JPH0529662A - Photosemiconductor device - Google Patents
Photosemiconductor deviceInfo
- Publication number
- JPH0529662A JPH0529662A JP18085991A JP18085991A JPH0529662A JP H0529662 A JPH0529662 A JP H0529662A JP 18085991 A JP18085991 A JP 18085991A JP 18085991 A JP18085991 A JP 18085991A JP H0529662 A JPH0529662 A JP H0529662A
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- elements
- view
- resin substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リードレスタイプの樹
脂封止型光半導体装置に関し、特に複数個の素子を有す
る光半導体装置に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a leadless type resin-sealed optical semiconductor device, and more particularly to an optical semiconductor device having a plurality of elements.
【０００２】[0002]
【従来の技術】従来のリードレスタイプの光半導体装置
における面実装デバイス（以下、ＳＭＤと称す）におい
て、複数の素子を搭載する場合の構造および製造方法に
ついて図４ないし図６にて説明する。2. Description of the Related Art A structure and manufacturing method for mounting a plurality of elements in a conventional surface-mounted device (hereinafter referred to as SMD) in a leadless type optical semiconductor device will be described with reference to FIGS.
【０００３】図４は従来の光半導体装置において樹脂モ
ールド前の状態を示す図、図５は同じくその樹脂モール
ド後の状態を示す図であって、同図−Ａは平面図、同図
−Ｂは同図−ＡのＤ−Ｄ断面図、同図−Ｃは同図−Ａの
Ｅ−Ｅ断面図、図６は同じくその完成品を示す図であっ
て、同図−Ａは平面図、同図−Ｂは正面図、同図−Ｃは
側面図である。FIG. 4 is a view showing a state before resin molding in a conventional optical semiconductor device, FIG. 5 is a view showing a state after resin molding, and FIG. 4A is a plan view and FIG. Is a sectional view taken along the line D-D of FIG.-A, FIG.-C is a sectional view taken along the line E-E of FIG.-A, and FIG. 6 is a view showing the finished product thereof. The same figure-B is a front view and the same figure-C is a side view.
【０００４】図４の如く、使用する基板１は、電極を形
成するためのスルーホールメッキ部２と、光半導体素子
３及び駆動素子（ドライブ用ＩＣ等）４を搭載するため
のヘッダー部５，６と、前記各素子３，４と電極２を電
気的にボンディングワイヤー７で結線するための結線部
８，９をメッキパターンにて形成された樹脂基板であ
る。As shown in FIG. 4, a substrate 1 to be used has a through hole plated portion 2 for forming electrodes, a header portion 5 for mounting an optical semiconductor element 3 and a driving element (drive IC etc.) 4. 6 and a connecting portion 8 and 9 for electrically connecting the respective elements 3 and 4 and the electrode 2 with a bonding wire 7 in a plating pattern.
【０００５】そして、、光半導体素子３は基板１のヘッ
ダー部５にダイボンドし、同様に駆動素子４も基板１の
ヘッダー部６にダイボンドする。その後、ボンディング
ワイヤー７でメッキパターンの結線部８，９と各素子
３，４を結線する。さらにこの状態で、図５の如く、ト
ランスフアモールドにて透光性樹脂を用いて光学系レン
ズ１０を有するパッケージ１１を成形する。その後、ダ
イシングライン１２に沿ってパッケージ１０を多分割に
切断して図６のような単独のＳＭＤ光半導体装置が完成
する。Then, the optical semiconductor element 3 is die-bonded to the header portion 5 of the substrate 1, and similarly, the driving element 4 is also die-bonded to the header portion 6 of the substrate 1. After that, the bonding wires 7 connect the connection portions 8 and 9 of the plating pattern to the respective elements 3 and 4. Further, in this state, as shown in FIG. 5, the package 11 having the optical system lens 10 is molded by a transfer molding using a translucent resin. Then, the package 10 is cut into multiple pieces along the dicing line 12 to complete a single SMD optical semiconductor device as shown in FIG.
【０００６】[0006]
【発明が解決しようとする課題】従来のＳＭＤ型光半導
体装置において、複数個の素子を１つのパッケージ内に
搭載する場合、一般に光学系レンズは光半導体装置のセ
ンター部に設置され、基板の片面（表面）のみを用いて
複数の素子を搭載してモールドし、パッケージ成形完了
後、これを多分割に切断して単独のＳＭＤ型光半導体装
置としている。In a conventional SMD type optical semiconductor device, when a plurality of elements are mounted in one package, an optical system lens is generally installed at the center of the optical semiconductor device and one surface of a substrate is mounted. A plurality of elements are mounted and molded using only the (front surface), and after the package molding is completed, this is cut into multiple pieces to form a single SMD optical semiconductor device.
【０００７】しかしながら、近年パッケージの小型化が
進む上で、上記のように基板の表面のみに複数の素子を
搭載していると、受発光面となる基板の表面上のメッキ
パターンは複雑となってしまい、メッキパターンを設計
する上で大巾な制限を受けることとなる。すなわち、光
学系レンズの光軸をパッケージの中心に位置するようメ
ッキパターンを設計するのが困難となり、結果的に光半
導体装置の小型化に限界が生じている。However, in recent years due to the miniaturization of packages, when a plurality of elements are mounted only on the surface of the substrate as described above, the plating pattern on the surface of the substrate which becomes the light receiving and emitting surface becomes complicated. Therefore, there is a great limitation in designing the plating pattern. That is, it becomes difficult to design the plating pattern so that the optical axis of the optical system lens is located at the center of the package, and as a result, there is a limit to miniaturization of the optical semiconductor device.
【０００８】本発明は、レンズの光軸をパッケージの中
心にしたメッキパターンの設計が容易となり、ひいては
装置の小型化に貢献できる光半導体装置の提供を目的と
する。An object of the present invention is to provide an optical semiconductor device which facilitates the design of a plating pattern with the optical axis of the lens as the center of the package and contributes to downsizing of the device.
【０００９】[0009]
【課題を解決するための手段】本発明による課題解決手
段は、図１ないし図３の如く、複数の素子５，６が搭載
されるＳＭＤ型光半導体装置において、樹脂基板１の両
面にモールド時にキャビティーランナー部および素子搭
載部となる凹面２０，２１を設け、樹脂基板１の両面に
メッキパターンを設け、この両面メッキパターンの一部
を接続するためのスルーホール２２及び、このスルーホ
ール２２に多分割後電極となるスルーホールメッキ部２
を設け、両凹面２０，２１に素子３，４を搭載しモール
ドして光学系レンズ１０を有するパッケージ１１を成形
し、その後樹脂基板１をダイシングライン１２に沿って
多分割に切断するものである。As shown in FIGS. 1 to 3, in the SMD type optical semiconductor device in which a plurality of elements 5 and 6 are mounted, as shown in FIGS. The cavity runner portion and the concave surfaces 20 and 21 which will be the element mounting portion are provided, the plating patterns are provided on both surfaces of the resin substrate 1, and the through hole 22 for connecting a part of the double-sided plating pattern and the through hole 22 are provided. Through-hole plated part 2 which will be the electrode after multi-division
Is provided, the elements 3 and 4 are mounted on the biconcave surfaces 20 and 21 and molded to form a package 11 having the optical system lens 10, and then the resin substrate 1 is cut along the dicing line 12 into multiple divisions. ..
【００１０】[0010]
【作用】上記課題解決手段において、樹脂基板１の両面
に素子搭載用凹面２０，２１を設け、さらに樹脂基板１
の両面にメッキパターンを設け、この両面メッキパター
ンの一部を接続するためのスルーホール２２及び、この
スルーホール２２に多分割後電極となるスルーホールメ
ッキ部２を形成しているから、樹脂基板１の両面を素子
搭載部及びメッキパターンの設置可能領域として使用で
きる。In the above means for solving the problems, element mounting concave surfaces 20 and 21 are provided on both surfaces of the resin substrate 1, and the resin substrate 1 is further provided.
Since the plating patterns are provided on both surfaces of the resin substrate and the through-holes 22 for connecting a part of the double-sided plating patterns and the through-hole plating portions 2 to be the electrodes after multi-division are formed in the through holes 22, the resin substrate Both surfaces of No. 1 can be used as an area where the element mounting portion and the plating pattern can be installed.
【００１１】このため、受発光面となる面には複雑なメ
ッキパターンが不要となるから、光学系レンズ１０の光
軸を中心にしたメッキパターンの設計が容易になり、そ
の結果パッケージサイズ１１の小型化が実現できる。Therefore, since a complicated plating pattern is not required on the light receiving / emitting surface, the plating pattern centering on the optical axis of the optical system lens 10 can be easily designed, and as a result, the package size 11 can be reduced. Miniaturization can be realized.
【００１２】[0012]
【実施例】図１は本発明の一実施例に係る光半導体装置
において樹脂モールド前の状態を示す図であって、同図
−Ａは平面図、同図−Ｂは背面図、同図−Ｃは同図−Ａ
のＡ−Ａ断面図、同図−Ｄは同図−ＡのＢ−Ｂ断面図、
同図−Ｅは同図−ＡのＣ−Ｃ断面図である。図２は同じ
くその樹脂モールド後の状態を示す図であって、同図−
Ａは平面図、同図−Ｂは背面図、同図−Ｃは同図−Ａの
Ａ−Ａ断面図、同図−Ｄは同図−ＡのＢ−Ｂ断面図、同
図−Ｅは同図−ＡのＣ−Ｃ断面図である。図３は同じく
その完成品を示す図であって、同図−Ａは平面図、同図
−Ｂは背面図、同図−Ｃは正面図、同図−Ｄは左側面
図、同図−Ｅは右側面図である。なお、図４ないし図６
に示した同一機能部品については同一符号を付してい
る。FIG. 1 is a view showing a state before resin molding in an optical semiconductor device according to an embodiment of the present invention, wherein FIG. 1A is a plan view, FIG. 1B is a rear view, and FIG. C is the same figure-A
A-A sectional view of the same, FIG.-D is a BB sectional view of the same-A,
FIG. 6E is a cross-sectional view taken along the line CC of FIG. FIG. 2 is also a view showing the state after the resin molding, which is similar to FIG.
A is a plan view, FIG.-B is a rear view, FIG.-C is a sectional view taken along line AA in FIG.-A, FIG.-D is a sectional view taken along line BB in FIG.-A, and FIG. It is CC sectional drawing of the same figure-A. FIG. 3 is also a view showing the finished product, where FIG. 3A is a plan view, FIG. 3B is a rear view, FIG. 3C is a front view, FIG. 3D is a left side view, and FIG. E is a right side view. 4 to 6
The same functional components as shown in (4) are designated by the same reference numerals.
【００１３】図示の如く、本実施例のＳＭＤ型光半導体
装置は、樹脂基板１にメッキパターンが設けられ、該メ
ッキパターン上に複数の光半導体素子３及び駆動素子４
が搭載され、該各光半導体素子３及び駆動素子４を透光
性樹脂にてモールドして複数の光学系レンズ１０付きの
パッケージ１１が形成され、該パッケージ１１を分離独
立させるため樹脂基板１をダイシングライン１２に沿っ
て多分割に切断して成る。As shown in the figure, in the SMD type optical semiconductor device of this embodiment, a plating pattern is provided on the resin substrate 1, and a plurality of optical semiconductor elements 3 and driving elements 4 are provided on the plating pattern.
Is mounted, the optical semiconductor element 3 and the driving element 4 are molded with a translucent resin to form a package 11 with a plurality of optical system lenses 10, and the resin substrate 1 for separating the package 11 from each other is formed. It is formed by cutting along the dicing line 12 into multiple divisions.
【００１４】前記樹脂基板１は、図１の如く、表面に光
半導体素子３を搭載するための第一素子搭載用凹面２０
が、裏面に駆動素子４を搭載するための第二素子搭載用
凹面２１が形成されている。そして、第一素子搭載用凹
面２０内には、光半導体素子３がダイボンドされる第一
ヘッダー部５と、光半導体素子３とボンディングワイヤ
ー７を介して結線される第一結線部８とがメッキパター
ンにて形成されている。一方、第二素子搭載用凹面２１
内には、樹脂封止時にキャビティランナー部となり駆動
素子４がダイボンドされる第二ヘッダー部６と、駆動素
子４とボンディングワイヤー７を介して結線される第二
結線部９とがメッキパターンにて形成されている。As shown in FIG. 1, the resin substrate 1 has a first element mounting concave surface 20 for mounting the optical semiconductor element 3 on the surface thereof.
However, the second element mounting concave surface 21 for mounting the drive element 4 is formed on the back surface. Then, in the concave surface 20 for mounting the first element, the first header portion 5 to which the optical semiconductor element 3 is die-bonded and the first connection portion 8 which is connected to the optical semiconductor element 3 via the bonding wire 7 are plated. It is formed in a pattern. On the other hand, the concave surface 21 for mounting the second element
In the inside, a second header portion 6 which serves as a cavity runner portion when the resin is sealed and the drive element 4 is die-bonded, and a second connection portion 9 which is connected to the drive element 4 via the bonding wire 7 are formed by a plating pattern. Has been formed.
【００１５】また、樹脂基板１には、前記両面メッキパ
ターンの一部を接続するためのスルーホール２２が設け
られており、該スルーホール２２に多分割後に電極とな
るスルーホールメッキ部２が形成されてている。Further, the resin substrate 1 is provided with a through hole 22 for connecting a part of the double-sided plating pattern, and the through hole plated portion 2 which becomes an electrode after being divided into multiple parts is formed in the through hole 22. Has been done.
【００１６】前記両搭載用凹面２０，２１は、光半導体
素子３及び駆動素子４がダイボンド、ワイヤボンドされ
た状態で全て収まる高さに設定されている。そして、第
二素子搭載用凹面２１に、樹脂注入時に樹脂を該凹面２
１から基板１の第一素子搭載用凹面２０に流入させる
（図２参照）ための樹脂流入孔２３が連通して設けられ
ている。なお、樹脂流入孔２３は、両面メツキパターン
の一部を接続するためのスルーホールメツキを設けた構
造を有している。Both of the mounting concave surfaces 20 and 21 are set to such a height that the optical semiconductor element 3 and the driving element 4 are all accommodated in a die-bonded and wire-bonded state. When the resin is injected into the concave surface 21 for mounting the second element, the concave surface 21 is filled with the resin.
A resin inflow hole 23 is provided so as to communicate with the first element mounting concave surface 20 of the substrate 1 (see FIG. 2). The resin inflow hole 23 has a structure provided with a through hole plating for connecting a part of the double-sided plating pattern.
【００１７】ここで、上記光半導体装置の製造方法につ
いて詳述する。Now, a method of manufacturing the optical semiconductor device will be described in detail.
【００１８】まず、光半導体素子３を第一素子搭載用凹
面２０のヘッダー部５にダイボンドし、ボンディングワ
イヤー７にて結線部８と結線する。また、駆動素子４を
第二素子搭載用凹面２１のヘッダー部６にダイボンド
し、ボンディングワイヤー７にて結線部９と結線する
（この状態を図１に示す）。First, the optical semiconductor element 3 is die-bonded to the header portion 5 of the concave surface 20 for mounting the first element, and is connected to the connection portion 8 by the bonding wire 7. Further, the driving element 4 is die-bonded to the header portion 6 of the concave surface 21 for mounting the second element, and is connected to the connection portion 9 by the bonding wire 7 (this state is shown in FIG. 1).
【００１９】次に、樹脂基板１の裏面側、すなわち第二
素子搭載用凹面２１から透光性樹脂を注入し光半導体素
子３及び駆動素子４をモールド（トランスファモール
ド）して光学系レンズ１０付きのパッケージ１１を成形
する（この状態を図２に示す）。このとき、樹脂は、キ
ャビティランナー部兼用の第二素子搭載用凹面２１から
スルーホールメツキを有する樹脂流入孔２３を通過して
樹脂基板１の表面に導かれ、その後第一素子搭載用凹面
２０に流入する。Next, a transparent resin is injected from the back surface side of the resin substrate 1, that is, the concave surface 21 for mounting the second element, and the optical semiconductor element 3 and the driving element 4 are molded (transfer molded) to have the optical system lens 10. The package 11 is molded (this state is shown in FIG. 2). At this time, the resin is guided to the surface of the resin substrate 1 from the concave surface 21 for mounting the second element, which also serves as the cavity runner, through the resin inflow hole 23 having the through hole plating, and then to the concave surface 20 for mounting the first element. Inflow.
【００２０】しかる後、ダイシングライン１２に沿って
ダイシングを行い樹脂基板１を多分割し、単独のＳＭＤ
光半導体装が完成する（この状態を図３に示す）。Thereafter, dicing is performed along the dicing line 12 to divide the resin substrate 1 into multiple pieces, and a single SMD is formed.
The optical semiconductor device is completed (this state is shown in FIG. 3).
【００２１】このように、樹脂基板１の表面に光半導体
素子搭載用の凹面２０を、裏面にキャビティランナー部
兼用駆動素子搭載用の凹面２１を設け、さらに樹脂基板
１の両面にメッキパターンを設け、この両面メッキパタ
ーンの一部を接続するためのスルーホール２２及び、こ
のスルーホール２２に多分割後電極となるスルーホール
メッキ部２を形成しているから、樹脂基板１の両面を素
子搭載部及びメッキパターンの設置可能領域として使用
できる。As described above, the concave surface 20 for mounting the optical semiconductor element is provided on the front surface of the resin substrate 1, the concave surface 21 for mounting the driving element also serving as the cavity runner portion is provided on the rear surface, and the plating pattern is provided on both surfaces of the resin substrate 1. Since the through hole 22 for connecting a part of the double-sided plating pattern and the through-hole plated portion 2 to be an electrode after multi-division are formed in the through hole 22, both surfaces of the resin substrate 1 are mounted on the element mounting portion. It can also be used as an area where the plating pattern can be installed.
【００２２】このため、従来の樹脂基板の表面のみを用
いた光半導体装置に比べて受光面あるいは発光面となる
表面は、複雑なメッキパターンが不要となるから、光学
系レンズ１０の光軸を中心にしたメッキパターンの設計
が容易になり、その結果パッケージサイズ１１の小型化
が実現できる。したがって、実装時の必要実装面積の縮
小化が図れる。Therefore, as compared with the conventional optical semiconductor device using only the surface of the resin substrate, the surface serving as the light receiving surface or the light emitting surface does not require a complicated plating pattern, so that the optical axis of the optical system lens 10 is set. The centered plating pattern can be easily designed, and as a result, the package size 11 can be reduced. Therefore, the required mounting area at the time of mounting can be reduced.
【００２３】上記実施例では、２個の素子搭載の場合で
説明したが、２個以上の複数素子搭載の場合において
も、同様な構造を用いたて型の光半導体装置を提供する
ことができる。In the above embodiment, the case where two elements are mounted has been described. However, even when two or more elements are mounted, a vertical type optical semiconductor device having the same structure can be provided. ..
【００２４】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.
【００２５】上記実施例では、２個の素子搭載の場合で
説明したが、２個以上の複数素子搭載の場合において
も、同様な構造を用いたて型の光半導体装置を提供する
ことができる。In the above embodiment, the case where two elements are mounted has been described. However, even when mounting two or more elements, a vertical type optical semiconductor device having the same structure can be provided. ..
【００２６】[0026]
【発明の効果】以上の説明から明らかな通り、本発明に
よると、受光面あるいは発光面となる面には複雑なメッ
キパターンが不要となるため、光学系レンズをパッケー
ジの中心に設置するメッキパターンの設計が容易とな
り、その結果装置自体も小型化するといった優れた効果
がある。As is apparent from the above description, according to the present invention, since a complicated plating pattern is not required on the light receiving surface or the light emitting surface, the plating pattern for mounting the optical system lens at the center of the package The design is easy, and as a result, the device itself has a small size.
【図面の簡単な説明】[Brief description of drawings]
【図１】図１は本発明の一実施例に係る光半導体装置に
おいて樹脂モールド前の状態を示す図であって、同図−
Ａは平面図、同図−Ｂは背面図、同図−Ｃは同図−Ａの
Ａ−Ａ断面図、同図−Ｄは同図−ＡのＢ−Ｂ断面図、同
図−Ｅは同図−ＡのＣ−Ｃ断面図である。FIG. 1 is a diagram showing a state before resin molding in an optical semiconductor device according to an embodiment of the present invention.
A is a plan view, FIG.-B is a rear view, FIG.-C is a sectional view taken along line AA in FIG.-A, FIG.-D is a sectional view taken along line BB in FIG.-A, and FIG. It is CC sectional drawing of the same figure-A.
【図２】図２は同じくその樹脂モールド後の状態を示す
図であって、同図−Ａは平面図、同図−Ｂは背面図、同
図−Ｃは同図−ＡのＡ−Ａ断面図、同図−Ｄは同図−Ａ
のＢ−Ｂ断面図、同図−Ｅは同図−ＡのＣ−Ｃ断面図で
ある。2 is a view showing the state after the resin molding, FIG. 2A is a plan view, FIG. 2B is a rear view, and FIG. 2C is AA of FIG. 2A. Sectional view, Figure-D is Figure-A
6B is a cross-sectional view taken along the line BB, and FIG. 7E is a cross-sectional view taken along the line CC of FIG.
【図３】図３は同じくその完成品を示す図であって、同
図−Ａは平面図、同図−Ｂは背面図、同図−Ｃは正面
図、同図−Ｄは左側面図、同図−Ｅは右側面図である。3 is a diagram showing the same finished product, FIG. 3A is a plan view, FIG. 3B is a rear view, FIG. 3C is a front view, and FIG. 3D is a left side view. The same figure-E is a right side view.
【図４】図４は従来の光半導体装置において樹脂モール
ド前の状態を示す図である。FIG. 4 is a diagram showing a state before resin molding in a conventional optical semiconductor device.
【図５】図５は同じくその樹脂モールド後の状態を示す
図であって、同図−Ａは平面図、同図−Ｂは同図−Ａの
Ｄ−Ｄ断面図、同図−Ｃは同図−ＡのＥ−Ｅ断面図であ
る。5 is a diagram showing the state after the resin molding, FIG. 5A is a plan view, FIG. 5B is a sectional view taken along the line DD of FIG. 5A, and FIG. FIG. 3B is a sectional view taken along line EE in FIG.
【図６】図６は同じくその完成品を示す図であって、同
図−Ａは平面図、同図−Ｂは正面図、同図−Ｃは側面図
である。FIG. 6 is also a view showing the finished product, in which FIG. 6A is a plan view, FIG. 6B is a front view, and FIG. 6C is a side view.
１ 樹脂基板 ２ スルーホールメッキ部 ３ 光半導体素子 ４ 駆動素子 ５，６ ヘッダー部 ７ ボンディングワイヤー ８，９ 結線部 １０ 光学系レンズ １１ パッケージ １２ ダイシングライン ２０，２１ 素子搭載用凹面 ２２ スルーホール 1 Resin Substrate 2 Through Hole Plated Section 3 Optical Semiconductor Element 4 Driving Element 5,6 Header Section 7 Bonding Wire 8,9 Connection Section 10 Optical System Lens 11 Package 12 Dicing Line 20, 21 Element Mounting Concave Surface 22 Through Hole
Claims (1)
該メッキパターン上に複数の光半導体素子及び駆動素子
が搭載され、該各光半導体素子及び駆動素子を透光性樹
脂にてモールドして複数の光学系レンズ付きのパッケー
ジが形成され、該パッケージを分離独立させるため樹脂
基板をダイシングラインに沿って多分割に切断して成る
光半導体装置において、前記樹脂基板の両面に光半導体
素子及び駆動素子が搭載される素子搭載用凹面が設けら
れ、該両凹面内に、光半導体素子及び駆動素子がダイボ
ンドされるヘッダー部と、光半導体素子及び駆動素子に
ボンディングワイヤーを介して結線される結線部とがメ
ッキパターンにて形成され、該両面メッキパターンの一
部を接続するためのスルーホールが設けられ、該スルー
ホールに多分割後に電極となるスルーホールメッキ部が
形成され、前記光半導体素子及び駆動素子が両凹面に搭
載されたことを特徴とする光半導体装置。Claims: 1. A resin substrate is provided with a plating pattern,
A plurality of optical semiconductor elements and driving elements are mounted on the plating pattern, and the optical semiconductor elements and driving elements are molded with a transparent resin to form a package with a plurality of optical system lenses. In an optical semiconductor device obtained by cutting a resin substrate into multiple divisions along a dicing line for separation and independence, an element mounting concave surface on which an optical semiconductor element and a driving element are mounted is provided on both surfaces of the resin substrate. A header portion to which the optical semiconductor element and the driving element are die-bonded and a connection portion to be connected to the optical semiconductor element and the driving element via a bonding wire are formed in the concave surface by a plating pattern. A through hole for connecting the parts is formed, and a through hole plated part to be an electrode after multi-division is formed in the through hole. The optical semiconductor device, characterized in that the conductor elements and the drive elements are mounted on both concave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18085991A JPH0529662A (en) | 1991-07-22 | 1991-07-22 | Photosemiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18085991A JPH0529662A (en) | 1991-07-22 | 1991-07-22 | Photosemiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529662A true JPH0529662A (en) | 1993-02-05 |
Family
ID=16090606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18085991A Pending JPH0529662A (en) | 1991-07-22 | 1991-07-22 | Photosemiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529662A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150138A (en) * | 1996-11-15 | 1998-06-02 | Citizen Electron Co Ltd | Side-use electronic component provided with lower electrode |
| JP2003304004A (en) * | 2002-04-11 | 2003-10-24 | Citizen Electronics Co Ltd | Optical transmission chip and mounting structure thereof |
| JP2006049443A (en) * | 2004-08-02 | 2006-02-16 | Citizen Electronics Co Ltd | Light emitting device and its mounting structure |
| JP2008252148A (en) * | 2008-07-22 | 2008-10-16 | Nichia Corp | Package for light-emitting device and manufacturing method thereof |
| US11469220B2 (en) * | 2018-01-17 | 2022-10-11 | Osram Oled Gmbh | Component and method for producing a component |
-
1991
- 1991-07-22 JP JP18085991A patent/JPH0529662A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150138A (en) * | 1996-11-15 | 1998-06-02 | Citizen Electron Co Ltd | Side-use electronic component provided with lower electrode |
| JP2003304004A (en) * | 2002-04-11 | 2003-10-24 | Citizen Electronics Co Ltd | Optical transmission chip and mounting structure thereof |
| JP2006049443A (en) * | 2004-08-02 | 2006-02-16 | Citizen Electronics Co Ltd | Light emitting device and its mounting structure |
| JP2008252148A (en) * | 2008-07-22 | 2008-10-16 | Nichia Corp | Package for light-emitting device and manufacturing method thereof |
| US11469220B2 (en) * | 2018-01-17 | 2022-10-11 | Osram Oled Gmbh | Component and method for producing a component |
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