JPH054417B2 - - Google Patents
Info
- Publication number
- JPH054417B2 JPH054417B2 JP58147794A JP14779483A JPH054417B2 JP H054417 B2 JPH054417 B2 JP H054417B2 JP 58147794 A JP58147794 A JP 58147794A JP 14779483 A JP14779483 A JP 14779483A JP H054417 B2 JPH054417 B2 JP H054417B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- bis
- resin
- hydroxyphenyl
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 150000002148 esters Chemical class 0.000 claims description 20
- 229920000412 polyarylene Polymers 0.000 claims description 20
- 239000010456 wollastonite Substances 0.000 claims description 14
- 229910052882 wollastonite Inorganic materials 0.000 claims description 14
- 239000011342 resin composition Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- -1 flame retardancy Substances 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 13
- 238000000465 moulding Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000012763 reinforcing filler Substances 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 150000005690 diesters Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N monomethylhydroquinone Natural products CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 125000004957 naphthylene group Chemical group 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- IUGDILGOLSSKNE-UHFFFAOYSA-N 1,1,1-trichloro-2,2-bis(4-hydroxyphenyl)ethane Chemical compound C1=CC(O)=CC=C1C(C(Cl)(Cl)Cl)C1=CC=C(O)C=C1 IUGDILGOLSSKNE-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WPZJSWWEEJJSIZ-UHFFFAOYSA-N 2,6-dibromo-4-[(3,5-dibromo-4-hydroxyphenyl)methyl]phenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1CC1=CC(Br)=C(O)C(Br)=C1 WPZJSWWEEJJSIZ-UHFFFAOYSA-N 0.000 description 1
- WIFDRXSVRSCMMY-UHFFFAOYSA-N 2,6-dichloro-4-[(3,5-dichloro-4-hydroxyphenyl)methyl]phenol Chemical compound C1=C(Cl)C(O)=C(Cl)C=C1CC1=CC(Cl)=C(O)C(Cl)=C1 WIFDRXSVRSCMMY-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- OSQKFELINJQDTF-UHFFFAOYSA-N 2-[2-(2-hydroxy-3-methylphenyl)propan-2-yl]-6-methylphenol Chemical compound CC1=CC=CC(C(C)(C)C=2C(=C(C)C=CC=2)O)=C1O OSQKFELINJQDTF-UHFFFAOYSA-N 0.000 description 1
- XBQRPFBBTWXIFI-UHFFFAOYSA-N 2-chloro-4-[2-(3-chloro-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(Cl)=CC=1C(C)(C)C1=CC=C(O)C(Cl)=C1 XBQRPFBBTWXIFI-UHFFFAOYSA-N 0.000 description 1
- SWZVJOLLQTWFCW-UHFFFAOYSA-N 2-chlorobenzene-1,3-diol Chemical compound OC1=CC=CC(O)=C1Cl SWZVJOLLQTWFCW-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- NOGYFAIHVRCHRE-UHFFFAOYSA-N 4-[(3,5-difluoro-4-hydroxyphenyl)methyl]-2,6-difluorophenol Chemical compound C1=C(F)C(O)=C(F)C=C1CC1=CC(F)=C(O)C(F)=C1 NOGYFAIHVRCHRE-UHFFFAOYSA-N 0.000 description 1
- IJSGQDFHZUWQES-UHFFFAOYSA-N 4-[(4-chlorophenyl)-(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(Cl)=CC=1)C1=CC=C(O)C=C1 IJSGQDFHZUWQES-UHFFFAOYSA-N 0.000 description 1
- MIFGCULLADMRTF-UHFFFAOYSA-N 4-[(4-hydroxy-3-methylphenyl)methyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(CC=2C=C(C)C(O)=CC=2)=C1 MIFGCULLADMRTF-UHFFFAOYSA-N 0.000 description 1
- LGROSXVRVNTVHP-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-(4-methylphenyl)methyl]phenol Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 LGROSXVRVNTVHP-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- LCYRQNBSGYQLKY-UHFFFAOYSA-N 4-[2-(4-hydroxynaphthalen-1-yl)propan-2-yl]naphthalen-1-ol Chemical compound C1=CC=C2C(C(C)(C=3C4=CC=CC=C4C(O)=CC=3)C)=CC=C(O)C2=C1 LCYRQNBSGYQLKY-UHFFFAOYSA-N 0.000 description 1
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920006358 Fluon Polymers 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- GBAYRIZBYGUJHR-UHFFFAOYSA-N OC1=CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O.ClC=1C=C(C=C(C1O)Cl)C(C)(C)C1=CC(=C(C(=C1)Cl)O)Cl Chemical compound OC1=CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O.ClC=1C=C(C=C(C1O)Cl)C(C)(C)C1=CC(=C(C(=C1)Cl)O)Cl GBAYRIZBYGUJHR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- UHZZMRAGKVHANO-UHFFFAOYSA-M chlormequat chloride Chemical compound [Cl-].C[N+](C)(C)CCCl UHZZMRAGKVHANO-UHFFFAOYSA-M 0.000 description 1
- 229960000359 chromic chloride Drugs 0.000 description 1
- LJAOOBNHPFKCDR-UHFFFAOYSA-K chromium(3+) trichloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Cl-].[Cr+3] LJAOOBNHPFKCDR-UHFFFAOYSA-K 0.000 description 1
- 239000011636 chromium(III) chloride Substances 0.000 description 1
- 235000007831 chromium(III) chloride Nutrition 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical group OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、高い耐熱性とすぐれた機械的性質お
よび低い成形収縮率と良離型性を有するポリアリ
ーレンエステル樹脂組成物に関する。
ポリアリーレンエステルは耐熱性、強度、剛
性、難燃性、耐薬品性などのすぐれたエンジニア
リングプラスチツクとして、とくに電気部品や自
動車部品などの用途において注目されている。
しかし、該用途において該樹脂の特長である難
燃性、耐薬品性、電気的性質などを維持しなが
ら、さらに高い耐熱性、剛性度、寸法精度（低成
形収縮率）を有する材料が該分野における技術進
歩とあいまつて要求されている。
一般に樹脂にガラス繊維や炭素繊維等の繊維状
強化材また、タルク、炭酸カルシウム、炭酸マグ
ネシウム、亜硫酸カルシウム、水酸化アルミニウ
ム、マイカ、二硫化モリブデン、ウオラストナイ
ト、グラフアイト、チタン白、ガラスビーズなど
の粉末状、針状もしくは薄片状の無機充填材等を
配合することにより、耐熱性、剛性、成形収縮率
が改良されることが知られている。
ポリアリーレンエステル樹脂においても上記強
化材や充填材を配合した場合、その配合量に応じ
て、耐熱性、剛性の向上と成形収縮率の低下が認
められる。成形収縮率は該強化材や充填材の配合
量が多いほど低下し、射出成形等における型忠実
度は良好となるが、成形収縮率が低くなるに従
い、射出成形時の離型性が低下し、成形品の金型
からの取り出しが著しく困難となる。そのため、
成形品突き出し時に過大な応力が負荷され、成形
品中に歪が残留し、ストレスクラツクが発生した
り、また突き出し時に変形し、さらには破断を引
き起すなどのトラブルが発生する。
したがつて、通常は、成形収縮率を下げ、型忠
実度が良好で寸法精度のいい樹脂組成物が大いに
必要とされているにもかかわらず、金型からの離
型性に問題の起らない程度の成形収縮率とするた
め、強化材、充填材の配合量が制限されているの
が実状である。
本発明者は、上記の状況に鑑み鋭意研究した結
果、ポリアリーレンエステル樹脂にウオラストナ
イトを配合し、さらに特定量のフツ素樹脂を併用
することによつて、耐熱性、剛性が高く、強度が
良好で、低い成形収縮率と良離型性を有する組成
物を得ることが出来ることを見い出し、本発明に
達した。
本発明はポリアリーレンエステル20〜80wt％、
ウオラストナイト10〜70wt％、フツ素樹脂0.5〜
20wt％からなることを特徴とするポリアリーレ
ンエステル樹脂組成物である。
本発明で使用するポリアリーレンエステルは二
価フエノールまたはその誘導体と芳香族二塩基酸
またはその誘導体から合成されるポリエステルで
ある。
具体的には二価フエノールは次の一般式で示さ
れるものである。
上記中Arはフエニレン核、ビフエニレン核ま
たはナフチレン核の如き芳香核を示し、Ｒは水素
原子、アルキル基（例えばメチル基及びエチル
基）、ハロゲン化アルキル基、アリール基（例え
ばフエニル基及びナフチル基）、ハロゲン化アリ
ール基、アラルキル基（例えばベンジル基及びフ
エニルエチル基）、ハロゲン化アラルキル基、ア
ルキル置換アリール基、ハロゲン化アルキル置換
アリール基、脂環基またはハロゲン化脂環基を示
し、Ｘはメチレン基、エチレン基、プロピレン
基、エチリデン基、プロピリデン基及びイソプロ
ピリデン基の如きアルキレン基またはアルキリデ
ン基：芳香族基、第三級アミノ基（−Ｎ（alk）
−）、エーテル基（−Ｏ−）、カルボニル基（−
CO−）、或いは硫黄含有基、例えばサルフアイド
（−Ｓ−）、スルフオキサイド（−SO−）または
スルフオニル（−SO2−）基により相互に連結さ
れた二つまたはそれ以上のアルキレン若しくはア
ルキリデン基を示す。Ｘはまた脂環基、または硫
黄含有基、例えばサルフアイド、スルフオキサイ
ド或いはスルフオニル基、エーテル基、カルボニ
ル基または第三級アミノ基でもよい。Ｙはハロゲ
ン原子、ニトロ基またはR′若しくはOR′（ただし、
R′は既述せるＲと同意義を有する）で示される
基、ｍはＯ乃至Ｘ上の置換可能の水素原子の数ま
での整数ｎはＯ乃至芳香族核Ar上の置換可能な
水素原子の数までの整数、ｐは少なくとも１の整
数、ｑは０乃至１の整数、ｒは整数（ただしｑが
０であるときはｒは０でもよい）を示す。
上式で示したジフエノールにおいて、一個以上
の置換基Ｙがあるときは、これ等置換基は同一で
も別異でもよい。同じことがＲおよびR′につい
てもいえる。芳香族核の置換基Ｙと水酸基はオル
ソ−、メタ−またはパラ−位置の何れでもよい。
またはこれらの混合物を用いてもよい。
上掲の一般式で示されかつ本発明方法実施に当
り好適なるジフエノールの例は次の如くである。
ビス（４−ヒドロキシフエニル）−メタン、ビ
ス（４−ヒドロキシ−３−メチルフエニル）−メ
タン、ビス（４−ヒドロキシ−３，５−ジクロロ
フエニル）−メタン、ビス（４−ヒドロキシ−３，
５−ジブロモフエニル）−メタン、ビス（４−ヒ
ドロキシ−３，５−ジフルオロフエニル）−メタ
ン、ビス（４−ヒドロキシフエニル）ケトン、ビ
ス（４−ヒドロキシフエニル）−サルフアイド、
ビス（４−ヒドロキシフエニル）−スルフオン、
４，４−ジヒドロキシジフエニルエーテル、１，
１−ビス（４−ヒドロキシフエニル）−エタン、
２，２−ビス（４−ヒドロキシフエニル）−プロ
パン、２，２−ビス（ヒドロキシ−３−メチルフ
エニル）−プロパン、２，２−ビス（４−ヒドロ
キシ−３−クロロフエニル）−プロパン、２，２
−ビス（４−ヒドロキシ−３，５−ジクロロフエ
ニル）−プロパン、２，２−ビス（４−ヒドロキ
シナフチル）−プロパン、ビス（４−ヒドロキシ
フエニル）−フエニルメタン、ビス（４−ヒドロ
キシフエニル）−ジフエニルメタン、ビス（４−
ヒドロキシフエニル）−４−メチルフエニルメタ
ン、１，１−ビス（４−ヒドロキシフエニル）−
２，２，２−トリクロロエタン、ビス（４−ヒド
ロキシフエニル）−（４−クロロフエニル）−メタ
ン、１，１−ビス（４−ヒドロキシフエニル）−
シクロヘキサン、ビス（４−ヒドロキシフエニ
ル）−シクロヘキサシルメタン、４，４−ジヒド
ロキシジフエニル、２，２−ジヒドロキシジフエ
ニル、２，６−ジヒドロキシナフタレンの如きジ
ヒドロキシナフタレン、ヒドロキノン、レゾルシ
ノール、2.6−ジヒドロキシトルエン、２，６−
ジヒドロキシクロロベンゼン、３，６−ジヒドロ
キシトルエン。
二価フエノールの誘導体とは具体的には前記二
価フエノールのアルキル、フエニルなどのジエス
テルである。またこれらの混合物を用いてもよ
い。
芳香族二塩基酸は次の一般式で示されるもので
ある。
HOOC−Ar′−COOH
上式中、Ar′はｏ−フエニレン基、ｍ−フエニ
レン基、ｐ−フエニレン基及びナフチレン基の如
きアリレン基を示し、これらのアリレン基はアル
キル基またはハロゲン原子で置換されてもよい。
またこれらの混合物を用いてもよい。
芳香族二塩基酸の誘導体とは前記芳香族二塩基
酸のジクロリドまたはアルキル、フエニルなどの
ジエステルである。またこれらの混合物を用いて
もよい。
芳香族二塩基酸の誘導体とは前記芳香族二塩基
酸のジクロリドまたはアルキル、フエニルなどの
ジエステルである。またこれらの混合物を用いて
もよい。
本発明組成物の成分として使用されるポリアリ
ーレンエステルは前記の二価フエノールまたはそ
の誘導体と前記の芳香族二塩基酸またはその誘導
体を界面重縮合法、溶液重縮合法、溶融重縮合法
などの任意の方法で合成される。
好ましいポリアリーレンエステルはビスフエノ
ールＡ（２，２−ビス（４−ヒドロキシフエニル）
−プロパン）残基およびテレフタル酸残基および
イソフタル酸残基からなる構造を有するものであ
る。
これは、ユニチカ(株)より「Ｕポリマー」とし
て、上市されている。
本発明組成物の成分として使用される無機充填
材としては、ウオラストナイトが適用される。
ウオラストナイトは通常無処理でも使用しうる
が、ポリアリーレンエステルと親和性をもたせる
ために、アミノシラン、エポキシシラン等のシラ
ンカツプリング剤、クロミツククロライド、その
他の目的に応じた表面処理剤を使用することがで
きる。
本発明組成物の成分として使用されるフツ素樹
脂とは、分子中にフツ素原子(F)を含有する合成高
分子をいうが、その例としては四フツ化エチレン
樹脂、四フツ化エチレン−パーフロロアルキルビ
ニルエーテル共重合樹脂、四フツ化エチレン−六
フツ化プロピレン共重合樹脂、四フツ化エチレン
−エチレン共重合樹脂、三フツ化塩化エチレン樹
脂、フツ化ビニリデン樹脂などが挙げられる。
前記フツ素樹脂の内、四フツ化エチレン樹脂
（ポリテトラフルオロエチレン）は融点が約330℃
であるが、溶融粘度が高く融点以上でも流動しな
い。したがつて、該組成物中での分散状態が成形
加工条件によつても変化しにくく、組成物の特
性、機械的強度や射出成形時の離型性が変化しに
くいため好ましい。
配合量としては、ポリアリーレンエステル20〜
80wt％、ウオラストナイト10〜70wt％、フツ素
樹脂0.5〜20wt％（ウオラストナイトとフツ素樹
脂の合計量としては、全樹脂組成物の20〜80wt
％）配合したものが有効である。
すなわち、ウオラストナイトとフツ素樹脂の合
計量が樹脂組成物中の80wt％を越え、ポリアリ
ーレンエステルの量が20wt％未満の時は、混合
が不充分であり、均一な組成物が得られず、樹脂
組成物の流動性が失なわれ、成形が困難になる。
また、ウオラストナイトとフツ素樹脂の合計量が
20wt％未満の時は十分な成形収縮率低下効果が
得られない。
また、該強化材もしくは該充填材とフツ素樹脂
の合計量が20〜80wt％であつても、ウオラスト
ナイトの量が10wt％未満であれば成形収縮率低
下効果が不充分であり、逆にフツ素樹脂の量が
0.5wt％未満であれば、射出成形時等の離型性が
十分でない。
また、ウオラストナイトが70wt％を越えると、
混合が不十分となり、コンパウンド化の工程が困
難になり、均一な組成物が得られない。フツ素樹
脂の量が20wt％を越えると得られた成形品の強
度低下が顕著になり、好ましくない。
本発明の組成物の配合手段は特に限定されな
い。ポリアリーレンエステル、ウオラストナイ
ト、フツ素樹脂を各々別々に溶融混合機に供給す
ることが可能であり、またあらかじめこれらの原
料類を乳鉢、ヘンシエルミキサー、ボールミル、
リボンブレンダーなどを利用して予備混合してか
ら溶融混合機に供給することもできる。
なお、本発明組成物に対して、本発明の目的を
そこなわない範囲で、酸化防止剤および熱安定
剤、紫外線吸収剤、滑剤、離型剤、染料、顔料な
どの着色剤、難燃剤、難燃助剤、帯電防止剤など
の通常の添加剤を１種以上添加することができ
る。
また、他の熱可塑性樹脂（たとえば、ポリエチ
レン、ポリプロピレン、ポリアミド、ポリカーボ
ネート、ポリエステルカーボネート、ポリエチレ
ンテレフタレート、ポリブチレンテレフタレー
ト、ポリサルホン、ポリエーテルサルホン、変性
ポリフエニレンオキサイド、アクリロニトリル−
スチレン−ブタジエン樹脂（ABS樹脂）、ポリフ
エニレンサルフアイド樹脂など）、熱硬化性樹脂
（例えばフエノール樹脂、エポキシ樹脂など）を
目的に応じて配合することができる。
特に、ポリカーボネート、ポリエステルカーボ
ネート、ポリエチレンテレフタレート、ポリブチ
レンテレフタレートは該ポリアリーレンエステル
との相溶性が良好であり、加工性が改良されるな
どすぐれた改良効果を有するため好ましい。
また、ポリアミド、例えばナイロン６、ナイロ
ン66は該ポリアリーレンエステルの加工性を改良
するとともに、耐薬品性を向上させるなどの効果
を有するため好ましい。
以下、実施例により本発明を具体的に説明する
が、これらは好適な態様の例示であつて、実施例
の組成物に限定されるものではない。
実施例 １〜５
下記構造を主たる構造とするポリアリーレンエ
ステル（ユニチカ(株)製、Ｕポリマー Ｕ−100）
（但し、ｍ／ｎ＝約５／５）と、ウオラストナイ
ト（長瀬産業製NYAD−Ｇ、CaSiO3針状）と四
フツ化エチレン樹脂（ICI製フルオン L169）を
第１表に示した組成で混合し、二軸押出機（池貝
鉄工製 PCM−30）により、340℃の温度で溶融
混練した後、ストランドを水冷、切断してペレツ
トを得た。
得られたペレツトを射出成形（住友−ネスター
ル47／28 射出成形機、シリンダー温度360℃、
金型温度180℃）により、曲げ試験片を成形した。
型開き後、エジエクターピンにより成形品を突出
す際の抵抗をストレインゲージタイプの圧力セン
サーを用いて測定した。
また、得られた曲げ試験片を用いて、曲げ強
度、曲げ弾性率、熱変形温度、成形収縮率を測定
した。
曲げ強度はASTM Ｄ−790、熱変形温度は
ASTM Ｄ−648（18.6Kg／cm2）に準拠して測定し
た。結果を第１表に示す。
比較例 １〜５
実施例１〜５に用いたポリアリーレンエステル
とウオラストナイト四フツ化エチレン樹脂を第１
表に示した割合で混合し、実施例１〜５と同様の
加工を行い、物性を測定した。結果を第１表に示
す。
The present invention relates to a polyarylene ester resin composition having high heat resistance, excellent mechanical properties, low mold shrinkage, and good mold release properties. Polyarylene esters are attracting attention as engineering plastics with excellent heat resistance, strength, rigidity, flame retardance, and chemical resistance, especially in applications such as electrical parts and automobile parts. However, in this field, there is a need for a material that has even higher heat resistance, rigidity, and dimensional accuracy (low mold shrinkage) while maintaining the characteristics of the resin, such as flame retardancy, chemical resistance, and electrical properties. This is required in conjunction with technological advances in the field. Generally, resins are supplemented with fibrous reinforcement materials such as glass fibers and carbon fibers, as well as talc, calcium carbonate, magnesium carbonate, calcium sulfite, aluminum hydroxide, mica, molybdenum disulfide, wollastonite, graphite, white titanium, glass beads, etc. It is known that heat resistance, rigidity, and molding shrinkage rate can be improved by blending inorganic fillers in the form of powder, needles, or flakes. When the above-mentioned reinforcing materials and fillers are added to the polyarylene ester resin, improvements in heat resistance and rigidity and reduction in mold shrinkage rate are observed depending on the amount added. The molding shrinkage rate decreases as the amount of the reinforcing material or filler increases, and the mold fidelity in injection molding etc. becomes better, but as the molding shrinkage rate decreases, the mold releasability during injection molding decreases. , it becomes extremely difficult to remove the molded product from the mold. Therefore,
Excessive stress is applied during ejection of the molded product, causing problems such as distortion remaining in the molded product, stress cracks, deformation during ejection, and even breakage. Therefore, although there is a great need for resin compositions that have low mold shrinkage, good mold fidelity, and good dimensional accuracy, they usually do not have problems in releasability from molds. In reality, the amounts of reinforcing materials and fillers blended are limited in order to achieve a molding shrinkage rate that is negligible. As a result of intensive research in view of the above situation, the present inventor has found that by blending wollastonite into polyarylene ester resin and further using a specific amount of fluororesin, it has high heat resistance, rigidity, and strength. It has been discovered that it is possible to obtain a composition having good mold shrinkage, low mold shrinkage, and good mold release properties, and the present invention has been achieved. The present invention contains 20 to 80 wt% polyarylene ester,
Wolastonite 10~70wt%, fluororesin 0.5~
This is a polyarylene ester resin composition characterized by comprising 20 wt%. The polyarylene ester used in the present invention is a polyester synthesized from dihydric phenol or its derivative and aromatic dibasic acid or its derivative. Specifically, the dihydric phenol is represented by the following general formula. In the above, Ar represents an aromatic nucleus such as a phenylene nucleus, a biphenylene nucleus, or a naphthylene nucleus, and R represents a hydrogen atom, an alkyl group (such as a methyl group and an ethyl group), a halogenated alkyl group, or an aryl group (such as a phenyl group and a naphthyl group). , represents a halogenated aryl group, an aralkyl group (e.g. benzyl group and phenylethyl group), a halogenated aralkyl group, an alkyl-substituted aryl group, a halogenated alkyl-substituted aryl group, an alicyclic group or a halogenated alicyclic group, and X is a methylene group. , ethylene group, propylene group, ethylidene group, propylidene group and isopropylidene group: aromatic group, tertiary amino group (-N(alk)
-), ether group (-O-), carbonyl group (-
CO-), or two or more alkylene or alkylidene groups interconnected by sulfur-containing groups, such as sulfide (-S-), sulfoxide (-SO-) or sulfonyl ( -SO2- ) groups. shows. X may also be an alicyclic group, or a sulfur-containing group, such as a sulfide, sulfoxide or sulfonyl group, an ether group, a carbonyl group or a tertiary amino group. Y is a halogen atom, a nitro group, or R' or OR' (however,
R′ has the same meaning as R mentioned above), m is an integer from O to the number of substitutable hydrogen atoms on X, n is a substitutable hydrogen atom from O to aromatic nucleus Ar p is an integer of at least 1, q is an integer from 0 to 1, and r is an integer (however, when q is 0, r may be 0). In the diphenol shown in the above formula, when there is one or more substituents Y, these substituents may be the same or different. The same is true for R and R'. The substituent Y and the hydroxyl group on the aromatic nucleus may be in the ortho-, meta- or para-position. Alternatively, a mixture of these may be used. Examples of diphenols represented by the above general formula and suitable for carrying out the method of the present invention are as follows. Bis(4-hydroxyphenyl)-methane, bis(4-hydroxy-3-methylphenyl)-methane, bis(4-hydroxy-3,5-dichlorophenyl)-methane, bis(4-hydroxy-3,
5-dibromophenyl)-methane, bis(4-hydroxy-3,5-difluorophenyl)-methane, bis(4-hydroxyphenyl)ketone, bis(4-hydroxyphenyl)-sulfide,
bis(4-hydroxyphenyl)-sulfone,
4,4-dihydroxydiphenyl ether, 1,
1-bis(4-hydroxyphenyl)-ethane,
2,2-bis(4-hydroxyphenyl)-propane, 2,2-bis(hydroxy-3-methylphenyl)-propane, 2,2-bis(4-hydroxy-3-chlorophenyl)-propane, 2,2-bis(4-hydroxyphenyl)-propane
-bis(4-hydroxy-3,5-dichlorophenyl)-propane, 2,2-bis(4-hydroxynaphthyl)-propane, bis(4-hydroxyphenyl)-phenylmethane, bis(4-hydroxyphenyl) )-diphenylmethane, bis(4-
hydroxyphenyl)-4-methylphenylmethane, 1,1-bis(4-hydroxyphenyl)-
2,2,2-trichloroethane, bis(4-hydroxyphenyl)-(4-chlorophenyl)-methane, 1,1-bis(4-hydroxyphenyl)-
Dihydroxynaphthalenes such as cyclohexane, bis(4-hydroxyphenyl)-cyclohexacylmethane, 4,4-dihydroxydiphenyl, 2,2-dihydroxydiphenyl, 2,6-dihydroxynaphthalene, hydroquinone, resorcinol, 2,6-dihydroxy Toluene, 2,6-
Dihydroxychlorobenzene, 3,6-dihydroxytoluene. Specifically, the divalent phenol derivative is a diester of the divalent phenol such as alkyl or phenyl. A mixture of these may also be used. The aromatic dibasic acid is represented by the following general formula. HOOC-Ar'-COOH In the above formula, Ar' represents an arylene group such as o-phenylene group, m-phenylene group, p-phenylene group and naphthylene group, and these arylene groups are substituted with an alkyl group or a halogen atom. It's okay. A mixture of these may also be used. The derivatives of aromatic dibasic acids are dichlorides or diesters of alkyl, phenyl, etc. of the aromatic dibasic acids. A mixture of these may also be used. The derivatives of aromatic dibasic acids are dichlorides or diesters of alkyl, phenyl, etc. of the aromatic dibasic acids. A mixture of these may also be used. The polyarylene ester used as a component of the composition of the present invention is prepared by combining the above-mentioned dihydric phenol or its derivative and the above-mentioned aromatic dibasic acid or its derivative by interfacial polycondensation method, solution polycondensation method, melt polycondensation method, etc. Synthesized using any method. A preferred polyarylene ester is bisphenol A (2,2-bis(4-hydroxyphenyl)
-propane) residue, terephthalic acid residue, and isophthalic acid residue. This is marketed as "U Polymer" by Unitika Co., Ltd. Wollastonite is used as the inorganic filler used as a component of the composition of the present invention. Wollastonite can normally be used without any treatment, but in order to make it compatible with polyarylene ester, silane coupling agents such as aminosilane and epoxysilane, chromic chloride, and other surface treatment agents are used depending on the purpose. can do. The fluororesin used as a component of the composition of the present invention refers to a synthetic polymer containing fluorine atoms (F) in the molecule, examples of which include tetrafluoroethylene resin, tetrafluoroethylene resin, Examples include perfluoroalkyl vinyl ether copolymer resin, tetrafluoroethylene-hexafluoride propylene copolymer resin, tetrafluoroethylene-ethylene copolymer resin, trifluorochloride ethylene resin, vinylidene fluoride resin, and the like. Among the fluororesins mentioned above, tetrafluoroethylene resin (polytetrafluoroethylene) has a melting point of approximately 330°C.
However, it has a high melt viscosity and does not flow even above the melting point. Therefore, it is preferable because the dispersion state in the composition does not change easily depending on the molding processing conditions, and the properties, mechanical strength, and mold releasability during injection molding of the composition do not change easily. The blending amount is polyarylene ester 20~
80wt%, wollastonite 10-70wt%, fluororesin 0.5-20wt% (the total amount of wollastonite and fluororesin is 20-80wt% of the total resin composition)
%) is effective. In other words, when the total amount of wollastonite and fluororesin exceeds 80 wt% in the resin composition and the amount of polyarylene ester is less than 20 wt%, mixing is insufficient and a uniform composition cannot be obtained. First, the fluidity of the resin composition is lost, making molding difficult.
In addition, the total amount of wollastonite and fluororesin
If it is less than 20wt%, a sufficient molding shrinkage reduction effect cannot be obtained. Furthermore, even if the total amount of the reinforcing material or filler and fluororesin is 20 to 80 wt%, if the amount of wollastonite is less than 10 wt%, the effect of reducing the molding shrinkage rate is insufficient, and vice versa. The amount of fluororesin in
If it is less than 0.5 wt%, mold releasability during injection molding etc. will not be sufficient. In addition, when wollastonite exceeds 70wt%,
Mixing becomes insufficient, the compounding process becomes difficult, and a uniform composition cannot be obtained. If the amount of fluororesin exceeds 20 wt%, the strength of the obtained molded product will decrease significantly, which is not preferable. The means of blending the composition of the present invention is not particularly limited. It is possible to feed polyarylene ester, wollastonite, and fluororesin separately to a melt mixer, and these raw materials can be added in advance to a mortar, Henschel mixer, ball mill,
It is also possible to pre-mix using a ribbon blender or the like and then supply it to the melt mixer. The composition of the present invention may contain antioxidants, heat stabilizers, ultraviolet absorbers, lubricants, mold release agents, colorants such as dyes and pigments, flame retardants, One or more conventional additives such as flame retardant aids and antistatic agents can be added. In addition, other thermoplastic resins (for example, polyethylene, polypropylene, polyamide, polycarbonate, polyester carbonate, polyethylene terephthalate, polybutylene terephthalate, polysulfone, polyether sulfone, modified polyphenylene oxide, acrylonitrile-
Styrene-butadiene resin (ABS resin), polyphenylene sulfide resin, etc.), thermosetting resin (for example, phenol resin, epoxy resin, etc.) can be blended depending on the purpose. In particular, polycarbonate, polyester carbonate, polyethylene terephthalate, and polybutylene terephthalate are preferred because they have good compatibility with the polyarylene ester and have excellent improving effects such as improved processability. Further, polyamides such as nylon 6 and nylon 66 are preferable because they improve the processability of the polyarylene ester and improve chemical resistance. Hereinafter, the present invention will be specifically explained with reference to Examples, but these are illustrative of preferred embodiments and are not limited to the compositions of Examples. Examples 1 to 5 Polyarylene ester having the following structure as the main structure (manufactured by Unitika Co., Ltd., U-Polymer U-100) (However, m/n = approximately 5/5), wollastonite (NYAD-G manufactured by Nagase Sangyo, CaSiO 3 needles) and tetrafluoroethylene resin (Fluon L169 manufactured by ICI) in the composition shown in Table 1. After melt-kneading at a temperature of 340° C. using a twin-screw extruder (PCM-30 manufactured by Ikegai Iron Works), the strands were water-cooled and cut to obtain pellets. The obtained pellets were injection molded (Sumitomo-Nestal 47/28 injection molding machine, cylinder temperature 360℃,
A bending test piece was molded using a mold temperature of 180°C.
After opening the mold, the resistance when ejecting the molded product with an ejector pin was measured using a strain gauge type pressure sensor. Further, using the obtained bending test piece, bending strength, bending elastic modulus, heat deformation temperature, and molding shrinkage rate were measured. Bending strength is ASTM D-790, heat distortion temperature is
Measured in accordance with ASTM D-648 (18.6 Kg/cm 2 ). The results are shown in Table 1. Comparative Examples 1 to 5 The polyarylene ester and wollastonite tetrafluoroethylene resin used in Examples 1 to 5 were
They were mixed in the proportions shown in the table, processed in the same manner as in Examples 1 to 5, and measured for physical properties. The results are shown in Table 1.
【表】【table】
【表】
本発明組成物は、ポリアリーレンエステルの耐
熱性と剛性（弾性率）が改良され、高い強度をも
ち、かつ低い成形収縮率と良離型性を有すること
がわかる（実施例１〜５）。
また、本発明組成物以外の組成においては成形
収縮率の改良が十分でなかつたり（比較例２）、
強度の低下が大きかつたり（比較例４）、離型性
が不十分である（比較例５）など、目的とする良
好な特性を有していない。[Table] It can be seen that the composition of the present invention has improved heat resistance and rigidity (modulus of elasticity) of polyarylene ester, high strength, low mold shrinkage rate, and good mold release properties (Examples 1 to 3). 5). In addition, in compositions other than the composition of the present invention, the improvement in molding shrinkage rate was not sufficient (Comparative Example 2),
It does not have the desired good properties, such as a large decrease in strength (Comparative Example 4) and insufficient mold releasability (Comparative Example 5).
Claims (1)
ラストナイト10〜70wt％およびフツ素樹脂0.5〜
20wt％からなることを特徴とするポリアリーレ
ンエステル樹脂組成物。1 Polyarylene ester 20-80wt%, wollastonite 10-70wt% and fluororesin 0.5-80wt%
A polyarylene ester resin composition comprising 20wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14779483A JPS6038456A (en) | 1983-08-11 | 1983-08-11 | Polyarylene ester resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14779483A JPS6038456A (en) | 1983-08-11 | 1983-08-11 | Polyarylene ester resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6038456A JPS6038456A (en) | 1985-02-28 |
| JPH054417B2 true JPH054417B2 (en) | 1993-01-20 |
Family
ID=15438354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14779483A Granted JPS6038456A (en) | 1983-08-11 | 1983-08-11 | Polyarylene ester resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6038456A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0725996B2 (en) * | 1986-12-26 | 1995-03-22 | ポリプラスチックス株式会社 | Polyester resin composition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197455A (en) * | 1983-04-26 | 1984-11-09 | Mitsui Toatsu Chem Inc | Lubricating resin composition |
| JPS59197456A (en) * | 1983-04-26 | 1984-11-09 | Mitsui Toatsu Chem Inc | Lubricating resin composition |
-
1983
- 1983-08-11 JP JP14779483A patent/JPS6038456A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197455A (en) * | 1983-04-26 | 1984-11-09 | Mitsui Toatsu Chem Inc | Lubricating resin composition |
| JPS59197456A (en) * | 1983-04-26 | 1984-11-09 | Mitsui Toatsu Chem Inc | Lubricating resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6038456A (en) | 1985-02-28 |
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