JPH0547252A - Electric contact material and its manufacture - Google Patents
Electric contact material and its manufactureInfo
- Publication number
- JPH0547252A JPH0547252A JP20508091A JP20508091A JPH0547252A JP H0547252 A JPH0547252 A JP H0547252A JP 20508091 A JP20508091 A JP 20508091A JP 20508091 A JP20508091 A JP 20508091A JP H0547252 A JPH0547252 A JP H0547252A
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- JP
- Japan
- Prior art keywords
- layer
- alloy
- plating layer
- plating
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気接点材料とその製造
方法に関し、更に詳しくは、クラッド法で製造した従来
の電気接点材料に比べても、耐摩耗性，耐食性，加工性
などの特性が略同等である電気接点材料とそれを極めて
安価に製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric contact material and a method for producing the same, and more specifically, it has characteristics such as abrasion resistance, corrosion resistance and workability as compared with conventional electric contact materials produced by the clad method. Substantially equivalent electrical contact material and method for making it at very low cost.
【０００２】[0002]
【従来の技術】各種金属線条の表面をＡｇまたはＡｇ合
金で被覆して成る材料は、その基材である金属線条が具
備する特性に加えて、ＡｇまたはＡｇ合金が備えている
耐食性，半田付け性，電気接続性などの特性も発現する
ので、従来から各種の用途に用いられている。2. Description of the Related Art A material obtained by coating the surface of various metal filaments with Ag or an Ag alloy has, in addition to the characteristics possessed by the metal filaments as its base material, the corrosion resistance of Ag or Ag alloys. Since it exhibits characteristics such as solderability and electrical connectivity, it has been conventionally used for various purposes.
【０００３】例えば、Ｃｕ合金条の表面を厚み0.５〜２
０μｍのＡｇ層で被覆して成る材料は、Ｃｕ合金の優れ
た機械的特性に加えて、Ａｇが有する優れた耐食性，半
田付け性，電気接続性等も同時に発現する経済的な高性
能導体として知られており、電気・電子機器分野におけ
る接触部品やリードの材料として広く用いられている。For example, the surface of a Cu alloy strip has a thickness of 0.5-2.
The material coated with a 0 μm Ag layer is an economical high-performance conductor that exhibits not only the excellent mechanical properties of Cu alloys, but also the excellent corrosion resistance, solderability, and electrical connectivity that Ag has. It is known and widely used as a material for contact parts and leads in the field of electric and electronic devices.
【０００４】ところで、これら材料のうち、例えばスイ
ッチは固定接点と可動接点を組合せて構成されている
が、これら両接点の材料には、いずれも、上記したＡｇ
またはＡｇ合金で基材を被覆した材料が通常用いられて
いる。この場合、Ａｇ層の厚みが0.２〜5.０μｍのとき
は、通常、基材にＡｇを電気めっきしたものが用いら
れ、またＡｇ層の厚みが５μｍ以上の厚みのときは、基
材とＡｇ箔をクラッドしたものが用いられている。そし
て、Ａｇ合金層で表面層が構成されている接点の場合
は、通常、Ａｇ合金箔と基材とをクラッドして製造した
材料が用いられている。By the way, of these materials, for example, a switch is composed of a combination of a fixed contact and a movable contact, and the materials of these two contacts are all Ag described above.
Alternatively, a material in which a base material is coated with an Ag alloy is usually used. In this case, when the thickness of the Ag layer is 0.2 to 5.0 μm, a base material electroplated with Ag is usually used, and when the thickness of the Ag layer is 5 μm or more, the base material is And Ag foil clad is used. In the case of a contact whose surface layer is composed of an Ag alloy layer, a material produced by clad an Ag alloy foil and a base material is usually used.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上記した接
点材料のうち、表面層がＡｇ合金層のものは、Ａｇ層の
ものに比べて、耐摩耗性と耐アーク性に優れている。し
かし、層の厚みは５μｍ以上であるため高価なＡｇ合金
の使用量は多くなり、しかもめっき法で層を成膜するこ
とが困難であるためクラッド法を適用せざるを得ず、結
果として製造コストが大幅に上昇するという欠点があ
る。By the way, among the above-mentioned contact materials, the one having the Ag alloy layer as the surface layer is superior in wear resistance and arc resistance to the one having the Ag layer. However, since the thickness of the layer is 5 μm or more, the amount of expensive Ag alloy used is large, and since it is difficult to form the layer by the plating method, the clad method has to be applied, resulting in manufacturing. It has the disadvantage of significantly increasing costs.
【０００６】本発明は、表面がＡｇ合金で構成されてい
る電気接点材料における上記問題を解決し、クラッド法
で製造した従来のＡｇ合金表面の電気接点材料に比べて
も、その接点特性は略同等である電気接点材料と、それ
を極めて安価に製造する方法の提供を目的とする。The present invention solves the above problems in an electric contact material whose surface is composed of an Ag alloy, and its contact characteristics are substantially even when compared with the conventional electric contact material of the Ag alloy surface manufactured by the clad method. An object of the present invention is to provide an equivalent electrical contact material and a method of manufacturing the same at an extremely low cost.
【０００７】[0007]
【課題を解決するための手段】上記した目的を達成する
ために、本発明においては、接点基材と、前記接点基材
の表面に形成されたＮｉもしくはＣｏまたは両者の合金
から成る下地層と、前記下地層の表面に形成されたＡｇ
−Ｓｎ−Ｉｎ合金から成る表面層とを備えていることを
特徴とする電気接点材料が提供され、また、接点基材の
表面に、めっき法で、ＮｉもしくはＣｏまたは両者の合
金から成る下地めっき層を成膜する工程（以下、第１工
程という）；前記下地めっき層の表面に、めっき法で、
Ａｇめっき層を成膜する工程（以下、第２工程とい
う）；前記Ａｇめっき層の表面に、めっき法で、Ｓｎめ
っき層とＩｎめっき層を順不同に成膜する工程（以下、
第３工程という）；および、非酸化性雰囲気中で加熱し
て、前記Ａｇめっき層とＳｎめっき層とＩｎめっき層と
に拡散処理を施してこれら３層をＡｇ−Ｓｎ−Ｉｎ合金
層に転化する工程（以下、第４工程という）；を備えて
いることを特徴とする電気接点材料の製造方法が提供さ
れる。In order to achieve the above object, in the present invention, a contact base material and a base layer made of Ni or Co or an alloy of both are formed on the surface of the contact base material. , Ag formed on the surface of the underlayer
-Sn-In alloy is provided on the surface of the contact base material, and the surface of the contact base material is plated by Ni or Co or an alloy of both. A step of forming a layer (hereinafter referred to as a first step); on the surface of the base plating layer by a plating method,
A step of forming an Ag plating layer (hereinafter referred to as a second step); a step of forming an Sn plating layer and an In plating layer in a random order on the surface of the Ag plating layer by a plating method (hereinafter, referred to as
Third step); and heating in a non-oxidizing atmosphere to subject the Ag plating layer, the Sn plating layer, and the In plating layer to diffusion treatment to convert these three layers into an Ag-Sn-In alloy layer. And a step (hereinafter, referred to as a fourth step).
【０００８】まず、本発明における接点基材の材料とし
ては、例えば、Ｃｕや各種のＣｕ合金；鋼材，アルミニ
ウム材のような材料の表面をＣｕまたはＣｕ合金で被覆
して成る複合材料；またはＮｉやＦｅ，もしくはこれら
の合金；などをあげることができる。接点基材の形状
は、格別限定されるものではなく、例えば、線材，条
材，棒材，管材などをあげることができる。First, as the material of the contact base material in the present invention, for example, Cu or various Cu alloys; a composite material obtained by coating the surface of a material such as steel or aluminum with Cu or Cu alloy; or Ni. And Fe, or alloys thereof; and the like. The shape of the contact base material is not particularly limited, and examples thereof include a wire material, a strip material, a rod material, and a pipe material.
【０００９】本発明の電気接点材料の製造方法におい
て、まず、第１工程は、接点基材の表面にめっき法でＮ
ｉ，Ｃｏまたは両者の合金から成る下地めっき層を成膜
する工程である。この下地めっき層は、後述する第４工
程の拡散処理時に、下地めっき層の下に位置する接点基
材の構成元素が、この下地めっき層の上に成膜されてい
るＡｇめっき層，Ｓｎめっき層およびＩｎめっき層に拡
散することを防止するためのバリア層として機能する。In the method for producing an electric contact material of the present invention, first, the first step is to apply N on the surface of the contact base material by plating.
This is a step of forming a base plating layer made of i, Co or an alloy of both. In this undercoat plating layer, the constituent elements of the contact base material located under the undercoat plating layer are deposited on the undercoat plating layer during the diffusion treatment of the fourth step, which will be described later. It functions as a barrier layer for preventing diffusion into the layer and the In plating layer.
【００１０】この下地層は、電気めっき法や無電解めっ
き法などによって形成される。コストの点からすると、
電気めっき法が好適である。下地層は、後述する第４工
程において接点基材の構成元素のＡｇ−Ｓｎ−Ｉｎ合金
層への拡散を防止するための拡散バリアとして機能す
る。したがって、その厚みは、この機能を達成できる程
度の厚みであればよく、具体的には0.１μｍ以上、好ま
しくは0.５μｍ以上であればよい。しかし、あまり厚く
しても無意味であり、しかも材料コストを高めるので、
とくに好ましくは0.５〜2.０μｍ程度である。This underlayer is formed by an electroplating method or an electroless plating method. In terms of cost,
The electroplating method is preferred. The underlayer functions as a diffusion barrier for preventing the constituent elements of the contact base material from diffusing into the Ag—Sn—In alloy layer in the fourth step described later. Therefore, the thickness may be such that this function can be achieved, and specifically, the thickness may be 0.1 μm or more, preferably 0.5 μm or more. However, it is meaningless to make it too thick, and since it increases the material cost,
Particularly preferably, it is about 0.5 to 2.0 μm.
【００１１】第２工程は、第１工程と同じくめっき法に
よって、上記下地めっき層の表面にＡｇめっき層を形成
する工程である。その厚みは格別限定されないが、0.２
μｍ以上であることが好ましい。また、接点としての特
性低下を招かず、また、材料コストとの関係からすると
0.５〜3.０μｍ程度であることがとくに好ましい。第３
工程は、第２工程で成膜したＡｇめっき層の表面に同じ
くめっき法で、Ｓｎめっき層とＩｎめっき層を形成する
工程である。The second step is a step of forming an Ag plating layer on the surface of the base plating layer by the plating method as in the first step. The thickness is not particularly limited, but 0.2
It is preferably at least μm. In addition, it does not cause deterioration of the characteristics as a contact, and in terms of material cost
It is particularly preferable that the thickness is about 0.5 to 3.0 μm. Third
The step is a step of forming the Sn plating layer and the In plating layer on the surface of the Ag plating layer formed in the second step by the same plating method.
【００１２】このＳｎめっき層とＩｎめっき層は、前記
したＡｇめっき層と一緒に、後述する第４工程における
拡散処理を受けることにより、Ｓｎ，Ｉｎ，Ａｇが相互
に拡散して合金化してなるＡｇ−Ｓｎ−Ｉｎ合金層に転
化する。したがって、Ｓｎめっき層とＩｎめっき層の成
膜順序は格別限定されず順不同であればよい。この場
合、拡散処理時の温度や時間によっても変動するが、通
常、得られたＡｇ−Ｓｎ−Ｉｎ合金層においては、Ａｇ
濃度，Ｓｎ濃度，Ｉｎ濃度はこの層の中の全ての個所で
一定値になっているわけではなく、下地層側に接近する
ほどＡｇ濃度が高くなる（Ｓｎ濃度やＩｎ濃度は低くな
る）。すなわち、各合金成分はこの合金層の厚み方向で
濃度勾配をもって拡散している。The Sn plating layer and the In plating layer are alloyed with the Ag plating layer by diffusing Sn, In and Ag into each other by being subjected to a diffusion treatment in a fourth step described later. It is converted to an Ag-Sn-In alloy layer. Therefore, the film formation order of the Sn plating layer and the In plating layer is not particularly limited as long as the order is not limited. In this case, although it varies depending on the temperature and time during the diffusion treatment, in the obtained Ag-Sn-In alloy layer, Ag is usually
The concentration, the Sn concentration, and the In concentration are not constant values at all points in this layer, and the Ag concentration increases (the Sn concentration and the In concentration decrease) as they approach the underlayer side. That is, each alloy component diffuses with a concentration gradient in the thickness direction of this alloy layer.
【００１３】そして、Ｓｎ濃度の平均値が２〜２０重量
％，Ｉｎ濃度の平均値が１〜１０重量％、したがって、
Ａｇ濃度の平均値が７０〜９７重量％になっているよう
なＡｇ−Ｓｎ−Ｉｎ合金層のときに、その耐摩耗性や耐
アーク性は良好である。したがって、第３工程における
Ｓｎめっき層の厚み，Ｉｎめっき層の厚みは、上記した
問題を勘案してそれぞれ選択される。The average Sn concentration is 2 to 20% by weight, and the average In concentration is 1 to 10% by weight.
When the Ag-Sn-In alloy layer has an average Ag concentration of 70 to 97% by weight, its wear resistance and arc resistance are good. Therefore, the thickness of the Sn plating layer and the thickness of the In plating layer in the third step are selected in consideration of the above problems.
【００１４】具体的には、Ａｇめっき層の厚みに対し、
Ｓｎめっき層は、0.０３〜0.３６倍の厚みに成膜するこ
とが好ましく、またＩｎめっき層は0.０１５〜0.１６倍
の厚みに成膜することが好ましい。Ｓｎめっき層，Ｉｎ
めっき層の厚みがそれぞれＡｇめっき層の厚みに対し、
0.０３倍値未満，0.０１５倍値未満の場合は、形成され
たＡｇ−Ｓｎ−Ｉｎ合金層における平均Ｓｎ濃度，平均
Ｉｎ濃度が２重量％未満，１重量％未満になってしま
い、その結果、Ａｇ−Ｓｎ−Ｉｎ合金層の耐摩耗性や耐
アーク性が充分に発揮されなくなる。また、Ｓｎめっき
層，Ｉｎめっき層の厚みがＡｇめっき層の厚みに対し、
それぞれ、0.３６倍値，0.１６倍値を超えると、Ｓｎ，
Ｉｎが下地層のＮｉやＣｏとも合金化してしまい、得ら
れる材料は、著しくその加工性が低下する。Specifically, with respect to the thickness of the Ag plating layer,
The Sn plating layer is preferably formed to a thickness of 0.03 to 0.36 times, and the In plating layer is preferably formed to a thickness of 0.015 to 0.16 times. Sn plating layer, In
The thickness of the plating layer is respectively the thickness of the Ag plating layer,
When the value is less than 0.03 times or less than 0.015 times, the average Sn concentration and the average In concentration in the formed Ag-Sn-In alloy layer are less than 2% by weight and less than 1% by weight, respectively. As a result, the wear resistance and arc resistance of the Ag-Sn-In alloy layer are not fully exhibited. Moreover, the thickness of the Sn plating layer and the In plating layer is greater than the thickness of the Ag plating layer.
When the value exceeds 0.36 times and 0.16 times, respectively, Sn,
In is alloyed with Ni and Co of the underlayer, and the workability of the obtained material is significantly reduced.
【００１５】第４工程は前記したＳｎめっき層とＩｎめ
っき層とＡｇめっき層に拡散処理を施して、三者をＡｇ
−Ｓｎ−Ｉｎ合金層に転化する工程である。拡散処理
は、接点材料の酸化を防止するために、窒素，アルゴ
ン，水素のような非酸化性雰囲気中で行われる。この拡
散処理時の温度と時間は、Ｓｎめっき層とＩｎめっき層
とＡｇめっき層のそれぞれの厚み、基材の材質、断面積
によって適宜に選定されるが、概ね、処理温度は３００
℃以上，処理時間は１０秒以上であればよい。In the fourth step, the Sn plating layer, the In plating layer, and the Ag plating layer are subjected to a diffusion treatment so that the three components are Ag.
It is a step of converting into a -Sn-In alloy layer. The diffusion process is carried out in a non-oxidizing atmosphere such as nitrogen, argon or hydrogen to prevent oxidation of the contact material. The temperature and time during this diffusion treatment are appropriately selected depending on the thicknesses of the Sn plating layer, the In plating layer, and the Ag plating layer, the material of the base material, and the cross-sectional area.
The processing time may be 10 ° C. or more and the temperature may be 10 ° C. or more.
【００１６】本発明の製造方法においては、下地層用の
めっき槽，Ａｇめっき層用のめっき槽，Ｓｎめっき層用
のめっき槽，Ｉｎめっき層用のめっき槽をシリーズに配
列し、ここに接点基材の条や線を連続的に走行させるこ
とにより、接点基材の表面に、下地めっき層，Ａｇめっ
き層，Ｓｎめっき層，Ｉｎめっき層を順次連続的に成膜
し、更にＩｎめっき層用のめっき槽につづけて熱処理ラ
インをシリーズに接続して、ここにめっき処理が終了し
た接点基材を連続的に走行させることによって拡散処理
を行えば、一貫した生産ラインの下での連続生産が可能
になる。In the manufacturing method of the present invention, a plating tank for the underlayer, a plating tank for the Ag plating layer, a plating tank for the Sn plating layer, and a plating tank for the In plating layer are arranged in series, and a contact is provided here. The base plating layer, the Ag plating layer, the Sn plating layer, and the In plating layer are sequentially and successively formed on the surface of the contact base material by continuously running the strips and wires of the base material, and the In plating layer is further formed. Continuing production under a consistent production line by connecting the heat treatment line to the series after the plating tank for use and performing the diffusion treatment by continuously running the contact base material that has been plated Will be possible.
【００１７】このようにして得られた電気接点材料は、
接点基材の表面にＮｉ，Ｃｏまたはその合金から成る層
が配置され、この層の上に、Ａｇ−Ｓｎ−Ｉｎ合金層か
ら成る表面層が形成されている。The electrical contact material thus obtained is
A layer made of Ni, Co or an alloy thereof is arranged on the surface of the contact base material, and a surface layer made of an Ag-Sn-In alloy layer is formed on this layer.
【００１８】[0018]
【実施例】下地めっき層用のめっき槽，Ａｇめっき層用
のめっき槽，Ｓｎめっき層用のめっき槽，Ｉｎめっき層
用のめっき槽および窒素ガス雰囲気焼鈍炉を直列に配置
した生産ラインに、表面に前処理を施した純銅条（幅３
０mm，厚み0.３mm）を連続的に走行させて、表１で示し
たような各めっき層を成膜したのち、表１の条件で拡散
処理を行った。[Example] A plating tank for a base plating layer, a plating tank for an Ag plating layer, a plating tank for a Sn plating layer, a plating tank for an In plating layer, and a nitrogen gas atmosphere annealing furnace are arranged in series in a production line. Pure copper strip with surface pretreatment (width 3
0 mm, thickness 0.3 mm) was continuously run to form each plating layer as shown in Table 1, and then diffusion treatment was performed under the conditions of Table 1.
【００１９】拡散処理後の合金層におけるＡｇ，Ｓｎ，
Ｉｎの平均濃度（重量％）を測定し、その結果を表１に
示した。また、これらの各接点材料につき、下記の仕様
で耐摩耗性，曲げ加工性，耐食性の評価を行なった。そ
の結果も表１に併記した。 耐摩耗性（動摩擦係数）：ヘッド頭部半径５mmのＡｇ
棒、荷重１０ｇ、摺動距離１０mm、摺動回数２００回。Ag, Sn, in the alloy layer after the diffusion treatment,
The average concentration (% by weight) of In was measured, and the results are shown in Table 1. In addition, each of these contact materials was evaluated for wear resistance, bending workability, and corrosion resistance under the following specifications. The results are also shown in Table 1. Wear resistance (dynamic friction coefficient): Ag with a head head radius of 5 mm
Rod, load 10 g, sliding distance 10 mm, sliding count 200 times.
【００２０】曲げ加工性：Ｖブロック法、内側半径0.３
Ｒ、倍率１００倍の実体顕微鏡で割れの状態を観察。 耐食性（硫化試験）：Ｈ2 Ｓ ３ｐｐｍ、温度４０℃の
雰囲気に２時間放置したのち、１０ｇ，１０ｍＡで接触
抵抗（ｍΩ）を測定。 比較のために、厚み0.３mmの銅条に、Ａｇ：９0.０重量
％，Ｓｎ：5.０重量％，Ｉｎ：5.０重量％から成り、厚
みが５μｍのＡｇ−Ｓｎ−Ｉｎ合金箔をクラッドして比
較例接点を製造した。この接点についても、実施例と同
様にして、耐摩耗性，曲げ加工性，耐食性を測定し、そ
の結果も表１に示した。Bendability: V block method, inner radius 0.3
R, observe the state of cracks with a stereoscopic microscope with 100x magnification. Corrosion resistance (sulfurization test): After being left for 2 hours in an atmosphere of H 2 S 3 ppm and a temperature of 40 ° C., contact resistance (mΩ) was measured at 10 g and 10 mA. For comparison, a copper strip having a thickness of 0.3 mm is formed of Ag: 90.0 wt%, Sn: 5.0 wt%, In: 5.0 wt%, and an Ag-Sn-In alloy having a thickness of 5 μm. The foil was clad to produce a comparative contact. With respect to this contact, wear resistance, bending workability and corrosion resistance were measured in the same manner as in the example, and the results are also shown in Table 1.
【００２１】また、この比較例接点の製造コストを１０
０としたときに、各実施例接点の製造コストを相対値と
して算出し、それを表１に示した。Further, the manufacturing cost of this comparative example contact is 10
When it was set to 0, the manufacturing cost of each Example contact was calculated as a relative value, which is shown in Table 1.
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【発明の効果】以上の説明で明らかなように、本発明の
電気接点材料は、従来のクラッド法で製造した材料に比
べても、耐摩耗性，耐食性（耐硫化性），加工性が略同
等である。そして、本発明の電気接点材料は、接点表面
のＡｇ−Ｓｎ−Ｉｎ合金層が低廉なコストで行なえるめ
っき法で成膜した薄い各めっき層を拡散熱処理すること
によって製造することができるので、Ａｇの使用量を節
約でき、また工程数が少ない一貫した生産ラインで製造
することができるので、その製造コストの大幅な低下が
可能になり、その工業的価値は大である。As is apparent from the above description, the electrical contact material of the present invention has substantially less wear resistance, corrosion resistance (sulfuration resistance) and workability than materials manufactured by the conventional cladding method. Is equivalent. Since the electrical contact material of the present invention can be manufactured by diffusion heat treatment of each thin plating layer formed by the plating method in which the Ag-Sn-In alloy layer on the contact surface can be performed at low cost, Since the amount of Ag used can be saved and the production can be performed on a consistent production line with a small number of steps, the production cost can be greatly reduced and its industrial value is great.
Claims (2)
されたＮｉもしくはＣｏまたは両者の合金から成る下地
層と、前記下地層の表面に形成されたＡｇ−Ｓｎ−Ｉｎ
合金から成る表面層とを備えていることを特徴とする電
気接点材料。1. A contact base material, an underlayer formed of Ni or Co or an alloy of both on the surface of the contact base material, and Ag—Sn—In formed on the surface of the underlayer.
An electric contact material comprising a surface layer made of an alloy.
しくはＣｏまたは両者の合金から成る下地めっき層を成
膜する工程；前記下地めっき層の表面に、めっき法で、
Ａｇめっき層を成膜する工程；前記Ａｇめっき層の表面
に、めっき法で、Ｓｎめっき層とＩｎめっき層を順不同
に成膜する工程；および、非酸化性雰囲気中で加熱し
て、前記Ａｇめっき層とＳｎめっき層とＩｎめっき層と
に拡散処理を施してこれら３層をＡｇ−Ｓｎ−Ｉｎ合金
層に転化する工程；を備えていることを特徴とする電気
接点材料の製造方法。2. A step of forming a base plating layer made of Ni or Co or an alloy of both by a plating method on the surface of the contact base material; and a plating method on the surface of the base plating layer,
A step of forming an Ag plating layer; a step of forming an Sn plating layer and an In plating layer in a random order on the surface of the Ag plating layer by a plating method; and heating in a non-oxidizing atmosphere to form the Ag plating layer. A method of manufacturing an electrical contact material, comprising the steps of subjecting a plated layer, a Sn plated layer, and an In plated layer to a diffusion treatment to convert these three layers into an Ag-Sn-In alloy layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20508091A JPH0547252A (en) | 1991-08-15 | 1991-08-15 | Electric contact material and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20508091A JPH0547252A (en) | 1991-08-15 | 1991-08-15 | Electric contact material and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0547252A true JPH0547252A (en) | 1993-02-26 |
Family
ID=16501095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20508091A Pending JPH0547252A (en) | 1991-08-15 | 1991-08-15 | Electric contact material and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547252A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005007907A1 (en) * | 2003-07-18 | 2005-01-27 | Sumitomo Electric Industries, Ltd. | Electric contact and electrical equipment including the same |
| KR100729722B1 (en) * | 2005-10-13 | 2007-06-18 | 희성금속 주식회사 | Method for cladding Ag at welding part of a plate contact point of AgSnInOx series |
| WO2013077286A1 (en) * | 2011-11-22 | 2013-05-30 | エヌイーシー ショット コンポーネンツ株式会社 | Temperature fuse and sliding electrode used in temperature fuse |
| WO2013141273A1 (en) * | 2012-03-22 | 2013-09-26 | 田中貴金属工業株式会社 | Electrode material having clad structure |
| WO2013168620A1 (en) * | 2012-05-07 | 2013-11-14 | 田中貴金属工業株式会社 | Electrode material for thermal-fuse movable electrode |
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-
1991
- 1991-08-15 JP JP20508091A patent/JPH0547252A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005007907A1 (en) * | 2003-07-18 | 2005-01-27 | Sumitomo Electric Industries, Ltd. | Electric contact and electrical equipment including the same |
| KR100729722B1 (en) * | 2005-10-13 | 2007-06-18 | 희성금속 주식회사 | Method for cladding Ag at welding part of a plate contact point of AgSnInOx series |
| CN103946946A (en) * | 2011-11-22 | 2014-07-23 | 恩益禧肖特电子零件有限公司 | Temperature fuse and sliding electrode used in temperature fuse |
| WO2013077286A1 (en) * | 2011-11-22 | 2013-05-30 | エヌイーシー ショット コンポーネンツ株式会社 | Temperature fuse and sliding electrode used in temperature fuse |
| US9460883B2 (en) | 2011-11-22 | 2016-10-04 | Nec Schott Components Corporation | Temperature fuse and sliding electrode used for temperature fuse |
| JPWO2013077286A1 (en) * | 2011-11-22 | 2015-04-27 | エヌイーシー ショット コンポーネンツ株式会社 | Thermal fuse and sliding electrode used for the thermal fuse |
| JP2013196984A (en) * | 2012-03-22 | 2013-09-30 | Tanaka Kikinzoku Kogyo Kk | Electrode material having clad structure |
| WO2013141273A1 (en) * | 2012-03-22 | 2013-09-26 | 田中貴金属工業株式会社 | Electrode material having clad structure |
| JP2013235674A (en) * | 2012-05-07 | 2013-11-21 | Tanaka Kikinzoku Kogyo Kk | Electrode material for temperature fuse movable electrode |
| WO2013168620A1 (en) * | 2012-05-07 | 2013-11-14 | 田中貴金属工業株式会社 | Electrode material for thermal-fuse movable electrode |
| US10176958B2 (en) | 2012-05-07 | 2019-01-08 | Tanaka Kikinzoku Kogyo K.K. | Electrode material for thermal-fuse movable electrode |
| WO2014091634A1 (en) * | 2012-12-14 | 2014-06-19 | 株式会社徳力本店 | Electrode material for thermal fuse and production method therefor |
| WO2014091633A1 (en) * | 2012-12-14 | 2014-06-19 | 株式会社徳力本店 | Electrode material for thermal fuse and production method therefor |
| WO2014091632A1 (en) * | 2012-12-14 | 2014-06-19 | 株式会社徳力本店 | Electrode material for thermal fuse and production method therefor |
| JP6021284B2 (en) * | 2012-12-14 | 2016-11-09 | 株式会社徳力本店 | Electrode material for thermal fuse and method for manufacturing the same |
| JPWO2014091632A1 (en) * | 2012-12-14 | 2017-01-05 | 株式会社徳力本店 | Method for manufacturing electrode material for thermal fuse |
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