JPH05162246A - Laminated sheet for printed circuit - Google Patents
Laminated sheet for printed circuitInfo
- Publication number
- JPH05162246A JPH05162246A JP32916291A JP32916291A JPH05162246A JP H05162246 A JPH05162246 A JP H05162246A JP 32916291 A JP32916291 A JP 32916291A JP 32916291 A JP32916291 A JP 32916291A JP H05162246 A JPH05162246 A JP H05162246A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- glass woven
- laminated sheet
- woven fabric
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は寸法安定性、反り、加工
性に優れた印刷回路用積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit laminate excellent in dimensional stability, warpage and workability.
【０００２】[0002]
【従来の技術】印刷回路用積層板として、ガラス不織布
を中間層基材としガラス織布を表面層基材とし、これら
基材にエポキシ樹脂を含浸させ加熱加圧した積層板（以
下、コンポジット積層板という）が多量に使用されるよ
うになった。ガラス織布のみの基材にエポキシ樹脂を含
浸させた積層板は機械的強度、寸法安定性、耐熱性等に
優れ、スルーホールメッキの信頼性が高いので、電子計
算機、通信機、電子交換機等の産業用電子機器に多く使
用されている。しかし基材にガラス織布のみを使用する
ので、印刷回路板の加工工程の一つである孔あけ工程で
は打抜加工が不可能であり、ドリル加工されているのが
実状である。また、Ｖカット加工後においても、ガラス
織布基材を使用するため折れ性が悪く端面よりガラス織
布の繊維がヒゲ状となってしまう。2. Description of the Related Art As a laminate for a printed circuit, a laminate made of a nonwoven glass fabric as an intermediate layer base material and a glass woven fabric as a surface layer base material and impregnated with an epoxy resin and heated and pressed (hereinafter referred to as composite laminate). Plates) have come to be used in large quantities. Laminates made by impregnating epoxy resin on a base material made only of glass woven fabric have excellent mechanical strength, dimensional stability, heat resistance, etc., and high reliability of through-hole plating, so electronic calculators, communication devices, electronic exchanges, etc. Is widely used in industrial electronic devices. However, since only the glass woven fabric is used as the base material, the punching process is not possible in the punching process, which is one of the processes for processing the printed circuit board, and the actual condition is that it is drilled. Further, even after the V-cut processing, since the glass woven fabric base material is used, the foldability is poor and the fibers of the glass woven fabric become beard-like from the end faces.
【０００３】一方、コンポジット積層板はガラス織布基
材の積層板より経済的に安価で、かつ打抜き孔あけ加工
が可能で、Ｖカット性が優れており、加工性の良いガラ
ス基材積層板として注目をあびたが、スルーホールメッ
キの信頼性、寸法安定性、反りがガラス織布基材積層板
より低いと評価されていた。その理由として、ガラス織
布基材エポキシ積層板の構成は、有機物であるエポキシ
樹脂と無機物であるガラス織布の重量比率が約４０：６
０である。この場合エポキシ樹脂が主に各種電気性能を
優れたものにし、ガラス織布が曲げ強度寸法安定性など
の機械的性能を良好にしていると考えられる。On the other hand, a composite laminated plate is economically cheaper than a glass woven fabric-based laminated plate, can be punched and punched, has an excellent V-cutting property, and has a good workability. However, the reliability, dimensional stability, and warpage of through-hole plating were evaluated to be lower than that of the glass woven fabric substrate laminate. The reason is that the glass woven fabric-based epoxy laminate has a composition in which the weight ratio of the organic epoxy resin to the inorganic glass woven fabric is about 40: 6.
It is 0. In this case, it is considered that the epoxy resin mainly makes various electrical performances excellent, and the glass woven fabric makes mechanical properties such as bending strength and dimensional stability favorable.
【０００４】ところで一般のコンポジット積層板は、中
間層にガラス不織布が基材として用いられており、織布
基材を使用した積層板に比べて加熱加圧成形時の歪みを
生じ易いため、寸法安定性、反りが劣るという問題があ
る。By the way, a general composite laminated board uses a glass non-woven fabric as a base material for the intermediate layer, and is liable to be distorted at the time of heat and pressure molding as compared with a laminated board using a woven base material. There is a problem of poor stability and warpage.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、表面層のガ
ラス織布の枚数を増すことにより、従来のコンポジット
積層板の優れた打抜き加工性、Ｖカット性の特徴を失う
ことなく、積層板加工時の寸法安定性、反りの優れた積
層板を提供することにある。SUMMARY OF THE INVENTION According to the present invention, by increasing the number of glass woven fabrics for the surface layer, a laminated board can be obtained without losing the excellent punching and V-cutting characteristics of the conventional composite laminated board. It is intended to provide a laminated plate having excellent dimensional stability and warpage during processing.
【０００６】[0006]
【課題を解決するための手段】本発明は、表面層が熱硬
化性樹脂を含浸したガラス織布からなり、中間層は熱硬
化性樹脂に対してフィラーが１０〜２００重量％含有さ
れている樹脂を含浸したガラス不織布からなる積層板に
おいて、各表面層に熱硬化性樹脂を含浸したガラス織布
を２枚以上使用したことを特徴とする印刷回路用積層板
である。According to the present invention, a surface layer is made of a glass woven fabric impregnated with a thermosetting resin, and the intermediate layer contains 10 to 200% by weight of a filler with respect to the thermosetting resin. A laminated board for a printed circuit, comprising a glass woven cloth impregnated with a resin, and two or more glass woven cloths each surface layer of which is impregnated with a thermosetting resin.
【０００７】従来のコンポジット積層板は、図１に示す
様に、中間層の基材にガラス不織布が用いられ、表面層
には各面に１枚のガラス織布が用いられているため、ガ
ラス織布基材の積層板に比較して積層板加工工程での寸
法安定性、反りが劣る問題があった。本発明はこの欠点
を解決するものであり、表面層のガラス織布を図２に示
す様に、各表面に各２枚以上使用することにより、加工
時の寸法安定性、反りをガラス織布基材の積層板と同等
レベルまで向上させることができる。As shown in FIG. 1, a conventional composite laminated plate uses a glass non-woven fabric as a base material for an intermediate layer and a glass woven fabric for each surface as a surface layer. There was a problem that the dimensional stability and warpage in the laminated plate processing step were inferior to the laminated plate of the woven fabric substrate. The present invention solves this drawback. As shown in FIG. 2, by using two or more glass woven fabrics for each surface layer, the dimensional stability and warpage during processing can be improved by using the glass woven fabric. It can be improved to the same level as the laminate of the base material.
【０００８】本発明において使用するガラス織布は５０
ｇ／ｍ2 〜２６０ｇ／ｍ2 までのものが好ましい。また
使用するガラス織布は２１０ｇ／ｍ2 のガラス織布で各
面に対してそれぞれ２〜３枚が望ましく、それ以上では
コンポジット積層板の打抜き加工性、Ｖカット性が低下
してくるので望ましくない。The glass woven fabric used in the present invention is 50
those up to g / m 2 ~260g / m 2 is preferred. Further, the glass woven cloth used is 210 g / m 2 of glass woven cloth, and it is desirable that the number of sheets is 2 to 3 on each side, and if it is more than that, the punching workability and V-cutting property of the composite laminate are deteriorated, which is desirable. Absent.
【０００９】[0009]
【実施例】エポキシ樹脂ワニスの組成は次の通りであ
る。EXAMPLES The composition of the epoxy resin varnish is as follows.
【００１０】[0010]
【表１】 [Table 1]
【００１１】上記材料を混合して均一なワニスを作製し
た。次に表面層用として配合した該ワニスをガラス織布
(日東紡製 WE-18K-RB84 210g/m2)に樹脂含有量が４２〜
４５％になるように含浸乾燥し、ガラス織布プリプレグ
を得た。続いて、中間層用として同様に配合したワニス
に樹脂分１００部に対し次の配合の無機充填剤を添加
し、撹拌混合し無機充填剤含有ワニスを作製した。 シリカ （龍森製 クリスタライトＶＸ−３） ２５部 水酸化アルミニウム（Ａｌ2Ｏ3 ・３Ｈ2Ｏ） ７０部 超微粉末シリカ （シオノギ製薬製 カープレックス） ５部 この無機充填剤含有ワニスをガラス不織布基材（日本バ
イリーン製）に樹脂及び無機充填剤の含有量が９０％に
なるように含浸乾燥してプリプレグを得た。The above materials were mixed to prepare a uniform varnish. Next, the varnish compounded for the surface layer was made into a glass woven fabric.
(Nittobo WE-18K-RB84 210g / m 2 ) with a resin content of 42-
The glass woven fabric prepreg was impregnated and dried to 45% to obtain a woven prepreg. Subsequently, an inorganic filler having the following composition was added to 100 parts of the resin content of the varnish similarly mixed for the intermediate layer, and the mixture was stirred and mixed to prepare an inorganic filler-containing varnish. Silica (Tatsumori Ltd. crystallites VX-3) 25 parts of aluminum hydroxide (Al 2 O 3 · 3H 2 O) 70 parts of ultrafine powder silica (Shionogi Seiyaku Carplex) 5 parts glass nonwoven this inorganic filler-containing varnish A base material (manufactured by Nippon Vilene) was impregnated and dried so that the content of the resin and the inorganic filler was 90% to obtain a prepreg.
【００１２】[0012]
【実施例】ガラス不織布基材プリプレグを中間層とし、
上下表面層に前記ガラス織布プリプレグを各２枚配置
し、更にその上に金属箔を重ね、プレス成形して厚さ
１.６mmの銅張積層板を得た。Example: A glass non-woven fabric base material prepreg is used as an intermediate layer,
Two pieces of each of the above-mentioned glass woven prepregs are arranged on the upper and lower surface layers, and a metal foil is further laid on the prepreg and press-formed to obtain a thickness
A 1.6 mm copper clad laminate was obtained.
【００１３】[0013]
【比較例】前記実施例において、上記表面層のガラス織
布プリプレグを各１枚配置し、以下実施例と同様にして
厚さ １.６mmの銅箔積層板を得た。得られた銅張積層板
について回路板での加工工程における寸法変化率(収縮
率)、反り、Ｖカット性を測定した。その結果を表２に
示す。COMPARATIVE EXAMPLE One glass woven prepreg of the above surface layer was arranged in each of the above examples, and a copper foil laminate having a thickness of 1.6 mm was obtained in the same manner as in the following examples. With respect to the obtained copper-clad laminate, the dimensional change rate (shrinkage rate), warpage, and V-cut property in the process of processing the circuit board were measured. The results are shown in Table 2.
【００１４】[0014]
【表２】 [Table 2]
【００１５】（測定方法） 寸法変化率：JIS C 6481に準じて測定。 反り ： 同 上 Ｖカット性：２５mm幅のテストピースを作成し、両表面
ガラス織布の層をＶカットして中間層の部分を ０.５mm
残した。スパン５０mmとして曲げ強度を測定し、折れ強
度とした。(Measuring method) Dimensional change rate: Measured according to JIS C 6481. Warpage: Same as above V-cut property: A test piece with a width of 25 mm was prepared, and the layers of glass woven cloth on both surfaces were V-cut to give an intermediate layer of 0.5 mm.
left. Bending strength was measured with a span of 50 mm and defined as bending strength.
【００１６】表２からも明らかなように、表面層のガラ
ス織布を多くした銅張積層板は、打抜き加工性、Ｖカッ
ト性は、従来のコンポジット銅張板と同等で、寸法安定
性、反りに優れていることがわかる。As is clear from Table 2, the copper-clad laminate having a large amount of glass woven surface layer has the same punching workability and V-cutting property as the conventional composite copper-clad sheet, and has dimensional stability and dimensional stability. It turns out that it is excellent in warpage.
【００１７】[0017]
【発明の効果】本発明による積層板は、表面層のガラス
織布を増すことにより、従来のコンポジット積層板に比
べ寸法収縮率、反りが大幅に低減し、ガラス織布基材積
層板と同等レベルとなり、工業的な印刷回路用積層板と
して好適である。EFFECTS OF THE INVENTION The laminated sheet according to the present invention has a dimensional shrinkage rate and warpage significantly reduced as compared with the conventional composite laminated sheet by increasing the glass woven cloth as the surface layer, and is equivalent to the glass woven substrate laminated sheet. It becomes a level and is suitable as an industrial printed circuit board laminate.
【図１】従来のコンポジット積層板の概略断面図。FIG. 1 is a schematic cross-sectional view of a conventional composite laminated board.
【図２】本発明のコンポジット積層板の概略断面図。FIG. 2 is a schematic sectional view of a composite laminate of the present invention.
１ 銅箔 ２ 熱硬化性樹脂を含浸したガラス織布 ３ 熱硬化性樹脂を含浸したガラス不織布 1 Copper foil 2 Glass woven fabric impregnated with thermosetting resin 3 Glass non-woven fabric impregnated with thermosetting resin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｈ 7011−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H05K 1/03 H 7011-4E
Claims (1)
織布からなり、中間層は熱硬化性樹脂に対してフィラー
が１０〜２００重量％含有されている樹脂を含浸したガ
ラス不織布からなる積層板において、各表面層に熱硬化
性樹脂を含浸したガラス織布を２枚以上使用したことを
特徴とする印刷回路用積層板。1. The surface layer is made of a glass woven fabric impregnated with a thermosetting resin, and the intermediate layer is made of a glass nonwoven fabric impregnated with a resin containing 10 to 200% by weight of a filler with respect to the thermosetting resin. A laminated board for a printed circuit, comprising two or more glass woven fabrics each surface layer of which is impregnated with a thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32916291A JPH05162246A (en) | 1991-12-12 | 1991-12-12 | Laminated sheet for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32916291A JPH05162246A (en) | 1991-12-12 | 1991-12-12 | Laminated sheet for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05162246A true JPH05162246A (en) | 1993-06-29 |
Family
ID=18218339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32916291A Pending JPH05162246A (en) | 1991-12-12 | 1991-12-12 | Laminated sheet for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05162246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG94696A1 (en) * | 1996-02-29 | 2003-03-18 | Sumitomo Bakelite Co | Laminated board and process for production thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60203438A (en) * | 1984-03-29 | 1985-10-15 | 住友ベークライト株式会社 | Laminated board for printed circuit |
| JPS62270333A (en) * | 1986-05-20 | 1987-11-24 | 東芝ケミカル株式会社 | Copper-lined laminated board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH03211892A (en) * | 1990-01-17 | 1991-09-17 | Sumitomo Bakelite Co Ltd | Manufacture of laminated board for printed circuit |
-
1991
- 1991-12-12 JP JP32916291A patent/JPH05162246A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60203438A (en) * | 1984-03-29 | 1985-10-15 | 住友ベークライト株式会社 | Laminated board for printed circuit |
| JPS62270333A (en) * | 1986-05-20 | 1987-11-24 | 東芝ケミカル株式会社 | Copper-lined laminated board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH03211892A (en) * | 1990-01-17 | 1991-09-17 | Sumitomo Bakelite Co Ltd | Manufacture of laminated board for printed circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG94696A1 (en) * | 1996-02-29 | 2003-03-18 | Sumitomo Bakelite Co | Laminated board and process for production thereof |
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