JPH0713226Y2 - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0713226Y2 JPH0713226Y2 JP1307889U JP1307889U JPH0713226Y2 JP H0713226 Y2 JPH0713226 Y2 JP H0713226Y2 JP 1307889 U JP1307889 U JP 1307889U JP 1307889 U JP1307889 U JP 1307889U JP H0713226 Y2 JPH0713226 Y2 JP H0713226Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- terminal
- electronic component
- lead
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半導体素子組立て用のリードフレームに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a lead frame for assembling semiconductor devices.
例えば、水晶発振器には、振動子、特定のコンデンサを
除く回路部分を半導体チップに形成し、リードフレーム
によって上記半導体チップの回路に上記特定の電子部品
を接続し、一体に組立てる構造を採るものがある。For example, a crystal oscillator has a structure in which a circuit portion excluding a vibrator and a specific capacitor is formed on a semiconductor chip, and the specific electronic component is connected to a circuit of the semiconductor chip by a lead frame and integrally assembled. is there.
この場合、通常のワイヤボンディング用内部リードのほ
かに、特定の電子部品の端子を例えば半田付けして接続
する内部リードを備えたリードフレームを使用する。In this case, in addition to the normal wire-bonding internal lead, a lead frame having an internal lead for connecting a terminal of a specific electronic component by, for example, soldering is used.
第２図（ａ）は従来のこの種リードフレームの一例を、
第２図（ｂ），（ｃ），（ｄ）はこのリードフレームを
使用しての組立て手順を示す。FIG. 2 (a) shows an example of a conventional lead frame of this type,
2 (b), (c) and (d) show an assembling procedure using this lead frame.
図において１はリードフレーム、11はダイアイランド、
12は内部リード、13は外部リード、２は１次モールドパ
ッケージ、３は振動子、４はコンデンサ、５は２次モー
ルドパッケージである。In the figure, 1 is a lead frame, 11 is a die island,
Reference numeral 12 is an inner lead, 13 is an outer lead, 2 is a primary mold package, 3 is a vibrator, 4 is a capacitor, and 5 is a secondary mold package.
ダイアイランド11に半導体チップをマウントし、この半
導体チップの各電極パットと対応する内部リードをボン
ディングワイヤで接続し、半導体チップ部分を一次モー
ルドした後、リードフレーム１の不用になった部分を切
断、除去する〔図（ｂ）〕。A semiconductor chip is mounted on the die island 11, each electrode pad of the semiconductor chip is connected to the corresponding internal lead with a bonding wire, the semiconductor chip portion is primarily molded, and then the unnecessary portion of the lead frame 1 is cut, Remove [Figure (b)].
次に、振動子３及びコンデンサ４をその端子を内部リー
ドに半田付けして接続し〔図（ｃ）〕、振動子３、コン
デンサ４及び１次モールドパッケージ２を一体に２次モ
ールドする〔図（ｄ）〕。Next, the vibrator 3 and the capacitor 4 are connected by soldering their terminals to the internal lead [Fig. (C)], and the vibrator 3, the capacitor 4 and the primary mold package 2 are secondarily molded integrally. (D)].
従来のこの種リードフレームは、特定の電子部品の端子
を半田付けする内部リードの表面が他の内部リードと同
様に平らであり、端子の半田付けの際端子が動いてやり
づらく、また所定の位置に半田付けすることが難しいと
いう問題があった。In this type of conventional lead frame, the surface of the internal lead for soldering the terminal of a specific electronic component is flat like other internal leads, and the terminal is difficult to move when soldering the terminal, There was a problem that it was difficult to solder to the position.
本考案は上記の問題を解消するためになされたもので、
半田付けがし易く、所定の位置に取付けることができる
ものを提供することを目的とする。The present invention has been made to solve the above problems,
It is an object of the present invention to provide a product that can be easily soldered and can be mounted at a predetermined position.
本考案のリードフレームは、内部リードの電子部品の端
子を半田付け等電気的に固着する部分に該端子が嵌まる
溝を設けたものである。The lead frame of the present invention is provided with a groove into which the terminal of the electronic component of the internal lead is fitted, such as by soldering, to which the terminal is fitted.
第１図（ａ），（ｂ）は本考案の一実施例を示す。 1 (a) and 1 (b) show an embodiment of the present invention.
図において12はリードフレームの内部リード、121は内
部リード12の設けた溝、６は電子部品、61は電子部品６
の端子である。In the figure, 12 is an internal lead of the lead frame, 121 is a groove provided with the internal lead 12, 6 is an electronic component, 61 is an electronic component 6
Is the terminal.
溝121は内部リード12の所定の位置に端子61が嵌まる構
造に設けたもので、端子61を溝121に嵌めるこんで半田
付け又は溶接等により電気的に固着すれば、端子61の動
きが少なく、固着がし易い、また、所定の位置に正確に
取付けることができる。The groove 121 is provided in a structure in which the terminal 61 is fitted in a predetermined position of the inner lead 12.If the terminal 61 is fitted in the groove 121 and is electrically fixed by soldering or welding, the movement of the terminal 61 is prevented. The number is small, sticking is easy, and it can be accurately mounted at a predetermined position.
上記には簡単な構造の例を示したが、電子部品の端子を
接続する内部リードには、複雑な形状、配列のものが多
いが、溝121の有効性が変ることがない。Although an example of a simple structure has been shown above, the internal leads connecting the terminals of the electronic component often have complicated shapes and arrangements, but the effectiveness of the groove 121 does not change.
以上説明したように、本考案によれば、半田付けする電
子部品の端子の動きが少なくなり、半田付けがし易くな
るとともに、所定の位置に正確に取付けることができ、
取付け位置のばらつきがなくなるという効果がある。As described above, according to the present invention, the movement of the terminals of the electronic component to be soldered is reduced, the soldering is facilitated, and the soldering can be accurately performed at a predetermined position.
This has the effect of eliminating variations in mounting position.
第１図（ａ），（ｂ）は本考案の一実施例を示す斜視
図、断面図、第２図（ａ）は従来のこの種リードフレー
ムの一例を示す斜視図、第２図（ｂ），（ｃ），（ｄ）
は第２図（ａ）を使用しての組立て手順を示す斜視図で
ある。 12…内部リード、121…溝、６…電子部品、61…端子 なお図中同一符号は同一または相当する部分を示す。1 (a) and 1 (b) are perspective views and sectional views showing an embodiment of the present invention, and FIG. 2 (a) is a perspective view showing an example of a conventional lead frame of this type, and FIG. 2 (b). ), (C), (d)
FIG. 4 is a perspective view showing an assembling procedure using FIG. 2 (a). 12 ... Internal lead, 121 ... Groove, 6 ... Electronic component, 61 ... Terminal In the drawings, the same reference numerals indicate the same or corresponding portions.
Claims (1)
続し一体に組立てるために該電子部品の端子を固着して
電気的に接続する内部リードを備えたリードフレームに
おいて、 上記内部リードの電子部品の端子を固着する部分に該端
子が嵌まる溝を備えたことを特徴とするリードフレー
ム。1. A lead frame provided with an internal lead for fixing and electrically connecting terminals of a specific electronic component to a circuit of a semiconductor chip so as to assemble the electronic component integrally with the circuit of the semiconductor chip. A lead frame, characterized in that a groove into which the terminal is fitted is provided in a portion to which the terminal of the component is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1307889U JPH0713226Y2 (en) | 1989-02-08 | 1989-02-08 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1307889U JPH0713226Y2 (en) | 1989-02-08 | 1989-02-08 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104645U JPH02104645U (en) | 1990-08-20 |
| JPH0713226Y2 true JPH0713226Y2 (en) | 1995-03-29 |
Family
ID=31223088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1307889U Expired - Lifetime JPH0713226Y2 (en) | 1989-02-08 | 1989-02-08 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713226Y2 (en) |
-
1989
- 1989-02-08 JP JP1307889U patent/JPH0713226Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104645U (en) | 1990-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |