little deformation at high temperatures, and durability was obtained.
【図１】本発明の実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の他の実施例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the present invention.
１ 母型 ２ Ｎｉ電気メッキ層 ３ Ｎｉ合金電鋳層 ４ Ｎｉ合金無電解メッキ層 ５ 裏打部材 ６ 中間精密電鋳金型 ７ Ｎｉ電気メッキ層除去処理 ８ 精密電鋳金型 ９ 中間精密電鋳金型 １０ 精密電鋳金型 1 Mother Mold 2 Ni Electroplating Layer 3 Ni Alloy Electroforming Layer 4 Ni Alloy Electroless Plating Layer 5 Backing Member 6 Intermediate Precision Electroforming Mold 7 Ni Electroplating Layer Removal Treatment 8 Precision Electroforming Die 9 Intermediate Precision Electroforming Die 10 Precision Electroformed mold
Claims (3)
施し、その上にＮｉ合金電鋳層を厚く形成させた後、母
型を脱型させ、その後表面のＮｉ又はＣｏの電気メッキ
層を除去して製造したことを特徴とする精密電鋳金型。1. A surface of a mother die is electroplated with Ni or Co, a Ni alloy electroformed layer is formed thickly thereon, and then the mother die is demolded, and then a Ni or Co electroplated layer on the surface is formed. A precision electroformed mold characterized by being manufactured by removing.
施し、その上にＮｉ合金系無電解メッキ層を形成し、更
にその表面にＮｉ合金電鋳層を厚く形成させた後、母型
を脱型させ、その後表面のＮｉ又はＣｏの電気メッキ層
を除去して製造したことを特徴とする精密電鋳金型。2. The surface of the master mold is electroplated with Ni or Co, a Ni alloy-based electroless plating layer is formed thereon, and a Ni alloy electroformed layer is thickly formed on the surface of the master mold. A precision electroformed mold produced by demolding, and then removing the electroplating layer of Ni or Co on the surface.
けた請求項１又は２記載の精密電鋳金型。3. The precision electroformed mold according to claim 1, wherein a backing member is attached to the surface of the Ni alloy electroformed layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33553992A JPH06158381A (en) | 1992-11-21 | 1992-11-21 | Precision electroformed mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33553992A JPH06158381A (en) | 1992-11-21 | 1992-11-21 | Precision electroformed mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06158381A true JPH06158381A (en) | 1994-06-07 |
Family
ID=18289710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33553992A Pending JPH06158381A (en) | 1992-11-21 | 1992-11-21 | Precision electroformed mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06158381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124449A1 (en) * | 2011-03-17 | 2012-09-20 | コニカミノルタアドバンストレイヤー株式会社 | Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die |
-
1992
- 1992-11-21 JP JP33553992A patent/JPH06158381A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124449A1 (en) * | 2011-03-17 | 2012-09-20 | コニカミノルタアドバンストレイヤー株式会社 | Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die |
| US9023269B2 (en) | 2011-03-17 | 2015-05-05 | Konica Minolta, Inc. | Manufacturing method of resin molding mold, resin molding mold, resin molding mold set, manufacturing method of microchip substrate, and manufacturing method of microchip using said mold |
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