JPH05299401A - Organic matter remover - Google Patents
Organic matter removerInfo
- Publication number
- JPH05299401A JPH05299401A JP9906592A JP9906592A JPH05299401A JP H05299401 A JPH05299401 A JP H05299401A JP 9906592 A JP9906592 A JP 9906592A JP 9906592 A JP9906592 A JP 9906592A JP H05299401 A JPH05299401 A JP H05299401A
- Authority
- JP
- Japan
- Prior art keywords
- ozone
- wafer
- solvent
- organic matter
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置の製造装置
の中で、半導体基板（以下、ウェハ、という）表面上の
有機物を除去する為の有機物除去装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic substance removing device for removing organic substances on the surface of a semiconductor substrate (hereinafter referred to as a wafer) in a semiconductor device manufacturing apparatus.
【０００２】[0002]
【従来の技術】従来この種の装置は、図３に示すよう
に、ウェハ上の有機物をその溶剤にて溶かし、除去する
為の槽１及び２を有し、かつ、水洗槽３で処理したウェ
ハを遠心力を利用して乾燥させる為のスピンドライヤー
槽９を有している。このスピンドライヤー槽９では、ウ
ェハ収納治具固定ホルダー１３内で、モータ電極１０を
接続したモータ１１により回転する回転テーブル１２上
のウェハを乾燥する。2. Description of the Related Art Conventionally, as shown in FIG. 3, an apparatus of this type has tanks 1 and 2 for dissolving and removing organic substances on a wafer with its solvent, and treating with a washing tank 3. It has a spin dryer tank 9 for drying the wafer by utilizing the centrifugal force. In this spin dryer tank 9, the wafer on the rotary table 12 rotated by the motor 11 to which the motor electrode 10 is connected is dried in the wafer storage jig fixing holder 13.
【０００３】[0003]
【発明が解決しようとする課題】この従来の有機物除去
装置では、ウェハ上の有機物を溶剤で溶かして除去しよ
うとしている為、溶剤中に溶け込んだ有機物がウェハ上
に再付着し、集積回路の細かい段差部等に残っていた。
その為、後工程の熱処理などでウェハを汚染するという
問題点があった。In this conventional organic substance removing device, since the organic substance on the wafer is to be removed by dissolving it in a solvent, the organic substance dissolved in the solvent is redeposited on the wafer, and the integrated circuit becomes fine. It was left on the steps.
Therefore, there is a problem that the wafer is contaminated by the heat treatment in the subsequent process.
【０００４】[0004]
【課題を解決するための手段】本発明の特徴は、ウェハ
表面上の有機物を溶剤によって溶かす手段と、前記溶か
された有機物をオゾンと反応させて除去する手段とを有
する有機物除去装置にある。この有機物を溶剤によって
溶かす手段は該溶剤を入れた溶剤槽であり、有機物をオ
ゾンと反応させて除去する手段はＵＶランプと酸素供給
管とが載置されているＵＶオゾン槽であることができ
る。あるいは、有機物を溶剤によって溶かす手段は回転
テーブル上で回転するウェハの表面に吐出ノズルによっ
て該溶剤を吹き付けるものであり、有機物をオゾンと反
応させて除去する手段はオゾンを発生させるＵＶランプ
と排気ダクトを具備したオゾン処理室であることができ
る。A feature of the present invention resides in an organic substance removing apparatus having means for dissolving organic substances on a wafer surface with a solvent, and means for reacting and removing the dissolved organic substances with ozone. The means for dissolving the organic matter with a solvent may be a solvent tank containing the solvent, and the means for removing the organic matter by reacting with ozone may be a UV ozone tank on which a UV lamp and an oxygen supply pipe are mounted. . Alternatively, the means for dissolving the organic matter with the solvent is to spray the solvent onto the surface of the wafer rotating on the rotary table with a discharge nozzle, and the means for reacting and removing the organic matter with ozone is a UV lamp for generating ozone and an exhaust duct. Can be an ozone treatment chamber.
【０００５】このような本発明では、ＵＶランプにより
オゾンを発生しかつ、活性化することにより、ウェハ上
に微量残った有機物とオゾンを反応させガス状にし、分
子レベルで完全に有機物を除去する事が出来る。According to the present invention as described above, ozone is generated and activated by the UV lamp to react a small amount of the organic matter remaining on the wafer with ozone to form a gas, and the organic matter is completely removed at the molecular level. I can do things.
【０００６】[0006]
【実施例】次に、本発明について、図面を参照して説明
する。図１は、本発明の第１の実施例の有機物除去装置
の槽構成図である。Next, the present invention will be described with reference to the drawings. FIG. 1 is a tank configuration diagram of an organic substance removing apparatus according to a first embodiment of the present invention.
【０００７】表面に有機物を有するウェハ（図示省略）
は、まず、溶剤の入ったはくり槽１に入り大部分の有機
物が除去される。次に、ウェハ表面に再付着した有機物
を除去する為、再び溶剤の入ったはくり槽２に入る。こ
の後、純水槽３で洗浄するが、ウェハ表面には、ごく微
量の有機物が残っている為、ＵＶオゾン槽４内で、ＵＶ
電極５からの電圧で、ＵＶランプ６から発せられる紫外
線（λ＝２８４ｍｍ及びλ＝１８４ｍｍ付近の波長）に
より、活性化されたオゾン（Ｏ3 ）を発生させ、ウェハ
上の有機物の分子、又は原子と反応させることで有機物
を完全に除去しかつ、乾燥させる。このＵＶオゾン槽４
では、酸素供給管７によってオゾンを効率良く発生させ
る為の酸素を供給し、シャッター８によってＵＶオゾン
槽４を密閉することにより、発生したオゾンを外部に逃
がさない様にしている。A wafer having an organic substance on its surface (not shown)
First, most of the organic substances are removed from the stripping tank 1 containing the solvent. Next, in order to remove the organic substances redeposited on the surface of the wafer, the solvent again enters the stripping tank 2. After that, the wafer is cleaned in the pure water tank 3. However, since a very small amount of organic matter remains on the wafer surface, the UV is kept in the UV ozone tank 4.
Activated ozone (O 3 ) is generated by ultraviolet rays (wavelengths near λ = 284 mm and λ = 184 mm) emitted from the UV lamp 6 by the voltage from the electrode 5, and organic molecules or atoms on the wafer are generated. The organic matter is completely removed by reacting with and dried. This UV ozone tank 4
Then, oxygen for efficiently generating ozone is supplied by the oxygen supply pipe 7, and the UV ozone tank 4 is closed by the shutter 8 so that the generated ozone is not escaped to the outside.
【０００８】なお、有機物を完全に除去する為に本実施
例では、ＵＶランプを用いたが、オゾンと有機物を反応
させて、有機物の除去を行う機能を有する有機物除去装
置は、オゾン発生原理が異なっていてもよい。In this embodiment, a UV lamp was used to completely remove the organic substance. However, an organic substance removing device having a function of reacting ozone with the organic substance to remove the organic substance has the ozone generation principle. It may be different.
【０００９】次に、本発明の第２の実施例について図２
を参照して説明する。まず、ウェハ２４が、搬送アーム
２８により回転テーブル２２の上に乗せられる。次に回
転テーブル２２がウェハ２４を吸着し、さらに回転モー
タ２３によって回転させられる。この時、吐出ノズル２
１から有機溶剤がウェハ２４上に吐出される。一定時間
この状態を保つ事により、ウェハ２４上の有機物は、ほ
とんど溶解され、遠心力によりウェハ２４の外部に排出
される。Next, a second embodiment of the present invention will be described with reference to FIG.
Will be described. First, the wafer 24 is placed on the turntable 22 by the transfer arm 28. Next, the rotary table 22 attracts the wafer 24, and the rotary table 23 rotates the wafer 24. At this time, the discharge nozzle 2
The organic solvent is discharged onto the wafer 24 from 1. By keeping this state for a certain period of time, most of the organic substances on the wafer 24 are dissolved and discharged to the outside of the wafer 24 by the centrifugal force.
【００１０】次に、吐出ノズル２１から、有機溶剤を吐
出するのを止め、回転モータ２３により、高速回転させ
る。この状態を一定時間続けるとウェハ２４上の有機溶
剤もウェハ２４の外部へ排出され、ウェハ２４は乾燥す
る。Next, the discharge of the organic solvent from the discharge nozzle 21 is stopped, and the rotation motor 23 rotates at high speed. If this state is continued for a certain period of time, the organic solvent on the wafer 24 is also discharged to the outside of the wafer 24, and the wafer 24 is dried.
【００１１】しかし、この状態では、ウェハ２４上に微
量の有機皮膜が残っている為、搬送アーム２８により、
ウェハ２４をオゾン処理室１５へ搬送ベルト２７に搭載
されて搬送される。However, in this state, since a trace amount of the organic film remains on the wafer 24, the transfer arm 28 causes
The wafer 24 is mounted on the transfer belt 27 and transferred to the ozone processing chamber 15.
【００１２】オゾン処理室２５の中には、ＵＶランプ２
６が点灯しており、オゾンが多量に発生している。この
オゾンをＵＶランプ２６から出される光により、活性化
させ、ウェハ２４上の有機物と反応させる。従ってオゾ
ン処理室２５の中でウェハ２４上の有機物はＨ2 Ｏ，Ｃ
Ｏ2 ，ＮＯX …となって排気ダクト２９から排出される
ことになる。In the ozone treatment chamber 25, the UV lamp 2
6 is on, and a large amount of ozone is generated. The ozone is activated by the light emitted from the UV lamp 26 and reacts with the organic substances on the wafer 24. Therefore, in the ozone treatment chamber 25, the organic substances on the wafer 24 are H 2 O, C
It becomes O 2 , NO x ... And is discharged from the exhaust duct 29.
【００１３】以上の処理を実施することで、ウェハ２４
上の有機物は、完全に除去される。By performing the above processing, the wafer 24
The above organic matter is completely removed.
【００１４】本実施例において、先に述べた第１の実施
例と同様にオゾンを発生させる為にＵＶランプを用いた
が、その他の方式によりオゾンを発生させてもよい。In this embodiment, the UV lamp is used to generate ozone similarly to the first embodiment described above, but ozone may be generated by other methods.
【００１５】[0015]
【発明の効果】以上説明した様に、本発明は、ウェハ上
の有機物を分子又は、原子レベルでオゾンと反応させる
ことで、完全に除去出来るという効果を有し、後工程に
有機物を持ち込みウェハを汚染することはない。Industrial Applicability As described above, the present invention has an effect that organic substances on a wafer can be completely removed by reacting them with ozone at the molecular or atomic level. Does not pollute.
【図１】本発明の第１の実施例の有機物除去装置を示す
構成図。FIG. 1 is a configuration diagram showing an organic substance removing apparatus according to a first embodiment of the present invention.
【図２】本発明の第２の実施例の有機物除去装置を示す
構成図。FIG. 2 is a configuration diagram showing an organic substance removing apparatus according to a second embodiment of the present invention.
【図３】従来技術の有機物除去装置を示す構成図。FIG. 3 is a configuration diagram showing a conventional organic matter removing device.
１，２ はくり槽 ３ 純水槽 ４ ＵＶオゾン槽 ５ ＵＶ電極 ６ ＵＶランプ ７ 酸素供給管 ８ シャッター ９ スピンドライヤー １０ モータ電極 １１ モータ １２ 回転テーブル １３ ウェハ収納治具固定ホルダー ２１ 吐出ノズル ２２ 回転テーブル ２３ 回転モータ ２４ ウェハー ２５ オゾン処理室 ２６ ＵＶランプ ２７ 搬送ベルト ２８ 搬送アーム ２９ 排気ダクト 1, 2 peeling tank 3 pure water tank 4 UV ozone tank 5 UV electrode 6 UV lamp 7 oxygen supply tube 8 shutter 9 spin dryer 10 motor electrode 11 motor 12 rotary table 13 wafer storage jig fixed holder 21 discharge nozzle 22 rotary table 23 Rotation motor 24 Wafer 25 Ozone treatment chamber 26 UV lamp 27 Transport belt 28 Transport arm 29 Exhaust duct
Claims (4)
て溶かす手段と、前記溶かされた有機物をオゾンと反応
させて除去する手段とを有することを特徴とする有機物
除去装置。1. An organic substance removing apparatus comprising: a means for dissolving an organic substance on the surface of a semiconductor substrate with a solvent; and a means for removing the dissolved organic substance by reacting with ozone.
は該溶剤を入れた溶剤槽であり、前記有機物をオゾンと
反応させて除去する手段はＵＶオゾン槽であることを特
徴とする請求項１に記載の有機物除去装置。2. The means for dissolving the organic matter with a solvent is a solvent tank containing the solvent, and the means for reacting and removing the organic matter with ozone is a UV ozone tank. The organic substance removing device described.
供給管とが載置されていることを特徴とする請求項２に
記載の有機物除去装置。3. The organic substance removing apparatus according to claim 2, wherein a UV lamp and an oxygen supply pipe are mounted on the UV ozone tank.
は回転テーブル上で回転する半導体基板の表面に吐出ノ
ズルによって該溶剤を吹き付けるものであり、前記有機
物をオゾンと反応させて除去する手段はオゾンを発生さ
せるＵＶランプと排気ダクトを具備したオゾン処理室で
あることを特徴とする請求項１に記載の有機物除去装
置。4. The means for dissolving the organic matter with a solvent sprays the solvent onto the surface of a semiconductor substrate rotating on a turntable by a discharge nozzle, and the means for reacting the organic matter with ozone to remove the ozone. The organic substance removing apparatus according to claim 1, wherein the ozone treating chamber is provided with a UV lamp for generating the gas and an exhaust duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906592A JPH05299401A (en) | 1992-04-20 | 1992-04-20 | Organic matter remover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906592A JPH05299401A (en) | 1992-04-20 | 1992-04-20 | Organic matter remover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05299401A true JPH05299401A (en) | 1993-11-12 |
Family
ID=14237399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9906592A Pending JPH05299401A (en) | 1992-04-20 | 1992-04-20 | Organic matter remover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05299401A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188530A (en) * | 1984-10-08 | 1986-05-06 | Toshiba Corp | Cleaning apparatus |
| JPH01111337A (en) * | 1987-10-26 | 1989-04-28 | Toshiba Corp | Wafer cleaning apparatus |
-
1992
- 1992-04-20 JP JP9906592A patent/JPH05299401A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188530A (en) * | 1984-10-08 | 1986-05-06 | Toshiba Corp | Cleaning apparatus |
| JPH01111337A (en) * | 1987-10-26 | 1989-04-28 | Toshiba Corp | Wafer cleaning apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980623 |