JPH06140115A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH06140115A JPH06140115A JP28058392A JP28058392A JPH06140115A JP H06140115 A JPH06140115 A JP H06140115A JP 28058392 A JP28058392 A JP 28058392A JP 28058392 A JP28058392 A JP 28058392A JP H06140115 A JPH06140115 A JP H06140115A
- Authority
- JP
- Japan
- Prior art keywords
- package
- contact
- terminal
- positioning
- mounting base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＩＣソケット、殊にＩＣ
パッケージをソケット基盤に具備させた浮沈可能なＩＣ
搭載台にて支承しつつコンタクトとの弾性的接触を得る
ようにしたＩＣソケットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, especially an IC.
Floating and sinking IC with package on socket base
The present invention relates to an IC socket which is elastically supported by a mounting base while being elastically supported.
【０００２】[0002]
【従来の技術】実開昭５８−３０２９５号等に示される
ように、ソケット基盤のＩＣ収容部にＩＣパッケージを
支承するＩＣ搭載台を浮沈動可に設け、該搭載台周囲の
ソケット基盤部にコンタクトを植装し、上記搭載台をＩ
Ｃパッケージの支承下において沈降させつつ、該ＩＣパ
ッケージのＩＣ端子と上記コンタクトの弾性接片の接触
部との弾性的接触を得るようにしたＩＣソケットが知ら
れている。2. Description of the Related Art As shown in Japanese Utility Model Laid-Open No. 58-30295, an IC mounting base for supporting an IC package is provided in an IC accommodating portion of a socket base so that it can be moved up and down. Implant contacts and attach the above mount
There is known an IC socket in which the IC terminal of the IC package and the contact portion of the elastic contact piece of the contact are elastically contacted with each other while sinking under the support of the C package.
【０００３】上記ＩＣソケットにおいては、通常ＩＣリ
ードに接触すべきコンタクトをソケット基盤側において
位置決めし、該コンタクトに接触すべきＩＣリードを有
するＩＣパッケージをＩＣ搭載台側において位置決めす
る等してコンタクトとＩＣ端子の対応を得るようにして
いる。In the above-mentioned IC socket, a contact that should normally come into contact with an IC lead is positioned on the socket substrate side, and an IC package having an IC lead that should come into contact with the contact is positioned on the IC mounting base side to form a contact. We are trying to get the correspondence of IC terminals.
【０００４】[0004]
【発明が解決しようとする問題点】然しながら、上記Ｉ
Ｃソケットにおいてはコンタクト及びＩＣ端子の個々の
位置決めが適正になされても、コンタクトはＩＣ搭載台
によって何ら規制される関係になく、従ってＩＣ搭載台
に位置決め搭載されたＩＣパッケージのＩＣ端子との相
対位置を正確に保証する機能に欠け、殊にＩＣ端子が極
小ピッチである場合には位置決め瑕疵を生ずる恐れがあ
り信頼性に欠ける。本発明はこの問題を構造簡潔にして
合理的に解決し得るようにしたものである。However, the above-mentioned I
In the C socket, even if the contacts and the IC terminals are properly positioned, the contacts are not in any relation regulated by the IC mounting base, and therefore, the contacts are positioned relative to the IC terminals of the IC package positioned and mounted on the IC mounting base. It lacks the function of accurately guaranteeing the position, and in particular, when the IC terminals have a very small pitch, positioning defects may occur, resulting in poor reliability. The present invention has a structurally simplified structure to allow a rational solution.
【０００５】[0005]
【問題点を解決するための手段】本発明は上記問題を解
決する手段として、上記ＩＣ搭載台の外周部に上記コン
タクトの位置決め手段、殊にＩＣ端子との弾性的接触に
供する弾性接片部の位置決め手段を設けて、ＩＣ搭載台
にＩＣパッケージの支持機能を具備させつつ上記コンタ
クトの位置決め機能をも具有させるようにし、よってコ
ンタクトとＩＣ端子との相対位置の適正化を保証するよ
うにしたものである。As a means for solving the above problems, the present invention provides a means for positioning the contacts on the outer periphery of the IC mounting base, in particular, an elastic contact piece portion for elastic contact with an IC terminal. The positioning means is provided so that the IC mounting base has the function of supporting the IC package and also has the function of positioning the contact, thereby ensuring the proper relative position between the contact and the IC terminal. It is a thing.
【０００６】又本発明は上記ＩＣパッケージをＩＣ搭載
台に支承しＩＣ端子を上記位置決め手段たる位置決め孔
又は位置決め溝に対向させる場合に、上記ＩＣ端子がＩ
Ｃ搭載台における上記位置決め孔又は位置決め溝の開口
面より離間して同位置決め孔又は位置決め溝と対向し配
置されるように構成したものである。Further, according to the present invention, when the IC package is supported on an IC mounting base and the IC terminal is opposed to the positioning hole or the positioning groove as the positioning means, the IC terminal is I.
It is configured so as to be spaced apart from the opening surface of the positioning hole or the positioning groove in the C mounting table so as to face the positioning hole or the positioning groove.
【０００７】[0007]
【作用】本発明によれば、ソケット基盤側に植装された
コンタクト、殊にＩＣ端子との接触に供する弾性接片と
ＩＣ搭載台とを関連づけ、ＩＣ搭載台に設けた位置決め
手段にて上記弾性接片を位置決めしＩＣ搭載台に位置決
め搭載されたＩＣパッケージのＩＣ端子との接触に供し
得るようにしたものであるから、ＩＣ搭載台にＩＣパッ
ケージの位置決め搭載機能に加えてコンタクトの位置決
め機能をも具有させることができ、よってＩＣ端子とコ
ンタクトとの相対位置を正確に保つことが可能となる。According to the present invention, the contact mounted on the socket base side, in particular, the elastic contact piece used for contacting the IC terminal and the IC mounting base are associated with each other, and the positioning means provided on the IC mounting base is used for the above. The elastic contact piece is positioned so that it can be used for contact with the IC terminal of the IC package mounted on the IC mounting table. Therefore, in addition to the IC package positioning mounting function of the IC mounting table, the contact positioning function is also provided. Therefore, the relative position between the IC terminal and the contact can be accurately maintained.
【０００８】本発明は上記によってＩＣ搭載台を備えた
ＩＣソケットにおけるＩＣ端子とコンタクトの位置決め
瑕疵の問題を解消し、上記の如くＩＣ搭載台にＩＣ端子
に対するコンタクトの位置決め保証機能を具備させるこ
とにより、高信頼の接触を確保し極小ピッチのＩＣ端子
にも有効に対処できる。The present invention solves the problem of defective positioning of the IC terminal and the contact in the IC socket provided with the IC mounting base as described above, and provides the IC mounting base with the function of guaranteeing the positioning of the contact with respect to the IC terminal as described above. The highly reliable contact can be secured and the IC terminal with an extremely small pitch can be effectively dealt with.
【０００９】又ＩＣパッケージは手指又は自動機により
ＩＣ搭載台の真上に待ち来して落下させ同台への搭載が
行なわれているが、本発明においては、ＩＣパッケージ
をＩＣ搭載台に支承しつつ、そのＩＣ端子を位置決め孔
又は位置決め溝の開口面、即ち、同孔又は溝が開口する
ＩＣ搭載台表面より離間して位置決め孔又は位置決め溝
と対向させるように構成したので、上記ＩＣパッケージ
の落下搭載時に微細で脆弱なＩＣ端子がＩＣ搭載台の表
面に衝撃的に当って変形等を招来する問題を有効に解決
する。The IC package is mounted on the IC mounting table by waiting and dropping it right above the IC mounting table with a finger or an automatic machine. In the present invention, the IC package is supported on the IC mounting table. At the same time, the IC terminal is arranged so as to face the positioning hole or the positioning groove apart from the opening surface of the positioning hole or the positioning groove, that is, the surface of the IC mounting base on which the hole or the groove opens. It effectively solves the problem that the fine and fragile IC terminal impacts the surface of the IC mounting table when the device is dropped and is deformed.
【００１０】更には手指等でＩＣ搭載台にＩＣパッケー
ジを注意深く載置するようにしても作業者個々の手作業
に依存するため、その手加減によりどうしてもＩＣ端子
をＩＣ搭載台表面にこすりがちであるが、本発明によれ
ば上記の通りＩＣ端子がＩＣ搭載台の位置決め孔又は位
置決め溝の開口面より離間して搭載する構成を採ってい
るので、ＩＣ端子が多数の孔又は溝を穿けた搭載台表面
とこすれ合ってＩＣ端子表面のメッキ層を損傷したり変
形する不具合を有効に防止する。Further, even if the IC package is carefully placed on the IC mounting table with fingers or the like, it depends on the manual work of each worker, and therefore the IC terminal tends to be rubbed on the surface of the IC mounting table. However, according to the present invention, since the IC terminal is mounted separately from the opening surface of the positioning hole or the positioning groove of the IC mounting base as described above, the IC terminal is mounted with a large number of holes or grooves. It effectively prevents the trouble of rubbing against the surface of the base to damage or deform the plating layer on the surface of the IC terminal.
【００１１】更にＩＣパッケージを手指で常に水平に保
ちながらＩＣ搭載台に搭載するのは困難で、むしろ同パ
ッケージを傾けて搭載しがちであるが、この場合には傾
きの下辺側に配置されたＩＣ端子の先端縁が位置決め孔
の縁部に引掛ったり、又は側辺部に配置されたＩＣ端子
の側縁が孔又は溝の縁部に引掛り、そのままではＩＣパ
ッケージが所定の姿勢でＩＣ搭載台に収まらない問題、
或いは上記引掛りと前記こすれ動作が複合的に生じて修
復困難なＩＣ端子の変形が生ずる問題を招来するが、本
発明は前記のように、ＩＣ端子をＩＣ搭載台の位置決め
孔又は位置決め溝と対向させるに際し、そのＩＣ搭載台
における開口面から離間する構成を併備させたので、上
記ＩＣパッケージの傾斜搭載時におけるＩＣ端子の引掛
りや、これによる収まりの悪化、端子変形の問題を可及
的に防止し、以上述べた作用により前記コンタクトの弾
性接片の接触部をＩＣ搭載台の位置決め孔又は溝により
位置決めする作用効果を遺憾なく発揮させ、その利点を
享受できるものである。Further, it is difficult to mount the IC package on the IC mounting base while always keeping it horizontally with fingers, and it is apt to mount the package in a tilted manner, but in this case, it is arranged on the lower side of the tilt. The leading edge of the IC terminal catches on the edge of the positioning hole, or the side edge of the IC terminal arranged on the side part catches on the edge of the hole or groove. Problems that do not fit on the mounting base,
Alternatively, the above-mentioned catching operation and the above-mentioned rubbing operation occur in a combined manner, which causes a problem that the IC terminal which is difficult to repair is deformed. When facing the IC mounting base, the IC mounting base is separated from the opening surface of the IC mounting base. Therefore, it is possible to prevent the IC terminal from being caught when the above-mentioned IC package is obliquely mounted, resulting in deterioration of the fit and deformation of the terminal. By virtue of the above-mentioned action, the effect of positioning the contact portion of the elastic contact piece of the contact by the positioning hole or groove of the IC mounting table is fully exhibited, and the advantage thereof can be enjoyed.
【００１２】[0012]
【実施例】以下本発明の実施例を図面に基いて説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
【００１３】図１乃至図３はコンタクトの位置決め手段
としてＩＣ搭載台にコンタクトと等ピッチで位置決め溝
を設けた実施例を示す。1 to 3 show an embodiment in which positioning grooves are provided on the IC mounting table as a contact positioning means at the same pitch as the contacts.
【００１４】１は方形の絶縁基盤にて形成されたソケッ
ト基盤を示す。該ソケット基盤１はＩＣパッケージ１５
に対応したＩＣ収容スペース６及びＩＣパッケージ１５
のＩＣ端子１６に対応したコンタクト１０を有する。Reference numeral 1 denotes a socket base formed of a rectangular insulating base. The socket base 1 is an IC package 15
IC accommodation space 6 and IC package 15 corresponding to
The contact 10 corresponding to the IC terminal 16 of FIG.
【００１５】上記ＩＣ収容スペース６として上記ソケッ
ト基盤１の中央部に方形の窓を画成し、該ＩＣ収容スペ
ース６内にＩＣ搭載台７を浮沈動可に設ける。該ＩＣ収
容スペース６外周の四辺又は二辺にコンタクト１０を配
置しソケット基盤１に植装する。As the IC housing space 6, a rectangular window is defined in the central portion of the socket base 1, and an IC mounting base 7 is provided in the IC housing space 6 so as to be movable up and down. The contacts 10 are arranged on four or two sides of the outer periphery of the IC housing space 6 and are implanted in the socket base 1.
【００１６】該ＩＣ搭載台７を浮沈動可にする手段とし
て、該搭載台７をＩＣ収容スペース６たる窓内において
上方力を付与するバネ１３にて弾力的に支承し、該バネ
１３に抗し沈降し且つバネ１３に従い上昇せしめる構成
とする。As a means for allowing the IC mounting base 7 to move up and down, the mounting base 7 is elastically supported by a spring 13 that applies an upward force in the window which is the IC housing space 6, and is resistant to the spring 13. Then, it is settled and raised according to the spring 13.
【００１７】搭載台７にはたとえばその中央部にピン１
４を縦方向に緩挿し、該ピン１４下端を上記窓下方のソ
ケット基盤部に螺合、圧入、接着等の手段にて固定し、
ピン上端の頭部を搭載台７に係合させて抜け止めとし、
ＩＣ搭載台７の上昇時の上限位置を設定すると共に、ソ
ケット基盤１に対する一体組立を図る。The mounting table 7 has, for example, a pin 1 at the center thereof.
4 is loosely inserted in the longitudinal direction, and the lower end of the pin 14 is fixed to the socket base portion below the window by means such as screwing, press fitting, or adhering.
The head of the upper end of the pin is engaged with the mounting base 7 to prevent it from coming off.
The upper limit position when the IC mounting base 7 is raised is set, and the socket base 1 is integrally assembled.
【００１８】上記バネ１３としては、例えばコイルスプ
リングを用い、該コイルスプリングをＩＣ搭載台７と該
ＩＣ搭載台直下のソケット基盤部との間に介装し、圧縮
状態で上記ピン１４の周囲に配置する。As the spring 13, for example, a coil spring is used, and the coil spring is interposed between the IC mounting base 7 and the socket base portion directly below the IC mounting base, and is surrounded by the pin 14 in a compressed state. Deploy.
【００１９】他方、上記コンタクト１０は上記搭載台７
の外周部のソケット基盤部に植装され、該植装部からＩ
Ｃ搭載台７に向かって延びた弾性接片１０ｂを有する。On the other hand, the contact 10 corresponds to the mounting base 7
Is planted in the socket base portion of the outer peripheral portion of the
It has an elastic contact piece 10b extending toward the C mounting base 7.
【００２０】図１乃至図３に示す実施例においては、Ｉ
Ｃパッケージ１５のＩＣ端子１６をコンタクト１０に載
せ接触を図る載接形ＩＣソケットを例示し、上記弾性接
片１０ｂは横方向に延在させて上下方向に弾性変位作用
を具備させると共に、該弾性接片１０ｂの自由端に接触
部１０ａを形成し、該接触部１０ａを上記ＩＣ搭載台７
外周部に位置させる。In the embodiment shown in FIGS. 1 to 3, I
An example of a mounting type IC socket in which the IC terminal 16 of the C package 15 is placed on the contact 10 to make contact is shown. The elastic contact piece 10b is extended in the lateral direction to have an elastic displacement action in the vertical direction, and A contact portion 10a is formed on the free end of the contact piece 10b, and the contact portion 10a is formed on the IC mounting table 7
Located on the outer circumference.
【００２１】上記の如くしたＩＣ搭載台７の外周部に上
記コンタクト１０の弾性接片１０ｂの位置決め手段を設
ける。図１乃至第図３に示す実施例は該位置決め手段と
して、ＩＣ搭載台７の側部に隔壁１１により画成された
多数の位置決め溝１２を形成する。Positioning means for the elastic contact piece 10b of the contact 10 is provided on the outer peripheral portion of the IC mounting base 7 as described above. In the embodiment shown in FIGS. 1 to 3, as the positioning means, a large number of positioning grooves 12 defined by partition walls 11 are formed on the side of the IC mounting base 7.
【００２２】該位置決め溝１２は上記コンタクト１０の
接触部１０ａを受け入れ、位置決めを図るものであり、
図示のようにコンタクトピッチ、従ってＩＣ端子ピッチ
と同一ピッチでコンタクト数と同数の位置決め溝１２を
設けてコンタクトの個々を捕捉し得るようにするか、又
はコンタクトの部分群において捕捉し得るように配置す
る。上記の如く配置した位置決め溝１２内に上記弾性接
片１０ｂの接触部１０ａ受け入れ位置決めを図る。The positioning groove 12 is for receiving the contact portion 10a of the contact 10 for positioning.
As shown in the figure, the positioning pitches 12 are provided at the same pitch as the contact pitch, and thus as the IC terminal pitch, as many as the number of contacts so that each of the contacts can be captured or arranged so as to be captured in a subgroup of the contacts. To do. The contact portion 10a of the elastic contact piece 10b is received and positioned in the positioning groove 12 arranged as described above.
【００２３】上記によってＩＣ搭載台７は各隔壁１１を
接触部１０ａ間において各弾性接片１０ｂの接触部１０
ａ間に介入し、位置決め溝１２内壁にてこれを側面規制
しつつ浮沈動する。従ってコンタクト１０の弾性接片１
０ｂの接触部１０ａとＩＣ搭載台７とは上記位置決め手
段を介して相互に位置を補完し合う関係に置かれ、ＩＣ
搭載台７が左右方向又は前後方向に微動した時、該微動
方向と直交する側に配列した上記弾性接片１０ｂも上記
位置決め手段を介してＩＣ端子１６との相対位置を保ち
つつ同方向に追随動する。この結果相対位置が適正に保
たれる。As described above, in the IC mounting table 7, the partition walls 11 are provided between the contact portions 10a, and the contact portions 10 of the elastic contact pieces 10b are provided.
It intervenes between a and floats / descends while side-regulating it by the inner wall of the positioning groove 12. Therefore, the elastic contact piece 1 of the contact 10
The contact portion 10a of 0b and the IC mounting base 7 are placed in a relationship of complementing each other through the positioning means.
When the mounting table 7 slightly moves in the left-right direction or the front-back direction, the elastic contact pieces 10b arranged on the side orthogonal to the fine-movement direction also follow the same direction while maintaining the relative position to the IC terminal 16 through the positioning means. Move. As a result, the relative position is properly maintained.
【００２４】上記の如くしたＩＣ搭載台７にＩＣパッケ
ージ１５を位置決め搭載する。ＩＣ搭載台７はＩＣパッ
ケージ１５の位置決め手段として例えば、ＩＣ搭載台７
の周囲縁部に額縁状の位置決め壁８を立上げ、該位置決
め壁８にてＩＣ搭載台７に搭載されたＩＣパッケージ１
５の側面を規制し、位置決めを図る。斯くしてＩＣパッ
ケージ１５から側方へ突出されたＩＣ端子１６と上記位
置決め溝１２内に存する弾性接片１０ｂの接触部１０ａ
とは一対一の対応関係に置かれる。The IC package 15 is positioned and mounted on the IC mounting table 7 as described above. The IC mounting table 7 serves as a positioning means for the IC package 15, for example, the IC mounting table 7
A frame-shaped positioning wall 8 is erected on the peripheral edge of the IC package 1 mounted on the IC mounting table 7 by the positioning wall 8.
The side of 5 is regulated and the positioning is aimed at. Thus, the contact portion 10a of the elastic contact piece 10b existing in the positioning groove 12 and the IC terminal 16 protruding laterally from the IC package 15.
And are placed in a one-to-one correspondence.
【００２５】この時、ＩＣパッケージ１５本体を該本体
と対向するＩＣ搭載台７の表面９に支承し、同ＩＣ端子
１６は位置決め溝１２の開口面、即ち同溝１２が開口す
る部位のＩＣ搭載台表面より離間して同開口面と対向す
るように構成する。又この時、図３に示すように、ＩＣ
端子１６が接触部１０ａに載接状態となるか、又は接触
部１０ａの真上に若干離間し対向した状態に置かれる。At this time, the main body of the IC package 15 is supported on the surface 9 of the IC mounting base 7 facing the main body, and the IC terminals 16 are mounted on the opening surface of the positioning groove 12, that is, the portion where the groove 12 opens. It is configured so as to be spaced apart from the table surface and to face the same opening surface. At this time, as shown in FIG.
The terminal 16 is placed in contact with the contact portion 10a, or is placed directly above the contact portion 10a with a slight distance between them and facing each other.
【００２６】上記対応状態においてＩＣパッケージ１５
に図３中、白抜き矢印で示す下方力を与えることによ
り、ＩＣ押え部１７がＩＣ端子１６を位置決め溝１２と
対向する位置において押圧することにより同パッケージ
１５及びＩＣ搭載台７をバネ１３にて抗して沈降動さ
せ、該沈降動によりＩＣ端子１６により接触部１０ａを
押圧して弾性接片１０ｂをその弾力に抗して下方に弾性
変位させ、その復元弾力によりＩＣ端子１６との弾性接
触を図る。In the corresponding state, the IC package 15
3, a downward force indicated by an outlined arrow is applied to the IC pressing portion 17 to press the IC terminal 16 at a position facing the positioning groove 12, and thereby the package 15 and the IC mounting base 7 to the spring 13. And the IC terminal 16 presses the contact portion 10a to elastically displace the elastic contact piece 10b downward against its resilience, and the elastic resilience causes the elastic contact with the IC terminal 16. Make contact.
【００２７】図４、図５は上記位置決め手段の他例を示
す。4 and 5 show another example of the positioning means.
【００２８】該実施例においては上記位置決め手段とし
て位置決め孔１２′を用いている。前記と同様に該位置
決め孔１２′をＩＣ搭載台７の周縁部にコンタクト１０
と同一ピッチで多数並設し、各コンタクト１０の弾性接
片１０ｂを該位置決め孔１２′へ向け延ばし、その自由
端部に上向きの接触部１０ａを曲成し、該接触部１０ａ
を該位置決め孔１２′内へ挿入しＩＣ端子１６と対峙状
態に置く。これによって弾性接片１０ｂはその接触部１
０ａにおいて孔内壁より側面規制され、弾性接片１０ｂ
とＩＣ搭載台７、従ってこれに位置決め搭載されたＩＣ
パッケージ１５との相対位置が確保される。In this embodiment, a positioning hole 12 'is used as the positioning means. In the same manner as described above, the positioning hole 12 'is provided on the peripheral portion of the IC mounting base 7 for contact 10
Are arranged in parallel with each other at the same pitch, the elastic contact pieces 10b of each contact 10 are extended toward the positioning hole 12 ', and an upward contact portion 10a is bent at the free end thereof, and the contact portion 10a is bent.
Is inserted into the positioning hole 12 'and placed in a state of facing the IC terminal 16. As a result, the elastic contact piece 10b has its contact portion 1
At 0a, the side surface is restricted from the inner wall of the hole, and the elastic contact piece 10b
And the IC mounting base 7, and therefore the IC mounted and positioned on it
The relative position with respect to the package 15 is secured.
【００２９】この場合にも、前記と同様ＩＣパッケージ
１５本体を該本体と対向するＩＣ搭載台７の表面９に支
承し、同ＩＣ端子１６は上記位置決め孔１２′の開口
面、即ち同孔１２′が開口する部位のＩＣ搭載台表面よ
り離間して同開口面と対向するように構成する。Also in this case, the main body of the IC package 15 is supported on the surface 9 of the IC mounting base 7 facing the main body, and the IC terminal 16 has the opening surface of the positioning hole 12 ', that is, the same hole 12 as described above. It is configured such that it is spaced apart from the surface of the IC mounting table at the portion where ′ opens and faces the opening surface.
【００３０】斯くしてＩＣパッケージ１５を搭載台７に
搭載し、該搭載台７の各コーナーに設けた位置決め壁
８′により各列端のＩＣ端子１６側面を規制しつつＩＣ
パッケージ１５の位置決めを図り、該ＩＣパッケージ１
５のＩＣ端子１６を上記位置決め孔１２′と対向する位
置において下方へ押圧することによって前記と同様、Ｉ
Ｃ端子１５と弾性接片１０ｂとの弾性接触が得られる。Thus, the IC package 15 is mounted on the mounting base 7, and the side walls of the IC terminals 16 at the ends of each row are regulated by the positioning walls 8'provided at the respective corners of the mounting base 7.
By positioning the package 15, the IC package 1
As described above, by pressing the IC terminal 16 of No. 5 downward at the position facing the positioning hole 12 ', I
Elastic contact between the C terminal 15 and the elastic contact piece 10b is obtained.
【００３１】上記各実施例におけるＩＣ押え手段とし
て、ソケット基盤１の一端にＩＣ押えカバー２を軸４に
て枢着し基盤上へ閉合可に設けると共に、ソケット基盤
１の他端にソケット基盤１上に閉合されたＩＣ押えカバ
ー２の自由端に係合して閉合を保持するロックレバー３
を軸５にて枢着する。As the IC pressing means in each of the above-described embodiments, an IC pressing cover 2 is pivotally attached to one end of the socket base 1 by a shaft 4 so as to be capable of being closed on the base, and the socket base 1 is attached to the other end of the socket base 1. A lock lever 3 that engages with the free end of the IC pressing cover 2 that is closed above to hold the closure.
Is pivoted on the shaft 5.
【００３２】上記ＩＣ押えカバー２の内面にはＩＣ端子
１６と対向するＩＣ押え部１７を設け、同カバー２の閉
合によってＩＣ端子１６の上面を位置決め孔１２′又は
位置決め溝１２と離間し対向する位置において押圧し同
孔又は溝内に存する弾性接片１０ｂの接触部１０ａとの
弾性接触を得る。An IC pressing portion 17 facing the IC terminal 16 is provided on the inner surface of the IC pressing cover 2, and when the cover 2 is closed, the upper surface of the IC terminal 16 faces the positioning hole 12 'or the positioning groove 12 so as to face it. By pressing at the position, elastic contact with the contact portion 10a of the elastic contact piece 10b existing in the same hole or groove is obtained.
【００３３】[0033]
【発明の効果】以上説明した通り本発明によれば、ＩＣ
端子との接触に供するコンタクトの弾性接片の接触部と
ＩＣ搭載台とをＩＣ搭載台側に設けた位置決め孔又は位
置決め溝を介して相互に位置を補完し合う関係とするこ
とができ、上記弾性接片をＩＣ搭載台側において正確に
位置決めしてＩＣ搭載台に搭載されたＩＣパッケージの
ＩＣ端子との接触に供することができ、ＩＣ端子とコン
タクトとの正確な相対位置を保証する。As described above, according to the present invention, the IC
The contact portion of the elastic contact piece of the contact used for contact with the terminal and the IC mounting base can be in a relationship of complementing each other through a positioning hole or a positioning groove provided on the IC mounting base side. The elastic contact piece can be accurately positioned on the IC mounting base side to be used for contact with the IC terminal of the IC package mounted on the IC mounting base, and the accurate relative position between the IC terminal and the contact is guaranteed.
【００３４】本発明は上記によってＩＣ搭載台を備えた
ＩＣソケットにおけるＩＣ端子とコンタクトの位置決め
瑕疵の問題を解消し、上記の如くＩＣ搭載台に上記位置
決め保証機能を具備させることにより、高信頼の接触を
確保し極小ピッチのＩＣ端子にも有効に対処できること
となった。The present invention solves the problem of the positioning defect of the IC terminal and the contact in the IC socket provided with the IC mounting base as described above, and provides the IC mounting base with the positioning guarantee function as described above, thereby achieving high reliability. It is possible to secure contact and effectively deal with IC terminals with a very small pitch.
【００３５】又本発明によれば、前記作用の欄において
述べたように、ＩＣパッケージを手指又は自動機により
ＩＣ搭載台に落下させ搭載を行なった場合にも、ＩＣパ
ッケージをＩＣ搭載台に支承しつつ、そのＩＣ端子を位
置決め孔又は位置決め溝の開口面、即ち、同孔又は溝が
開口するＩＣ搭載台表面より離間して同位置決め孔又は
位置決め溝と対向させるように構成したので、上記ＩＣ
パッケージの落下搭載時に微細で脆弱なＩＣ端子がＩＣ
搭載台の表面に衝撃的に当って変形等を招来する問題を
有効に解決する。Further, according to the present invention, as described in the section of the above-mentioned action, even when the IC package is dropped and mounted on the IC mounting base by a finger or an automatic machine, the IC package is supported on the IC mounting base. At the same time, the IC terminal is arranged so as to face the positioning hole or the positioning groove apart from the opening surface of the positioning hole or the positioning groove, that is, the surface of the IC mounting base on which the hole or the groove opens.
When the package is dropped and mounted, the IC terminals have fine and fragile IC terminals.
Effectively solves the problem of impacting the surface of the mounting table and causing deformation.
【００３６】更には本発明によれば上記の通りＩＣ端子
がＩＣ搭載台の位置決め孔又は位置決め溝の開口面より
離間して搭載する構成を採っているので、手指でＩＣパ
ッケージを搭載する場合にＩＣ端子が多数の孔又は溝を
穿けた搭載台表面とこすれ合ってＩＣ端子表面のメッキ
層を損傷したり変形する不具合を有効に防止し、更にＩ
Ｃパッケージを傾けて搭載した場合にも傾きの下辺側に
配置されたＩＣ端子の先端縁が位置決め孔の縁部に引掛
ったり、又は側辺部に配置されたＩＣ端子の側縁が孔又
は溝の縁部に引掛り、そのままではＩＣパッケージが所
定の姿勢でＩＣ搭載台に収まらない問題、或いは上記引
掛りと前記こすれ動作が複合的に生じて修復困難なＩＣ
端子の変形が生ずる問題を有効に解決する。Furthermore, according to the present invention, since the IC terminal is mounted separately from the positioning hole or the opening surface of the positioning groove of the IC mounting base as described above, when the IC package is mounted by fingers. This effectively prevents the IC terminal from rubbing against the surface of the mounting table having a large number of holes or grooves, thereby damaging or deforming the plating layer on the surface of the IC terminal.
Even when the C package is tilted and mounted, the leading edge of the IC terminal arranged on the lower side of the tilt is caught on the edge of the positioning hole, or the side edge of the IC terminal arranged on the side is a hole or An IC that is caught on the edge of the groove and cannot be mounted on the IC mounting table in a predetermined posture as it is, or an IC that is difficult to repair due to a combination of the above-mentioned hooking and rubbing operation.
Effectively solves the problem of terminal deformation.
【００３７】即ち本発明は前記のようにＩＣパッケージ
をＩＣ搭載台に支承しつつ、ＩＣ端子をＩＣ搭載台の位
置決め孔又は位置決め溝と対向させるに際し、そのＩＣ
搭載台における開口面から離間する構成を併備させたの
で、上記ＩＣパッケージの傾斜搭載時におけるＩＣ端子
の引掛りや、これによる収まりの悪化、端子変形の問題
を可及的に防止し、ひいては以上述べた作用により前記
コンタクトの弾性接片の接触部をＩＣ搭載台の位置決め
孔又は溝により位置決めする作用効果を遺憾なく発揮さ
せ、その利点を享受できるものである。That is, according to the present invention, when the IC package is supported on the IC mounting base as described above and the IC terminal is opposed to the positioning hole or the positioning groove of the IC mounting base, the IC
Since the structure is provided so as to be separated from the opening surface of the mounting table, it is possible to prevent the problem of the IC terminal from being caught when the above IC package is obliquely mounted, the deterioration of the setting due to this, and the terminal deformation. With the above-described operation, the effect of positioning the contact portion of the elastic contact piece of the contact by the positioning hole or groove of the IC mounting table is fully exhibited, and the advantage thereof can be enjoyed.
【００３８】又ＩＣ端子と位置決め孔又は同溝の開口面
とが離間しているので、同開口面に付着した塵埃がＩＣ
端子下面に転着して接触の信頼性を損なう問題を確実に
解消できた。Further, since the IC terminal is separated from the positioning hole or the opening surface of the groove, dust attached to the opening surface of the IC is removed.
It was possible to reliably solve the problem of rolling on the bottom surface of the terminal and impairing the reliability of contact.
【図１】本発明の実施例を示すＩＣソケット斜視図。FIG. 1 is a perspective view of an IC socket showing an embodiment of the present invention.
【図２】ＩＣ搭載台の位置決め手段とコンタクトの弾性
接片との相対関係を示す平面図。FIG. 2 is a plan view showing the relative relationship between the positioning means of the IC mounting table and the elastic contact piece of the contact.
【図３】図１においてＩＣ搭載台にＩＣパッケージを搭
載した状態をＩＣ押え前の状態を以って示すＩＣソケッ
ト断面図。FIG. 3 is an IC socket cross-sectional view showing a state in which an IC package is mounted on the IC mounting base in FIG. 1 in a state before IC pressing.
【図４】他例を示す同断面図。FIG. 4 is a cross-sectional view showing another example.
【図５】同他例におけるＩＣ搭載台の位置決め手段とコ
ンタクト及びＩＣ端子との相対関係を示す平面図。FIG. 5 is a plan view showing the relative relationship between the positioning means of the IC mounting table and the contacts and IC terminals in the other example.
１ ソケット基盤 ６ ＩＣ収容スペース ７ ＩＣ搭載台 ８ 位置決め壁 １０ コンタクト １０ａ 接触部 １０ｂ 弾性接片 １１ 隔壁 １２ 位置決め溝 １２′ 位置決め孔 １５ ＩＣパッケージ １６ ＩＣ端子 DESCRIPTION OF SYMBOLS 1 Socket substrate 6 IC accommodation space 7 IC mounting table 8 Positioning wall 10 Contact 10a Contact part 10b Elastic contact piece 11 Partition wall 12 Positioning groove 12 'Positioning hole 15 IC package 16 IC terminal
Claims (1)
ジを支承するＩＣ搭載台を浮沈動可に設け、該搭載台周
囲のソケット基盤部にコンタクトを植装し、上記搭載台
をＩＣパッケージの支承下において沈降させ、該ＩＣパ
ッケージのＩＣ端子と上記コンタクトの弾性接片の接触
部との弾性的接触を得るようにしたＩＣソケットにおい
て、上記ＩＣ搭載台の外周部にコンタクト位置決め孔又
は位置決め溝を設け、該位置決め孔又は位置決め溝内に
上記弾性接片の接触部を受け入れ、該弾性接片の接触部
を該位置決め孔形成壁又は位置決め溝形成壁にて規制す
る構成とすると共に、上記ＩＣ搭載台に支承されたＩＣ
パッケージのＩＣ端子が上記位置決め孔又は位置決め溝
開口面より離間して同開口面と対向するように構成した
ことを特徴とするＩＣソケット。1. An IC mounting base for supporting an IC package is provided in an IC accommodating portion of a socket base so that the IC mounting base can be moved up and down, contacts are mounted on the socket base around the mounting base, and the mounting base supports the IC package. In an IC socket that is settled down to obtain elastic contact between the IC terminal of the IC package and the contact portion of the elastic contact piece of the contact, a contact positioning hole or positioning groove is formed on the outer peripheral portion of the IC mounting base. The contact part of the elastic contact piece is received in the positioning hole or the positioning groove, and the contact part of the elastic contact piece is regulated by the positioning hole forming wall or the positioning groove forming wall, and the IC is mounted. IC supported on the platform
An IC socket characterized in that the IC terminal of the package is configured to face the opening surface of the positioning hole or the positioning groove apart from the opening surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4280583A JPH07114139B2 (en) | 1992-09-26 | 1992-09-26 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4280583A JPH07114139B2 (en) | 1992-09-26 | 1992-09-26 | IC socket |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62126337A Division JPS63291375A (en) | 1987-05-22 | 1987-05-22 | Ic socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06140115A true JPH06140115A (en) | 1994-05-20 |
| JPH07114139B2 JPH07114139B2 (en) | 1995-12-06 |
Family
ID=17627063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4280583A Expired - Lifetime JPH07114139B2 (en) | 1992-09-26 | 1992-09-26 | IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114139B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016001546A (en) * | 2014-06-11 | 2016-01-07 | 株式会社エンプラス | Socket for electric component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921417U (en) * | 1972-05-26 | 1974-02-23 | ||
| JPS56165106A (en) * | 1980-05-23 | 1981-12-18 | Minolta Camera Co Ltd | Automatic focusing device for zoom lens |
-
1992
- 1992-09-26 JP JP4280583A patent/JPH07114139B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921417U (en) * | 1972-05-26 | 1974-02-23 | ||
| JPS56165106A (en) * | 1980-05-23 | 1981-12-18 | Minolta Camera Co Ltd | Automatic focusing device for zoom lens |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016001546A (en) * | 2014-06-11 | 2016-01-07 | 株式会社エンプラス | Socket for electric component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07114139B2 (en) | 1995-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4887969A (en) | IC socket | |
| JP4133141B2 (en) | Socket for electrical parts | |
| JP4721582B2 (en) | socket | |
| US7884630B2 (en) | IC carrie, IC socket and method for testing IC device | |
| JPH07240263A (en) | Burn-in receptacle | |
| US4984991A (en) | IC socket | |
| JP2854276B2 (en) | Tray unit for semiconductor device test | |
| JP2006294308A (en) | Socket for electrical component | |
| US5045923A (en) | Contact structure in socket with IC carrier placed thereon | |
| US5154619A (en) | Ic socket | |
| US5788526A (en) | Integrated circuit test socket having compliant lid and mechanical advantage latch | |
| JPH06224313A (en) | Ic carrier | |
| JP3755715B2 (en) | Socket for electrical parts | |
| JP4172856B2 (en) | IC socket | |
| JPH06140115A (en) | Ic socket | |
| KR100773194B1 (en) | Socket for BGA package | |
| US20040175986A1 (en) | Land grid array connector assembly with mounting base | |
| JPH08273777A (en) | Ic socket | |
| JP4038828B2 (en) | IC socket | |
| KR101279019B1 (en) | Socket adapter | |
| JP2002043007A (en) | Ic socket | |
| JP2507359Y2 (en) | IC socket | |
| US20240071983A1 (en) | Solder ball attaching apparatus | |
| JP4397110B2 (en) | Socket and electronic component mounting apparatus including the same | |
| JPH10112365A (en) | Ic socket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071206 Year of fee payment: 12 |