JPH0543239B2 - - Google Patents
Info
- Publication number
- JPH0543239B2 JPH0543239B2 JP62191297A JP19129787A JPH0543239B2 JP H0543239 B2 JPH0543239 B2 JP H0543239B2 JP 62191297 A JP62191297 A JP 62191297A JP 19129787 A JP19129787 A JP 19129787A JP H0543239 B2 JPH0543239 B2 JP H0543239B2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- signal
- axis
- signal leads
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、２次元的に配列される超音波振動子
を備える超音波探触子に関し、更に詳しくはＺ軸
に対称な信号電極同士の接続の改良に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to an ultrasonic probe equipped with two-dimensionally arranged ultrasonic transducers, and more specifically, to Concerning connection improvements.
（従来の技術）
従来から、スライス方向の分解能を向上する超
音波探触子の提案が種々なされている。例えば、
特開昭62−2799号にその一例が開示されている。
上記開示によれば、超音波探触子は第５図に示す
構成となつている。第５図において、超音波振動
子１は、長軸、短軸及び厚みがそれぞれＸ，Ｙ及
びＺの各方向にある直方体状圧電体を、Ｘ方向に
所定のピツチで分割し、Ｙ方向に３分割して構成
される。図示されていないが、各エレメントの上
面には共通電極、下面には信号電極がそれぞれ固
着される。信号電極は板面をＸ−Ｚ面にして配置
されるプリント板２，３及び４にそれぞれ形成さ
れる信号リード（２ａはプリント板２に形成され
る信号リードである）に個々に接続され取出され
る。プリント板３の信号リードは各チンネル毎、
送受波部（図示せず）に接続される。プリント板
２及び４の各信号リードで、同じＸ軸上にあるエ
レメントに接続されるものは、一緒にして上記と
異なる送受波部に接続される（両端に位置するエ
レメントは同時駆動となる）。各プリント板２と
３の間及び３と４の間には、それぞれバツキング
材５が配置される。又、図示されていないが、通
常、共通電極側には音響整合層を接合して半円柱
状音響レンズが設置される。(Prior Art) Various proposals have been made for ultrasonic probes that improve the resolution in the slice direction. for example,
An example of this is disclosed in Japanese Patent Application Laid-Open No. 62-2799.
According to the above disclosure, the ultrasonic probe has the configuration shown in FIG. 5. In FIG. 5, the ultrasonic transducer 1 divides a rectangular parallelepiped piezoelectric material whose major axis, minor axis, and thickness are in the X, Y, and Z directions, respectively, at a predetermined pitch in the X direction, and divides the piezoelectric material into parts in the Y direction. It is divided into three parts. Although not shown, a common electrode is fixed to the upper surface of each element, and a signal electrode is fixed to the lower surface of each element. The signal electrodes are individually connected to signal leads formed on printed boards 2, 3, and 4 (2a is a signal lead formed on printed board 2), which are arranged with the board surfaces facing the X-Z plane, and taken out. be done. The signal leads on the printed board 3 are for each channel,
It is connected to a wave transmitting/receiving section (not shown). The signal leads of printed boards 2 and 4 that are connected to elements on the same X-axis are connected together to different wave transmitting and receiving parts than the above (elements located at both ends are driven simultaneously). . Backing materials 5 are arranged between each printed board 2 and 3 and between 3 and 4, respectively. Although not shown, a semi-cylindrical acoustic lens is usually installed on the common electrode side with an acoustic matching layer bonded thereto.
上記の構成において、関心領域の変化に対応し
てＹ方向の開口が可変され、Ｘ方向に対しては公
知のリニアアレイ型超音波探触子と同じ走査が行
われる。これにより浅い部位から深い部位にかけ
てＹ方向の分解能が改善される。 In the above configuration, the aperture in the Y direction is varied in response to changes in the region of interest, and the same scanning as in the known linear array type ultrasound probe is performed in the X direction. This improves the resolution in the Y direction from the shallow region to the deep region.
（発明が解決しようとする問題点）
ところで、上記の超音波振動子のＸ方向の配列
は、細かいピツチの多数のエレメントで構成され
ている。このため、前記信号リード同士の接続点
がＸ方向に多数構成され、その接続はリードの束
を用いて各チヤネル毎に行われる必要がある。従
つて、従来の超音波探触子にあつては、前記信号
リード同士の接続作業は時間を要するうえに、間
違いを招く恐れがある。(Problems to be Solved by the Invention) By the way, the arrangement of the above-mentioned ultrasonic transducers in the X direction is composed of a large number of elements with a fine pitch. Therefore, a large number of connection points between the signal leads are arranged in the X direction, and the connections must be made for each channel using a bundle of leads. Therefore, in the case of conventional ultrasonic probes, the work of connecting the signal leads to each other takes time and may lead to mistakes.
本発明は、かかる点に鑑みてなされたものであ
り、その目的は、前記信号リード同士の接続作業
を簡単に、接続ミスを低減する超音波探触子を実
現するにある。 The present invention has been made in view of the above, and an object thereof is to realize an ultrasonic probe in which the signal leads can be easily connected to each other and connection errors can be reduced.
（問題点を解決するための手段）
上記目的を達成する本発明の超音波探触子は、
超音波振動子と同じピツチの平行パターン状の信
号リードを備える可撓性プリント板を、超音波振
動子のピツチに合せ、Ｚ軸を対称軸として対向設
置して信号電極と信号リードを個々に接続した構
成で、各プリント板を折曲げ、対向位置にある信
号リードを接続し、Ｚ軸に対称な信号電極同士を
接続するようになつている。(Means for Solving the Problems) The ultrasonic probe of the present invention that achieves the above object has the following features:
A flexible printed board equipped with signal leads in a parallel pattern of the same pitch as the ultrasonic transducer is aligned with the pitch of the ultrasonic transducer, and placed facing each other with the Z axis as the axis of symmetry to connect the signal electrodes and signal leads individually. In the connected configuration, each printed board is bent, signal leads at opposing positions are connected, and signal electrodes that are symmetrical about the Z axis are connected to each other.
（実施例）
以下、本発明について図面を参照して詳細に説
明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図及び第２図は本発明の一実施例による超
音波探触子を示す構成図であり、第１図はＹ−Ｚ
断面図及び第２図は第１図におけるＡ−Ａ断面図
（Ｘ−Ｚ断面図）である。図において、超音波振
動子１１は、Ｙ方向に溝１２及び１３で３分割さ
れる短冊状のエレメント１１ｘをＸ方向にピツチ
ｔで多数配列する構成となつている。溝１２及び
１３によりブロツク１１y1，１１y2及び１１y3は
音響的に完全に分離される。帯状の共通電極１４
はエレメント１１ｘの上面に固着され、その両端
はエレメント１１ｘのＸ−Ｚ面に位置する。信号
電極１５y1，１５y2及び１５y3はブロツク１１y1，
１１y2及び１１y3の各面（エレメント１１ｘの下
面）に固着される。プリント板１６y2はピツチｔ
の平行パターンの信号リード１７ｋ，１７(k+1)，
…を有する。プリント板１６y2はＺ軸上、即ち、
ブロツク１１y2（エレメント１１ｘ）の中心線上
に設置される。又、プリント板１６y1及び１６y3
はプリント板１６y2（Ｚ軸）に対し左右対称の位
置に設置される（プリント板１６y1及び１６y3は
後述する第３図の構成を示す）。各プリント板の
設置方法は、板面をＸ−Ｚ面にして行われ、信号
電極１５y1，１５y2及び１５y3と各プリント板の
信号リードが接続される。そして、プリント板１
６y2の信号リード１７ｋ，１７(k+1)，…は個々に
送受波部（図示せず）接続される。プリント板１
６y1は、第３図に示すように可撓性部材からなる
ベース１８と、べーす１８に接合される補強板１
９とで構成される。ベース１８にはＸ方向にピツ
チｔで３（ｎ＋１）（ｎ＝０，１，２，３，…）個
の信号リード２０1，２０2，…が形成される。補
強板１９の接合部には、導電性部材からなる２個
のリングを１ユニツトとする貫通穴A1，B2，C3，
…，A(3o+1)，B(3o+2)，C3(o+1)が設けらる（穴の数
は２×３（ｎ＋１）個）。貫通穴A1は信号リード
２０1の線上に位置し、該リードと電気的に接続
される。貫通穴B2は信号リード２０2の線上に位
置し、該リードと電気的に接続される。他の貫通
穴も上記と同じ構成で所定の信号リードとそれぞ
れ接続される。一方、各貫通穴はＺ方向でも所定
の間隔をとる。例えば貫通穴のＡ系（A1，…，
A(3o+1)）とＢ系（B2，…，B(3o+2)）の間隔と、貫
通穴のＢ系（B2，…，B(3o+2)）とＣ系（C3，…，
C3(o+1)）との間隔は等しく設定されている。この
ように各貫通穴は、Ｘ及びＺ方向において所定の
関係を保持することにより、プリント板１６y1と
プリント板１６y3を（プリント板１６y3はプリン
ト板１６y1と同じ構成）、第１図に示すように対
向設置して折曲げ、補強板１９を重ねたとき、双
方のプリント板の貫通穴は第４図（各符号は第３
図と同一意味で用いらている）に示す対応で重ね
られる。即ち、プリント板１６y1の貫通穴A1，
B2及びC3がプリント板１６y3の貫通穴C3(o+1)，
B(3o+2)及びA(3o+1)それぞれに重なる。重なつた貫
通穴A1及びC3(o+1)の一方に導電性のピン（図示せ
ず）が挿入され、プリント板１６y1の信号リード
２０1とプリント板１６y3の信号リード２０3(o+1)
が接続される。貫通穴A1又はC3(o+1)の他方には、
外部回路接続用リードが挿入固定され送受波部に
接続される。これにより、上記信号リードに接続
される信号電極１５y1及び１５y3は同一の送受波
部と信号の授受を行うようになる。上記の処置が
各チヤネル毎にとられる。 1 and 2 are configuration diagrams showing an ultrasonic probe according to an embodiment of the present invention, and FIG. 1 is a Y-Z
The sectional view and FIG. 2 are AA sectional views (X-Z sectional views) in FIG. 1. In the figure, the ultrasonic transducer 11 has a configuration in which a large number of strip-shaped elements 11x, which are divided into three by grooves 12 and 13 in the Y direction, are arranged at a pitch t in the X direction. Grooves 12 and 13 completely acoustically separate blocks 11 y1 , 11 y2 and 11 y3 . Strip-shaped common electrode 14
is fixed to the upper surface of the element 11x, and both ends thereof are located on the X-Z plane of the element 11x. Signal electrodes 15 y1 , 15 y2 and 15 y3 are connected to blocks 11 y1 ,
11 y2 and 11 y3 (lower surface of element 11x). Printed board 16 y2 is pitch t
Parallel pattern signal leads 17k, 17 (k+1) ,
It has... The printed board 16 y2 is on the Z axis, that is,
It is installed on the center line of block 11y2 (element 11x). Also, printed boards 16 y1 and 16 y3
are installed in symmetrical positions with respect to the printed board 16 y2 (Z-axis) (printed boards 16 y1 and 16 y3 have the configuration shown in FIG. 3, which will be described later). Each printed board is installed with the board surface facing the X-Z plane, and the signal electrodes 15 y1 , 15 y2 and 15 y3 are connected to the signal leads of each printed board. And printed board 1
The signal leads 17k, 17 (k+1) , . . . of 6y2 are individually connected to a wave transmitting/receiving unit (not shown). Printed board 1
6 y1 is a base 18 made of a flexible member and a reinforcing plate 1 joined to the base 18 as shown in FIG.
It consists of 9. Three (n+1) (n=0, 1, 2, 3, . . . ) signal leads 20 1 , 20 2 , . . . are formed on the base 18 at a pitch t in the X direction. At the joint of the reinforcing plate 19, there are through holes A 1 , B 2 , C 3 , and two rings made of conductive material forming one unit.
..., A (3o+1) , B (3o+2) , C 3(o+1) are provided (the number of holes is 2×3 (n+1)). The through hole A 1 is located on the signal lead 20 1 and is electrically connected to the signal lead 20 1 . The through hole B 2 is located on the signal lead 20 2 and is electrically connected to the signal lead 20 2 . The other through holes have the same configuration as above and are respectively connected to predetermined signal leads. On the other hand, each through-hole has a predetermined interval also in the Z direction. For example, A system of through holes (A 1 ,...,
The distance between A (3o+1) ) and B system (B 2 ,...,B (3o+2) ) and the through hole B system (B 2 ,...,B (3o+2) ) and C system (C 3 ,...,
C 3(o+1) ) are set equally. In this way, each through hole maintains a predetermined relationship in the X and Z directions, so that the printed board 16 y1 and the printed board 16 y3 (the printed board 16 y3 has the same configuration as the printed board 16 y1 ) are connected as shown in FIG. When the reinforcing plates 19 are folded and placed facing each other as shown in Fig. 4, the through holes in both printed boards are as shown in Fig.
(used with the same meaning as in the figure). That is, the through hole A 1 of the printed board 16 y1 ,
B 2 and C 3 are through holes C 3 (o+1) of printed board 16 y3 ,
Overlaps B (3o+2) and A (3o+1) respectively. A conductive pin (not shown) is inserted into one of the overlapping through holes A 1 and C 3 (o+1) , and the signal lead 20 1 of the printed board 16 y1 and the signal lead 20 3 of the printed board 16 y3 are inserted. (o+1)
is connected. The other side of through hole A 1 or C 3(o+1) has
An external circuit connection lead is inserted and fixed and connected to the wave transmitting/receiving section. Thereby, the signal electrodes 15 y1 and 15 y3 connected to the signal leads exchange signals with the same wave transmitting/receiving section. The above actions are taken for each channel.
一方、第１図に示す共通電極１４はエレメント
１１ｘの側壁にてそれぞれ共通リード２１に半田
付けされ、送受波部に接続される。共通リード２
１はプリント板１６y1及び１６y3に絶縁スペーサ
２２を介在して一体化される。バツキング材２３
はプリント板１６y1と１６y2の間及び１６y2と１
６y3の間に配置され各プリント板及び各信号電極
に接合する。上記のバツキング材と各信号電極及
び各プリント板との接合、並びにスペーサとプリ
ント板と共通リードとの接合は絶縁性接着剤で行
われる。図示されていないが超音波振動子１１の
上に整合層が接合され、音響レンズが設置され
る。 On the other hand, the common electrodes 14 shown in FIG. 1 are soldered to common leads 21 on the side walls of the element 11x, respectively, and connected to the wave transmitting/receiving section. common lead 2
1 is integrated with printed boards 16 y1 and 16 y3 with insulating spacers 22 interposed therebetween. Bucking material 23
is between printed board 16 y1 and 16 y2 and between 16 y2 and 1
6 Y3 and connected to each printed board and each signal electrode. The above-mentioned backing material is bonded to each signal electrode and each printed board, and the spacer, printed board, and common lead are bonded to each other using an insulating adhesive. Although not shown, a matching layer is bonded onto the ultrasonic transducer 11, and an acoustic lens is installed.
以上の構成において、エレメント１１ｘのピツ
チとプリント板１６y1及び１６y3の信号リードの
ピツチは等しい。従つて、プリント板１６y1及び
１６y3を折曲げて補強部１９を重ねたとき、所望
の貫通穴同士を機械的に一致させることができ
る。これにより、Ｚ軸に対して対象の位置にある
信号電極同士を確実に接続することができる。 In the above configuration, the pitch of the element 11x and the pitch of the signal leads of the printed boards 16 y1 and 16 y3 are equal. Therefore, when the printed boards 16 y1 and 16 y3 are bent and the reinforcing portions 19 are overlapped, the desired through holes can be mechanically aligned. Thereby, signal electrodes located at targeted positions with respect to the Z-axis can be reliably connected to each other.
尚、本発明はＹ方向の分割を実施例に限定する
ものではなく、種々の変形が考えられる。例え
ば、溝ではなく完全に分割する構成であつてもよ
い。又、補強板は必ずしも必要としない。プリン
ト板の一部に機械的強度をもたせ、そこで貫通穴
を形成してもよい。更に、貫通穴を介さずに接続
するようにしてもよいし、貫通穴を設けるにして
も、信号リード毎に１個設け、ここで信号リード
同士の接続と送受波部との接続を一緒にやるよう
にしてもよい。更に、超音波振動子の２次元的配
列は、奇数個の超音波振動子アレイを平面的に配
列して構成してもよい。 Note that the present invention is not limited to the division in the Y direction to the embodiment, and various modifications are possible. For example, the structure may be completely divided instead of using grooves. Further, a reinforcing plate is not necessarily required. A portion of the printed board may be provided with mechanical strength and a through hole may be formed there. Furthermore, the connection may be made without using a through hole, or even if a through hole is provided, one is provided for each signal lead, and the connection between the signal leads and the connection with the wave transmitting/receiving section are made at the same time. You may as well do it. Furthermore, the two-dimensional array of ultrasound transducers may be constructed by arranging an odd number of ultrasound transducer arrays in a plane.
（発明の効果）
以上説明の通り、本発明の超音波探触子によれ
ば、超音波振動子と同じピツチの平行パターン状
の信号リードを備える可撓性プリント板を、超音
波振動子のピツチに合せ、Ｚ軸を対称軸として対
向設置して信号電極と信号リードを個々に接続し
た構成で、各プリント板を折曲げ、対向位置にあ
る信号リードを接続し、Ｚ軸に対称な信号電極同
士を接続するため、所望の貫通穴同士を機械的に
一致させることができる。従つて、信号リード同
士の接続作業が簡単になり、接続ミスを低減する
ことができる。(Effects of the Invention) As explained above, according to the ultrasonic probe of the present invention, a flexible printed board equipped with signal leads in a parallel pattern of the same pitch as the ultrasonic transducer is connected to the ultrasonic transducer. In this configuration, the signal electrodes and signal leads are individually connected to each other with the Z-axis as the axis of symmetry, and the signal electrodes and the signal leads are individually connected to each other. Since the electrodes are connected to each other, desired through holes can be mechanically aligned. Therefore, the work of connecting the signal leads to each other becomes easy, and connection errors can be reduced.
第１図は本発明の一実施例を示す構成図（Ｙ−
Ｚ断面図）、第２図は第１図のＡ−Ａ断面図（Ｘ
−Ｚ断面図）、第３図は本発明の一実施例におけ
るプリント板の斜視図、第４図は本発明の一実施
例におけるプリント板の貫通穴の対応関係の説明
図、第５図は従来例を示す構成図である。
１１……超音波振動子、１１ｘ……超音波振動
子のエレメント、１１y1，１１y2，１１y3……Ｙ
方向に分割されて形成されるブロツク、１２，１
３……溝、１４……共通電極、１５y1，１５y2，
１５y3……信号電極、１６y1，１６y2，１６y3…
…プリント板、１７ｋ，１７(k+1)，〜，……信号
リード、１８……可撓性部材からなるベース、１
９……補強板、２０1，２０2，〜……信号リー
ド、２１……共通リード、２２……絶縁スペー
サ、A1，B2，C3，〜……貫通穴。
FIG. 1 is a configuration diagram (Y-
2 is the AA sectional view (X
-Z sectional view), FIG. 3 is a perspective view of a printed board in an embodiment of the present invention, FIG. 4 is an explanatory diagram of the correspondence of through holes in the printed board in an embodiment of the present invention, and FIG. 5 is a perspective view of a printed board in an embodiment of the present invention. FIG. 2 is a configuration diagram showing a conventional example. 11...Ultrasonic transducer, 11x...Element of ultrasonic transducer, 11 y1 , 11 y2 , 11 y3 ...Y
Block formed by dividing in the direction, 12, 1
3...Groove, 14...Common electrode, 15 y1 , 15 y2 ,
15 y3 ... signal electrode, 16 y1 , 16 y2 , 16 y3 ...
...Printed board, 17k, 17 (k+1) , ~, ...Signal lead, 18...Base made of flexible member, 1
9...Reinforcement plate, 201 , 202 , ~...signal lead, 21...common lead, 22...insulation spacer, A1 , B2 , C3 , ~...through hole.
Claims (1)
Ｚ軸に対称な奇数個に分割された超音波振動子を
備え、Ｘ，Ｙ及びＺの各方向をそれぞれ走査方
向、スライス方向及び送受波方向とする超音波探
触子において、 前記と同じピツチの平行パターン状の信号リー
ドを備える可撓性プリント板を、Ｚ軸に対称な超
音波振動子のピツチに合せて対向設置し、信号電
極と信号リードを個々に接続した構成で、各プリ
ント板を折曲げ、対向位置にある各プリント板の
信号リードを接続し、Ｚ軸に対称な信号電極同士
を接続することを特徴とする超音波探触子。[Claims] 1. An ultrasonic transducer is provided with an odd number of ultrasonic transducers that are divided at a predetermined pitch in the X direction and symmetrical to the Z axis in the Y direction, and each of the X, Y, and Z directions is a scanning direction. In an ultrasonic probe with slicing direction and wave transmission/reception direction, a flexible printed board equipped with parallel pattern signal leads of the same pitch as above is aligned with the pitch of the ultrasonic transducer symmetrical to the Z axis. With a configuration in which the signal electrodes and signal leads are installed facing each other and connected individually, each printed board is bent, the signal leads of each printed board located in the opposing position are connected, and the signal electrodes that are symmetrical about the Z axis are connected to each other. An ultrasonic probe featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62191297A JPS6436197A (en) | 1987-07-30 | 1987-07-30 | Ultrasonic wave probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62191297A JPS6436197A (en) | 1987-07-30 | 1987-07-30 | Ultrasonic wave probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6436197A JPS6436197A (en) | 1989-02-07 |
| JPH0543239B2 true JPH0543239B2 (en) | 1993-07-01 |
Family
ID=16272219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62191297A Granted JPS6436197A (en) | 1987-07-30 | 1987-07-30 | Ultrasonic wave probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436197A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60192500A (en) * | 1984-03-14 | 1985-09-30 | Nippon Dempa Kogyo Co Ltd | Matrix array type ultrasonic wave probe and its manufacture |
| JPS61114178A (en) * | 1984-11-08 | 1986-05-31 | Omron Tateisi Electronics Co | Matrix array type ultrasonic oscillator |
-
1987
- 1987-07-30 JP JP62191297A patent/JPS6436197A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60192500A (en) * | 1984-03-14 | 1985-09-30 | Nippon Dempa Kogyo Co Ltd | Matrix array type ultrasonic wave probe and its manufacture |
| JPS61114178A (en) * | 1984-11-08 | 1986-05-31 | Omron Tateisi Electronics Co | Matrix array type ultrasonic oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6436197A (en) | 1989-02-07 |
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