JPH06100708A - Composite laminated sheet - Google Patents
Composite laminated sheetInfo
- Publication number
- JPH06100708A JPH06100708A JP25331492A JP25331492A JPH06100708A JP H06100708 A JPH06100708 A JP H06100708A JP 25331492 A JP25331492 A JP 25331492A JP 25331492 A JP25331492 A JP 25331492A JP H06100708 A JPH06100708 A JP H06100708A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- glass fiber
- resin
- thermosetting resin
- woven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コンポジット積層板の
改良に関するものである。FIELD OF THE INVENTION This invention relates to improvements in composite laminates.
【０００２】[0002]
【従来の技術】電子電気機器の低価格化に伴って、これ
れに組み込んで使用されるプリント配線板にも低価格化
が要求されるようになり、プリント配線板の基板となる
積層板は、これまでガラス繊維織布基材積層板が用いら
れていた分野にも低コストのコンポジット積層板が用い
られるようになってきた。コンポジット積層板（ＣＥＭ
−３）は、芯層に使用されている基材がガラス繊維不織
布であることに起因して、ガラス繊維織布基材の積層板
（ＦＲ−４）に比べて加熱後の反りが大きい問題があ
る。これは、ガラス繊維織布がガラス繊維を均一に織っ
たものであるのに対し、ガラス繊維不織布はガラス短繊
維をランダムにからませたものであり空隙率が高いため
である。基材に含浸されている熱硬化性樹脂が硬化する
ときの収縮応力に対して、ガラス繊維不織布では不均一
な応力逃げが行なわれるために反りを生じるものと推測
されている。また、コンポジット積層板は、コスト低減
等の目的で樹脂中に無機充填剤を添加することが多く体
積中に基材の占める割合が低いため、樹脂に生じた応力
を基材が抑えることができなくなったときに反りを生じ
るとも考えられている。2. Description of the Related Art As the price of electronic and electrical equipment has become lower, the price of printed wiring boards used by incorporating them has also become lower. In the field where glass fiber woven substrate laminates have been used up to now, low cost composite laminates have come to be used. Composite laminate (CEM
-3) is a problem that the warp after heating is large as compared with the laminated plate (FR-4) of the glass fiber woven fabric substrate, because the substrate used for the core layer is the glass fiber nonwoven fabric. There is. This is because the glass fiber woven cloth is a uniform woven glass fiber, whereas the glass fiber nonwoven cloth is a short glass fiber randomly entangled and has a high porosity. It is presumed that warpage occurs due to uneven stress relief in the glass fiber nonwoven fabric against shrinkage stress when the thermosetting resin impregnated in the base material is cured. In addition, in the composite laminated plate, an inorganic filler is often added to the resin for the purpose of cost reduction and the ratio of the base material in the volume is low, so the base material can suppress the stress generated in the resin. It is also thought to warp when it disappears.
【０００３】一方、プリント配線板への部品搭載の方式
が、基板にあけた貫通孔への挿入実装から表面実装へ移
行しており、プリント配線板への部品の半田付け方式
も、部品を半田付けする位置だけを半田ごて等で加熱す
る手付け方式から、プリント配線板上に部品を搭載して
噴流半田槽の中を通すフローソルダー方式や、プリント
配線板上にクリーム半田を塗布し、部品を搭載して加熱
炉の中を通すリフロー方式に移行してきた。従来の方式
による半田付けでは、プリント配線板の一部分だけが加
熱されることが多く、プリント配線板全体が加熱される
ことは少なかったが、フローソルダー方式やリフロー方
式への移行により、プリント配線板全体が加熱される工
程が必須となってきた。On the other hand, the method of mounting components on a printed wiring board is shifting from insertion mounting in through holes formed in a board to surface mounting, and the method of soldering components to a printed wiring board is also soldering of components. From a manual method that heats only the position to be attached with a soldering iron, etc., a flow solder method that mounts components on the printed wiring board and lets it pass through the jet solder bath, or apply cream solder to the printed wiring board It has been moved to a reflow method in which the In conventional soldering, only a part of the printed wiring board is often heated and the entire printed wiring board is not heated so much, but due to the shift to the flow solder method or reflow method, the printed wiring board is The process of heating the whole has become essential.
【０００４】このような状況において、加熱処理により
反りやすいコンポジット積層板について、内部に生ずる
応力を抑える種々の検討が行われている。コンポジット
積層板は、マトリックス樹脂である熱硬化性樹脂をガラ
ス繊維織布、ガラス繊維不織布に含浸し、芯層をガラス
繊維不織布で、両表面層をガラス繊維織布で構成して、
加熱加圧成形して製造されるが、例えば、表面層に配置
するガラス繊維織布に含浸する熱硬化性樹脂に、可撓性
付与剤を単に添加したり、添加した可撓性付与剤を前記
熱硬化性樹脂または硬化剤と反応させて低応力化を図る
検討が行われている。Under such circumstances, various studies have been conducted on the composite laminated plate which is likely to warp by heat treatment to suppress the stress generated inside. The composite laminated plate is formed by impregnating a glass fiber woven fabric and a glass fiber non-woven fabric with a thermosetting resin which is a matrix resin, and forming the core layer with the glass fiber non-woven fabric and both surface layers with the glass fiber woven fabric,
It is produced by heat and pressure molding. For example, the flexibility-imparting agent is simply added to the thermosetting resin impregnated in the glass fiber woven fabric arranged in the surface layer, or the flexibility-imparting agent added is added. Studies have been conducted to reduce the stress by reacting with the thermosetting resin or the curing agent.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の技術では、コンポジット積層板の加熱後の反りを低
減することはできるが、プリント配線板の基板として必
要な他の特性、すなわち耐熱性および金属箔引き剥がし
強さの低下をもたらすという問題点があった。本発明が
解決しようとする課題は、表面実装等の基板全体の高温
加熱を行なうプリント配線板の製造工程に対応できる、
プリント配線板の基板として適したコンポジット積層板
を提供するもので、高温加熱後の反りを抑え、併せて耐
熱性、絶縁性、および金属箔引き剥がし強さを確保する
ことである。However, although the above-mentioned conventional technique can reduce the warpage of the composite laminate after heating, it has other properties required for the substrate of the printed wiring board, namely, heat resistance and metal. There is a problem in that the peeling strength of the foil is reduced. The problem to be solved by the present invention can be applied to a manufacturing process of a printed wiring board that performs high temperature heating of the entire substrate such as surface mounting.
The object of the present invention is to provide a composite laminated board suitable as a substrate for a printed wiring board, to suppress warpage after heating at a high temperature, and at the same time, ensure heat resistance, insulation, and metal foil peeling strength.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係る第１のコンポジット積層板は、芯層を
構成するガラス繊維不織布に含浸されている熱硬化性樹
脂がダイマー酸変性エポキシ樹脂を含み、ダイマー酸変
性エポキシ樹脂の配合量が、固型重量比で、前記熱硬化
性樹脂１００部に対して５０部以下であることを特徴と
する本発明に係る第２のコンポジット積層板は、上記第
１の発明において、ダイマー酸変性エポキシ樹脂がノボ
ラック型フェノール樹脂と反応させたものであり、その
配合量が固型重量比で、熱硬化性樹脂１００部に対して
６０部以下であることを特徴とする。本発明に係る第３
のコンポジット積層板は、芯層を構成するガラス繊維不
織布に含浸されている熱硬化性樹脂がプロピレンオキサ
イド付加ビスフェノールＡ型エポキシ樹脂を含み、プロ
ピレンオキサイド付加ビスフェノールＡ型エポキシ樹脂
の配合量が、固型重量比で、前記熱硬化性樹脂１００部
に対して４０部以下であることを特徴とする。In order to solve the above-mentioned problems, in the first composite laminate of the present invention, the thermosetting resin impregnated in the glass fiber nonwoven fabric constituting the core layer is modified with dimer acid. A second composite laminate according to the present invention, which contains an epoxy resin, and a dimer acid-modified epoxy resin is mixed in a solid weight ratio of 50 parts or less based on 100 parts of the thermosetting resin. The plate is a product obtained by reacting a dimer acid-modified epoxy resin with a novolac type phenol resin in the above-mentioned first invention, and the compounding amount thereof is 60 parts or less based on 100 parts of the thermosetting resin in a solid weight ratio. Is characterized in that. Third according to the present invention
In the composite laminated plate of No. 3, the thermosetting resin impregnated in the glass fiber non-woven fabric forming the core layer contains propylene oxide-added bisphenol A type epoxy resin, and the blending amount of propylene oxide-added bisphenol A type epoxy resin is solid type. The weight ratio is 40 parts or less with respect to 100 parts of the thermosetting resin.
【０００７】[0007]
【作用】本発明に係るコンポジット積層板は、ダイマー
酸変性エポキシ樹脂、またはプロピレンオキサイド付加
ビスフェノールＡ型エポキシ樹脂を芯層へ使用すること
により、プリント配線板の基板として必要な特性を低下
させることなく、高温加熱後の反りを低減するものであ
る。低弾性のダイマー酸変性エポキシ樹脂あるいはプロ
ピレンオキサイド付加ビスフェノールＡ型エポキシ樹脂
が熱硬化性樹脂中に存在することにより、熱硬化性樹脂
の硬化収縮により生ずる積層板の内部応力を吸収、緩和
する。ダイマー酸変性エポキシ樹脂がノボラック型フェ
ノール樹脂と反応させたものであるときは、未反応のダ
イマー酸変性エポキシ樹脂を低減することができ、耐熱
性の低下を抑制する上でより好ましいものである。低弾
性の上記ダイマー酸変性エポキシ樹脂を、コンポジット
積層板の表面層に配置するガラス繊維織布に含浸する熱
硬化性樹脂に配合して使用した場合は、ダイマー酸変性
エポキシ樹脂が有する脂肪族骨格の影響で、積層板の耐
熱性、および積層板の成形時に表面に一体に貼付た金属
箔の接着力を低下させてしまう。また、上記プロピレン
オキサイド付加ビスフェノールＡ型エポキシ樹脂を、コ
ンポジット積層板の表面層に配置するガラス繊維織布に
含浸する熱硬化性樹脂に配合して使用した場合は、プロ
ピレンオキサイド付加ビスフェノールＡ型エポキシ樹脂
が有するエーテル結合の影響で、積層板表面の絶縁抵抗
が劣化し、耐電食性を低下させてしまう。そこで、上記
ダイマー酸変性エポキシ樹脂あるいはプロピレンオキサ
イド付加ビスフェノールＡ型エポキシ樹脂を、芯層に配
置するガラス繊維不織布に含浸する熱硬化性樹脂に配合
しているわけである。但し、ダイマー酸変性エポキシ樹
脂の配合割合が多いと、積層板のガラス転移温度が低下
し、耐熱性、耐湿絶縁特性が低下する。また、プロピレ
ンオキサイド付加ビスフェノールＡ型エポキシ樹脂の配
合割合が多いと、積層板のガラス転移温度が低下し、耐
熱性、耐湿絶縁特性が低下するので、上記所定の配合量
に限定すべきである。The composite laminated board according to the present invention uses a dimer acid-modified epoxy resin or a propylene oxide-added bisphenol A type epoxy resin for the core layer without deteriorating the characteristics required as a substrate for a printed wiring board. In addition, the warp after heating at a high temperature is reduced. The presence of the low-elasticity dimer acid-modified epoxy resin or propylene oxide-added bisphenol A type epoxy resin in the thermosetting resin absorbs and relaxes the internal stress of the laminated plate caused by the curing shrinkage of the thermosetting resin. When the dimer acid-modified epoxy resin is reacted with a novolac type phenol resin, the amount of unreacted dimer acid-modified epoxy resin can be reduced, which is more preferable in suppressing the decrease in heat resistance. When the low-elasticity dimer acid-modified epoxy resin is blended with the thermosetting resin impregnated into the glass fiber woven fabric arranged in the surface layer of the composite laminate, the aliphatic skeleton of the dimer acid-modified epoxy resin is used. Under the influence of, the heat resistance of the laminated plate and the adhesive force of the metal foil integrally attached to the surface during molding of the laminated plate are reduced. Further, when the propylene oxide-added bisphenol A type epoxy resin is mixed with a thermosetting resin impregnated in a glass fiber woven fabric arranged in the surface layer of the composite laminate, the propylene oxide-added bisphenol A type epoxy resin is used. Due to the influence of the ether bond contained in, the insulation resistance of the surface of the laminated plate is deteriorated and the electrolytic corrosion resistance is reduced. Therefore, the above-mentioned dimer acid-modified epoxy resin or propylene oxide-added bisphenol A type epoxy resin is blended with the thermosetting resin that impregnates the glass fiber nonwoven fabric arranged in the core layer. However, when the blending ratio of the dimer acid-modified epoxy resin is high, the glass transition temperature of the laminated plate is lowered, and the heat resistance and the moisture resistant insulation property are lowered. Further, when the blending ratio of the propylene oxide-added bisphenol A type epoxy resin is large, the glass transition temperature of the laminated plate is lowered, and the heat resistance and the moisture resistance insulation characteristic are lowered, so the content should be limited to the above predetermined amount.
【０００８】[0008]
【実施例】本発明で使用するガラス繊維不織布は、ガラ
ス−紙混抄不織布等も含む。また、マトリックス樹脂で
ある熱硬化性樹脂は、エポキシ樹脂、フェノール樹脂、
ユリア樹脂、ポリイミド、ポリエステル等を適宜用いる
ことができる。これら熱硬化性樹脂には、品質改善、加
工性の向上、コスト低減などの目的で、無機充填剤（Ａ
ｌ2Ｏ3，Ａｌ2Ｏ3・Ｈ2Ｏ，Ａｌ2Ｏ3・３Ｈ2Ｏ，タル
ク，ＭｇＯ，ＳｉＯ2等）を配合してもよい。ノボラッ
ク型フェノール樹脂は、フェノール、アルキルフェノー
ル、２価フェノール、多価フェノール等フェノール類を
原料とするものである。本発明に係るコンポジット積層
板は、通常のプリント配線板のためのもののほか、多層
プリント配線板のための積層板も含むものである。本発
明に係るコンポジット積層板で使用するダイマー酸変性
エポキシ樹脂は、例えば、（化１）で示すものである。
また、プロピレンオキサイド付加ビスフェノールＡ型エ
ポキシ樹脂は、（化２）で示すものなどである。EXAMPLES The glass fiber non-woven fabric used in the present invention also includes a glass-paper mixed non-woven fabric. Further, the thermosetting resin which is a matrix resin, epoxy resin, phenol resin,
Urea resin, polyimide, polyester or the like can be used as appropriate. These thermosetting resins include inorganic filler (A) for the purpose of quality improvement, processability improvement, cost reduction, etc.
1 2 O 3 , Al 2 O 3 .H 2 O, Al 2 O 3 .3H 2 O, talc, MgO, SiO 2 etc.) may be added. The novolac type phenol resin is made of phenols such as phenol, alkylphenol, dihydric phenol and polyhydric phenol as raw materials. The composite laminate according to the present invention includes not only those for ordinary printed wiring boards but also those for multilayer printed wiring boards. The dimer acid-modified epoxy resin used in the composite laminate according to the present invention is, for example, one represented by (Chemical Formula 1).
In addition, the propylene oxide-added bisphenol A type epoxy resin is, for example, the one shown in Chemical formula 2.
【０００９】[0009]
【化１】 [Chemical 1]
【００１０】[0010]
【化２】 [Chemical 2]
【００１１】実施例１〜２、比較例１ ビスフェノールＡ型エポキシ樹脂（大日本インキ製エピ
クロン８５５）８０重量部に対して、硬化剤としてノボ
ラック型フェノール樹脂（大日本インキ製ブライオーフ
ェンＶＨ−４１７０）２０重量部、硬化促進剤２−エチ
ル−４−メチル−イミダゾール０．５重量部、無機充填
剤ＳｉＯ2５０重量部を配合し、ビスフェノールＡ型エ
ポキシ樹脂ワニス（Ａ）を調製した。ワニス（Ａ）と、
ダイマー酸変性エポキシ樹脂（東都化成製ＹＤ−１７
１）とを、表１に示す配合量（樹脂固型分重量）で希釈
溶剤メチルエチルケトンに溶解し、ワニス（Ｂ）を調製
した。単位重量５０ｇ／ｍ2のガラス繊維不織布に、ワ
ニス（Ｂ）を含浸乾燥して、充填剤を含む樹脂付着量８
４重量％のプリプレグ（Ｉ）を得た。別に準備したビス
フェノールＡ型エポキシ樹脂ワニス（Ｃ）を、単位重量
２０５ｇ／ｍ2のガラス繊維織布に含浸乾燥し、樹脂付
着量４０重量％のプリプレグ（II）を得た。プリプレグ
（Ｉ）を６プライ重ね、その両側にプリプレグ（II）を
１プライずつ配置し、さらに両側に厚さ１８μｍの銅箔
を載置して、加熱加圧積層成形により、厚さ１．６mmの
コンポジット銅張り積層板を得た。Examples 1 and 2, Comparative Example 1 80 parts by weight of a bisphenol A type epoxy resin (Dainippon Ink's Epicron 855) was used as a curing agent for a novolac type phenolic resin (Dainippon Ink's Briafen VH-4170). 20 parts by weight of a curing accelerator, 0.5 parts by weight of 2-ethyl-4-methyl-imidazole, and 50 parts by weight of an inorganic filler SiO 2 were mixed to prepare a bisphenol A type epoxy resin varnish (A). Varnish (A),
Dimer acid-modified epoxy resin (YD-17 manufactured by Tohto Kasei)
1) and 1) were dissolved in a diluting solvent methyl ethyl ketone in the blending amounts (resin solid content weight) shown in Table 1 to prepare a varnish (B). A glass fiber non-woven fabric having a unit weight of 50 g / m 2 is impregnated with the varnish (B) and dried to give a resin adhesion amount of 8 including a filler.
4% by weight of prepreg (I) was obtained. Separately prepared bisphenol A type epoxy resin varnish (C) was impregnated into a glass fiber woven fabric having a unit weight of 205 g / m 2 and dried to obtain a prepreg (II) having a resin adhesion amount of 40% by weight. Six plies of prepreg (I) are stacked, one ply of prepreg (II) is placed on each side of the prepreg, and copper foil with a thickness of 18 μm is placed on each side of the prepreg (I). A composite copper clad laminate of was obtained.
【００１２】実施例３ 実施例１におけるダイマー酸変性エポキシ樹脂７０重量
部とノボラック型フェノール樹脂３０重量部、２−エチ
ル−４−メチル−イミダゾール０．５重量部を配合し、
８０℃で５時間反応させ、ダイマー酸変性エポキシ樹脂
とノボラック型フェノール樹脂の予備反応物を調製し
た。実施例１で使用したワニス（Ａ）と、前記予備反応
物とを、表１に示す配合量（樹脂固型分重量）で希釈溶
剤メチルエチルケトンに溶解し、ワニス（Ｄ）を調製し
た。単位重量５０ｇ／ｍ2のガラス繊維不織布に、ワニ
ス（Ｄ）を含浸乾燥して、充填剤を含む樹脂付着量８４
重量％のプリプレグ（III）を得た。プリプレグ（III）
を６プライ重ね、その両側にプリプレグ（II）を１プラ
イずつ配置し、さらに両側に厚さ１８μｍの銅箔を載置
して、加熱加圧積層成形により、厚さ１．６mmのコンポ
ジット銅張り積層板を得た。Example 3 70 parts by weight of the dimer acid-modified epoxy resin in Example 1, 30 parts by weight of a novolac type phenol resin, and 0.5 parts by weight of 2-ethyl-4-methyl-imidazole were blended,
Reaction was carried out at 80 ° C. for 5 hours to prepare a preliminary reaction product of a dimer acid-modified epoxy resin and a novolac type phenol resin. Varnish (D) was prepared by dissolving the varnish (A) used in Example 1 and the pre-reacted product in the diluent solvent methyl ethyl ketone in the blending amounts (resin solid content weight) shown in Table 1. A glass fiber nonwoven fabric having a unit weight of 50 g / m 2 is impregnated with a varnish (D) and dried to obtain a resin adhesion amount of 84 including a filler.
A weight percent of prepreg (III) was obtained. Prepreg (III)
6 plies are stacked, 1 ply of prepreg (II) is placed on each side, and copper foil with a thickness of 18 μm is placed on both sides. A laminated board was obtained.
【００１３】[0013]
【表１】 [Table 1]
【００１４】実施例４〜５、比較例２ 実施例１で使用したワニス（Ａ）と、プロピレンオキサ
イド付加ビスフェノールＡ型エポキシ樹脂（三洋化成製
ＢＰＰ−３５０）とを、表２に示す配合量（樹脂固型分
重量）で希釈溶剤メチルエチルケトンに溶解し、ワニス
（Ｅ）を調製した。単位重量５０ｇ／ｍ2のガラス繊維
不織布に、ワニス（Ｅ）を含浸乾燥して、充填剤を含む
樹脂付着量８４重量％のプリプレグ（IV）を得た。プリ
プレグ（IV）を６プライ重ね、その両側にプリプレグ
（II）を１プライずつ配置し、さらに両側に厚さ１８μ
ｍの銅箔を載置して、加熱加圧積層成形により、厚さ
１．６mmのコンポジットタイプの銅張積層板を得た。Examples 4 to 5 and Comparative Example 2 The varnish (A) used in Example 1 and the propylene oxide-added bisphenol A type epoxy resin (BPP-350 manufactured by Sanyo Kasei) were blended in amounts shown in Table 2 ( A resin varnish (E) was prepared by dissolving the resin solid component weight) in a diluent solvent methyl ethyl ketone. A glass fiber nonwoven fabric having a unit weight of 50 g / m 2 was impregnated with the varnish (E) and dried to obtain a prepreg (IV) containing a filler and having a resin adhesion amount of 84% by weight. 6 plies of prepreg (IV) are piled up, 1 ply of prepreg (II) is placed on each side of the prepreg (IV), and the thickness is 18μ
m of copper foil was placed on the copper foil, and the laminate was heated and pressed to obtain a composite-type copper-clad laminate having a thickness of 1.6 mm.
【００１５】[0015]
【表２】 [Table 2]
【００１６】従来例１〜３ 実施例１で使用したワニス（Ｃ）と、ダイマー酸変性エ
ポキシ樹脂或はプロピレンオキサイド付加ビスフェノー
ルＡ型エポキシ樹脂とを、表３に示す配合量（樹脂固型
分重量）で配合し、ワニス（Ｆ）を調製した。単位重量
２０５ｇ／ｍ2のガラス繊維織布に、ワニス（Ｆ）を含
浸乾燥して、樹脂付着量４０重量％のプリプレグ（Ｖ）
を得た。実施例１で使用したワニス（Ａ）を、単位重量
５０ｇ／ｍ2のガラス繊維不織布に含浸乾燥して、充填
剤を含む樹脂付着量８４重量％のプリプレグ（VI）を得
た。プリプレグ（VI）を６プライ重ね、その両側にプリ
プレグ（Ｖ）を１プライずつ配置し、さらに両側に厚さ
１８μｍの銅箔を載置して、加熱加圧積層成形により、
厚さ１．６mmのコンポジット銅張り積層板を得た。Conventional Examples 1 to 3 The varnish (C) used in Example 1 and a dimer acid-modified epoxy resin or a propylene oxide-added bisphenol A type epoxy resin were blended in amounts shown in Table 3 (resin solid content weight). ) To prepare a varnish (F). A prepreg (V) having a unit weight of 205 g / m 2 impregnated with a varnish (F) and dried to give a resin adhesion amount of 40% by weight.
Got The varnish (A) used in Example 1 was impregnated into a glass fiber nonwoven fabric having a unit weight of 50 g / m 2 and dried to obtain a prepreg (VI) containing a filler and having a resin adhesion amount of 84% by weight. 6 plies of prepreg (VI) are stacked, 1 ply of prepreg (V) is placed on each side of the prepreg (VI), and a copper foil having a thickness of 18 μm is placed on each side of the prepreg (VI).
A 1.6 mm thick composite copper clad laminate was obtained.
【００１７】[0017]
【表３】 [Table 3]
【００１８】上記実施例、比較例、従来例の各積層板の
特性を表４に示す。表中、加熱後の反りは、試験片（サ
イズ：３４０×２５５mm，ｎ＝１２）に５００ｇの荷重
をかけてこれを２６０℃半田浴に１０秒間浮かべた後に
測定した平均値である。半田耐熱性は、試験片を３００
℃半田浴に浮かべ表面にふくれが発生するまでの時間を
測定した。銅箔ピール強度は、ＪＩＳ法により測定し
た。絶縁抵抗は、プレッシャークッカー処理（１２１
℃，２気圧，６ｈｒ）後に測定した。Table 4 shows the characteristics of the laminates of the above-mentioned examples, comparative examples and conventional examples. In the table, the warpage after heating is an average value measured after applying a load of 500 g to a test piece (size: 340 × 255 mm, n = 12) and floating it in a solder bath at 260 ° C. for 10 seconds. Solder heat resistance is 300
The time until the blistering on the floating surface in the solder bath was measured. The copper foil peel strength was measured by the JIS method. Insulation resistance is measured by pressure cooker treatment (121
The measurement was carried out after 2 hours at 6 ° C).
【００１９】[0019]
【表４】 [Table 4]
【００２０】[0020]
【発明の効果】上述したように、本発明に係るコンポジ
ット積層板は、加熱後の反り抑制と併せて、耐熱性、金
属箔引き剥がし強さおよび耐湿絶縁性を確保することが
できた。高温加熱工程対応のプリント配線板の基板とし
て適しており、耐湿絶縁性の確保により、狭ピッチのス
ルーホールを設けることが可能となり、従来より高密度
のプリント配線板を製造することができる。As described above, the composite laminate according to the present invention is able to secure the heat resistance, the peeling strength of the metal foil and the moisture-proof insulation together with the suppression of the warp after heating. It is suitable as a substrate for a printed wiring board compatible with high-temperature heating processes. By ensuring moisture-proof insulation, it is possible to provide through holes with a narrow pitch, and it is possible to manufacture a printed wiring board with a higher density than before.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｊ 7011−4Ｅ // Ｂ２９Ｋ 63:00 105:06 Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 J 7011-4E // B29K 63:00 105: 06
Claims (3)
芯層のシート状基材がガラス繊維不織布であり、これら
に熱硬化性樹脂が含浸され加熱加圧成形により一体化さ
れているコンポジット積層板において、ガラス繊維不織
布に含浸されている熱硬化性樹脂がダイマー酸変性エポ
キシ樹脂を含み、ダイマー酸変性エポキシ樹脂の配合量
が、固型重量比で、前記熱硬化性樹脂１００部に対して
５０部以下であることを特徴とするコンポジット積層
板。1. A sheet-like base material for a surface layer is woven glass fiber cloth,
In a composite laminate in which the sheet-like base material of the core layer is a glass fiber non-woven fabric and these are impregnated with a thermosetting resin and integrated by heat and pressure molding, the thermosetting resin impregnated in the glass fiber non-woven fabric Contains a dimer acid-modified epoxy resin, and the compounding amount of the dimer acid-modified epoxy resin is 50 parts or less based on 100 parts by weight of the thermosetting resin in a solid weight ratio.
型フェノール樹脂と反応させたものであり、その配合量
が、固型重量比で、熱硬化性樹脂１００部に対して６０
部以下であることを特徴とする請求項１記載のコンポジ
ット積層板。2. A dimer acid-modified epoxy resin is made to react with a novolac type phenol resin, and the compounding amount thereof is 60 relative to 100 parts of thermosetting resin in a solid weight ratio.
The composite laminate according to claim 1, wherein the composite laminate is less than or equal to 1 part.
芯層のシート状基材がガラス繊維不織布であり、これら
に熱硬化性樹脂が含浸され加熱加圧成形により一体化さ
れているコンポジット積層板において、ガラス繊維不織
布に含浸されている熱硬化性樹脂がプロピレンオキサイ
ド付加ビスフェノールＡ型エポキシ樹脂を含み、プロピ
レンオキサイド付加ビスフェノールＡ型エポキシ樹脂の
配合量が、固型重量比で、前記熱硬化性樹脂１００部に
対して４０部以下であることを特徴とするコンポジット
積層板。3. A sheet-like substrate for the surface layer is a glass fiber woven fabric,
In a composite laminate in which the sheet-like base material of the core layer is a glass fiber non-woven fabric and these are impregnated with a thermosetting resin and integrated by heat and pressure molding, the thermosetting resin impregnated into the glass fiber non-woven fabric Includes a propylene oxide-added bisphenol A type epoxy resin, and the blending amount of the propylene oxide-added bisphenol A type epoxy resin is 40 parts or less based on 100 parts by weight of the thermosetting resin in a solid weight ratio. Composite laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253314A JP2720726B2 (en) | 1992-09-24 | 1992-09-24 | Composite laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253314A JP2720726B2 (en) | 1992-09-24 | 1992-09-24 | Composite laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06100708A true JPH06100708A (en) | 1994-04-12 |
| JP2720726B2 JP2720726B2 (en) | 1998-03-04 |
Family
ID=17249578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4253314A Expired - Lifetime JP2720726B2 (en) | 1992-09-24 | 1992-09-24 | Composite laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2720726B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002264158A (en) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | Method for producing laminated plate |
| US6839187B2 (en) | 2002-12-11 | 2005-01-04 | Pentax Corporation | Lens distance-varying mechanism, and step-zoom lens incorporating the same |
| US6906871B2 (en) | 2002-12-11 | 2005-06-14 | Pentax Corporation | Cam mechanism for lens barrel |
| US6940658B2 (en) | 2002-12-11 | 2005-09-06 | Pentax Corporation | Step-zoom lens |
| CN114057395A (en) * | 2021-12-13 | 2022-02-18 | 苏州市华研富士新材料有限公司 | High-strength high-temperature-resistant glass fiber composite board and production process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225132A (en) * | 1985-07-24 | 1987-02-03 | Shin Kobe Electric Mach Co Ltd | Production of laminated sheet |
| JPS63270747A (en) * | 1987-04-30 | 1988-11-08 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
-
1992
- 1992-09-24 JP JP4253314A patent/JP2720726B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225132A (en) * | 1985-07-24 | 1987-02-03 | Shin Kobe Electric Mach Co Ltd | Production of laminated sheet |
| JPS63270747A (en) * | 1987-04-30 | 1988-11-08 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002264158A (en) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | Method for producing laminated plate |
| US6839187B2 (en) | 2002-12-11 | 2005-01-04 | Pentax Corporation | Lens distance-varying mechanism, and step-zoom lens incorporating the same |
| US6906871B2 (en) | 2002-12-11 | 2005-06-14 | Pentax Corporation | Cam mechanism for lens barrel |
| US6940658B2 (en) | 2002-12-11 | 2005-09-06 | Pentax Corporation | Step-zoom lens |
| CN114057395A (en) * | 2021-12-13 | 2022-02-18 | 苏州市华研富士新材料有限公司 | High-strength high-temperature-resistant glass fiber composite board and production process thereof |
| CN114057395B (en) * | 2021-12-13 | 2023-09-12 | 苏州市华研富士新材料有限公司 | High-strength high-temperature-resistant glass fiber composite board and production process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2720726B2 (en) | 1998-03-04 |
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