JPH0614422Y2 - Composite parts - Google Patents
Composite partsInfo
- Publication number
- JPH0614422Y2 JPH0614422Y2 JP1990008487U JP848790U JPH0614422Y2 JP H0614422 Y2 JPH0614422 Y2 JP H0614422Y2 JP 1990008487 U JP1990008487 U JP 1990008487U JP 848790 U JP848790 U JP 848790U JP H0614422 Y2 JPH0614422 Y2 JP H0614422Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead member
- lead
- circuit
- electrodes
- circuit elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は回路基板に面接続されるＬＣフィルタや遅延線
のような複合部品の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a structure of a composite component such as an LC filter or a delay line which is surface-connected to a circuit board.
従来のこの種の複合部品は、合成樹脂やセラミックから
なる基板の導体パターンに回路素子を取りつけ、その回
路素子間を導体パターンにより接続して回路を構成し、
外部端子を基板の側辺の導体パターンに接続する。そし
て外部端子を露呈させた状態で全体を樹脂封止してあ
る。In the conventional composite component of this type, a circuit element is attached to a conductor pattern of a substrate made of synthetic resin or ceramic, and the circuit is formed by connecting the circuit elements with a conductor pattern.
The external terminal is connected to the conductor pattern on the side of the board. The whole is resin-sealed with the external terminals exposed.
このような構造は基板の側辺に外部端子の取りつけ部分
を設ける必要があるので、基板面に沿った平面的な広が
りが大きくなる。In such a structure, it is necessary to provide a mounting portion for the external terminal on the side of the substrate, so that the planar spread along the substrate surface becomes large.
また基板を用いることにより、その基板分だけ厚みが増
加する。Further, by using the substrate, the thickness increases by the amount of the substrate.
本考案の課題は、リード部材に直接回路素子を接続する
ことにより、基板と外部端子を不要にして、薄形で平面
的な広がりを小さくした複合部品を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a thin composite component having a small planar spread by directly connecting a circuit element to a lead member, eliminating the need for a substrate and external terminals.
本考案の複合部品は、板状金属からなる複数のリード部
材の面上に面接続用電極を有する回路素子を配置して所
望の電極を直接リード部材に接続し、しかもリード部材
には回路素子の高さの異なる配置位置を設け、高さを異
ならせてリード部材の面上に配置された回路素子間をリ
ード部材を用いて接続した回路を、リード部材の外部端
子となる部分を露呈させた状態で樹脂封止してあること
を特徴とする。In the composite component of the present invention, a circuit element having surface-connecting electrodes is arranged on the surfaces of a plurality of lead members made of a plate-like metal to directly connect a desired electrode to the lead member, and the lead member has a circuit element. The positions where the lead members are different in height are provided, and the circuit elements arranged on the surface of the lead member with different heights are connected by using the lead member, exposing the portions that will be the external terminals of the lead member. It is characterized in that it is resin-sealed in a closed state.
以下、本考案の複合部品の実施例を示す第１図から第６
図までを参照しながら説明する。第１図は樹脂封止を除
いた場合の平面図、第２図は第１図の正面図、第３図は
第１図の右側面図、第４図は結線図、第５図は回路図、
第６図は複合部品の右側面図である。An embodiment of the composite part of the present invention will be described below with reference to FIGS.
Description will be made with reference to the drawings. 1 is a plan view without resin sealing, FIG. 2 is a front view of FIG. 1, FIG. 3 is a right side view of FIG. 1, FIG. 4 is a connection diagram, and FIG. 5 is a circuit. Figure,
FIG. 6 is a right side view of the composite component.
第１図は第５図の回路図に示すローパスフィルタの構成
を示してあり、インダクタンス素子である高周波コイル
Ｌ1、Ｌ2が直列接続し、容量素子であるコンデンサＣ1
がその接続点に並列接続している。FIG. 1 shows the configuration of the low-pass filter shown in the circuit diagram of FIG. 5, in which high-frequency coils L 1 and L 2 which are inductance elements are connected in series, and a capacitor C 1 which is a capacitance element.
Is connected in parallel to the connection point.
コイルＬ1、Ｌ2はＨ形のセラミックからなるベース１の
上に固着したコア２に線材を巻装してある。ベースの四
隅には夫々面接続用の電極を印刷焼付等の公知の技術を
用いて形成してあり、コイルのリード３が接続する。チ
ップ形のコンデンサＣ1の両端にも面接続用の電極が形
成してある。The coils L 1 and L 2 are formed by winding a wire around a core 2 fixed on a base 1 made of H-shaped ceramic. Electrodes for surface connection are formed on the four corners of the base by a known technique such as printing and printing, and the leads 3 of the coil are connected to the electrodes. Electrodes for surface connection are also formed on both ends of the chip-type capacitor C 1 .
回路素子は板状金属からなる６つのリード部材の面上に
配置してあり、コンデンサＣ1の両端の電極は夫々平坦
なリード部材５とリード部材８に直接面接続されてい
る。The circuit elements are arranged on the surfaces of six lead members made of a plate-shaped metal, and the electrodes on both ends of the capacitor C 1 are directly surface-connected to the flat lead members 5 and 8, respectively.
リード部材４、６、７、９は対向する側の先端を屈曲さ
せてリード部材５、８の水平位置よりも高くしてあり、
その高い位置に回路素子が配置される。コイルＬ1はコ
ンデンサＣ1上に重ねて配置し、リード３の接続する片
側の電極がリード部材８上のコンデンサＣ1の電極、他
のリード３の接続する電極がリード部材４の高くなって
いる回路素子の配置位置１０でリード部材４に夫々接続
される。The lead members 4, 6, 7, 9 are bent at their tips on the opposite side to be higher than the horizontal positions of the lead members 5, 8.
The circuit element is arranged at the high position. The coil L 1 is placed on the capacitor C 1 so that the lead 3 is connected to one side of the capacitor C 1 on the lead member 8 and the other lead 3 is connected to the electrode of the lead member 4. Each of the circuit elements is connected to the lead member 4 at the arrangement position 10 of the circuit element.
また、コイルＬ2もコンデンサＣ1に重ねて配置してあ
り、リード３の接続する片側の電極をリード部材８上の
コンデンサＣ1の電極、他のリード３の接続する電極を
高くなっている配置位置１０でリード部材６に接続して
ある。コンデンサの電極とリード部材、さらにコンデン
サの電極とコイルの電極の接続は、半田や溶接により行
われる。配置位置１０の高さはリード部材５とリード部
材８の面上のコンデンサＣ1の上側の面とほぼ同じ水平
位置にある。Further, the coil L 2 is also arranged so as to overlap the capacitor C 1 , and the electrode on one side to which the lead 3 is connected is made higher than the electrode of the capacitor C 1 on the lead member 8 and the electrode to which the other lead 3 is connected. It is connected to the lead member 6 at the arrangement position 10. The electrodes of the capacitor and the lead members, and the electrodes of the capacitor and the electrodes of the coil are connected by soldering or welding. The height of the arrangement position 10 is substantially the same horizontal position as the upper surface of the capacitor C 1 on the surfaces of the lead member 5 and the lead member 8.
なおコイルＬ1のリード３の接続していない２つの電極
はリード部材５に接続するコンデンサＣ1の電極とリー
ド部材７の回路素子の配置位置１０に接触しているが、
コイルＬ1の取りつけ状態を安定にするために夫々接続
する。コイルＬ2のリード３の接続していない電極もリ
ード部材８に接続するコンデンサＣ1の電極とリード部
材９の配置位置１０に夫々接続される。そして、４つの
電極を固定されたコイルＬ1とコイルＬ2はリード部材の
面上で水平に支持される。The two electrodes of the coil L 1 which are not connected to the lead 3 are in contact with the electrode 10 of the capacitor C 1 connected to the lead member 5 and the arrangement position 10 of the circuit element of the lead member 7,
The coils L 1 are connected in order to stabilize the mounting state. The electrodes of the coil L 2 to which the leads 3 are not connected are also connected to the electrode 10 of the capacitor C 1 connected to the lead member 8 and the arrangement position 10 of the lead member 9, respectively. The coil L 1 and the coil L 2 to which the four electrodes are fixed are supported horizontally on the surface of the lead member.
６つのリード部材の面上に配置されるコンデンサＣ1と
コイルＬ1、コイルＬ2は部分的に重ねて配置されると共
に高さの異なる水平位置でリード部材に接続する。The capacitor C 1 and the coil L 1 and the coil L 2 arranged on the surfaces of the six lead members are partially overlapped with each other and are connected to the lead member at different horizontal positions.
第１図において、コイルＬ1、Ｌ2とコンデンサＣ1の電
極が重なって接続される部分は点々を付してある。In FIG. 1 , the parts where the coils L 1 and L 2 and the electrodes of the capacitor C 1 overlap and are connected are dotted.
第４図はこのようにして配置し、接続された回路素子と
リード部材間の接続を示す結線図であり、リード部材は
回路素子を固定したり相互に接続する役割を有する。FIG. 4 is a connection diagram showing the connection between the circuit element and the lead member which are arranged and connected in this manner, and the lead member has a role of fixing the circuit elements and connecting them to each other.
また、リード部材４は第５図における入力端子１１、リ
ード部材８は中継端子１２、リード部材６は出力端子１
３、リード部材５はアース端子１４の役割を兼ねてい
る。リード部材７、リード部材９は単に回路素子を支持
する役割を有する。The lead member 4 is the input terminal 11 in FIG. 5, the lead member 8 is the relay terminal 12, and the lead member 6 is the output terminal 1.
3. The lead member 5 also serves as the ground terminal 14. The lead members 7 and 9 have a role of simply supporting the circuit element.
なおリード部材については、複合部品の組み立て時にリ
ードフレームの状態にしておき、回路素子を接続し、リ
ード部材の外部端子となる部分を除いて全体を樹脂封止
した後にリード部材として切断、分離すればよい。Regarding the lead member, leave it in the lead frame state during assembly of the composite component, connect the circuit elements, and resin-seal the entire lead member except for the external terminals, and then cut and separate the lead member. Good.
第６図ではリード部材６からなる外部端子２１とリード
部材９からなる外部端子２２が外装樹脂１５の面に沿っ
て側面から底面まで延在している様子を示してあるが、
面接続用端子を形成してあればよく、側面から階段状に
外方に突出していてもよい。また、外部端子としては出
力端子１３の役割をするリード部材６の外部端子２１、
入力端子１１の役割をするリード部材４の外部端子、ア
ース端子１４の役割をするリード部材５の外部端子が外
装樹脂１５の外側に露呈しておればよく、回路素子、こ
の場合コイルＬ1、コイルＬ2を支持しているにすぎない
リード部材７、リード部材９、中継端子１２の役割を有
するリード部材８は外部端子として外側に露呈していな
くてもよい。FIG. 6 shows that the external terminal 21 made of the lead member 6 and the external terminal 22 made of the lead member 9 extend from the side surface to the bottom surface along the surface of the exterior resin 15.
It suffices if the surface connection terminals are formed, and they may project outward from the side surface in a stepwise manner. Further, the external terminals 21 of the lead member 6 serving as the output terminals 13 as the external terminals,
It suffices that the external terminal of the lead member 4 that plays the role of the input terminal 11 and the external terminal of the lead member 5 that plays the role of the ground terminal 14 are exposed to the outside of the exterior resin 15, and the circuit element, in this case the coil L 1 , The lead member 7, which only supports the coil L 2 , the lead member 9, and the lead member 8 which functions as the relay terminal 12 may not be exposed to the outside as external terminals.
複合部品は実施例としてローパスフィルタを示したが、
このようなＬＣフィルタの外に遅延線や、回路素子とし
て別の種類の回路素子、例えば抵抗を用いた複合部品を
同じようにして構成できることは言うまでもない。Although the composite component has shown a low-pass filter as an example,
It goes without saying that, in addition to such an LC filter, a delay line or a circuit element of another type as a circuit element, for example, a composite component using a resistor can be similarly configured.
実施例ではリード部材の面上に回路素子の高さを異なら
せて配置し、しかも回路素子を部分的に重ねてその電極
同志を直接接続する場合を説明したが、平面的な位置が
重なるだけで電気的には直接に接続しない場合もある。
また、単に水平位置だけを異ならせてリード部材の面上
に回路素子を配置してあってもよい。さらに、回路素子
はリード部材の片面だけでなく、両面にあってもよい。In the embodiment, the case where the circuit elements are arranged on the surface of the lead member at different heights, and the circuit elements are partially overlapped to directly connect the electrodes to each other, the planar positions are overlapped. In some cases, it may not be directly electrically connected.
Further, the circuit element may be arranged on the surface of the lead member by merely changing the horizontal position. Further, the circuit element may be provided not only on one side of the lead member but also on both sides.
両面にある場合としては、実施例におけるリード部材５
とリード部材８にも他のリード部材４、６、７、８と同
じように高い配置位置１０を設け、コンデンサＣ1をリ
ード部材５とリード部材８の配置位置１０の裏側に接続
し、表側にコイルＬ1、Ｌ2を平面的な位置を実施例と同
じにして接続する場合がこれに相当する。If it is on both sides, the lead member 5 in the embodiment
The lead member 8 is also provided with a high arrangement position 10 like the other lead members 4, 6, 7 and 8, and the capacitor C 1 is connected to the back side of the arrangement position 10 of the lead member 5 and the lead member 8 and This corresponds to the case where the coils L 1 and L 2 are connected in the same plane position as in the embodiment.
コイルは面接続用の電極が形成してあればよく、特に実
施例の形状に限定する必要はない。The coil only needs to be formed with electrodes for surface connection, and is not particularly limited to the shape of the embodiment.
なお、本考案の複合部品の大きさは一例を挙げると、縦
と横が５mm、高さが3.0mm程度となった。For example, the size of the composite part of the present invention is about 5 mm in length and width and about 3.0 mm in height.
以上述べたように、本考案の複合部品は板状金属からな
る複数のリード部材の面上に面接続用電極を有する回路
素子を配置して所定の電極を直接リード部材に接続して
あるが、リード部材には高さの異なる回路素子の配置位
置を設け、高さを異ならせてリード部材の面上に配置さ
れた回路素子間をリード部材を用いて接続する回路を構
成してある。As described above, in the composite component of the present invention, a circuit element having surface-connecting electrodes is arranged on the surface of a plurality of lead members made of plate-shaped metal, and predetermined electrodes are directly connected to the lead member. The lead member is provided with the arrangement position of the circuit elements having different heights, and the circuit is configured to connect the circuit elements arranged on the surface of the lead member with different heights by using the lead member.
本考案の複合部品は、従来のように基板を用いないの
で、複合部品として基板の厚み分だけ薄くできる。Since the composite component of the present invention does not use a substrate as in the prior art, the composite component can be thinned by the thickness of the substrate.
また外部端子をリード部材とは別に必要としないし、回
路素子の立体的な配置と接続が可能であり、回路素子の
実装密度が高まるので平面的な広がりを小さくできる。In addition, external terminals are not required separately from the lead member, the circuit elements can be arranged and connected in three dimensions, and the packaging density of the circuit elements is increased, so that the planar spread can be reduced.
このようにして全体として小形の面接続用の複合部品を
安価に提供することができる。In this way, it is possible to inexpensively provide a small-sized composite component for surface connection as a whole.
第１図は本考案の複合部品の実施例を示す平面図、第２
図は第１図の正面図、第３図は第１図の右側面図、第４
図は結線図、第５図は回路図、第６図は外装樹脂で被っ
た複合部品の右側面図である。 Ｌ1、Ｌ2：高周波コイル、Ｃ1：コンデンサ、４〜９：
リード部材FIG. 1 is a plan view showing an embodiment of the composite component of the present invention, and FIG.
The drawing is a front view of FIG. 1, FIG. 3 is a right side view of FIG.
The drawing is a connection diagram, FIG. 5 is a circuit diagram, and FIG. 6 is a right side view of a composite component covered with an exterior resin. L 1, L 2: high frequency coil, C 1: capacitor, 4-9:
Lead member
Claims (1)
に面接続用電極を有する回路素子を配置して所定の電極
を直接リード部材に接続し、しかもリード部材には回路
素子の高さの異なる配置位置を設け、高さの高い位置に
配置された回路素子の面接続用電極は、少なくとも１つ
が高さの低い位置に配置された回路素子の面接続用電極
に接続してあり、回路素子間をリード部材を用いて接続
した回路を、リード部材の外部端子となる部分を露呈さ
せた状態で樹脂封止してあることを特徴とする複合部
品。1. A circuit element having a surface-connecting electrode is arranged on the surface of a plurality of lead members made of a plate-shaped metal, and a predetermined electrode is directly connected to the lead member. The surface-connecting electrodes of the circuit elements arranged at different heights are arranged at high positions, and at least one of them is connected to the surface-connecting electrodes of the circuit elements arranged at low positions. A composite component in which a circuit in which circuit elements are connected by using a lead member is resin-sealed in a state in which a portion of the lead member to be an external terminal is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990008487U JPH0614422Y2 (en) | 1990-01-31 | 1990-01-31 | Composite parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990008487U JPH0614422Y2 (en) | 1990-01-31 | 1990-01-31 | Composite parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0399407U JPH0399407U (en) | 1991-10-17 |
| JPH0614422Y2 true JPH0614422Y2 (en) | 1994-04-13 |
Family
ID=31512115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990008487U Expired - Lifetime JPH0614422Y2 (en) | 1990-01-31 | 1990-01-31 | Composite parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0614422Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59155709U (en) * | 1983-04-05 | 1984-10-19 | ティーディーケイ株式会社 | Chip composite parts |
| JPH01289307A (en) * | 1988-05-17 | 1989-11-21 | Matsushita Electric Ind Co Ltd | Chip noise filter |
-
1990
- 1990-01-31 JP JP1990008487U patent/JPH0614422Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0399407U (en) | 1991-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |