JPH0572544A - Terminal connecting structure and connecting method for terminal - Google Patents
Terminal connecting structure and connecting method for terminalInfo
- Publication number
- JPH0572544A JPH0572544A JP14766091A JP14766091A JPH0572544A JP H0572544 A JPH0572544 A JP H0572544A JP 14766091 A JP14766091 A JP 14766091A JP 14766091 A JP14766091 A JP 14766091A JP H0572544 A JPH0572544 A JP H0572544A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- connection
- connection terminal
- light
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶パネルに設けられ
た端子とこれを駆動する半導体素子の端子とを接続する
際などに用いられる端子接続構造および端子接続方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal connecting structure and a terminal connecting method used for connecting a terminal provided on a liquid crystal panel and a terminal of a semiconductor element for driving the same.
【０００２】[0002]
【従来の技術】図４は従来の端子接続構造を示すもの
で、図中符号１は一方の部品の基板、符号２は他方の部
品の基板である。基板１，２の表面には接続端子部４，
５が設けられている。これらの基板１，２間には、接着
剤に導電性粒子６が分散されてなる接着剤層７が設けら
れている。そして前記接続端子部４，５は接着剤層７の
導電性粒子６を介して電気的に接続している。2. Description of the Related Art FIG. 4 shows a conventional terminal connection structure. In the figure, reference numeral 1 is a substrate of one component and reference numeral 2 is a substrate of the other component. Connecting terminals 4,
5 are provided. An adhesive layer 7 formed by dispersing conductive particles 6 in an adhesive is provided between the substrates 1 and 2. The connection terminal portions 4 and 5 are electrically connected through the conductive particles 6 of the adhesive layer 7.
【０００３】この端子接続構造を形成するには、導電性
粒子６を分散させた接着剤を基板１に塗布し、ついで他
方の基板２を押し付けて、両基板１，２の接続端子部
４，５が導電性粒子６に接触するようにしていた。In order to form this terminal connection structure, an adhesive in which the conductive particles 6 are dispersed is applied to the substrate 1 and then the other substrate 2 is pressed to connect the connection terminal portions 4 of both the substrates 1 and 2. 5 was in contact with the conductive particles 6.
【０００４】[0004]
【発明が解決しようとする課題】前記のような接続構造
では導電性粒子６が凝集していると、この凝集した導電
性粒子６を介して図５に示すように隣接する接続端子部
４，４，５，５間でショートが発生するため、電極ピッ
チを狭めることが難しい問題があった。In the connection structure as described above, when the conductive particles 6 are aggregated, the adjacent connection terminal portions 4, 4, as shown in FIG. Since a short circuit occurs between Nos. 4, 5, and 5, it is difficult to reduce the electrode pitch.
【０００５】本発明は前記事情に鑑みてなされたもの
で、電極ピッチを狭めてもショートが起こることの無い
端子接続構造および端子接続方法を提供することを目的
とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a terminal connection structure and a terminal connection method in which a short circuit does not occur even if the electrode pitch is narrowed.
【０００６】[0006]
【課題を解決するための手段】請求項１の端子接続構造
は、光を透過する材料で形成された基板の表面に、光を
透過しない材料からなる接続端子部が設けられ、前記接
続端子部上に、感光すると除去可能になる感光性材料に
よって導電性粒子が保持されてなる接続層を形成し、こ
の接続層を介して前記接続端子部と他の部品に設けられ
た接続端子部とが電気的に接続されていることを特徴と
する構造である。According to a first aspect of the present invention, there is provided a terminal connection structure, wherein a surface of a substrate formed of a light-transmitting material is provided with a connection terminal portion made of a light-impermeable material. On the above, a connection layer in which conductive particles are held by a photosensitive material that can be removed by exposure to light is formed, and the connection terminal portion and the connection terminal portion provided in another component are formed through this connection layer. It is a structure characterized by being electrically connected.
【０００７】前記感光性材料には、感光した部分が現像
処理により除去されるもので、未露光部に導電性粒子を
保持できる材料が用いられる。そのような材料として
は、ポジ型フォトレジスト等の感光性樹脂が好適に用い
られる。As the photosensitive material, a material whose exposed portion is removed by a developing process and which can hold conductive particles in an unexposed portion is used. A photosensitive resin such as a positive photoresist is preferably used as such a material.
【０００８】導電性粒子としては、各種の金属粒子や、
樹脂ビーズにニッケル、金などをメッキしたもの等、各
種のものを利用できる。この導電性粒子の粒径は、前記
他の部品に設けられた接続端子部との接続を確実に得る
為に、前記他の部品に設けられた接続端子部の周辺に設
けられたパシベーション膜の膜厚の約２倍以上であるこ
とが望ましい。As the conductive particles, various metal particles and
Various materials such as resin beads plated with nickel or gold can be used. The particle diameter of the conductive particles is the same as that of the passivation film provided around the connection terminal portion provided on the other component in order to reliably obtain the connection with the connection terminal portion provided on the other component. It is desirable that the thickness is about twice the film thickness or more.
【０００９】基板の接続端子部の間隔は、導電性粒子の
粒径の５倍程度まで、条件を最適化すれば粒径の３倍程
度まで狭めることができる。The distance between the connecting terminals of the substrate can be reduced to about 5 times the particle diameter of the conductive particles, or to about 3 times the particle diameter if the conditions are optimized.
【００１０】請求項２の端子接続方法は、表面側に光を
透過しない材料からなる接続端子部を備えると共に、光
を透過する材料で形成された基板を準備し、この基板の
表面に、感光すると除去可能になる感光性材料によって
導電性粒子が保持されてなる接続層を形成し、ついで前
記基板の裏側から光を照射して前記感光性材料を露光処
理した後現像処理し、この後前記基板に設けられた接続
端子部と他の部品に設けられた接続端子部とが向き合う
ようにしてこれら基板と他の部品とを重ね合わせこれら
を電気的に接続することを特徴とする方法である。According to a second aspect of the present invention, there is provided a terminal connecting method, wherein a front surface side is provided with a connection terminal portion made of a material which does not transmit light, and a substrate formed of a material which transmits light is prepared. Then, a connection layer formed of conductive particles held by a removable photosensitive material is formed, and then the photosensitive material is exposed to light from the back side of the substrate to be subjected to an exposure treatment and then a development treatment. The method is characterized in that the connection terminal portion provided on the substrate and the connection terminal portion provided on the other component face each other, and the substrate and the other component are overlapped and electrically connected to each other. ..
【００１１】感光性材料にポジ型フォトレジストを用い
た場合、露光・現像処理の条件は、導電性粒子の密度が
低ければ、通常の処理条件とほぼ同じで良い。導電性粒
子の密度を高くすると露光時間、現像時間を増す必要が
生じる。しかしこのような理由により露光時間、現像時
間が増加した場合でも、本発明の端子接続方法によれば
通常のフォトリソプロセスに比較してマスクアライメン
ト工程が不要になる分処理時間が短縮されるので、本発
明の端子接続方法における露光から現像終了までのスル
ープットは、通常のフォトリソプロセスとほぼ同程度と
なる。When a positive photoresist is used as the photosensitive material, the exposure / development processing conditions may be substantially the same as the usual processing conditions as long as the density of the conductive particles is low. When the density of the conductive particles is increased, it is necessary to increase the exposure time and the development time. However, even if the exposure time and the development time are increased due to such a reason, the terminal connection method of the present invention reduces the processing time by the amount that the mask alignment step is unnecessary as compared with the normal photolithography process. The throughput from the exposure to the end of development in the terminal connecting method of the present invention is almost the same as that in a normal photolithography process.
【００１２】請求項３の端子接続方法は、表面側に光を
透過しない材料からなる接続端子部を備えると共に光を
透過する材料で形成された基板を準備し、この基板の表
面に、感光すると除去可能になる感光性材料からなる樹
脂層を形成し、ついで前記基板の裏側から光を照射して
前記感光性材料を露光処理した後現像処理し、この後基
板の表面側に導電性粒子を配置し、ついで前記基板に設
けられた接続端子部と他の部品に設けられた接続端子部
とが向き合うようにしてこれら基板と他の部品とを重ね
合わせこれらを電気的に接続することを特徴とする方法
である。According to a third aspect of the present invention, there is provided a terminal connecting method, wherein a surface is provided with a connecting terminal portion made of a material which does not transmit light and a substrate formed of a material which transmits light is prepared. A resin layer made of a removable photosensitive material is formed, and then the photosensitive material is exposed to light from the back side of the substrate to be subjected to an exposure treatment and then a development treatment, and thereafter conductive particles are applied to the front surface side of the substrate. And arranging them so that the connection terminal portion provided on the substrate and the connection terminal portion provided on the other component face each other, and the substrate and the other component are overlapped and electrically connected to each other. And the method.
【００１３】請求項３の方法で用いられる感光性材料
は、少なくとも現像処理後には粘着性を有するものが好
適に用いられる。The photosensitive material used in the method of claim 3 is preferably one that has tackiness at least after development processing.
【００１４】[0014]
【作用】本発明の端子接続構造および方法では、基板の
裏面から光を照射すると、接続端子部がマスク代わりと
なって、表面に塗布された感光性材料が接続端子部のパ
ターンに一致して感光処理される。そして接続端子部間
には感光性樹脂および導電性粒子が存在しない状態とな
る。In the terminal connecting structure and method of the present invention, when light is irradiated from the back surface of the substrate, the connecting terminal portion serves as a mask, and the photosensitive material applied to the surface matches the pattern of the connecting terminal portion. Photosensitized. Then, the photosensitive resin and the conductive particles do not exist between the connection terminal portions.
【００１５】[0015]
【実施例】以下、図面を参照して本発明の端子接続構造
および方法を詳しく説明する。なお前記従来例と同一構
成部分には、同一符号を付して説明を簡略化する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The terminal connecting structure and method of the present invention will be described in detail below with reference to the drawings. The same components as those of the conventional example are designated by the same reference numerals to simplify the description.
【００１６】（実施例１）図１は本発明の端子接続方法
の一実施例を示すもので、図中符号１は基板である。こ
の基板１は、透明なガラスからなるもので、光透過可能
である。この基板１の表面側には接続端子部４が形成さ
れている。接続端子部４は、光を透過しない金属薄膜に
よって形成されている。(Embodiment 1) FIG. 1 shows an embodiment of the terminal connecting method of the present invention, in which reference numeral 1 is a substrate. The substrate 1 is made of transparent glass and is light transmissive. A connection terminal portion 4 is formed on the front surface side of the substrate 1. The connection terminal portion 4 is formed of a metal thin film that does not transmit light.
【００１７】この端子接続方法では、先ず図１（ａ）に
示すようにこの基板１の表面全体に接続層１０を形成す
る。この接続層１０は、ポジ型フォトレジスト１１を塗
布した後に、導電性粒子６を散布することによって形成
する。このように接続層１０を形成した後前記基板１の
裏側から光を照射する。すると光が基板１を透過して、
表面に形成した接続層１０のフォトレジスト１１が感光
し現像液に可溶な状態となる。ところが接続端子部４の
設けられた部分では光が透過できないので、この部分で
はフォトレジスト１１は現像液に不溶な状態を保つ。In this terminal connection method, first, as shown in FIG. 1A, a connection layer 10 is formed on the entire surface of the substrate 1. The connection layer 10 is formed by applying the positive photoresist 11 and then spraying the conductive particles 6. After forming the connection layer 10 in this manner, light is irradiated from the back side of the substrate 1. Then, the light passes through the substrate 1,
The photoresist 11 of the connection layer 10 formed on the surface is exposed to light and becomes soluble in the developing solution. However, since light cannot pass through the portion where the connection terminal portion 4 is provided, the photoresist 11 remains insoluble in the developing solution in this portion.
【００１８】この後このものを現像処理すると、図１
（ｂ）に示すように、接続端子部４上に接続層１０が残
留し、接続端子部４間の接続層１０は除去された状態と
なる。After that, when this product is developed, the result shown in FIG.
As shown in (b), the connection layer 10 remains on the connection terminal portion 4, and the connection layer 10 between the connection terminal portions 4 is removed.
【００１９】この後、図１（ｃ）に示すように、接着剤
１２が塗布された他の部品の基板２を基板１に重ね合わ
せる。この時、接続端子部４，５が向き合うようにす
る。他の部品の基板２の表面には接続端子部５の周辺に
パシベーション膜１６が形成されている。この後基板
１，２を圧着しつつ接着剤１２を硬化すると、図１
（ｄ）に示す端子接続構造が完成される。After that, as shown in FIG. 1C, the substrate 2 of the other component coated with the adhesive 12 is placed on the substrate 1. At this time, the connection terminal portions 4 and 5 are made to face each other. A passivation film 16 is formed around the connection terminal portion 5 on the surface of the substrate 2 of the other component. After that, when the adhesive 12 is cured while the substrates 1 and 2 are pressure bonded,
The terminal connection structure shown in (d) is completed.
【００２０】この端子接続構造は、光を透過しない金属
製接続端子部４が設けられたガラス製基板１の表面に、
接続端子部４上に位置する接続層１０が形成され、この
接続層１０をなす導電性粒子６を介して基板１の接続端
子部４と基板２の接続端子部５とが電気的に接続されて
いる。In this terminal connection structure, the surface of the glass substrate 1 provided with the metal connection terminal portion 4 that does not transmit light,
The connection layer 10 located on the connection terminal portion 4 is formed, and the connection terminal portion 4 of the substrate 1 and the connection terminal portion 5 of the substrate 2 are electrically connected via the conductive particles 6 forming the connection layer 10. ing.
【００２１】この実施例の端子接続構造は、光透過不能
な材料からなる接続端子部４が形成された光透過材料製
の基板１の表面に、感光すると除去可能になるフォトレ
ジスト１１によって導電性粒子６が保持されてなる接続
層１０が形成されたものなので、この接続構造を得る場
合、基板１の裏面側から光を照射することによって接続
端子部４をマスク代わりに利用して、容易にかつ正確
に、接続端子部４の部分に接続層１０が存在し接続端子
部４間の接続層１０が除去された状態とできる。従って
この端子接続構造によれば、隣接する接続端子部４，４
及び５，５間が接続層１０の導電性粒子６でショートが
発生することがなく、接続端子部４を狭いピッチで設け
ることが可能となる。In the terminal connection structure of this embodiment, the surface of the substrate 1 made of a light transmissive material on which the connection terminal portion 4 made of a light impermeable material is formed is made conductive by a photoresist 11 which can be removed when exposed to light. Since the connection layer 10 in which the particles 6 are held is formed, when obtaining this connection structure, the connection terminal portion 4 can be easily used by irradiating light from the back surface side of the substrate 1 as a mask. In addition, the connection layer 10 is accurately present in the connection terminal portion 4 and the connection layer 10 between the connection terminal portions 4 is removed. Therefore, according to this terminal connection structure, the adjacent connection terminal portions 4, 4
Further, the conductive particles 6 of the connection layer 10 do not cause a short circuit between 5 and 5, and the connection terminal portions 4 can be provided at a narrow pitch.
【００２２】さらにこの実施例の端子接続方法は、表面
側に光を透過しない材料からなる接続端子部４が設けら
れ、かつ光を透過する材料で形成された基板１を準備
し、この基板１の表面に、感光すると除去可能になるフ
ォトレジスト１１によって導電性粒子６が保持されてな
る接続層１０を形成し、ついで前記基板１の裏側から光
を照射して前記フォトレジスト１１を露光処理した後現
像処理し、ついで前記基板１に設けられた接続端子部４
と他の部品に設けられた接続端子部５とが向き合うよう
にしてこれら基板と他の部品とを重ね合わせこれらを電
気的に接続する方法なので、接続端子部４間のフォトレ
ジスト１１が導電性粒子６と共に除去された状態とな
る。従ってこの端子接続方法によれば、隣接する接続端
子部４，４，５，５間が導電性粒子６で接続されること
がなく、接続端子部４を狭いピッチで設けることが可能
となる。Further, in the terminal connecting method of this embodiment, the substrate 1 having the connecting terminal portion 4 made of a material which does not transmit light on the front surface side and formed of the material which transmits light is prepared. A connection layer 10 in which the conductive particles 6 are held by a photoresist 11 that can be removed by exposure is formed on the surface of the substrate, and then the photoresist 11 is exposed by irradiating light from the back side of the substrate 1. Post-development processing, and then connection terminal portion 4 provided on the substrate 1
And the connection terminals 5 provided on other parts face each other so that these substrates and other parts are superposed and electrically connected to each other. Therefore, the photoresist 11 between the connection terminals 4 is made conductive. The particles 6 are removed together with the particles 6. Therefore, according to this terminal connection method, the adjacent connection terminal portions 4, 4, 5, 5 are not connected by the conductive particles 6, and the connection terminal portions 4 can be provided at a narrow pitch.
【００２３】またこの実施例の端子接続方法では、基板
１の裏面側から光を照射して接続端子部４をマスクとし
て利用するので、セルフアライメント効果により接続端
子部４上に正確に接続層１０を残すことができる。従っ
てこの端子接続方法は、この点でも接続端子部４のピッ
チを狭めることが可能である。Further, in the terminal connecting method of this embodiment, since the connecting terminal portion 4 is used as a mask by irradiating light from the back surface side of the substrate 1, the connecting layer 10 can be accurately formed on the connecting terminal portion 4 by the self-alignment effect. You can leave. Therefore, according to this terminal connection method, the pitch of the connection terminal portions 4 can be narrowed also in this respect.
【００２４】(実施例２)図２は本実施例の端子接続方法
の最も特徴的な工程を示すものである。この実施例の端
子接続方法が実施例１と異なる点は、フォトレジスト１
１に導電性粒子６を混合したあと基板１に塗布した点の
みである。(Embodiment 2) FIG. 2 shows the most characteristic step of the terminal connecting method of this embodiment. The terminal connection method of this embodiment differs from that of the first embodiment in that the photoresist 1 is used.
1 is the point that the conductive particles 6 are mixed with 1 and then applied to the substrate 1.
【００２５】この方法でも実施例１の端子接続方法と同
様の作用効果が得られる。 （実施例３）図３は、本実施例の端子接続方法の要部を
示すものである。この実施例の端子接続方法では基板１
の表面に、まず図３（ａ）に示すように、フォトレジス
トのみを塗布して樹脂層１５を形成する。フォトレジス
トには、少なくとも現像処理後には粘着性を発揮するも
のを用いる。With this method, the same operational effect as the terminal connecting method of the first embodiment can be obtained. (Embodiment 3) FIG. 3 shows an essential part of the terminal connecting method of this embodiment. In the terminal connection method of this embodiment, the substrate 1
First, as shown in FIG. 3A, only the photoresist is applied to the surface of the resin layer 15 to form the resin layer 15. As the photoresist, one that exhibits adhesiveness at least after development processing is used.
【００２６】ついで前記基板１の裏側から光を照射した
後、前記樹脂層１５を現像処理する。すると図３（ｂ）
に示すように、接続端子部４上に樹脂層１５が残留し、
接続端子部４に隣接する光の透過した部分では樹脂層１
５が取り除かれる。Then, after irradiating light from the back side of the substrate 1, the resin layer 15 is developed. Then, Fig. 3 (b)
, The resin layer 15 remains on the connection terminal portion 4,
The resin layer 1 is provided in a portion adjacent to the connection terminal portion 4 through which light is transmitted.
5 is removed.
【００２７】この後基板１の表面側に導電性粒子６を配
置して、樹脂層１５に導電性粒子６を付着させて残留さ
せた。After that, the conductive particles 6 were arranged on the surface side of the substrate 1, and the conductive particles 6 were attached to the resin layer 15 and left.
【００２８】このあと実施例１と同様に、この基板１に
他部品の基板２を押し付け接続端子部４，５を導電性粒
子６を介して電気的に接続した。Thereafter, as in Example 1, the substrate 2 of another component was pressed against the substrate 1 to electrically connect the connection terminal portions 4 and 5 through the conductive particles 6.
【００２９】この実施例の端子接続方法では、基板１の
表面にフォトレジストからなる樹脂層１５を形成し、つ
いで前記基板１の裏側から光を照射して樹脂層１５を現
像処理し、この後基板１の表面側に導電性粒子６を散布
し、ついで前記基板１に設けられた接続端子部４に他の
部品に設けられた接続端子部５を押し付け接続する方法
なので、接続端子部４，４間の樹脂層１５は除去され
て、接続端子部４上にのみ樹脂層１５が残留した状態と
なり、接続端子部４上に導電性粒子６が分布し、その周
囲には導電性粒子６が存在しない状態とすることができ
る。従ってこの端子接続方法においても、隣接する接続
端子部４，４，５，５間が接続層１０の導電性粒子６で
接続されることがなく、接続端子部４を狭いピッチで設
けることが可能となる。In the terminal connecting method of this embodiment, the resin layer 15 made of photoresist is formed on the surface of the substrate 1, and then the resin layer 15 is developed by irradiating it with light from the back side of the substrate 1. Since the conductive particles 6 are scattered on the front surface side of the substrate 1 and then the connection terminal portions 4 provided on the substrate 1 are pressed and connected with the connection terminal portions 5 provided on other parts, the connection terminal portions 4, The resin layer 15 between the four is removed, and the resin layer 15 remains only on the connection terminal portion 4, the conductive particles 6 are distributed on the connection terminal portion 4, and the conductive particles 6 are distributed around it. It can be in a nonexistent state. Therefore, also in this terminal connection method, the adjacent connection terminal portions 4, 4, 5, 5 are not connected by the conductive particles 6 of the connection layer 10, and the connection terminal portions 4 can be provided at a narrow pitch. Becomes
【００３０】またこの端子接続方法においても、接続端
子部４がマスクとして機能するので、セルフアライメン
ト効果により位置ずれなく接続端子部４に樹脂層１５を
残してここに導電性粒子６を分布せしめることができ、
この点でも接続端子部４のピッチを狭めることが可能で
ある。Also in this terminal connection method, since the connection terminal portion 4 functions as a mask, it is possible to leave the resin layer 15 on the connection terminal portion 4 and disperse the conductive particles 6 therein without displacement due to the self-alignment effect. Can
Also in this respect, it is possible to narrow the pitch of the connection terminal portions 4.
【００３１】[0031]
【発明の効果】以上説明したように請求項１の端子接続
構造は、光を透過する材料で形成された基板の表面に、
光を透過しない材料からなる接続端子部が設けられ、前
記接続端子部上に、感光すると除去可能になる感光性材
料によって導電性粒子が保持されてなる接続層を形成
し、この接続層を介して前記接続端子部と他の部品に設
けられた接続端子部とが電気的に接続されていることを
特徴とする構造である。この端子接続構造によれば、こ
の接続構造を得る場合、基板の裏面側から光を照射する
ことによって接続端子部をマスク代わりに利用して、容
易にかつ正確に、接続端子部に接続層が存在し隣接する
接続端子部間の接続層が除去された状態とできる。従っ
てこの端子接続構造によれば、隣接する接続端子部間が
接続層の導電性粒子で接続されることがなく、接続端子
部を狭いピッチで設けることが可能となる。As described above, according to the terminal connection structure of the first aspect, the surface of the substrate formed of the light transmitting material is
A connection terminal portion made of a material that does not transmit light is provided, and a connection layer in which conductive particles are held by a photosensitive material that can be removed when exposed to light is formed on the connection terminal portion. The connection terminal portion and a connection terminal portion provided on another component are electrically connected to each other. According to this terminal connection structure, when this connection structure is obtained, the connection terminal portion is used as a mask by irradiating light from the back surface side of the substrate, and the connection layer is easily and accurately formed on the connection terminal portion. The connection layer between the existing and adjacent connection terminal portions can be removed. Therefore, according to this terminal connection structure, adjacent connection terminal portions are not connected by the conductive particles of the connection layer, and the connection terminal portions can be provided at a narrow pitch.
【００３２】請求項２の端子接続方法は、表面側に光を
透過しない材料からなる接続端子部を備えると共に光を
透過する材料で形成された基板を準備し、この基板の表
面に、感光すると除去可能になる感光性材料によって導
電性粒子が保持されてなる接続層を形成し、ついで前記
基板の裏側から光を照射して前記感光性材料を露光処理
した後現像処理し、この後前記基板に設けられた接続端
子部と他の部品に設けられた接続端子部とが向き合うよ
うにしてこれら基板と他の部品とを重ね合わせこれらを
電気的に接続することを特徴とする方法である。この端
子接続方法によれば、接続端子部間の感光性樹脂が導電
性粒子と共に除去されるので、隣接する接続端子部間が
導電性粒子で接続されることがなく、接続端子部を狭い
ピッチで設けることが可能となる。またこの端子接続方
法では、接続端子部がマスクとしての機能を果たすの
で、セルフアライメント効果により位置づれなく接続端
子部に接続層を残すことができ、この点でも接続端子部
のピッチを狭めることが可能である。According to a second aspect of the present invention, in the terminal connecting method, a substrate having a connecting terminal portion made of a material that does not transmit light is provided on the front surface side and a substrate formed of a material that transmits light is prepared. A removable light-sensitive material is used to form a connection layer in which conductive particles are held, and then the light-sensitive material is exposed to light from the back side of the substrate to be subjected to an exposure treatment and then a development treatment, and then the substrate. This method is characterized in that the board and the other component are superposed on each other so that the connection terminal part provided on the component and the connection terminal part provided on the other component face each other and are electrically connected to each other. According to this terminal connection method, since the photosensitive resin between the connection terminal portions is removed together with the conductive particles, the adjacent connection terminal portions are not connected by the conductive particles, and the connection terminal portions have a narrow pitch. Can be provided in. Further, in this terminal connection method, since the connection terminal portion functions as a mask, the connection layer can be left on the connection terminal portion without being positioned due to the self-alignment effect, and in this respect also, the pitch of the connection terminal portion can be narrowed. It is possible.
【００３３】請求項３の端子接続方法は、表面側に光を
透過しない材料からなる接続端子部を備えると共に光を
透過する材料で形成された基板を準備し、この基板の表
面に、感光すると除去可能になる感光性材料からなる樹
脂層を形成し、ついで前記基板の裏側から光を照射して
前記感光性材料を露光処理した後現像処理し、この後基
板の表面側に導電性粒子を配置し、ついで前記基板に設
けられた接続端子部と他の部品に設けられた接続端子部
とが向き合うようにしてこれら基板と他の部品とを重ね
合わせこれらを電気的に接続することを特徴とする方法
である。この端子接続方法によれば、接続端子部間の樹
脂層が除去されて、接続端子部上にのみ樹脂層が残留し
た状態となる結果、接続端子部上に導電性粒子が分布
し、その周囲には導電性粒子が存在しない状態となる。
従ってこの端子接続方法においても、隣接する接続端子
部間が接続層の導電性粒子で接続されることがなく、接
続端子部を狭いピッチで設けることが可能となる。また
この端子接続方法においても、接続端子部がマスクとし
て機能するので、セルフアライメント効果により位置ず
れなく接続端子部に樹脂層を残してここに導電性粒子を
分布せしめることができ、この点でも接続端子部のピッ
チを狭めることが可能である。According to a third aspect of the present invention, in the terminal connecting method, a substrate having a connecting terminal portion made of a material that does not transmit light on the front surface side is prepared and a substrate formed of a material that transmits light is prepared. A resin layer made of a removable photosensitive material is formed, and then the photosensitive material is exposed to light from the back side of the substrate to be subjected to an exposure treatment and then a development treatment, and thereafter conductive particles are applied to the front surface side of the substrate. Characterized by arranging them, and then superposing these boards and other parts so that the connection terminal parts provided on the board and the connection terminal parts provided on the other parts face each other and electrically connecting them. And the method. According to this terminal connection method, the resin layer between the connection terminal portions is removed, and the resin layer remains only on the connection terminal portions. As a result, conductive particles are distributed on the connection terminal portions and their surroundings. In this state, no conductive particles are present.
Therefore, also in this terminal connecting method, the adjacent connecting terminal portions are not connected by the conductive particles of the connecting layer, and the connecting terminal portions can be provided at a narrow pitch. Also in this terminal connection method, since the connection terminal portion functions as a mask, it is possible to leave the resin layer on the connection terminal portion and disperse the conductive particles there without displacement due to the self-alignment effect. It is possible to narrow the pitch of the terminal portion.
【図１】実施例１の端子接続方法を示す断面図。FIG. 1 is a sectional view showing a method of connecting terminals according to a first embodiment.
【図２】実施例２の端子接続方法の要部を示す断面図。FIG. 2 is a sectional view showing a main part of a terminal connecting method according to a second embodiment.
【図３】実施例３の端子接続方法の要部を示す断面図。FIG. 3 is a sectional view showing a main part of a terminal connecting method according to a third embodiment.
【図４】従来の端子接続構造を示す断面図。FIG. 4 is a cross-sectional view showing a conventional terminal connection structure.
【図５】従来の端子接続構造、接続方法の問題点を説明
するための断面図。FIG. 5 is a cross-sectional view for explaining problems with the conventional terminal connection structure and connection method.
１ 基板 ２ 基板 ４ 接続端子部 ５ 接続端子部 ６ 導電性粒子 ７ 接着剤層 １０ 接続層 １１ フォトレジスト １５ 樹脂層 １６ パシベーション膜 1 Substrate 2 Substrate 4 Connection Terminal Section 5 Connection Terminal Section 6 Conductive Particles 7 Adhesive Layer 10 Connection Layer 11 Photoresist 15 Resin Layer 16 Passivation Film
Claims (3)
面に、光を透過しない材料からなる接続端子部が設けら
れ、前記接続端子部上に、感光すると除去可能になる感
光性材料によって導電性粒子が保持されてなる接続層を
形成し、この接続層を介して前記接続端子部と他の部品
に設けられた接続端子部とが電気的に接続されているこ
とを特徴とする端子接続構造。1. A connection terminal portion made of a material that does not transmit light is provided on the surface of a substrate formed of a material that transmits light, and a photosensitive material that can be removed by exposure to light is provided on the connection terminal portion. A terminal characterized by forming a connection layer in which conductive particles are held, and electrically connecting the connection terminal section and a connection terminal section provided in another component through the connection layer. Connection structure.
続端子部を備えると共に光を透過する材料で形成された
基板を準備し、この基板の表面に、感光すると除去可能
になる感光性材料によって導電性粒子が保持されてなる
接続層を形成し、ついで前記基板の裏側から光を照射し
て前記感光性材料を露光処理した後現像処理し、この後
前記基板に設けられた接続端子部と他の部品に設けられ
た接続端子部とが向き合うようにしてこれら基板と他の
部品とを重ね合わせこれらを電気的に接続することを特
徴とする端子接続方法。2. A photosensitive material which is provided with a connection terminal portion made of a material which does not transmit light on the surface side and which is made of a material which transmits light and which can be removed when exposed to light on the surface of the substrate. To form a connection layer in which conductive particles are held, then irradiate light from the back side of the substrate to subject the photosensitive material to an exposure treatment and then a development treatment, and then a connection terminal portion provided on the substrate. And a connection terminal portion provided on another component face each other, and the substrate and the other component are superposed on each other and electrically connected to each other.
続端子部を備えると共に光を透過する材料で形成された
基板を準備し、この基板の表面に、この基板の表面に、
感光すると除去可能になる感光性材料からなる樹脂層を
形成し、ついで前記基板の裏側から光を照射して前記感
光性材料を露光処理した後現像処理し、この後基板の表
面側に導電性粒子を配置し、ついで前記基板に設けられ
た接続端子部と他の部品に設けられた接続端子部とが向
き合うようにしてこれら基板と他の部品とを重ね合わせ
これらを電気的に接続することを特徴とする端子接続方
法。3. A substrate provided with a connection terminal portion made of a material that does not transmit light on the surface side and formed of a material that transmits light is prepared, and the surface of this substrate is provided on the surface of this substrate.
A resin layer made of a photosensitive material that can be removed when exposed to light is formed, and then the photosensitive material is exposed to light from the back side of the substrate to be subjected to exposure processing and then development processing. Arranging particles, and then stacking these boards and other parts so that the connection terminals provided on the board and the connection terminals provided on the other parts face each other and electrically connecting them. Terminal connection method characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14766091A JPH0572544A (en) | 1991-06-19 | 1991-06-19 | Terminal connecting structure and connecting method for terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14766091A JPH0572544A (en) | 1991-06-19 | 1991-06-19 | Terminal connecting structure and connecting method for terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0572544A true JPH0572544A (en) | 1993-03-26 |
Family
ID=15435390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14766091A Withdrawn JPH0572544A (en) | 1991-06-19 | 1991-06-19 | Terminal connecting structure and connecting method for terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0572544A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6373206B1 (en) | 1999-03-31 | 2002-04-16 | Suzuki Motor Corporation | Motor drive control apparatus |
| US9579982B2 (en) | 2014-04-16 | 2017-02-28 | Tbk Co., Ltd. | Resonant motor system |
-
1991
- 1991-06-19 JP JP14766091A patent/JPH0572544A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6373206B1 (en) | 1999-03-31 | 2002-04-16 | Suzuki Motor Corporation | Motor drive control apparatus |
| US9579982B2 (en) | 2014-04-16 | 2017-02-28 | Tbk Co., Ltd. | Resonant motor system |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |