JPH0593052A - Electronic part and resin composition for sealing the same - Google Patents
Electronic part and resin composition for sealing the sameInfo
- Publication number
- JPH0593052A JPH0593052A JP25324891A JP25324891A JPH0593052A JP H0593052 A JPH0593052 A JP H0593052A JP 25324891 A JP25324891 A JP 25324891A JP 25324891 A JP25324891 A JP 25324891A JP H0593052 A JPH0593052 A JP H0593052A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- inorganic powder
- mol
- oxide
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、溶融時に光学的異方性
を示す溶融加工性ポリエステル樹脂からなる電子部品の
封止材に係わる。更に詳しくは、流動性及び耐湿性に優
れた電子部品封止用樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing material for electronic parts made of a melt-processable polyester resin which exhibits optical anisotropy when melted. More specifically, it relates to a resin composition for encapsulating electronic components, which has excellent fluidity and moisture resistance.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】例えば
IC、トランジスター、ダイオード、コイル、コンデンサ
ー、抵抗器、コネクター、LSI 等においては、電気絶縁
性の保持、外力に対する保護、外部雰囲気による特性変
化の防止等の目的で、これらを合成樹脂で封止すること
が広く行われている。異方性溶融相を形成し得る溶融加
工性ポリエステル（以下「液晶性ポリエステル」と略
す）は低線膨張係数、低成形収縮、低弾性係数等の優れ
た性質を有する点から封止材に極めて適した素材であ
る。ところが、高分子量の液晶性ポリエステルを用いた
電子部品封止材は、射出成形条件によっては溶融時の流
動不足、流動時の剪断力の為、素子の金線の変形、断線
等、部品の内部構造に損傷を与える場合がある。また、
従来の液晶性ポリエステルからなる電子部品封止材は吸
湿性が高いため、高湿条件下で使用すると吸収された水
分による電流のリーク、或いは素子の腐食などが生じる
ことがあった。この様な問題点は、最近の様に電子部品
の素子の構造が複雑となるにつれて、ますます注目され
ている。BACKGROUND OF THE INVENTION Problems to be Solved by the Invention
ICs, transistors, diodes, coils, capacitors, resistors, connectors, LSIs, etc. are sealed with synthetic resin for the purpose of maintaining electrical insulation, protecting against external forces, and preventing characteristic changes due to the external atmosphere. Is widely practiced. Melt processable polyester (hereinafter abbreviated as "liquid crystalline polyester") capable of forming an anisotropic melt phase is extremely useful as an encapsulant because of its excellent properties such as low linear expansion coefficient, low molding shrinkage and low elastic modulus. It is a suitable material. However, the electronic component encapsulant using high molecular weight liquid crystalline polyester may not be able to flow inside the component due to insufficient flow during melting or shear force during flow, depending on the injection molding conditions, such as deformation of the gold wire of the element or disconnection. May damage structure. Also,
Since conventional electronic component encapsulants made of liquid crystalline polyester have high hygroscopicity, leakage of current due to absorbed moisture or element corrosion may occur when used under high humidity conditions. Such a problem has been attracting more and more attention as the device structure of electronic components has become more complicated recently.
【０００３】[0003]
【課題を解決するための手段】本発明者らは上記問題点
を解決すべく鋭意検討した結果、特定の液晶性ポリエス
テルが有効であることを見出し、本発明に至った。As a result of intensive studies to solve the above problems, the present inventors have found that a specific liquid crystalline polyester is effective, and have completed the present invention.
【０００４】すなわち、本発明は、重量平均分子量が1,
000 〜25,000で、下記（Ｉ）〜（IV）で表わされる構成
単位を含み、全構成単位に対して（Ｉ）が50乃至85モル
％、（II）が0.1 乃至５モル％、（III)が５乃至37モル
％、（IV）が4.5 乃至23モル％である異方性溶融相を形
成し得る溶融加工性ポリエステルを樹脂を主成分とする
電子部品封止用樹脂組成物を提供するものである。That is, the present invention has a weight average molecular weight of 1,
000 to 25,000, including the structural units represented by the following (I) to (IV), wherein (I) is 50 to 85 mol%, (II) is 0.1 to 5 mol%, and (III) To provide a resin composition for encapsulating electronic parts, which contains a melt-processible polyester capable of forming an anisotropic melt phase having a content of 5 to 37 mol% and a content of (IV) of 4.5 to 23 mol% as a main component. Is.
【０００５】[0005]
【化２】 [Chemical 2]
【０００６】（Ｉ）〜（IV）の各構成単位を実現する原
料としては、以下のものが代表的な例としてあげられ
る。 （Ｉ）式は、ｐ−ヒドロキシ安息香酸及びその誘導体で
あるｐ−アセトキシ安息香酸、ｐ−ヒドロキシ安息香酸
フェニルエステル、ｐ−ヒドロキシ安息香酸メチルエス
テル等である。 （II）式は、６−ヒドロキシ−２−ナフトエ酸及びその
誘導体である６−アセトキシ−２−ナフトエ酸、６−ヒ
ドロキシ−２−ナフトエ酸フェニルエステル、６−ヒド
ロキシ−２−ナフトエ酸メチルエステル等である。 （III)式は、テレフタル酸、イソフタル酸、2,6 −ナフ
タレンジカルボン酸及びその誘導体であり、特にテレフ
タル酸及びその誘導体が好ましい。 （IV）式は、ハイドロキノン、レゾルシン、4,4'−ジヒ
ドロキシビフェニル、4,4'−ジヒドロキシジフェニルプ
ロパン、4,4'−ジヒドロキシベンゾフェノン、4,4'−ジ
ヒドロキシジフェニルスルホン及びその誘導体である各
化合物のアセトキシ化物等である。中でも4,4'−ジヒド
ロキシビフェニル、4,4'−ジヒドロキシジフェニルプロ
パン及びその誘導体が好ましく、特に4,4'−ジヒドロキ
シビフェニル及びその誘導体が好ましい。 構成単位（Ｉ）は全体に対し50〜85モル％であり、好ま
しくは50〜75モル％である。これらの範囲を越えると、
溶融粘度が上昇し、加工性が阻害される。構成単位（I
I）は全体に対し0.1 〜５モル％であり、好ましくは１
〜４モル％である。これより少ないと溶融粘度の上昇に
より加工性が阻害され、また多いと所望の耐湿性が得ら
れない。構成単位（III)は全体に対し５乃至37モル％で
あり、構成単位（IV）は全体に対し4.5 乃至23モル％で
ある。この構成単位（III)と構成単位（IV）の比率の差
を0.5 〜15モル％に調製することにより、所望の分子量
のポリマーを得ることができる。The following are typical examples of the raw materials for realizing the constituent units (I) to (IV). Formula (I) includes p-hydroxybenzoic acid and its derivatives, p-acetoxybenzoic acid, p-hydroxybenzoic acid phenyl ester, p-hydroxybenzoic acid methyl ester, and the like. The formula (II) is represented by 6-hydroxy-2-naphthoic acid and its derivatives, 6-acetoxy-2-naphthoic acid, 6-hydroxy-2-naphthoic acid phenyl ester, 6-hydroxy-2-naphthoic acid methyl ester, and the like. Is. Formula (III) is terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid and its derivatives, and terephthalic acid and its derivatives are particularly preferable. The formula (IV) is hydroquinone, resorcin, 4,4'-dihydroxybiphenyl, 4,4'-dihydroxydiphenylpropane, 4,4'-dihydroxybenzophenone, 4,4'-dihydroxydiphenylsulfone and each compound thereof which is a derivative thereof. The acetoxy compound and the like. Of these, 4,4'-dihydroxybiphenyl, 4,4'-dihydroxydiphenylpropane and its derivatives are preferable, and 4,4'-dihydroxybiphenyl and its derivatives are particularly preferable. The structural unit (I) is 50 to 85 mol%, preferably 50 to 75 mol%, based on the whole. Beyond these ranges,
The melt viscosity increases, and the workability is impaired. Building block (I
I) is 0.1 to 5 mol%, preferably 1
~ 4 mol%. If it is less than this range, the workability is hindered by the increase in melt viscosity, and if it is more than this, the desired moisture resistance cannot be obtained. The structural unit (III) is 5 to 37 mol% based on the whole, and the structural unit (IV) is 4.5 to 23 mol% based on the whole. A polymer having a desired molecular weight can be obtained by adjusting the difference in the ratio of the structural unit (III) and the structural unit (IV) to 0.5 to 15 mol%.
【０００７】本発明で用いるのに好適な液晶性ポリエス
テルは一般に重量平均分子量1,000〜25,000である。1,0
00 未満では成形性が悪く、26000 以上では流動不足、
流動時の剪断力により封止すべき物体の破損、変形等を
生じ好ましくない。好ましくは約2,000 〜8,000 であ
る。かかる分子量の測定は、ゲルパーミエーションクロ
マトグラフィーならびにその他のポリマーの溶液形成を
伴わない標準的測定法、例えば圧縮成形フィルムについ
て赤外分光法により末端基を定量することにより実施で
きる。また、ペンタフルオロフェノール溶液にして光散
乱法を用いて分子量を測定することもできる。本発明に
用いるポリエステルは、直接重合法やエステル交換法を
用いて重合でき、重合に際しては、通常溶融重合法やス
ラリー重合法が用いられる。これらの重合に際しては種
々の触媒の使用が可能であり、代表的なものはジアルキ
ル錫酸化物、ジアリール錫酸化物、二酸化チタン、アル
コキシチタンけい酸塩類、チタンアルコラート類、カル
ボン酸のアルカリ及びアルカリ土類金属塩類、BF3 の如
きルイス酸等が挙げられる。触媒の使用量は一般にはモ
ノマーの全重量に基いて約0.001 乃至１重量％、特に約
0.01乃至0.2 重量％が好ましい。溶融時に光学的異方性
を示す液晶性ポリマーであることは、本発明において耐
湿性と易加工性を併せ持つ上で不可欠な要素である。溶
融異方性の性質は直交偏光子を利用した慣用の偏光検査
方法により確認することができる。より具体的には溶融
異方性の確認はLeitz 偏光顕微鏡を使用しLeitz ホット
ステージにのせた試料を溶融し、窒素雰囲気下で40倍の
倍率で観察することにより実施できる。上記ポリマーは
光学的に異方性であり、直交偏光子間に挿入したとき光
を透過させる。試料が光学的に異方性であると、例えば
溶融静止液状態であっても偏光は透過する。The liquid crystalline polyester suitable for use in the present invention generally has a weight average molecular weight of 1,000 to 25,000. 1,0
If it is less than 00, moldability is poor, and if it is 26000 or more, fluidity is insufficient.
The shearing force at the time of flow undesirably causes damage or deformation of the object to be sealed. It is preferably about 2,000 to 8,000. The measurement of such a molecular weight can be carried out by a standard measurement method which does not involve solution formation of gel permeation chromatography and other polymers, for example, by quantifying an end group by infrared spectroscopy on a compression molded film. The molecular weight can also be measured by using a pentafluorophenol solution and using a light scattering method. The polyester used in the present invention can be polymerized by a direct polymerization method or a transesterification method, and in the polymerization, a melt polymerization method or a slurry polymerization method is usually used. Various catalysts can be used in these polymerizations, and representative ones are dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxytitanium silicates, titanium alcoholates, carboxylic acid alkali and alkaline earth. Examples thereof include metal salts, Lewis acids such as BF 3 . The amount of catalyst used is generally about 0.001 to 1% by weight, based on the total weight of the monomers, especially about
0.01 to 0.2% by weight is preferred. A liquid crystalline polymer that exhibits optical anisotropy when melted is an essential element in the present invention in order to have both moisture resistance and easy processability. The property of melt anisotropy can be confirmed by a conventional polarization inspection method using a crossed polarizer. More specifically, the melt anisotropy can be confirmed by using a Leitz polarization microscope to melt a sample placed on a Leitz hot stage and observing the sample in a nitrogen atmosphere at a magnification of 40 times. The polymer is optically anisotropic and transmits light when inserted between crossed polarizers. When the sample is optically anisotropic, polarized light is transmitted even in the molten still liquid state, for example.
【０００８】本発明の電子部品封止用樹脂組成物には無
機粉末を配合するのが好ましい。本発明に使用する無機
粉末とは、非導電性であれば特に限定されないが、好ま
しくは熱伝導率が300°K で10W/m・K以上であるものが
良い。熱伝導率の良好な無機粉末としては金属又は珪素
の酸化物、窒化物、炭化物を挙げることができる。この
場合、元素としては周期律表第II、III 、IV族の夫々第
７列までの元素から選ばれる。具体的な化合物として酸
化珪素、特に溶融シリカ、酸化ベリリウム、酸化マグネ
シウム、酸化アルミニウム、酸化トリウム、酸化亜鉛、
窒化珪素、窒化硼素、窒化アルミニウム、炭化珪素を挙
げることができる。これらの無機粉末は、一種又は二種
以上併用使用することができる。これらの中で、酸化珪
素が好ましく、特に溶融シリカが更に好ましい。無機粉
末は粉粒状であることが好ましく、その好ましい平均粒
径は１〜100 μm であり、更に好ましくは10〜70μm で
ある。無機粉末の使用量は、得られる組成物が封止すべ
き電子部品の線膨張係数と一致する様な組成であること
が好ましく、また、必要とされる熱伝導度や強度を得る
量に調製する必要がある。よってその使用量は全組成物
に対し、20〜80重量％、好ましくは20〜75重量％、特に
40〜75重量％が好ましい。It is preferable to add an inorganic powder to the resin composition for sealing electronic parts of the present invention. The inorganic powder used in the present invention is not particularly limited as long as it is non-conductive, but preferably has a thermal conductivity of 10 W / m · K or more at 300 ° K. Examples of the inorganic powder having a good thermal conductivity include oxides, nitrides and carbides of metal or silicon. In this case, the element is selected from the elements up to the seventh column of each of the II, III and IV groups of the periodic table. As a specific compound, silicon oxide, particularly fused silica, beryllium oxide, magnesium oxide, aluminum oxide, thorium oxide, zinc oxide,
Examples thereof include silicon nitride, boron nitride, aluminum nitride, and silicon carbide. These inorganic powders can be used alone or in combination of two or more. Of these, silicon oxide is preferable, and fused silica is particularly preferable. The inorganic powder is preferably in the form of powder, and its average particle size is preferably 1 to 100 μm, more preferably 10 to 70 μm. The amount of the inorganic powder used is preferably such that the composition obtained matches the linear expansion coefficient of the electronic component to be sealed, and the amount is adjusted to obtain the required thermal conductivity and strength. There is a need to. Therefore, the amount used is 20 to 80% by weight, preferably 20 to 75% by weight, especially
40-75% by weight is preferred.
【０００９】本発明の封止材には更に成形硬化時、及び
急激な温度変化のある使用時の樹脂の低歪化、低応力化
及び封止すべき物体との接着性のためシリコーンを配合
することができる。ここで言うシリコーンとはシリコー
ンオイル、シリコーンゴム、シリコーン樹脂である。こ
れらはポリオルガノシロキサンであり、主成分のジメチ
ルポリシロキサンの側鎖、例えばメチル基の一部及び／
又は主鎖末端の少なくとも一部が、水素、アルキル基、
アリール基、ハロゲン化アルキル基、ハロゲン化アリー
ル基、アミノ変性アルキル基、メルカプト変性アルキル
基、エポキシ変性アルキル基、カルボキシル基変性アル
キル基を有するもの、ポリエーテル変性化合物、アルコ
ール変性化合物、エステル変性化合物の一種又は二種以
上で置換されたものであっても良く、又架橋又はグラフ
ト構造を有するものであっても良い。使用するシリコー
ンオイルの粘度は0.5 〜1,000,000cStの範囲のものであ
り、好ましくは500 〜600,000cStである。押出、成形の
操作性及び成形性の樹脂からのしみ出しにくさの面か
ら、特に1,000 〜100,000cStの粘度のものが好ましい。
シリコーンオイルの添加量は組成物全量に対して 0.1〜
５重量％が好ましく、更に好ましくは0.5 〜３重量％で
ある。本発明に於いて、使用するシリコーンゴムは、粉
粒状のものが好ましく、高重合度のオルガノポリシロキ
サンに無機充填剤、硬化剤を混練し、熱加硫して架橋さ
せたミラブル型シリコーンゴム、この他触媒の存在下、
加熱、紫外線照射等により反応基を有するオルガノポリ
シロキサンの少なくとも一種以上を架橋させたシリコー
ンゴム等である。特に白金化合物触媒下でビニル基等の
不飽和基と-Si-H との間のヒドロシリル化付加反応によ
って架橋する付加型の粉粒状のシリコーンゴムが好まし
い。該粉粒状シリコーンゴムとしては、平均粒径 0.1〜
100 μm のものが好ましく、特に好ましくは１〜20μm
のものである。シリコーンゴムの添加量は組成物全量に
対して１〜20重量％が好ましく、更に好ましくは２〜15
重量％である。本発明に於いて、使用するシリコーン樹
脂とは三次元の高度に網状構造をもったポリオルガノシ
ロキサンであり、粉粒化したものが好ましく、平均粒径
0.1 〜100 μm のものが好ましく、特に好ましくは１〜
20μm のものである。シリコーン樹脂の添加量は組成物
全量に対して１〜20重量％が好ましい。The encapsulant of the present invention is further blended with silicone for the purpose of lowering the strain and stress of the resin at the time of molding and curing, and at the time of use with a sudden temperature change, and for the adhesiveness to the object to be sealed. can do. The silicone mentioned here is silicone oil, silicone rubber, or silicone resin. These are polyorganosiloxanes, which have side chains of the main component dimethylpolysiloxane, such as part of the methyl groups and / or
Alternatively, at least a part of the main chain terminal is hydrogen, an alkyl group,
Of aryl groups, halogenated alkyl groups, halogenated aryl groups, amino modified alkyl groups, mercapto modified alkyl groups, epoxy modified alkyl groups, carboxyl group modified alkyl groups, polyether modified compounds, alcohol modified compounds, ester modified compounds It may be substituted with one kind or two or more kinds, or may have a crosslinked or graft structure. The viscosity of the silicone oil used is in the range of 0.5 to 1,000,000 cSt, preferably 500 to 600,000 cSt. From the viewpoints of operability in extrusion and molding and difficulty in exuding from a resin having moldability, a viscosity of 1,000 to 100,000 cSt is particularly preferable.
The amount of silicone oil added is 0.1 to the total amount of the composition.
It is preferably 5% by weight, more preferably 0.5 to 3% by weight. In the present invention, the silicone rubber used is preferably a powdery granular one, a high polymerization degree of organopolysiloxane, an inorganic filler, a kneading agent is kneaded, and heat-vulcanized to crosslink a millable silicone rubber, In the presence of other catalysts,
It is a silicone rubber or the like in which at least one kind of organopolysiloxane having a reactive group is crosslinked by heating, irradiation with ultraviolet rays, or the like. In particular, an addition type powdery or granular silicone rubber which is crosslinked by a hydrosilylation addition reaction between an unsaturated group such as a vinyl group and -Si-H under a platinum compound catalyst is preferable. The powdery granular silicone rubber has an average particle size of 0.1 to
100 μm is preferable, and 1 to 20 μm is particularly preferable.
belongs to. The amount of silicone rubber added is preferably 1 to 20% by weight, more preferably 2 to 15% by weight, based on the total amount of the composition.
% By weight. In the present invention, the silicone resin to be used is a polyorganosiloxane having a three-dimensional highly network structure, preferably a powdered one, and an average particle size.
It is preferably 0.1 to 100 μm, particularly preferably 1 to
It is 20 μm. The addition amount of the silicone resin is preferably 1 to 20% by weight based on the total amount of the composition.
【００１０】本発明の封止剤には更に従来通常使用され
る前記以外の無機充填剤、染顔料、離型剤、酸化防止
剤、熱安定剤、強化剤、加水分解安定剤等の添加剤を配
合し得る。上記安定剤としては、各種エポキシ樹脂を使
用するのが好ましい。The sealant of the present invention further contains additives such as inorganic fillers, dyes and pigments, release agents, antioxidants, heat stabilizers, reinforcing agents, hydrolysis stabilizers, etc. Can be blended. As the stabilizer, it is preferable to use various epoxy resins.
【００１１】[0011]
【実施例】以下、実施例により本発明を更に具体的に説
明するが、本発明はこれらに限定されるものではない。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
【００１２】実施例１ 表１に示す如く、ｐ−アセトキシ安息香酸58モル％、６
−アセトキシ−２−ナフトエ酸４モル％、テレフタル酸
20.2モル％、4,4'−ジアセトキシビフェニル17.5モル％
及び全仕込み量に対し0.05重量％の酢酸カリウムを各
々、攪拌機、窒素導入管及び留出管を備えた反応器中に
仕込み、窒素気流下でこの混合物を１時間で260 ℃にま
で加熱した。反応器中から酢酸を留出させながら 260〜
300 ℃に２時間加熱し、更に 300〜320 ℃で１時間、 3
20〜360 ℃で１時間加熱し、真空下に酢酸を留出させ
た。次いで窒素を導入し室温まで冷却した。得られた重
合体は360 ℃で偏光ホットステージ顕微鏡観察により光
学異方性を示した。この重合体に平均粒径20μm の溶融
シリカを50重量％の割合で混合し、通常の押出成形機で
320 ℃で常法に従ってペレット化した。次にいわゆるイ
ンサート射出成形法でDIP 型14ピンICを成形した。下記
に示す測定法で評価した結果を表１に示す。試験法は次
の通りである。 （ICの金線断線数）図１に示す如き封止成形品に導通テ
ストを行い、チップ１とリードフレーム２間の金線３の
断線率（100 個の試料中の断線試料数）を測定した。 （ICの金線スイープ）封止成形品を軟Ｘ線で観察し、図
２におけるd/l を測定し、その平均を算出した。 （PCT 不良率）封止成形品を133 ℃、100 ％RHのオート
クレーブ中に入れ、100 時間後のIC不良率（100 個の試
料中の不良試料率）を測定した。 （半田耐熱性）半田耐熱性は280 ℃、30秒の半田浴中に
封止成形品を浸した後、表面を観察した。フクレ、し
わ、クラック、変形等の異常が認められたものは×、異
常のなかったものは○とした。Example 1 As shown in Table 1, p-acetoxybenzoic acid 58 mol%, 6
-Acetoxy-2-naphthoic acid 4 mol%, terephthalic acid
20.2 mol%, 4,4'-diacetoxybiphenyl 17.5 mol%
And 0.05% by weight of potassium acetate based on the total charged amount were charged into a reactor equipped with a stirrer, a nitrogen introducing tube and a distilling tube, and the mixture was heated to 260 ° C. for 1 hour under a nitrogen stream. 260 ~ while distilling acetic acid from the reactor
Heat at 300 ℃ for 2 hours, then at 300-320 ℃ for 1 hour, 3
The mixture was heated at 20 to 360 ° C for 1 hour, and acetic acid was distilled off under vacuum. Then, nitrogen was introduced and the mixture was cooled to room temperature. The polymer obtained exhibited optical anisotropy at 360 ° C. by observation with a polarized hot stage microscope. Fused silica having an average particle size of 20 μm was mixed with this polymer at a ratio of 50% by weight, and the mixture was mixed with an ordinary extruder.
Pelletization was carried out at 320 ° C according to a conventional method. Next, a DIP type 14-pin IC was molded by the so-called insert injection molding method. Table 1 shows the results evaluated by the measurement methods shown below. The test method is as follows. (Number of gold wire breaks in IC) Conduct a continuity test on the sealed molded product as shown in Fig. 1 and measure the wire breakage rate of the gold wire 3 between the chip 1 and the lead frame 2 (the number of broken wire samples in 100 samples). did. (IC gold wire sweep) The sealed molded product was observed by soft X-ray, d / l in FIG. 2 was measured, and the average thereof was calculated. (PCT defect rate) The encapsulation molded product was put in an autoclave at 133 ° C and 100% RH, and the IC defect rate (defective sample rate in 100 samples) after 100 hours was measured. (Solder heat resistance) The solder heat resistance was measured by immersing the molded encapsulation product in a solder bath at 280 ° C for 30 seconds and then observing the surface. When abnormalities such as blisters, wrinkles, cracks, and deformation were observed, x was given, and when no abnormalities were given, o was given.
【００１３】実施例２〜４ 最終的に加熱する温度が重合物の流動する温度域を下回
らないように設定する以外は実施例１と略同様の方法で
表１に記載の構成比率で各々重合を行い、得られた重合
体も同様の手法で評価した。結果を表１に示す。Examples 2 to 4 Polymerization was carried out in substantially the same manner as in Example 1 except that the final heating temperature was set not to fall below the temperature range in which the polymer flows, and the composition ratios shown in Table 1 were used. The obtained polymer was evaluated by the same method. The results are shown in Table 1.
【００１４】比較例１〜３ 最終的に加熱する温度が重合物の流動する温度域を下回
らないように設定する以外は実施例１と略同様の方法で
表１に記載の構成比率で各々重合を行い、得られた重合
体も同様の手法で評価した。結果を表１に示す。Comparative Examples 1 to 3 Polymerization was carried out in substantially the same manner as in Example 1 except that the final heating temperature was set not to fall below the temperature range in which the polymer flowed. The obtained polymer was evaluated by the same method. The results are shown in Table 1.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】以上述べた様に、本発明の電子部品封止
用樹脂組成物によれば溶融時に高い流動性を示し、また
高い耐湿性を有する封止材を得ることが可能となる。As described above, the resin composition for encapsulating electronic parts of the present invention makes it possible to obtain an encapsulant which exhibits high fluidity when melted and has high moisture resistance.
【図１】実施例で作成した封止成形品の略示平面図であ
る。FIG. 1 is a schematic plan view of a sealing molded product created in an example.
【図２】ICの金線スイープ試験の実施状況を示す模式図
である。FIG. 2 is a schematic diagram showing a state of implementation of a gold wire sweep test of an IC.
１…チップ ２…リードフレーム ３…金線 3a…成形前の金線の状態 3b…成形後の金線の状態 1 ... Chip 2 ... Lead frame 3 ... Gold wire 3a ... Gold wire before molding 3b ... Gold wire after molding
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｃ 1/02 Ｍ 7161−5Ｅ Ｈ０１Ｌ 23/29 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01C 1/02 M 7161-5E H01L 23/29 23/31
Claims (9)
記（Ｉ）〜（IV）で表わされる構成単位を含み、全構成
単位に対して（Ｉ）が50乃至85モル％、（II）が0.1 乃
至５モル％、（III)が５乃至37モル％、（IV）が4.5 乃
至23モル％である異方性溶融相を形成し得る溶融加工性
ポリエステルを主成分とする電子部品封止用樹脂組成
物。 【化１】 1. A weight average molecular weight of 1,000 to 25,000, including structural units represented by the following (I) to (IV), wherein (I) is 50 to 85 mol%, and (II) is For encapsulating electronic parts containing melt-processible polyester as a main component capable of forming an anisotropic melt phase having 0.1 to 5 mol%, (III) 5 to 37 mol%, and (IV) 4.5 to 23 mol% Resin composition. [Chemical 1]
リエステルに、20〜80重量％の無機粉末を配合してなる
請求項１記載の電子部品封止用樹脂組成物。2. The resin composition for encapsulating an electronic component according to claim 1, wherein the melt-processable polyester capable of forming an anisotropic melt phase is mixed with 20 to 80% by weight of inorganic powder.
K 以上で且つ非導電性の無機粉末である請求項２記載の
電子部品封止用樹脂組成物。3. The inorganic powder has a thermal conductivity of 10 W / m · at 300 ° K.
The resin composition for electronic component encapsulation according to claim 2, which is an inorganic powder having a temperature of K or more and non-conductivity.
物及び炭化物より選ばれた化合物である請求項２又は３
記載の電子部品封止用樹脂組成物。4. The inorganic powder is a compound selected from oxides, nitrides and carbides of metals or silicon.
A resin composition for encapsulating an electronic component as described above.
々第７列までの元素の酸化物、窒化物、炭化物より選ば
れた化合物である請求項２、３又は４記載の電子部品封
止用樹脂組成物。5. The electron according to claim 2, 3 or 4, wherein the inorganic powder is a compound selected from oxides, nitrides and carbides of elements up to the seventh column of each of Group II, III and IV of the Periodic Table. A resin composition for sealing components.
酸化マグネシウム、酸化アルミニウム、酸化トリウム、
酸化亜鉛、窒化珪素、窒化硼素、窒化アルミニウム及び
炭化珪素よりなる群から選ばれた一種又は二種以上の化
合物である請求項２〜５の何れか１項記載の電子部品封
止用樹脂組成物。6. The inorganic powder is silicon oxide, beryllium oxide,
Magnesium oxide, aluminum oxide, thorium oxide,
The resin composition for encapsulating electronic components according to any one of claims 2 to 5, which is one or more compounds selected from the group consisting of zinc oxide, silicon nitride, boron nitride, aluminum nitride and silicon carbide. ..
載の電子部品封止用樹脂組成物。7. The resin composition for encapsulating electronic components according to claim 6, wherein the silicon oxide is fused silica.
に更にシリコーンを配合してなる電子部品封止用樹脂組
成物。8. A resin composition for encapsulating electronic parts, which is obtained by further blending silicone with the composition according to any one of claims 1 to 7.
を用いて封止してなる電子部品。9. An electronic component which is encapsulated with the composition according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25324891A JP3056300B2 (en) | 1991-10-01 | 1991-10-01 | Resin composition for sealing electronic parts and electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25324891A JP3056300B2 (en) | 1991-10-01 | 1991-10-01 | Resin composition for sealing electronic parts and electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0593052A true JPH0593052A (en) | 1993-04-16 |
| JP3056300B2 JP3056300B2 (en) | 2000-06-26 |
Family
ID=17248628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25324891A Expired - Fee Related JP3056300B2 (en) | 1991-10-01 | 1991-10-01 | Resin composition for sealing electronic parts and electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3056300B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09289849A (en) * | 1996-04-26 | 1997-11-11 | Toray Ind Inc | Fishing line guide |
| CN100436519C (en) * | 2004-05-14 | 2008-11-26 | 住友化学株式会社 | Highly thermal-conductive resin composition |
-
1991
- 1991-10-01 JP JP25324891A patent/JP3056300B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09289849A (en) * | 1996-04-26 | 1997-11-11 | Toray Ind Inc | Fishing line guide |
| CN100436519C (en) * | 2004-05-14 | 2008-11-26 | 住友化学株式会社 | Highly thermal-conductive resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3056300B2 (en) | 2000-06-26 |
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