JPH05315716A - Electrical laminate plate - Google Patents
Electrical laminate plateInfo
- Publication number
- JPH05315716A JPH05315716A JP11355692A JP11355692A JPH05315716A JP H05315716 A JPH05315716 A JP H05315716A JP 11355692 A JP11355692 A JP 11355692A JP 11355692 A JP11355692 A JP 11355692A JP H05315716 A JPH05315716 A JP H05315716A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- base material
- metal foil
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる電気用積層板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electronic equipment, electric equipment, calculators, communication equipment and the like.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高出力化、高密
度化対策としてプリント配線板、多層プリント配線板、
電気用積層板の耐熱性が強く要求されている。このため
樹脂中に無機質充填剤を多量に含有させたりしているが
バインダーとしての樹脂そのものの耐熱性が障害となっ
ていた。2. Description of the Related Art In recent years, printed wiring boards, multilayer printed wiring boards,
There is a strong demand for heat resistance of electrical laminates. Therefore, a large amount of inorganic filler is contained in the resin, but the heat resistance of the resin itself as a binder has been an obstacle.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、無機質充填剤を多量に用いても耐熱性には限界が
ある。本発明は従来の技術における上述の問題点に鑑み
てなされたもので、その目的とするところは耐熱性に優
れた電気用積層板を提供し、プリント配線板、多層プリ
ント配線板に用いられるようにすることにある。As described in the prior art, heat resistance is limited even if a large amount of inorganic filler is used. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electric laminated board having excellent heat resistance and to be used for a printed wiring board and a multilayer printed wiring board. Is to
【０００４】[0004]
【課題を解決するための手段】本発明は所要枚数のシリ
コン及び又はポリイミド変性エポキシ樹脂含浸基材の上
面及び又は下面に、金属箔を配設ー体化してなることを
特徴とする電気用積層板のため、上記目的を達成するこ
とができたもので以下、本発明を詳細に説明する。SUMMARY OF THE INVENTION The present invention is a laminate for electrical use characterized in that a required number of silicon and / or polyimide modified epoxy resin-impregnated base materials are provided with metal foils on the upper and / or lower surfaces thereof. The present invention will be described in detail below because the above-mentioned object can be achieved because of the plate.
【０００５】本発明に用いる樹脂含浸基材のエポキシ樹
脂は、１分子中に２個以上のエポキシ基を持つビスフェ
ノ−ルＡ型エポキシ樹脂、ビスフェノ−ルＦ型エポキシ
樹脂、ノボラック型エポキシ樹脂、ハロゲン化エポキシ
樹脂、グリシジル型エポキシ樹脂、高分子型エポキシ樹
脂等のようにエポキシ樹脂全般を用いることができるが
シリコン及び又はポリイミドで変性したエポキシ樹脂を
含有していることが必要で、該変性エポキシ樹脂量は樹
脂全量の５０〜１００重量％（以下単に％と記す）であ
ることが必要である。即ち５０％未満では耐熱性が向上
しない傾向にあるからである。なお樹脂には必要に応じ
てタルク、クレー、シリカ、炭酸カルシュウム、水酸化
アルミニゥム等の無機質粉末充填剤やガラス繊維、アス
ベスト繊維、パルプ繊維、合成繊維、セラミック繊維等
の繊維質充填剤を含有させることができる。樹脂含浸基
材の基材としては、ガラス、アスベスト等の無機質繊維
やポリエステル、ポリアミド、ポリアクリル、ポリビニ
ルアルコール、ポリイミド、フッ素樹脂等の有機質繊維
や木綿等の天然繊維等の織布、不織布、紙である。更に
樹脂は同一の樹脂のみによる含浸でもよいが、同系樹脂
又は異系樹脂による１次含浸、２次含浸というように含
浸を複数にし、より含浸が均一になるようにすることも
できる。かくして基材に樹脂を含浸後、必要に応じて加
熱乾燥して樹脂含浸基材を得るものである。金属箔とし
ては銅、アルミニュウム、真鍮、ニッケル、鉄等の単
独、合金、複合箔が用いられ必要に応じて金属箔の片面
に接着剤層を設けておくことができる。一体化の条件は
樹脂、基材、厚み等で硬化温度、硬化時間、成形圧力を
選択することができ、無圧連続工法、ダブルベルト成形
工法、マルチロール工法等の連続的製造方法を用いるこ
ともできる。The epoxy resin as the resin-impregnated base material used in the present invention is a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolac type epoxy resin, or a halogen having two or more epoxy groups in one molecule. General epoxy resins such as epoxidized epoxy resin, glycidyl type epoxy resin, polymer type epoxy resin, etc. can be used, but it is necessary to contain an epoxy resin modified with silicon and / or polyimide. The amount is required to be 50 to 100% by weight (hereinafter simply referred to as "%") of the total amount of the resin. That is, if it is less than 50%, the heat resistance tends not to be improved. If necessary, the resin may contain an inorganic powder filler such as talc, clay, silica, calcium carbonate or aluminum hydroxide, or a fibrous filler such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber or ceramic fiber. be able to. As the base material of the resin-impregnated base material, glass, inorganic fibers such as asbestos, polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, organic fibers such as fluororesin and natural fibers such as cotton, woven cloth, nonwoven cloth, paper Is. Further, the resin may be impregnated with only the same resin, but it is also possible to make the impregnation more uniform by primary impregnation with the same resin or different type resin and secondary impregnation. Thus, the base material is impregnated with the resin and then dried by heating if necessary to obtain a resin-impregnated base material. As the metal foil, copper, aluminum, brass, nickel, iron or the like alone, an alloy or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary. As for the integration conditions, the curing temperature, curing time, and molding pressure can be selected depending on the resin, substrate, thickness, etc., and continuous manufacturing methods such as pressureless continuous method, double belt molding method, and multi-roll method should be used. Can also
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例１】ビスフェノ−ルＡ型エポキシ樹脂初期縮合
物をオルガノポリシロキサン、芳香族ポリイミド、不飽
和ポリイミドと反応させてなるシリコンポリイミド変性
エポキシ樹脂１００重量部（以下単に部と記す）にジシ
アンジアミド２部を添加したワニスを、厚み０．１５ｍ
ｍのガラス布に樹脂量が４５％になるように含浸、乾燥
して得たプリプレグ７枚を重ねた上下面に厚み０．０３
５ｍｍの銅箔を配した積層体を成形圧力４０Ｋｇ／ｃｍ
2 、１８０℃で９０分間加熱加圧成形して厚み１．２ｍ
ｍの両面銅張積層板を得た。Example 1 100 parts by weight of a silicone polyimide-modified epoxy resin (hereinafter simply referred to as "part") obtained by reacting a bisphenol A type epoxy resin precondensate with an organopolysiloxane, an aromatic polyimide, and an unsaturated polyimide was added to dicyandiamide 2 The varnish with the added parts has a thickness of 0.15 m.
A glass cloth of m was impregnated with a resin amount of 45% and dried, and seven prepregs obtained by stacking were stacked to have a thickness of 0.03.
Molding pressure of 40Kg / cm for laminates with 5mm copper foil
2. Heat and pressure molding for 90 minutes at 180 ℃, thickness 1.2m
A double-sided copper clad laminate of m was obtained.
【０００８】[0008]
【実施例２】実施例１と同じシリコンポリイミド変性エ
ポキシ樹脂７５部、ビスフェノ−ルＡ型エポキシ樹脂２
５部にジシアンジアミド２部を添加したワニスを用いた
以外は実施例１と同様に処理して厚み１．２ｍｍの両面
銅張積層板を得た。Example 2 75 parts of the same silicone polyimide modified epoxy resin as in Example 1 and bisphenol A type epoxy resin 2
A double-sided copper-clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 1 except that a varnish containing 5 parts by weight of 2 parts of dicyandiamide was used.
【０００９】[0009]
【比施例】ビスフェノ−ルＡ型エポキシ樹脂１００部に
ジシアンジアミド２部を添加したワニスを用いた以外は
実施例１と同様に処理して厚み１．２ｍｍの両面銅張積
層板を得た。Comparative Example A double-sided copper clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 1 except that a varnish prepared by adding 2 parts of dicyandiamide to 100 parts of a bisphenol A type epoxy resin was used.
【００１０】実施例１と２及び比較例の積層板の耐熱性
は表１のようである。Table 1 shows the heat resistance of the laminated plates of Examples 1 and 2 and Comparative Example.
【００１１】[0011]
【表１】 [Table 1]
【００１２】[0012]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する電気用積層板に
おいては、耐熱性が向上し、本発明の優れていることを
確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate having the structure described in the claims has improved heat resistance and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display area // B29K 105: 06
Claims (1)
性エポキシ樹脂含浸基材の上面及び又は下面に、金属箔
を配設ー体化してなることを特徴とする電気用積層板。1. An electrical laminate comprising a required number of silicon and / or polyimide-modified epoxy resin-impregnated base materials and metal foils disposed and formed on the upper and / or lower surfaces thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11355692A JPH05315716A (en) | 1992-05-06 | 1992-05-06 | Electrical laminate plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11355692A JPH05315716A (en) | 1992-05-06 | 1992-05-06 | Electrical laminate plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05315716A true JPH05315716A (en) | 1993-11-26 |
Family
ID=14615287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11355692A Pending JPH05315716A (en) | 1992-05-06 | 1992-05-06 | Electrical laminate plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05315716A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281663A (en) * | 2004-03-04 | 2005-10-13 | Hitachi Chem Co Ltd | Prepreg and metal foil-clad laminate and printed circuit board using the same |
| US7871694B2 (en) | 2004-03-04 | 2011-01-18 | Hitachi Chemical Company, Ltd. | Prepreg, metal-clad laminate and printed circuit board using same |
-
1992
- 1992-05-06 JP JP11355692A patent/JPH05315716A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281663A (en) * | 2004-03-04 | 2005-10-13 | Hitachi Chem Co Ltd | Prepreg and metal foil-clad laminate and printed circuit board using the same |
| US7871694B2 (en) | 2004-03-04 | 2011-01-18 | Hitachi Chemical Company, Ltd. | Prepreg, metal-clad laminate and printed circuit board using same |
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