JP2541884Y2 - Composite parts - Google Patents

Composite parts

Info

Publication number
JP2541884Y2
JP2541884Y2 JP1989149928U JP14992889U JP2541884Y2 JP 2541884 Y2 JP2541884 Y2 JP 2541884Y2 JP 1989149928 U JP1989149928 U JP 1989149928U JP 14992889 U JP14992889 U JP 14992889U JP 2541884 Y2 JP2541884 Y2 JP 2541884Y2
Authority
JP
Japan
Prior art keywords
lead
terminal member
lead member
elements
inductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989149928U
Other languages
Japanese (ja)
Other versions
JPH0388321U (en
Inventor
雅之 松本
浩二 伊藤
正人 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP1989149928U priority Critical patent/JP2541884Y2/en
Publication of JPH0388321U publication Critical patent/JPH0388321U/ja
Application granted granted Critical
Publication of JP2541884Y2 publication Critical patent/JP2541884Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、回路基板に面接続されるLCフィルタや遅延
線のような複合部品の構造に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a structure of a composite component such as an LC filter or a delay line which is surface-connected to a circuit board.

〔従来技術〕(Prior art)

従来のこの種の複合部品は、合成樹脂やセラミックか
らなる基板に回路素子を取り付け、その回路素子間を基
板上の導体パターンにより接続して回路を構成し、外部
端子を基板の側辺に導体パターンに接続する。そして外
部端子を露出させた状態で全体を樹脂封止してある。
In this type of conventional composite component, circuit elements are mounted on a board made of synthetic resin or ceramic, and the circuit elements are connected by a conductor pattern on the board to form a circuit. Connect to the pattern. The whole is sealed with resin in a state where the external terminals are exposed.

このような構造は基板の側辺に外部端子の取りつけ部
分を設ける必要があるので、基板面に沿った平面的な広
がりが大きくなる。
In such a structure, it is necessary to provide a portion for attaching an external terminal on a side of the substrate, so that a planar spread along the substrate surface is increased.

また基板を用いることにより、その基板分だけ厚みが
増加する。
In addition, the use of a substrate increases the thickness by the amount of the substrate.

〔課題〕〔Task〕

本考案の課題は、リード部材に直接回路素子を接続す
ることにより、基板と外部端子を用いる必要をなくし、
薄形で平面的な広がりを小さくした複合部品を提供する
ことにある。
The problem of the present invention is to connect a circuit element directly to a lead member, thereby eliminating the need to use a substrate and external terminals.
An object of the present invention is to provide a composite part which is thin and has a small planar spread.

〔課題を解決するための技術手段〕[Technical means for solving the problem]

本考案の複合部品は、板状金属からなる複合のリード
部材が入力端子部材、出力端子部材、アース端子部材と
ともに中継端子部材を具え、インダクタンス素子はリー
ド部材の片面において、リード部材の前記各部材のいず
れかに跨がる様にその表面に搭載され、容量素子はリー
ド部材の反対側の面において、リード部材の前記各部材
のいずれかに跨がる様にその表面に搭載され、前記リー
ド部材がその両側の表面上に搭載されたインダクタンス
素子と容量素子により接続され、リード部材の端部を露
出させてインダクタンス素子と容量素子とを樹脂封止し
てあることを特徴とする。
The composite component according to the present invention is characterized in that the composite lead member made of a plate-like metal includes an input terminal member, an output terminal member, and a relay terminal member together with a ground terminal member, and the inductance element is provided on one side of the lead member, and the respective members of the lead member are provided. The capacitive element is mounted on the surface so as to straddle any one of the respective members of the lead member on the surface on the opposite side of the lead member. The member is connected by an inductance element and a capacitance element mounted on the surfaces on both sides thereof, and the end element of the lead member is exposed to seal the inductance element and the capacitance element with a resin.

また、インダクタンス素子が、リード部材の片面にお
いて、入力端子部材と中継端子部材及び出力端子部材と
中継端子部材に跨がる様にその表面に搭載され、容量素
子が、リード部材の反対側の面において、入力端子部材
とアース端子部材、出力端子部材とアース端子部材及び
アース端子部材と中継端子部材とに跨がる様にその表面
に搭載され、前記リード部材がその両側の表面上に搭載
された複数のインダクタンス素子と複数の容量素子によ
り接続されるものである。
Also, an inductance element is mounted on one surface of the lead member so as to straddle the input terminal member and the relay terminal member and the output terminal member and the relay terminal member, and the capacitive element is mounted on the opposite surface of the lead member. , The input terminal member and the ground terminal member, the output terminal member and the ground terminal member, and the ground terminal member and the relay terminal member are mounted on the surface so as to straddle the lead member, and the lead member is mounted on the surface on both sides thereof. And a plurality of inductance elements and a plurality of capacitance elements.

さらに、容量素子がリード部材の反対側の面におい
て、入力端子部材、出力端子部材、中継端子部材とアー
ス端子部材の各々の素子搭載部とに跨がる様にその表面
に搭載され、前記リード部材がその両側の表面上の複数
のインダクタンス素子と複数の容量素子により接続され
るものである。
Further, the capacitive element is mounted on the surface opposite to the lead member so as to straddle the element mounting portions of the input terminal member, the output terminal member, the relay terminal member and the ground terminal member, and the lead is provided. The member is connected by a plurality of inductance elements and a plurality of capacitance elements on surfaces on both sides thereof.

〔実施例〕〔Example〕

以下、本考案の複合部品の実施例を示す第1図から第
4図までを参照しながら説明する。第1図は樹脂封止を
除いた場合の斜視図、第2図は第1図の回路素子の結線
図、第3図は回路図、第4図は複合部品の正面図であ
る。
Hereinafter, an embodiment of the composite part of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a perspective view without the resin sealing, FIG. 2 is a connection diagram of the circuit element of FIG. 1, FIG. 3 is a circuit diagram, and FIG. 4 is a front view of the composite component.

第1図は第3図の回路図に示すローパスフィルタの構
成を示しており、インダクタンス素子である高周波コイ
ルL1、L2を直列接続し、容量素子であるコンデンサC1
C2、C3をコイルL1、L2に並列接続してある。
Figure 1 shows the structure of a low-pass filter shown in the circuit diagram of Figure 3, a high-frequency coil L 1, L 2 is the inductance element connected in series, the capacitor C 1 is a capacitance element,
C 2 and C 3 are connected in parallel to coils L 1 and L 2 .

コイルL1、L2は、H形のセラミック材からなるベース
1の上に固着したコア2にコイルを巻装してある。ベー
ス1の四隅には夫々面接続用の電極を印刷焼付等の公知
の技術を用いて形成してあり、コイルのリード3が接続
する。チップ形のコンデンサC1、C2、C3の両端にも面接
続用の電極が形成してある。
The coils L 1 and L 2 are wound around a core 2 fixed on a base 1 made of an H-shaped ceramic material. At the four corners of the base 1, electrodes for surface connection are formed using a known technique such as printing and printing, and the leads 3 of the coil are connected. Electrodes for surface connection are also formed at both ends of the chip type capacitors C 1 , C 2 and C 3 .

夫々の回路素子は板状金属からなる4本のリード部材
の両面に配置してあり、コイルL1はリード部材4とリー
ド部材5間、コイルL2はリード部材5とリード部材6間
に直接面接続している。この接続は、リード3の接続す
るベース1の電極を各リード部材にその表側で接続する
ことにより行われる。なお、リード3の接続していない
電極もリード部材に接触する位置にあるが、これを半田
で接続することにより、コイルL1、L2のリード部材への
固定を強固にできる。
Each circuit element is disposed on both sides of four lead members made of sheet metal, and the coil L 1 is directly between the lead members 4 and 5, and the coil L 2 is directly between the lead members 5 and 6. Surface connection. This connection is performed by connecting the electrode of the base 1 to which the lead 3 is connected to each lead member on the front side. Although the electrode to which the lead 3 is not connected is also in a position where it comes into contact with the lead member, it is possible to firmly fix the coils L 1 and L 2 to the lead member by connecting it with solder.

コンデンサC1はリード部材4とリード部材7間、コン
デンサC2はリード部材5とリード部材7間、コンデンサ
C3はリード部材6とリード部材7間に各リード部材の裏
側で電極が面接続している。
Capacitor C 1 is between lead member 4 and lead member 7, capacitor C 2 is between lead member 5 and lead member 7, capacitor
C 3 electrodes behind each lead member is surface connection between the lead member 6 and the lead member 7.

各リード部材は回路素子間を固定したり、相互に接続
する導体の役割を有するが、リード部材4は第3図にお
ける入力端子11、リード部材5は中継端子12、リード部
材6は出力端子13、リード部材7はアース端子14の役割
を兼ねている。
Each lead member has a role of a conductor for fixing the circuit elements and connecting them to each other. The lead member 4 is an input terminal 11 in FIG. 3, the lead member 5 is a relay terminal 12, and the lead member 6 is an output terminal 13 in FIG. The lead member 7 also serves as a ground terminal 14.

なお、リード部材については、複合部品の組み立て時
に第1図の1点鎖線で示す部分を含むリードフレーム8
の状態で一体にしておき、回路素子を接続した後に実線
部分をリード部材として切断、分離すればよい。
As for the lead member, when assembling the composite part, the lead frame 8 includes a portion shown by a one-dot chain line in FIG.
After connecting the circuit elements, the solid line portion may be cut and separated as a lead member.

そして、リード部材の外部端子となる部分を除いて第
4図のように全体を樹脂封止する。第4図ではリード部
材6からなる外部端子61とリード部材5からなる外部端
子51が外装樹脂9の面に沿って側面から底面まで延在し
ている様子を示してあるが、複合部品の面接続用端子を
形成してあればよく、側面から階段状に突出していても
よい。また、外部端子としては出力端子13の役割をする
リード部材6の外部端子61、入力端子11の役割をするリ
ード部材4の外部端子、アース端子の役割をするリード
部材7の外部端子が外装樹脂9の外側に露出しておれば
よく、リード部材5は中継端子12の役割を有するにすぎ
ないので、その外部端子51は外側に露出していなくても
よい。
Then, as shown in FIG. 4, the entirety of the lead member is resin-sealed except for the portion to be an external terminal. FIG. 4 shows the external terminal 61 composed of the lead member 6 and the external terminal 51 composed of the lead member 5 extending from the side surface to the bottom surface along the surface of the exterior resin 9. It is sufficient that connection terminals are formed, and they may protrude from the side surface in a stepwise manner. As the external terminals, the external terminal 61 of the lead member 6 serving as the output terminal 13, the external terminal of the lead member 4 serving as the input terminal 11, and the external terminal of the lead member 7 serving as the ground terminal are formed of an exterior resin. The external terminal 51 does not need to be exposed to the outside since the lead member 5 only has the role of the relay terminal 12 as long as it is exposed outside the terminal 9.

複合部品は実施例としてローパスフィルタを示した
が、このようなLCフィルタの他に遅延線や、抵抗等の別
の種類の回路素子を含んだLCフィルタを構成できること
は言うまでもなく、インダクタンス素子や容量素子の数
を増やして構成することもできる。
Although the low-pass filter has been described as an example of the composite component, it is needless to say that an LC filter including another type of circuit element such as a delay line or a resistor can be configured in addition to such an LC filter. It is also possible to increase the number of elements.

コイルL1、L2は面接続用の電極が形成してあればよ
く、特に実施例の形状に限定する必要はなく、例えばチ
ップコイルでもよい。
The coils L 1 and L 2 need only be formed with electrodes for surface connection, and need not be limited to the shape of the embodiment, and may be, for example, a chip coil.

さらに、実施例ではいずれのリード部材の両面にも回
路素子の電極が接続しているが、片面だけに回路素子の
電極が接続するリード部材が混在していてもよい。
Further, in the embodiment, the electrodes of the circuit element are connected to both sides of any of the lead members. However, lead members to which the electrodes of the circuit element are connected may be mixed on only one side.

なお、本考案の複合部品はインダクタンス素子を3
つ、容量素子を6つ用いてフィルタを構成した場合、縦
と横が5mm、高さが2.7mm程度である。
The composite component of the present invention has three inductance elements.
In addition, when a filter is configured using six capacitive elements, the length and width are about 5 mm and the height is about 2.7 mm.

〔効果〕〔effect〕

以上述べたように、本考案の複合部品は、面接続用電
極を有する回路素子を直接リード部材に接続してあり、
リード部材に回路素子の固定と回路素子間を相互に接続
する導体の役割の他に外部端子の役割を兼ねさせてあ
る。しかも、回路素子のリード部材への接続は、リード
部材の両面で行われる。
As described above, in the composite component of the present invention, the circuit element having the surface connection electrode is directly connected to the lead member,
The lead member serves as an external terminal in addition to the function of the conductor for fixing the circuit elements and connecting the circuit elements to each other. In addition, connection of the circuit element to the lead member is performed on both sides of the lead member.

従って、従来のように基板を用いないので、複合部品
として基板の厚み分だけ薄くできる。
Therefore, since a substrate is not used unlike the conventional case, the composite component can be thinned by the thickness of the substrate.

また、リード部材の片面に複数のインダクタンス素子
が、反対側の面に複数の容量素子が接続されるので、イ
ンダクタンス素子や容量素子の実装密度が高まり、さら
に外部端子を別に用いないので平面的な広がりを小さく
できる。
Also, since a plurality of inductance elements are connected to one surface of the lead member and a plurality of capacitance elements are connected to the opposite surface, the mounting density of the inductance element and the capacitance element is increased, and the external terminal is not separately used, so that a flat surface is obtained. Spread can be reduced.

このようにして、全体として小形の面接続用の複合部
品を提供することができる。
In this way, it is possible to provide a small-sized composite component for surface connection as a whole.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本考案の複合部品の実施例を示す斜視図、第2
図は第1図の回路素子の結線図、第3図は回路図、第4
図は正面図である。 L1、L2:高周波コイル、C1、C2、C3:コンデンサ 4〜7:リード部材
FIG. 1 is a perspective view showing an embodiment of the composite part of the present invention, FIG.
FIG. 3 is a circuit diagram of the circuit element of FIG. 1, FIG.
The figure is a front view. L 1, L 2: high frequency coil, C 1, C 2, C 3: capacitor 4 to 7: Lead member

フロントページの続き (56)参考文献 特開 昭63−283008(JP,A) 特開 昭62−203311(JP,A) 実開 昭59−155709(JP,U)Continuation of the front page (56) References JP-A-63-283008 (JP, A) JP-A-62-203311 (JP, A) Real opening Sho-59-155709 (JP, U)

Claims (3)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】板状金属からなる複数のリード部材に複数
のインダクタンス素子と複数の容量素子を搭載して所定
のリード部材に接続し、リード部材の端部を露出させて
インダクタンス素子と容量素子とを樹脂封止する複合部
品において、 リード部材は、入力端子部材、出力端子部材、アース端
子部材とともに中継端子部材を具え、インダクタンス素
子はリード部材の片面において、リード部材の前記各部
材のいずれかに跨がる様にその表面に搭載され、容量素
子はリード部材の反対側の面において、リード部材の前
記各部材のいずれかに跨がる様にその表面に搭載され、
前記リード部材がその両側の表面上に搭載されたインダ
クタンス素子と容量素子により接続されたことを特徴と
する複合部品。
A plurality of inductance elements and a plurality of capacitance elements are mounted on a plurality of lead members made of a plate-like metal and connected to a predetermined lead member, and the ends of the lead members are exposed to thereby form an inductance element and a capacitance element. Wherein the lead member comprises a relay terminal member together with an input terminal member, an output terminal member, and a ground terminal member, and the inductance element is formed on one side of the lead member by any of the above members of the lead member. The capacitive element is mounted on the surface so as to straddle any of the respective members of the lead member on the surface on the opposite side of the lead member,
A composite component wherein the lead member is connected by an inductance element and a capacitance element mounted on both surfaces of the lead member.
【請求項2】板状金属からなる複数のリード部材に複数
のインダクタンス素子と複数の容量素子を搭載して所定
のリード部材に接続し、リード部材の端部を露出させて
インダクタンス素子と容量素子とを樹脂封止する複合部
品において、 リード部材は、入力端子部材、出力端子部材、アース端
子部材とともに中継端子部材を具え、インダクタンス素
子はリード部材の片面において、入力端子部材と中継端
子部材及び出力端子部材と中継端子部材に跨がる様にそ
の表面に搭載され、容量素子はリード部材の反対側の面
において、入力端子部材とアース端子部材、出力端子部
材とアース端子部材及びアース端子部材と中継端子部材
とに跨がる様にその表面に搭載され、前記リード部材が
その両側の表面上に搭載された複数のインダクタンス素
子と複数の容量素子により接続されたことを特徴とする
複合部品。
2. A method for mounting a plurality of inductance elements and a plurality of capacitance elements on a plurality of lead members made of a plate-like metal and connecting the plurality of inductance elements and a plurality of capacitance elements to a predetermined lead member, exposing the ends of the lead members to form an inductance element and a capacitance element. In the composite component for resin sealing, the lead member includes an input terminal member, an output terminal member, and a ground terminal member together with a relay terminal member, and the inductance element has an input terminal member, a relay terminal member, and an output terminal on one side of the lead member. The capacitor element is mounted on the surface so as to straddle the terminal member and the relay terminal member, and the capacitance element is provided on the surface opposite to the lead member on the input terminal member and the ground terminal member, and the output terminal member and the ground terminal member and the ground terminal member. A plurality of inductance elements mounted on the surface so as to straddle the relay terminal member, and the lead member is mounted on the surface on both sides thereof; A composite component characterized by being connected by a plurality of capacitive elements.
【請求項3】板状金属からなる複数のリード部材に複数
のインダクタンス素子と複数の容量素子を搭載して所定
のリード部材に接続し、リード部材の端部を露出させて
インダクタンス素子と容量素子とを樹脂封止する複合部
品において、 リード部材は、入力端子部材、出力端子部材、先端部に
複数の素子搭載部が形成されたアース端子部材とともに
中継端子部材を具え、インダクタンス素子はリード部材
の片面において、入力端子部材と中継端子部材及び出力
端子部材と中継端子部材に跨がる様にその表面に搭載さ
れ、容量素子はリード部材の反対側の面において、入力
端子部材、出力端子部材、中継端子部材とアース端子部
材の各々の素子搭載部とに跨がる様にその表面に搭載さ
れ、前記リード部材がその両側の表面上に搭載された複
数のインダクタンス素子と複数の容量素子により接続さ
れたことを特徴とする複合部品。
3. A plurality of inductance elements and a plurality of capacitance elements are mounted on a plurality of lead members made of a plate-like metal and connected to a predetermined lead member, and an end of the lead member is exposed to thereby form an inductance element and a capacitance element. The lead member comprises an input terminal member, an output terminal member, a relay terminal member together with a ground terminal member having a plurality of element mounting portions formed at a tip end, and the inductance element is formed of a lead member. On one side, the input terminal member and the relay terminal member, and the output terminal member and the relay terminal member are mounted on the surface so as to straddle the relay terminal member. A plurality of relay terminals are mounted on the surface so as to straddle each element mounting portion of the relay terminal member and the ground terminal member, and the lead member is mounted on the surface on both sides thereof. A composite component characterized by being connected by an inductance element and a plurality of capacitance elements.
JP1989149928U 1989-12-26 1989-12-26 Composite parts Expired - Lifetime JP2541884Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989149928U JP2541884Y2 (en) 1989-12-26 1989-12-26 Composite parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989149928U JP2541884Y2 (en) 1989-12-26 1989-12-26 Composite parts

Publications (2)

Publication Number Publication Date
JPH0388321U JPH0388321U (en) 1991-09-10
JP2541884Y2 true JP2541884Y2 (en) 1997-07-23

Family

ID=31696301

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JPS59155709U (en) * 1983-04-05 1984-10-19 ティーディーケイ株式会社 Chip composite parts

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