JPH0577947U - Surface mount IC L-shaped terminal - Google Patents
Surface mount IC L-shaped terminalInfo
- Publication number
- JPH0577947U JPH0577947U JP026015U JP2601592U JPH0577947U JP H0577947 U JPH0577947 U JP H0577947U JP 026015 U JP026015 U JP 026015U JP 2601592 U JP2601592 U JP 2601592U JP H0577947 U JPH0577947 U JP H0577947U
- Authority
- JP
- Japan
- Prior art keywords
- shaped terminal
- soldered
- solder pattern
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【目的】 半田パタ−ン３と半田付け面１Ｃがほぼ同面
積になっても、Ｌ字形端子１が半田パタ−ン３に良好に
半田付けされ、半田付け状態を確認することができる。
【構成】 端部１Ａが表面実装用ＩＣ２の側面に取り付
けられ、端部１Ｂが半田パターン３に半田付けされるＬ
字形端子１に対し、半田パターン３に半田付けされる端
部１Ｂの面に複数の溝４を形成する。
(57) [Abstract] [Purpose] Even if the solder pattern 3 and the soldering surface 1C have almost the same area, the L-shaped terminal 1 is well soldered to the solder pattern 3 and the soldering state is confirmed. can do. [Structure] An end 1A is attached to a side surface of a surface mounting IC 2, and an end 1B is soldered to a solder pattern 3.
A plurality of grooves 4 are formed on the surface of the end portion 1B to be soldered to the solder pattern 3 with respect to the letter-shaped terminal 1.
Description
【０００１】[0001]
この考案は、表面実装用ＩＣを半田パターンに半田づけするためのＬ字形端子 についてのものである。 This invention relates to an L-shaped terminal for soldering a surface mounting IC to a solder pattern.
【０００２】[0002]
次に、従来技術によるＬ字形端子の構成を図２により説明する。図２の２は表 面実装用ＩＣ、３は半田パターン、５はＬ字形端子、６は半田である。Ｌ字形端 子５は端部５Ａと端部５Ｂで構成され、端部５Ａは表面実装用ＩＣ２の側面に取 り付けられ、端部５Ｂの半田付け面５Ｃは半田パターン３に半田づけされる。図 ２のＬ１はＬ字形端子５間の端子ピッチである。 Next, the configuration of the L-shaped terminal according to the prior art will be described with reference to FIG. In FIG. 2, 2 is a surface mounting IC, 3 is a solder pattern, 5 is an L-shaped terminal, and 6 is solder. The L-shaped terminal 5 is composed of an end portion 5A and an end portion 5B, the end portion 5A is attached to the side surface of the surface mounting IC 2, and the soldering surface 5C of the end portion 5B is soldered to the solder pattern 3. . L1 in FIG. 2 is a terminal pitch between the L-shaped terminals 5.
【０００３】 端子ピッチＬ１が長い場合は、半田付け面５Ｃよりも半田パタ−ン３を広くと ることができるので、半田６がＬ字形端子５の回りに付着し、半田パタ−ン３と Ｌ字形端子５は半田付けされる。Ｌ字形端子５の半田付け面５Ｃの周囲が完全に 半田６で見えなくなれば、半田付け状態は良好である。When the terminal pitch L1 is long, the solder pattern 3 can be made wider than the soldering surface 5C, so that the solder 6 adheres around the L-shaped terminal 5 and the solder pattern 3 The L-shaped terminal 5 is soldered. If the periphery of the soldering surface 5C of the L-shaped terminal 5 is completely invisible by the solder 6, the soldered state is good.
【０００４】[0004]
次に、最近のＬ字形端子の使用状態を図３により説明する。図３の７はＬ字形 端子であり、その他は図２と同じものである。図３の端子ピッチＬ２は図２のＬ １より短くなり、半田パタ−ン３と半田付け面７Ｃがほぼ同じ面積になる。半田 ブリッジを避けるために半田６の量が少なくなり、半田６がＬ字形端子７の回り に十分に付着せず、Ｌ字形端子７と半田パタ−ン３の半田付け強度が減る場合が ある。また、Ｌ字形端子７の半田付け面７Ｃの半田付け状態を確認することがで きない。 Next, a recent usage state of the L-shaped terminal will be described with reference to FIG. Reference numeral 7 in FIG. 3 is an L-shaped terminal, and the others are the same as those in FIG. The terminal pitch L2 in FIG. 3 is shorter than L1 in FIG. 2, and the solder pattern 3 and the soldering surface 7C have substantially the same area. In order to avoid the solder bridge, the amount of the solder 6 is reduced, the solder 6 may not be sufficiently attached around the L-shaped terminal 7, and the soldering strength between the L-shaped terminal 7 and the solder pattern 3 may be reduced. Moreover, the soldering state of the soldering surface 7C of the L-shaped terminal 7 cannot be confirmed.
【０００５】 この考案は、半田パターン３に半田付けされるＬ字形端子の端部の面に複数の 溝を形成することにより、半田パタ−ン３と半田付け面がほぼ同じ面積になって も、Ｌ字形端子が半田パタ−ン３に良好に半田付けされ、半田付け状態を確認す ることができるＬ字形端子の提供を目的とする。According to the present invention, by forming a plurality of grooves on the end surface of the L-shaped terminal to be soldered to the solder pattern 3, even if the solder pattern 3 and the soldering surface have substantially the same area. , L-shaped terminals are satisfactorily soldered to the solder pattern 3, and it is an object of the present invention to provide an L-shaped terminal capable of confirming the soldering state.
【０００６】[0006]
この目的を達成するために、この考案では、端部１Ａが表面実装用ＩＣ２の側 面に取り付けられ、端部１Ｂが半田パターン３に半田付けされるＬ字形端子１に 対し、半田パターン３に半田付けされる端部１Ｂの面に複数の溝４を形成する。 In order to achieve this object, in the present invention, the end portion 1A is attached to the side surface of the surface mounting IC 2 and the end portion 1B is attached to the solder pattern 3 to the L-shaped terminal 1 which is soldered to the solder pattern 3. A plurality of grooves 4 are formed on the surface of the end 1B to be soldered.
【０００７】[0007]
次に、この考案によるＬ字形端子の形状を図１により説明する。図１の１はＬ 字形端子、４は溝であり、その他は図３と同じものである。Ｌ字形端子１は端部 １Ａが表面実装用ＩＣ２の側面に取り付けられ、端部１Ｂが半田パターン３に半 田付けされる。半田パターン３に半田付けされる端部１Ｂの面には波状の複数の 溝４が形成される。 Next, the shape of the L-shaped terminal according to the present invention will be described with reference to FIG. 1 is an L-shaped terminal, 4 is a groove, and others are the same as those in FIG. An end 1A of the L-shaped terminal 1 is attached to a side surface of the surface mounting IC 2, and an end 1B is soldered to the solder pattern 3. A plurality of wavy grooves 4 are formed on the surface of the end portion 1B to be soldered to the solder pattern 3.
【０００８】 すなわち、図１は端部１Ｂに波状の複数の溝４を形成したものである。Ｌ字形 端子１を使用すれば、半田パタ−ン３が半田付け面１Ｃとほぼ同じ面積になり、 半田の量が少なくなっても、溝４に半田が入り込んで半田付けされる。That is, in FIG. 1, a plurality of wavy grooves 4 are formed in the end portion 1B. If the L-shaped terminal 1 is used, the solder pattern 3 has almost the same area as the soldering surface 1C, and the solder enters the groove 4 and is soldered even if the amount of solder is small.
【０００９】[0009]
次に、この考案による実施例のＬ字形端子を図４より説明する。図４アは溝４ の断面を方形に形成したものであり、図４イは溝４の代わりに複数の突起８を形 成したものである。図４ウは図４アの溝４の向きを直角に変えたものである。 Next, the L-shaped terminal of the embodiment according to the present invention will be described with reference to FIG. FIG. 4A shows a groove 4 having a rectangular cross section, and FIG. 4A shows a plurality of protrusions 8 formed instead of the groove 4. In FIG. 4C, the direction of the groove 4 in FIG. 4A is changed to a right angle.
【００１０】[0010]
この考案によれば、半田パターンに半田付けされるＬ字形端子の端部の面に複 数の溝を形成するので、半田パタ−ンと半田付け面がほぼ同じ面積になっても、 Ｌ字形端子が半田パタ−ンに良好に半田付けされ、半田付け状態を確認すること ができる。 According to this invention, since a plurality of grooves are formed on the end surface of the L-shaped terminal to be soldered to the solder pattern, even if the solder pattern and the soldering surface have almost the same area, the L-shaped terminal is formed. The terminals are well soldered to the solder pattern, and the soldered state can be confirmed.
【図１】この考案によるＬ字形端子の構成図である。FIG. 1 is a configuration diagram of an L-shaped terminal according to the present invention.
【図２】従来技術によるＬ字形端子の構成図である。FIG. 2 is a configuration diagram of an L-shaped terminal according to the related art.
【図３】最近のＬ字形端子の使用状態説明図である。FIG. 3 is a diagram illustrating a recent usage state of an L-shaped terminal.
【図４】この考案によるＬ字形端子の実施例の構成図で
ある。FIG. 4 is a configuration diagram of an embodiment of an L-shaped terminal according to the present invention.
１ Ｌ字形端子 １Ａ 端部 １Ｂ 端部 １Ｃ 半田付け面 ２ 表面実装用ＩＣ ３ 半田パタ−ン ４ 溝 1 L-shaped terminal 1A End part 1B End part 1C Soldering surface 2 Surface mounting IC 3 Solder pattern 4 Groove
Claims (1)
側面に取り付けられ、第２の端部(1B)が半田パターン
(3) に半田づけされるＬ字形端子(1) に対し、 半田パターン(3) に半田づけされる第２の端部(1B)の面
に複数の溝(4) を形成することを特徴とする表面実装用
ＩＣのＬ字形端子。1. A first end (1A) is attached to a side surface of a surface mounting IC (2), and a second end (1B) is a solder pattern.
The L-shaped terminal (1) to be soldered to (3) is characterized by forming a plurality of grooves (4) on the surface of the second end (1B) to be soldered to the solder pattern (3). L-shaped terminal for surface mounting IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP026015U JPH0577947U (en) | 1992-03-27 | 1992-03-27 | Surface mount IC L-shaped terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP026015U JPH0577947U (en) | 1992-03-27 | 1992-03-27 | Surface mount IC L-shaped terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0577947U true JPH0577947U (en) | 1993-10-22 |
Family
ID=12181874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP026015U Pending JPH0577947U (en) | 1992-03-27 | 1992-03-27 | Surface mount IC L-shaped terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0577947U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278663A (en) * | 2005-03-29 | 2006-10-12 | Tokyo Coil Engineering Kk | Surface mounting component |
| JP2009124095A (en) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | Semiconductor package and mounting method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645576A (en) * | 1979-09-21 | 1981-04-25 | Hitachi Ltd | Electronic circuit parts |
| JPS59215759A (en) * | 1983-05-24 | 1984-12-05 | Nec Corp | Semiconductor device |
| JPS60113958A (en) * | 1983-11-26 | 1985-06-20 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01189151A (en) * | 1988-01-25 | 1989-07-28 | Oki Electric Ind Co Ltd | Outer lead of surface mounting type semiconductor device |
| JPH0217854B2 (en) * | 1980-11-17 | 1990-04-23 | Matsushita Electric Ind Co Ltd |
-
1992
- 1992-03-27 JP JP026015U patent/JPH0577947U/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645576A (en) * | 1979-09-21 | 1981-04-25 | Hitachi Ltd | Electronic circuit parts |
| JPH0217854B2 (en) * | 1980-11-17 | 1990-04-23 | Matsushita Electric Ind Co Ltd | |
| JPS59215759A (en) * | 1983-05-24 | 1984-12-05 | Nec Corp | Semiconductor device |
| JPS60113958A (en) * | 1983-11-26 | 1985-06-20 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01189151A (en) * | 1988-01-25 | 1989-07-28 | Oki Electric Ind Co Ltd | Outer lead of surface mounting type semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278663A (en) * | 2005-03-29 | 2006-10-12 | Tokyo Coil Engineering Kk | Surface mounting component |
| JP2009124095A (en) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | Semiconductor package and mounting method thereof |
| US8319319B2 (en) | 2007-11-12 | 2012-11-27 | Samsung Sdi Co., Ltd. | Semiconductor package and mounting method thereof |
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